MP34DT05
MEMS audio sensor omnidirectional digital microphone
Datasheet - production data
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Digital still and video cameras
Antitheft systems
Description
The MP34DT05 is an ultra-compact, low-power,
omnidirectional, digital MEMS microphone built
with a capacitive sensing element and an IC
interface.
The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process
dedicated to produce audio sensors.
The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digital signal externally in PDM
format.
Features
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Single supply voltage
Low power consumption
AOP = 122.5 dBSPL
64 dB signal-to-noise ratio
Omnidirectional sensitivity
–26 dBFS ± 3 dB sensitivity
PDM output
HCLGA package
−
Top-port design
−
SMD-compliant
−
EMI-shielded
−
ECOPACK®, RoHS, and “Green”
compliant
The MP34DT05 is a low-distortion digital
microphone with a 64 dB signal-to-noise ratio and
–26 dBFS ± 3 dB sensitivity.
The MP34DT05 is available in a top-port, SMDcompliant, EMI-shielded package and is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
Table 1: Device summary
Order codes
Temp.
range [°C]
Package
Packing
MP34DT05
-40 to +85
HCLGA
(3 x 4 x 1 mm)
4LD
Tray
MP34DT05TR
-40 to +85
Applications
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Mobile terminals
Laptop and notebook computers
Portable media players
VoIP
Speech recognition
A/V eLearning devices
Gaming and virtual reality input devices
November 2016
DocID029902 Rev 1
This is information on a product in full production.
HCLGA
(3 x 4 x 1 mm)
4LD
Tape and
reel
1/21
www.st.com
Contents
MP34DT05
Contents
1
Pin description ................................................................................ 5
2
Acoustic and electrical specifications ........................................... 6
2.1
Acoustic and electrical characteristics............................................... 6
2.2
Timing characteristics ....................................................................... 7
2.3
Frequency response ......................................................................... 8
3
Application recommendations ....................................................... 9
4
5
Carrier tape mechanical specifications ....................................... 11
Process recommendations ........................................................... 12
6
Sensing element ............................................................................ 14
7
Absolute maximum ratings........................................................... 15
8
Functionality .................................................................................. 16
8.1
9
10
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L/R channel selection ...................................................................... 16
Package information ..................................................................... 17
9.1
Soldering information ...................................................................... 17
9.2
HCLGA package information........................................................... 18
Revision history ............................................................................ 20
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MP34DT05
List of tables
List of tables
Table 1: Device summary ........................................................................................................................... 1
Table 2: Pin description .............................................................................................................................. 5
Table 3: Acoustic and electrical characteristics .......................................................................................... 6
Table 4: Distortion specifications @ 1 kHz ................................................................................................. 6
Table 5: Timing characteristics ................................................................................................................... 7
Table 6: Absolute maximum ratings ......................................................................................................... 15
Table 7: L/R channel selection ................................................................................................................. 16
Table 8: Recommended soldering profile limits ........................................................................................ 17
Table 9: Document revision history .......................................................................................................... 20
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List of figures
MP34DT05
List of figures
Figure 1: Pin connections ........................................................................................................................... 5
Figure 2: Timing waveforms ....................................................................................................................... 7
Figure 3: Typical frequency response normalized to 1 kHz........................................................................ 8
Figure 4: MP34DT05 electrical connections (top view) .............................................................................. 9
Figure 5: MP34DT05 electrical connections for stereo configuration (top view) ...................................... 10
Figure 6: Carrier tape without microphone (top view) ............................................................................... 11
Figure 7: Carrier tape with microphone (top view) .................................................................................... 11
Figure 8: Recommended picking area ...................................................................................................... 12
Figure 9: Recommended picker design .................................................................................................... 13
Figure 10: Recommended soldering profile limits .................................................................................... 17
Figure 11: HCLGA (3 x 4 x 1 mm) 4-lead package outline and mechanical data .................................... 18
Figure 12: Land pattern............................................................................................................................. 19
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1
Pin description
Pin description
Figure 1: Pin connections
LR
2
3
CLK
Vdd
1
4
DOU T
5
GND
(BOT TOM VIEW)
Table 2: Pin description
Pin #
Pin name
Function
1
Vdd
Power supply
2
LR
Left/Right channel selection
3
CLK
Synchronization input clock
4
DOUT
Left/Right PDM data output
5 (ground ring)
GND
0 V supply
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Acoustic and electrical specifications
MP34DT05
2
Acoustic and electrical specifications
2.1
Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz,
T = 25 °C, unless otherwise noted.
