MP34DT06J
Datasheet
MEMS audio sensor omnidirectional digital microphone
Features
•
•
•
•
•
•
•
•
Single supply voltage
Low power consumption
AOP = 122.5 dBSPL
64 dB signal-to-noise ratio
Omnidirectional sensitivity
–26 dBFS ± 1 dB sensitivity
PDM output
HCLGA package
–
Top-port design
–
SMD-compliant
–
EMI-shielded
–
ECOPACK, RoHS, and “Green” compliant
Applications
Product status link
MP34DT06J
Product summary
Order code
MP34DT06JTR
Temperature
range [°C]
-40 °C to +85
Package
HCLGA 4 LD
(3 x 4 x 1 mm)
Packing
Tape and reel
•
•
•
•
•
•
•
•
•
Mobile terminals
Laptop and notebook computers
Portable media players
VoIP
Speech recognition
A/V eLearning devices
Gaming and virtual reality input devices
Digital still and video cameras
Antitheft systems
Description
The MP34DT06J is an ultra-compact, low-power, omnidirectional, digital MEMS
microphone built with a capacitive sensing element and an IC interface.
The sensing element, capable of detecting acoustic waves, is manufactured using a
specialized silicon micromachining process dedicated to producing audio sensors.
The IC interface is manufactured using a CMOS process that allows designing a
dedicated circuit able to provide a digital signal externally in PDM format.
The MP34DT06J is a low-distortion digital microphone with a 64 dB signal-to-noise
ratio and –26 dBFS ±1 dB sensitivity.
The MP34DT06J is available in a top-port, SMD-compliant, EMI-shielded package
and is guaranteed to operate over an extended temperature range from -40 °C to
+85 °C.
DS12698 - Rev 3 - July 2021
For further information contact your local STMicroelectronics sales office.
www.st.com
MP34DT06J
Pin description
1
Pin description
Figure 1. Pin connections
LR
CLK
DOUT
Vdd
GND
BOTTOM VIEW
Table 1. Pin description
DS12698 - Rev 3
Pin #
Pin name
1
Vdd
Power supply
2
LR
Left/Right channel selection
3
CLK
Synchronization input clock
4
DOUT
Left/Right PDM data output
5
(ground ring)
GND
Function
Ground
page 2/20
MP34DT06J
Acoustic and electrical specifications
2
Acoustic and electrical specifications
2.1
Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25 °C, unless otherwise
noted.
Table 2. Acoustic and electrical characteristics
Symbol
Parameter
Vdd
Supply voltage
Idd
Current consumption in normal mode
IddPdn
Short-circuit current
AOP
Acoustic overload point
Min.
Typ. (1)
Max.
Unit
1.6
1.8
3.6
V
Mean value
Current consumption in power-down mode
Scc
So
Test condition
650
(2)
1
µA
5
µA
10
mA
122.5
Sensitivity
-27
-26
dBSPL
-25
dBFS
SNR
Signal-to-noise ratio
A-weighted @1 kHz, 94 dB SPL
64
dB(A)
PSR
Power supply rejection
100 mVpp sine 1 kHz
-90
dBFS
Clock
Input clock frequency (3)
1.2
2.4
3.25
MHz
10
ms
-40
+85
°C
Ton
Turn-on time (4)
Top
Operating temperature range
VIOL
Low-level logic input/output voltage
Iout = 1 mA
-0.3
0.35xVdd
V
VIOH
High-level logic input/output voltage
Iout = 1 mA
0.65xVdd
Vdd+0.3
V
100
pF
CLOAD
Specified by design - not tested in production
Capacitive load
1. Typical specifications are not guaranteed.
2. Input clock in static mode.
3. Duty cycle: min = 40% max = 60%.
4. Time from the first clock edge to valid output data.
Table 3. Distortion specifications @ 1 kHz
Parameter
Test condition
Typical value (1)
Distortion
94 dBSPL
0.2% THD + N
Distortion
110 dBSPL
0.7% THD + N
Distortion
120 dBSPL
6% THD + N
1. Typical specifications are not guaranteed.
DS12698 - Rev 3
page 3/20
MP34DT06J
Timing characteristics
2.2
Timing characteristics
Table 4. Timing characteristics
Parameter
Description
fCLK
Clock frequency for normal mode
fPD
Clock frequency for power-down mode
TCLK
Clock period for normal mode
Tdv
Time delay to valid data (CLOAD = 100 pF)
Ten
Tdis
Min.
Max.
