MP45DT02

MP45DT02 MEMS audio sensor omnidirectional digital microphone Datasheet - production data Description The MP45DT02 is a compact, low-power, topport, omnidirectional, digital MEMS microphone. The MP45DT02 is built with a sensing element and an IC interface with stereo capability. ) s ( ct u d o The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors. r P e t e l o The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format. HLGA (4.72 x 3.76 mm) 6LD ) (s Features • • • • • • • ct Single supply voltage Low power consumption 120 dBSPL acoustic overload point Omnidirectional sensitivity PDM single-bit output with option for stereo configuration HLGA package (SMD-compliant) plastic or metal ® ECOPACK , RoHS, and “Green” compliant u d o r P e t e l o s Applications b O • • • • • • • • • The MP45DT02 is available in an SMD-compliant metal (M) or plastic package and is guaranteed to operate over an extended temperature range from -30 °C to +85 °C. The MP45DT02’s digital output and package size (1.25 mm thick) make this device the best solution for laptop and portable computing applications. Table 1: Device summary Mobile terminals Laptop and notebook computers Portable media players VoIP Speech recognition A/V eLearning devices Gaming and virtual reality input devices Digital still and video cameras Antitheft systems January 2016 s b O The MP45DT02 has an acoustic overload point of 120 dBSPL with a best on the market 61 dB signal-to-noise ratio and -26 dB sensitivity. Order code Temp. range [°C] Package Packing MP45DT02 -30 to +85 HLGA 4.72x3.76 6LD Tray MP45DT02TR -30 to +85 HLGA 4.72x3.76 6LD Tape and reel MP45DT02TR-M -30 to +85 HLGA 4.72x3.76 6LD Tape and reel DocID018658 Rev 8 This is information on a product in full production. 1/15 www.st.com Contents MP45DT02 Contents 1 Pin description ................................................................................ 3 2 Acoustic and electrical specifications ........................................... 4 2.1 Acoustic and electrical characteristics............................................... 4 2.2 Timing characteristics ....................................................................... 5 2.3 Frequency response ......................................................................... 6 3 Sensing element .............................................................................. 7 4 5 Absolute maximum ratings............................................................. 8 Functionality .................................................................................... 9 5.1 ) s ( ct L/R channel selection ........................................................................ 9 u d Package information ..................................................................... 11 o r P e t e l o s Revision history ............................................................................ 14 b O ) s ( t c u d o r P e t e l o s 6 7 8 Application recommendations ..................................................... 10 7.1 Soldering information ...................................................................... 11 7.2 HLGA (4.72 x 3.76 mm) 6L (plastic) package information ............... 12 7.3 HLGA (4.72 x 3.76 mm) 6L (metal) package information ................ 13 b O 2/15 DocID018658 Rev 8 MP45DT02 1 Pin description Pin description Figure 1: Pin connections Vdd 6 1 GND DOUT 55 2 LR CLK 44 33 GND u d o r P e ( BO T T OM V I EW ) t e l o Table 2: Pin description Pin n° Pin name 1 GND 2 LR 3 GND 0 V supply 4 CLK Synchronization input clock 5 DOUT Left/right PDM data output 0 V supply s b O Function Left/right channel selection; MIC1 LR is connected to GND or Vdd and MIC2 LR is connected to Vdd or GND (see Figure 5: "MP45DT02 electrical connections for stereo configuration") ) (s t c u d o r P e 6 ) s ( ct Vdd Power supply t e l o s b O DocID018658 Rev 8 3/15 Acoustic and electrical specifications MP45DT02 2 Acoustic