Table 3: Acoustic and electrical characteristics
Symbol
Parameter
Test condition
Vdd
Supply voltage
Idd
Current consumption in normal mode
IddPdn
Short-circuit current
AOP
Acoustic overload point
So
Max.
Unit
1.6
1.8
3.6
V
650
(2)
1
-29
A-weighted @1 kHz,
94 dB SPL
SNR
Signal-to-noise ratio
PSR
Power supply rejection
Input clock frequency
µA
5
µA
10
mA
122.5
Sensitivity
fCLK
Typ. (1)
Mean value
Current consumption in power-down mode
Scc
Min.
-26
dBFS
dB(A)
-72
dBFS
3.25
MHz
10
ms
-40
+85
°C
V
1.2
(4)
-23
64
100 mVpp sine 1 kHz
(3)
dBSPL
2.4
Ton
Turn-on time
Top
Operating temperature range
VIOL
Low-level logic input/output voltage
Iout = 1 mA
-0.3
0.35xVdd
VIOH
High-level logic input/output voltage
Iout = 1 mA
0.65xVdd
Vdd+0.3
V
100
pF
CLOAD
Guaranteed by design
Capacitive load
Notes:
(1)Typical
specifications are not guaranteed.
(2)Input
clock in static mode.
(3)Duty
cycle: min = 40% max = 60%.
(4)Time
from the first clock edge to valid output data.
Table 4: Distortion specifications @ 1 kHz
Parameter
Test condition
Typical value (1)
Distortion
94 dBSPL
0.2% THD + N
Distortion
110 dBSPL
0.7% THD + N
Distortion
120 dBSP
6% THD + N
Notes:
(1)Typical
6/21
specifications are not guaranteed.
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MP34DT05
2.2
Acoustic and electrical specifications
Timing characteristics
Table 5: Timing characteristics
Parameter
Description
fCLK
Clock frequency for normal mode
fPD
Clock frequency for power-down mode
Min.
Max.
Unit
1.2
3.25
MHz
0.23
MHz
TCLK
Clock period for normal mode
308
1000
ns
TR,EN
Data enabled on DATA line, L/R pin = 1
70
90
ns
TR,DIS
Data disabled on DATA line, L/R pin = 1
4.3
5.3
ns
TL,EN
Data enabled on DATA line, L/R pin = 0
64
87
ns
TL,DIS
Data disabled on DATA line, L/R pin = 0
3.5
4.3
ns
Figure 2: Timing waveforms
TCLK
CLK
TL,DIS
TR,EN
TR,DIS
High Z
PDM R
High Z
TL,EN
PDM L
High Z
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Acoustic and electrical specifications
2.3
MP34DT05
Frequency response
Figure 3: Typical frequency response normalized to 1 kHz
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3
Application recommendations
Application recommendations
Figure 4: MP34DT05 electrical connections (top view)
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Application recommendations
MP34DT05
Figure 5: MP34DT05 electrical connections for stereo configuration (top view)
Power supply decoupling capacitors (100 nF ceramic, 1 μF ceramic) should be placed as
near as possible to pin 1 of the device (common design practice).
The L/R pin must be connected to Vdd or GND (refer to Table 7: "L/R channel selection").
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4
Carrier tape mechanical specifications
Carrier tape mechanical specifications
Figure 6: Carrier tape without microphone (top view)
Figure 7: Carrier tape with microphone (top view)
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Process recommendations
5
MP34DT05
Process recommendations
To ensure a consistent manufacturing process it is strongly advised to comply with
following recommendations:
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The recommended pick-up area for the MP34DT05 package must be defined using
the worst case (ie. no device alignment during picking process). This area has been
defined considering all the tolerances of the components involved (reel, package,
sound inlet). Picker tolerance shall be considered as well.
To prevent damage to the MEMS membrane or incorrect pick-up and placement, do
not pick up the component on the inlet area
For the package outline please refer to Figure 7: "Carrier tape with microphone (top
view)". Nozzle shape, size, and placement accuracy are the other key factors to
consider when deciding on the coordinates for the picking.
Device alignment before picking is highly recommended.