Unit
1.2
3.25
MHz
0.23
MHz
308
1000
-
105
Time delay to driven data
18
-
Time delay to High-Z
2
10
ns
Figure 2. Timing waveforms
1/fclk
CLK
Tdv
Tdis
Ten
DOUT
High-Z
High-Z
Mic Data
(L/R = Vdd)
Tdv
Tdis
Ten
DOUT
(L/R = Gnd)
DS12698 - Rev 3
High-Z
Mic Data
page 4/20
MP34DT06J
Frequency response
2.3
Frequency response
Figure 3. Typical frequency response normalized to 1 kHz
DS12698 - Rev 3
page 5/20
MP34DT06J
Application recommendations
3
Application recommendations
Figure 4. MP34DT06J electrical connections (top view)
Vdd
1µF
100nF
L/R
1
4
2
3
Dout
CLK
CODEC
TOP VIEW
5
Ground ring
Figure 5. MP34DT06J electrical connections for stereo configuration (top view)
Vdd
1µF
TOP VIEW
L/R
100nF
1
4
2
3
Dout
Dout
Vdd
1
4
2
3
5
Ground ring
CLK
CODEC
Power supply decoupling capacitors (100 nF ceramic, 1 μF ceramic) should be placed as near as possible to pin
1 of the device (common design practice).
The L/R pin must be connected to Vdd or GND (refer to Table 6. L/R channel selection).
DS12698 - Rev 3
page 6/20
MP34DT06J
Carrier tape mechanical specifications
4
Carrier tape mechanical specifications
Figure 6. Carrier tape without microphone (top view)
Figure 7. Carrier tape with microphone (top view)
DS12698 - Rev 3
page 7/20
MP34DT06J
Process recommendations
5
Process recommendations
To ensure a consistent manufacturing process it is strongly advised to comply with the following
recommendations:
•
The recommended pick-up area for the MP34DT06J package must be defined using the worst case (ie. no
device alignment during picking process). This area has been defined considering all the tolerances of the
components involved (reel, package, sound inlet). The picker tolerance shall be considered as well.
•
To prevent damage to the MEMS membrane or incorrect pick-up and placement, do not pick up the
component on the inlet area.
•
For the package outline please refer to Figure 7. Carrier tape with microphone (top view). Nozzle shape,
size, and placement accuracy are the other key factors to consider when deciding on the coordinates for
picking.
•
Device alignment before picking is highly recommended.
•
A vacuum force greater than 7 psi must be avoided
•
1 kPa = 0.145 psi (lb/in²) = 0.0102 kgf/cm² = 0.0098 atm
•
MSL (moisture sensitivity level) Class 3
•
Maximum of 3 reflow cycles is recommended
•
All recommended dimensions (device safe-picking area) do not include the pick-and-place equipment
tolerances
Figure 8. Recommended picking area
To have a safe pick-up “by design”, ST strongly advises an ad hoc nozzle.
The following picker ensures that the holes for the vacuum and the air stream are ALWAYS away from the
porthole of the device (4 vacuum ports located at each corner of the device). The recommended nozzle also has
a recess in the form of a cross which guarantees that the porthole is always left at atmospheric pressure. By using
the recommended nozzle, the membrane will not suffer any sudden air disturbances during the picking or placing
of the devices in the tape and reel.
DS12698 - Rev 3
page 8/20
MP34DT06J
Process recommendations
Figure 9. Recommended picker design
DS12698 - Rev 3
page 9/20
MP34DT06J
Sensing element
6
Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate
placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity
between those two plates.
DS12698 - Rev 3
page 10/20
MP34DT06J
Absolute maximum ratings
7
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to
maximum rating conditions for extended periods may affect device reliability.
Table 5. Absolute maximum ratings
Symbol
Ratings
Vdd
Supply voltage
Vin
Input voltage on any control pin
TSTG
Storage temperature range
Maximum value
Unit
-0.3 to 5
V
-0.3 to Vdd +0.3
V
-40 to +125
°C
±2000 (HBM)
ESD
Electrostatic discharge protection
±200 (MM)
V
±750 (CBM)
ESD
Product standard EN 55024:2010 - 3 air discharges
±15000
V
This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.
This device is sensitive to electrostatic discharge (ESD), improper handling can cause permanent damage to the part.
DS12698 - Rev 3
page 11/20
MP34DT06J
Functionality
8
Functionality
8.1
L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as shown in the following table. The L/R pin must
be connected to Vdd or GND.
Table 6. L/R channel selection
L/R
CLK low
CLK high
GND
Data valid
High impedance
Vdd
High impedance
Data valid
Note: As the L/R pin is internally connected to GND via a 200 kohm pull-down resistor, it is not mandatory to
connect the pin itself to GND for the respective channel selection.
