MSS40-1200

MSS40, MSS50 Back to back SCR module Table 1. Main features Symbol Value Unit IT(RMS) 55 and 70 A VDRM/VRRM 800 and 1200 V IGT 50 mA G2 A2 A1 G1 Description ISOTOP Packaged in ISOTOP modules, the MSS40 / MSS50 Series is based on two back-to-back SCR configurations, providing high noise immunity. They are suitable for high power applications such as solid state relays, heating control systems, welding equipment, motor control circuits... Table 2. e t le The compactness of the ISOTOP package allows high power density and optimized power bus connections. Thanks to their internal ceramic pad, they provide high voltage insulation (2500 VRMS), complying with UL standards (File ref: E81734). Figure 1. o r P e 1: Thyristor 2 Anode (A2) 2: Thyristor 2 Gate (G2) 3: Thyristor 1 Anode (A1) 4: Thyristor 2 Gate (G1) t e l o s b O July 2007 ) s ( ct Pin connections du 4 o r P Order codes Part numbers MSS40-1200 MSS50-800 MSS50-800 MSS50-1200 MSS50-1200 G1 3 A1 1 Marking MSS40-1200 so b O - c u d ) s t( A2 2 G2 Rev 4 1/7 www.st.com 7 Characteristics MSS40, MSS50 1 Characteristics Table 3. Absolute ratings (limiting values) Value Symbol Parameter Unit VDRM/VRRM Repetitive peak off-state voltage IT(RMS) ITSM 2t I 1200 800 1200 Tc = 80° C RMS on-state current 55 Tc = 85° C Non repetitive surge peak on-state current tp = 16.7 ms I2t tp = 10 ms Tj = 25° C Tj = 25° C tp = 20 ms Value for fusing 420 630 400 600 A 800 1800 A2S F = 120 Hz Tj = 125° C 50 IGM Peak gate current tp = 20 µs Tj = 125° C 4 Tj = 125° C 1 Average gate power dissipation Tstg Tj Storage junction temperature range Operating junction temperature range VRGM Maximum peak reverse gate voltage RL = 33 Ω (s) VGT VGD VD = VDRM RL = 3.3 kΩ IH IT = 500 mA Gate open IL IG = 1.2 IGT IDRM IRRM Table 5. - 40 to + 150 - 40 to + 125 od 5 W °C V ct b O - Unit MSS40 MSS50 MIN. 5 MAX. 50 MAX. 1.3 mA V V mA MAX. 120 mA Tj = 125° C MIN. 1000 V/µs Tj = 25° C MAX. Threshold voltage Tj = 125° C MAX. Dynamic resistance Tj = 125° C MAX. u d o r P e Gate open tp = 380 µs ITM = 100 A tp = 380 µs VDRM = VRRM Tj = 125° C Value 80 Tj = 25° C Tj = 125° C MAX. 1.7 1.7 0.85 11 V V 7 mΩ 20 µA 10 mA Thermal reistances Symbol Rth(j-c) uc 0.2 t e l o bs Rd A MIN. ITM = 80 A Vt0 ) s t( MAX. VD = 67 % VDRM VTM so Test Conditions VD = 12 V dV/dt Pr A/µs Electrical characteristics (Tj = 25° C, unless otherwise specified) Symbol IGT e t le V A 70 Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns Table 4. 2/7 MSS50 dI/dt PG(AV) O MSS40 Parameter Value MSS40 0.6 MSS50 0.45 Junction to case (AC) Unit ° C/W MSS40, MSS50 Figure 2. Characteristics Maximum average power Figure 3. dissipation versus average on-state current P(W) Average and DC on-state current versus case temperature IT(RMS)(A) 100 80 α = 180° 90 α = 180° MSS50 70 80 60 70 MSS40 MSS50 MSS40 60 50 50 40 40 30 30 180° 20 10 20 α α 10 IT(RMS)(A) Tcase(°C) 0 0 0 10 Figure 4. 20 30 40 50 60 70 0 80 Relative variation of thermal impedance versus pulse duration 25 Figure 5. 50 2.5 2.0 e t le 0.5 1.5 so 1.0 0.2 b O 0.5 tp(s) 1E-2 Figure 6. 