and electrical specifications 2.1 Acoustic and electrical characteristics The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25 °C, unless otherwise noted. Table 3: Acoustic and electrical characteristics Symbol Test condition Parameter Vdd Supply voltage Idd Current consumption in normal mode IddPdn Current consumption in (2) power-down mode Scc Short-circuit current AOP Acoustic overload point So Typ. 1.64 1.8 No load on data line 20 Unit 3.6 V (s) mA ct u d o 1 SNR Signal-to-noise ratio A-weighted @1 kHz, 1 Pa PSR Power supply rejection Guaranteed by (3) design Clock Input clock frequency e t e ol bs -O (4) 1 µA 10 Pr 120 -29 (s) Max. 0.65 Sensitivity (5) (1) Min. -26 -23 mA dBSPL dBFS 61 dB -70 dBFS 3.25 MHz 10 ms -30 +85 °C Guaranteed by design 2.4 TWK Wake-up time Top Operating temperature range VIOL Low level logic input/output voltage Iout = 1 mA -0.3 0.35xVdd V VIOH High level logic input/output voltage Iout = 1 mA 0.65xVdd Vdd+0.3 V ct u d o r P e t e l o Notes: s b O (1) (2) (3) (4) (5) Typical specifications are not guaranteed. Input clock in static mode. Test signal: 217 Hz square wave, 100 mVpp on Vdd pin. Duty cycle: min = 40% max = 60%. Time from the first clock edge to valid output data. Table 4: Distortion specifications 4/15 Parameter Test condition Value Distortion 100 dBSPL (50 Hz - 4 kHz) < 1% THD + N Distortion 115 dBSPL (1 kHz) < 5% THD + N DocID018658 Rev 8 MP45DT02 2.2 Acoustic and electrical specifications Timing characteristics Table 5: Timing characteristics Parameter Description fCLK Clock frequency for normal mode fPD Clock frequency for power-down mode TCLK TR,EN Clock period for normal mode Max Unit 1 3.25 MHz 0.23 MHz 1000 ns 308 30 Data enabled on DATA line, L/R pin = 1 TR,DIS Min (1) TL,EN Data disabled on DATA line, L/R pin = 1 30 TL,DIS Data enabled on DATA line, L/R pin = 0 Data disabled on DATA line, L/R pin = 0 ns 16 (1)(2) 16 (1)(2) (1) ns (2) ns ) s ( ct Notes: (1) ns From design simulations In order to measure the disable time, a 1 kΩ pull-down resistor must be added to the DOUT pin. u d o r P e Figure 2: Timing waveforms t e l o ) (s s b O t c u d o r P e t e l o s b O DocID018658 Rev 8 5/15 Acoustic and electrical specifications 2.3 MP45DT02 Frequency response Figure 3: Typical frequency response normalized at 1 kHz ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 6/15 DocID018658 Rev 8 MP45DT02 3 Sensing element Sensing element The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity between those two plates. Omron Corporation supplies this element for STMicroelectronics. ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O DocID018658 Rev 8 7/15 Absolute maximum ratings 4 MP45DT02 Absolute maximum ratings Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 6: Absolute maximum ratings Symbol Ratings Vdd Supply voltage Vin Input voltage on any control pin TSTG Storage temperature range ESD Electrostatic discharge protection Maximum value Unit -0.3 to 6 V -0.3 to Vdd +0.3 V -40 to +125 °C ) s ( t 2 (HBM) c u d e t e ol ) (s s b O t c u d o r P e t e l o s b O 8/15 DocID018658 Rev 8 o r P kV MP45DT02 Functionality 5 Functionality 5.1 L/R channel selection The L/R digital pad lets the user select the DOUT signal pattern as explained in Table 7: "L/R channel selection". The L/R pin must be connected to Vdd or GND. Table 7: L/R channel selection L/R CLK low CLK high GND Data valid High impedence Vdd High impedence Data valid ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O DocID018658 Rev 8 9/15 Application recommendations 6 MP45DT02 Application recommendations Figure 4: MP45DT02 electrical connections Vdd 10 µF 100 nF 1 2 5 3 ) s ( ct CODEC Dout TOP VIEW L/R 6 u d o C LK 4 r P e t e l o Figure 5: MP45DT02 electrical connections for stereo configuration s b O 2 3 10 0 n F MIC 2 1 6 D out Vd d 5 2 4 3 6 D out 5 4 C LK e t e ol Pr Vd d 10 µ F TOP VIE W u d o TO P VIE W ct MIC 1 1 ) (s s b O CODEC Power supply decoupling capacitors (100 nF ceramic, 10 µF ceramic) should be placed as near as possible to pin 6 of the device (common design practice). The L/R pin must be connected to Vdd or GND (refer to Table 7: "L/R channel selection"). 