DS12698 - Rev 3
page 12/20
MP34DT06J
Package information
9
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
9.1
Soldering information
The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards and is qualified for
soldering heat resistance according to JEDEC J-STD-020.
Landing pattern and soldering recommendations are available at www.st.com.
Figure 10. Recommended soldering profile limits
tp
TP
CRITICAL ZONE
RAMP-UP
TL to T P
TL
TEMPERATURE
TSMAX
tL
TSMIN
ts
PREHEAT
RAMP-DOWN
T25° to PEAK
30 60 90 120 150 180
210
TIME
240
270
300
330
360 390
Table 7. Recommended soldering profile limits
Description
Parameter
Pb free
TL to TP
3 °C/sec max
Minimum temperature
TSMIN
150 °C
Maximum temperature
TSMAX
200 °C
Time (TSMIN to TSMAX)
tS
60 sec to 120 sec
Average ramp rate
Preheat
Ramp-up rate
Time maintained above liquidus temperature
tL
60 sec to 150 sec
Liquidus temperature
TL
217 °C
Peak temperature
TP
260 °C max
Time within 5 °C of actual peak temperature
DS12698 - Rev 3
TSMAX to TL
20 sec to 40 sec
Ramp-down rate
6 °C/sec max
Time 25 °C (t25 °C) to peak temperature
8 minutes max
page 13/20
MP34DT06J
HCLGA package information
9.2
HCLGA package information
Figure 11. HCLGA (3 x 4 x 1 mm) 4-lead package outline and mechanical data
Dimensions are in millimeter unless otherwise specified
General Tolerance is +/-0.15mm unless otherwise specified
DM00231908_5
Table 8. Outer dimensions
1.
2.
DS12698 - Rev 3
Item
Dimensions (mm)
Tolerance (mm)
Length (L)
3
±0.1
Width (W)
4
±0.1
Height (H)
1.00
±0.1
AP
Ø 0.25
±0.05
The MEMS microphone plastic cap can exhibit some level of variation in color when the device is subjected
to thermal processes. This variation does not affect acoustic or electrical performance.
Ring plating can be subject to change not affecting acoustic and electrical performance.
page 14/20
MP34DT06J
HCLGA package information
Figure 12. Land pattern
0.85
GND
0.85
0.35
1.30
2.30
GND
LR
Vdd
0.95
CLK
GND
DOUT
0.40
0.35
GND
Pad + solder paste
DS12698 - Rev 3
page 15/20
MP34DT06J
Revision history
Table 9. Document revision history
DS12698 - Rev 3
Date
Version
17-Jul-2018
1
29-Apr-2019
2
30-Jun-2021
3
Changes
Initial release
Updated Table 4. Timing characteristics
Added Figure 12. Land pattern
Updated Section 2.2 Timing characteristics
page 16/20
MP34DT06J
Contents
Contents
1
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2
Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1
Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2
Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.3
Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4
Carrier tape mechanical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5
Process recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6
Sensing element. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
7
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
8
Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
8.1
9
L/R channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
9.1
Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
9.2
HCLGA package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
DS12698 - Rev 3
page 17/20
MP34DT06J
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Pin description. . . . . . . . . . . . . . . . .
Acoustic and electrical characteristics.
Distortion specifications @ 1 kHz . . . .
Timing characteristics . . . . . . . . . . . .
Absolute maximum ratings . . . . . . . .
L/R channel selection . . . . . . . . . . . .
Recommended soldering profile limits.
Outer dimensions. . . . . . . . . . . . . . .
Document revision history . . . . . . . . .
DS12698 - Rev 3
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. 2
. 3
. 3
. 4
11
12
13
14
16
page 18/20
MP34DT06J
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
DS12698 - Rev 3
Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical frequency response normalized to 1 kHz . . . . . . . . . . . . . . .
MP34DT06J electrical connections (top view) . . . . . . . . . . . . . . . . .
MP34DT06J electrical connections for stereo configuration (top view)
Carrier tape without microphone (top view). . . . . . . . . . . . . . . . . . .
Carrier tape with microphone (top view) . . . . . . . . . . . . . . . . . . . . .
Recommended picking area . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Recommended picker design . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Recommended soldering profile limits . . . . . . . . . . . . . . . . . . . . . .
HCLGA (3 x 4 x 1 mm) 4-lead package outline and mechanical data .
Land pattern. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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page 19/20
MP34DT06J
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2021 STMicroelectronics – All rights reserved
DS12698 - Rev 3
page 20/20
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