1E-1 s b O 600 MSS40 150 ) s t( c u d o r P IGT Tj(°C) 0.0 1E+1 -40 t c u d o r P e -20 0 20 40 60 80 100 120 140 160 Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms, and corresponding values of I2t 2 2 ITSM(A), I t (A s) 5000 MSS50 500 125 IH & IL Surge peak on-state current versus Figure 7. number of cycles t e l o ITSM(A) 700 (s) 1E+0 100 Relative variation of gate trigger current and holding current versus junction temperature IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] K=[Zth(j-c)/Rth(j-c)] 1.0 0.1 1E-3 75 Tj initial = 25°C ITSM t=20ms One cycle Non repetitive Tj initial=25°C 400 1000 MSS50 Repetitive TC=85°C 300 MSS50 I2t MSS40 200 dI/dt limitation: 50A/µs 100 MSS40 Repetitive TC=80°C 0 1 Number of cycles 10 100 tp(ms) 100 1000 0.01 0.10 1.00 10.00 3/7 Ordering information scheme Figure 8. MSS40, MSS50 On-state characteristics (maximum Figure 9. values) (MSS40) ITM(A) On-state characteristics (maximum values) (MSS50) ITM(A) 500 1000 Tj max.: Vt0=0.85V Rd=11mΩ Tj max.: Vt0=0.85V Rd=7mΩ 100 Tj=max 100 Tj=max Tj=25°C Tj=25°C VTM(V) VTM(V) 10 10 0.0 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.0 1.0 2.0 4.0 Ordering information scheme c u d Figure 10. Ordering information scheme SCR Module series Current 40 = 55 A 50 = 70 A ) s ( ct Voltage 800 = 800 V 1200 = 1200 V u d o r P e t e l o s b O 4/7 3.0 o s b O - e t le o r P MSS 40 - 800 5.0 ) s t( 6.0 MSS40, MSS50 3 Package information Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.9 Nm (max. 1.2 Nm) for the 6 x M4 screws (2 x M4 screws recommended for mounting the package on the heatsink and the 4 provided screws). ● The screws supplied with the package are adapted for mounting on a board (or other types of terminals) with a thickness of 0.6 mm min. and 2.2 mm max. Table 6. ISOTOP dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. A 11.80 12.20 0.465 A1 8.90 9.10 B 7.8 8.20 C 0.75 C2 1.95 E G2 A C 0.030 0.033 2.05 0.077 0.081 37.80 38.20 1.488 1.504 so 31.50 31.70 1.240 1.248 E 25.15 25.50 0.990 1.004 E1 23.85 24.15 0.939 0.951 e t le F D D1 ) s ( ct S B u d o r P e s b O t e l o ØP G1 E1 b O G D1 0.358 0.85 C2 D 0.480 0.323 E2 P1 ) s t( 0.307 A1 F1 od uc 0.350 Max. E2 Pr 24.80 typ. 0.976 typ. G 14.90 15.10 0.587 0.594 G1 12.60 12.80 0.496 0.504 G2 3.50 4.30 0.138 0.169 F 4.10 4.30 0.161 0.169 F1 4.60 5.00 0.181 0.197 P 4.00 4.30 0.157 0.69 P1 4.00 4.40 0.157 0.173 S 30.10 30.30 1.185 1.193 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information 4 MSS40, MSS50 Ordering information Table 7. 5 Ordering information Part number Marking MSS40-1200 MSS40-1200 MSS50-800 MSS50-800 MSS50-1200 MSS50-1200 Package Weight Base qty Delivery mode ISOTOP 27 g (without screws) 10 (with screws) Tube Revision history Table 8. Revision history Changes Revision Sep-2000 3 Last release. 11-Jul-2007 4 Reformated to current standards. Removed MSS40-800 product. c u d e t le ) s ( ct u d o r P e t e l o s b O 6/7 ) s t( Date o s b O - o r P MSS40, MSS50 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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