A vacuum force greater than 7 psi must be avoided
1 kPa = 0.145 psi (lb/in²) = 0.0102 kgf/cm² = 0.0098 atm
MSL (moisture sensitivity level) Class 3
Maximum of 3 reflow cycles is recommended
All recommended dimensions (device safe-picking area) do not include the pick-andplace equipment tolerances
Figure 8: Recommended picking area
To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle.
The following picker ensures that the holes for the vacuum and the air stream are ALWAYS
away from the porthole of the device (4 vacuum ports located at each corner of the device).
The recommended nozzle also has a recess, in the form of a cross, which guarantees that
the porthole is always left at atmospheric pressure. By using the recommended nozzle, the
membrane will not suffer any sudden air disturbances during the picking or placing of the
devices in the tape and reel.
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Process recommendations
Figure 9: Recommended picker design
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Sensing element
6
MP34DT05
Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable
plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound
pressure into the changes of coupled capacity between those two plates.
Omron Corporation supplies this element for STMicroelectronics.
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7
Absolute maximum ratings
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 6: Absolute maximum ratings
Symbol
Ratings
Vdd
Supply voltage
Vin
Input voltage on any control pin
TSTG
Storage temperature range
Maximum value
Unit
-0.3 to 5
V
-0.3 to Vdd +0.3
V
-40 to +125
°C
±2000 (HBM)
ESD
Electrostatic discharge protection
±200 (MM)
V
±750 (CBM)
ESD
Product standard EN 55024:2010 - 3 air
discharge
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V
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Functionality
MP34DT05
8
Functionality
8.1
L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 7: "L/R
channel selection". The L/R pin must be connected to Vdd or GND.
Table 7: L/R channel selection
L/R
CLK low
CLK high
GND
Data valid
High impedance
Vdd
High impedance
Data valid
Note: As the L/R pin is internally connected to GND via a 200 kohm pull/down resistor, it is
not mandatory to connect the pin itself to GND for the respective channel selection.
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9
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Soldering information
The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards
and is qualified for soldering heat resistance according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com.
Figure 10: Recommended soldering profile limits
tp
TP
CRITICAL ZONE
RAMP-UP
TL to T P
TL
TSMAX
TEMPERATURE
9.1
tL
TSMIN
ts
PREHEAT
RAMP-DOWN
T25° to PEAK
30 60 90 120 150 180
210
TIME
240
270
300
330
360 390
Table 8: Recommended soldering profile limits
Description
Average ramp rate
Preheat
Minimum temperature
Maximum temperature
Time (TSMIN to TSMAX)
Ramp-up rate
Parameter
Pb free
TL to TP
3 °C/sec max
TSMIN
TSMAX
tS
150 °C
200 °C
60 sec to 120 sec
TSMAX to TL
Time maintained above liquids temperature
Liquids temperature
tL
TL
Peak temperature
TP
Time within 5 °C of actual peak temperature
60 sec to 150 sec
217 °C
260 °C max
20 sec to 40 sec
Ramp-down rate
6 °C/sec max
Time 25 °C (t25 °C) to peak temperature
8 minutes max
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Package information
9.2
MP34DT05
HCLGA package information
Figure 11: HCLGA (3 x 4 x 1 mm) 4-lead package outline and mechanical data
Dimensions are in millimeter unless otherwise specified
General Tolerance is +/-0.15mm unless otherwise specified
OUTER DIMENSIONS
ITEM
Length [L]
Width [W]
Height [H]
AP
DIMENSION [mm]
3
4
1.00
Ø 0.25
TOLERANCE [mm]
±0.1
±0.1
±0.1
±0.1
DM00231908_1
1.
2.
18/21
The MEMS microphone plastic cap can exhibit some level of variation in color when
the device is subjected to thermal processes. This variation does does not affect
acoustic or electrical performance.
Ring plating can be subject to change not affecting acoustic and electrical
performances.
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MP34DT05
Package information
Figure 12: Land pattern
0.85
GND
0.85
0.35
1.30
2.30
GND
LR
Vdd
0.95
CLK
GND
DOUT
0.40
0.35
GND
Pad + solder paste
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Revision history
10
MP34DT05
Revision history
Table 9: Document revision history
20/21
Date
Revision
04-Nov-2016
1
Changes
Initial release
DocID029902 Rev 1
MP34DT05
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