10/15 DocID018658 Rev 8 MP45DT02 7 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ® ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK is an ST trademark. 7.1 Soldering information The HLGA (4.72 x 3.76 x 1.25) mm package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020. Landing pattern and soldering recommendations are available at www.st.com. ) s ( ct Figure 6: Recommended soldering profile limits u d o r P e t e l o ) (s s b O t c u d o r P e t e l o Table 8: Recommended soldering profile limits Description Average ramp rate s b O Preheat Minimum temperature Maximum temperature Time (TSMIN to TSMAX) Ramp-up rate Parameter Pb free TL to TP 3 °C/sec max TSMIN TSMAX tS 150 °C 200 °C 60 sec to 120 sec TSMAX to TL Time maintained above liquidus temperature Liquidus temperature tL TL 60 sec to 150 sec 217 °C Peak temperature TP 260 °C max Time within 5 °C of actual peak temperature 20 sec to 40 sec Ramp-down rate 6 °C/sec max Time 25 °C (t25 °C) to peak temperature 8 minutes max DocID018658 Rev 8 11/15 Package information 7.2 MP45DT02 HLGA (4.72 x 3.76 mm) 6L (plastic) package information Figure 7: HLGA (4.72 x 3.76 mm) 6-lead package outline N4 A1 Pin 1 indicator KC K C R1 N3 D2 // L1 D1 D N1 E1 KE E2 E N2 KD 7*G 1 K ) s ( ct u d o L2 r P e t e l o Table 9: HLGA (4.72 x 3.76 mm) 6-lead package mechanical data bs Symbol Min. A1 1.125 D1 4.670 ) s ( t D2 c u d R1 E1 ro E2 P e t e l o s b O Typ. Max. 1.250 1.375 4.720 4.770 1.320 0.750 0.840 0.930 3.710 3.760 3.810 1.880 L1 3.200 3.300 3.400 L2 2.250 2.350 2.450 N1 1.550 1.650 1.750 N2 1.075 1.175 1.275 N3 1.350 1.450 1.550 N4 0.865 0.965 1.065 G1 0.810 0.910 1.010 K 12/15 -O mm. 0.050 DocID018658 Rev 8 8287552_A MP45DT02 7.3 Package information HLGA (4.72 x 3.76 mm) 6L (metal) package information Figure 8: HLGA (4.72 x 3.76 mm) 6-lead package outline and mechanical data ) s ( ct u d o r P e t e l o Dimensions are in millimeter unless otherwise specified General Tolerance is +/-0.15mm unless otherwise spe cified s b O OUTER DIMENSIONS ITEM L e n g th [L ] W i d t h [W ] H e ig h t [ H ] ) (s DIMENSION [mm ] 4 .7 2 3 .7 6 1 .2 5 ct u d o TOL ERANCE [mm ] ± 0 .1 ± 0 .1 ± 0 .1 8499123_A Note: The MEMS microphone metal cap can exhibit some level of variation in color when the device is subjected to a thermal process. r P e t e l o s b O DocID018658 Rev 8 13/15 Revision history 8 MP45DT02 Revision history Table 10: Document revision history Date Revision Changes 28-Mar-2011 1 Initial release 21-Oct-2011 2 Added max. peak temperature TP to Added min. and max. sensitivity So to Table 3: "Acoustic and electrical characteristics" 01-Mar-2012 3 Document status promoted from preliminary to production data Updated SNR to 61 dB ("Description" and Table 3: "Acoustic and electrical characteristics") 07-May-2012 4 Added VIOL, VIOH to Table 3: "Acoustic and electrical characteristics" 05-Jul-2012 5 Added Section 4: "Sensing element" 21-Mar-2014 6 Added new package "Figure 8: "HLGA (4.72 x 3.76 mm) 6-lead package outline and mechanical data" 17-Jun-2014 7 Updated "Figure 3: Typical frequency response normalized at 1 kHz" 26-Jan-2016 8 Added footnote concerning disable time to Table 5: "Timing characteristics" u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 14/15 ) s ( ct DocID018658 Rev 8 MP45DT02 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. 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All other product or service names are the property of their respective owners. t e l o Information in this document supersedes and replaces information previously supplied in any prior versions of this document. s b O © 2016 STMicroelectronics – All rights reserved ) (s t c u d o r P e t e l o s b O DocID018658 Rev 8 15/15