P0102BL5AA4

P010XX Sensitive standard SCRs up to 0.8 A Datasheet − production data Description A G A K KA K G G A SOT-223 (P0102xN) TO-92 (P010xxA) Thanks to highly sensitive triggering levels, the P010XX SCR series is suitable for all applications where available gate current is limited, such as ground fault circuit interrupters, pilot circuits in solid state relays, stand-by mode power supplies, smoke and alarm detectors. Available in through-hole or surface mount packages, the voltage capability of this series has been upgraded since its introduction and is now available up to 600 V. A Table 1. Device summary G K SOT23-3L (P010xxL) Symbol Value Unit IT(RMS) up to 0.8 A VDRM/VRRM up to 600 V IGT From 5 to 200 µA Features • On-state rms current, 0.8 A • Repetitive peak off-state voltage up to 600 V • Triggering gate current from 5 to 200 µA • ECOPACK®2 compliant component April 2014 This is information on a product in full production. DocID15197 Rev 2 1/12 www.st.com Characteristics 1 P010xx Characteristics Table 2. Absolute ratings (limiting values) P010xxA and P010xxN Symbol Parameter IT(RMS) On-state rms current (180° conduction angle) IT(AV) Average on-state current (180° conduction angle) ITSM Non repetitive surge peak on-state current I²t TO-92 Tl = 55 °C SOT-223 Tamb = 70 °C TO-92 Tl = 55 °C SOT-223 Tamb = 70 °C tp = 8.3 ms tp = 10 ms Value Unit 0.8 A 0.5 A 8 Tj = 25 °C A 7 I²t value for fusing tp = 10 ms Tj = 25 °C 0.24 A2S dI/dt Critical rate of rise of on-state current IG = 2 x IGT, tr ≤ 100 ns F = 60 Hz Tj = 125 °C 50 A/µs IGM Peak gate current tp = 20 µs Tj = 125 °C 1 A Tj = 125 °C 0.1 W - 40 to + 150 - 40 to + 125 °C Value Unit PG(AV) Tstg Tj Average gate power dissipation Storage junction temperature range Operating junction temperature range Table 3. Absolute ratings (limiting values) P010xxL Symbol Parameter IT(RMS) On-state rms current (180° conduction angle) Tamb = 36 °C 0.25 A IT(AV) Average on-state current (180° conduction angle) Tamb = 36 °C 0.16 A ITSM Non repetitive surge peak on-state current I²t tp = 8.3 ms tp = 10 ms 7 Tj = 25 °C A 6 I²t value for fusing tp = 10 ms Tj = 25 °C 0.18 A2S dI/dt Critical rate of rise of on-state current IG = 2 x IGT, tr ≤ 100 ns F = 60 Hz Tj = 125 °C 50 A/µs IGM Peak gate current tp = 20 µs Tj = 125 °C 0.5 A Tj = 125 °C 0.02 W - 40 to + 150 - 40 to + 125 °C PG(AV) Tstg Tj 2/12 Average gate power dissipation Storage junction temperature range Operating junction temperature range DocID15197 Rev 2 P010xx Characteristics Table 4. Electrical characteristics(1) P010xxA and P010xxN Symbol IGT VGT Test conditions VD = 12 V, RL = 140 Ω Value Unit Max. 200 µA Max. 0.8 V Min. 0.1 V VGD VD = VDRM, RL = 3.3 kΩ, RGK = 1 kΩ VRG IRG = 10 µA Min. 8 V IH IT = 50 mA, RGK = 1 kΩ Max. 5 mA IL IG = 1 mA, RGK = 1 kΩ Max. 6 mA Tj = 125 °C dV/dt VD = 67% VDRM, RGK = 1 kΩ Tj = 125 °C Min. 75 V/µs VTM ITM = 1.6 A, tp = 380 µs Tj = 25 °C Max. 1.95 V Vt0 Threshold voltage Tj = 125 °C Max. 0.95 V Rd Dynamic resistance Tj = 125 °C Max. 600 mΩ IDRM IRRM VDRM = VRRM = 400 V R GK = 1 kΩ VDRM = VRRM = 600 V R GK = 1 kΩ VDRM = VRRM RGK = 1 kΩ 1 Tj = 25 °C 10 Max. Tj = 125 °C µA 100 1. Tj = 25 °C, unless otherwise specified Table 5. Electrical characteristics (1) P010xxL Symbol IGT VGT Test conditions Max. VD = 12 V, RL = 140 Ω P0102xL P0109AL Unit 200 1 µA Max. 0.8 V Min. 0.1 V VGD VD = VDRM, RL = 3.3 kΩ, RGK = 1 kΩ VRG IRG = 10 µA Min. 8 V IH IT = 50 mA, RGK = 1 kΩ Max. 6 mA IL IG = 1 mA, R GK = 1 kΩ Max. 7 mA Tj = 125 °C dV/dt VD = 67% VDRM, R GK = 1 kΩ Tj = 125 °C Min. VTM ITM = 0.4 A, tp = 380 µs Tj = 25 °C Max. 1.7 V Vt0 Threshold voltage Tj = 125 °C Max. 1.0 V Rd Dynamic resistance Tj = 125 °C Max. 1000 mΩ IDRM IRRM VDRM = VRRM Tj = 25 °C Tj = 125 °C 200 100 V/µs 1 Max. µA 100 1. Tj = 25 °C, unless otherwise specified DocID15197 Rev 2 3/12 12 Characteristics P010xx Table 6. Electrical device summary Voltage Order code 100 V 200 V 400 V Sensitivity Package Packing mode 600 V P0102AA 1AA3 X 200 µA TO-92 Bulk P0102AA 5AL3 X 200 µA TO-92 Tape and reel 13 inch P0102AL 5AA4 X 200 µA SOT23-3L Tape and reel 7 inch P0102BA 1AA3 X 200 µA TO-92 Bulk P0102BL 5AA4 X 200 µA SOT23-3L Tape and reel 7 inch P0102DA 1AA3 X 200 µA TO-92 Bulk P0102DA 2AL3 X 200 µA TO-92 Ammopack P0102DA 5AL3 X 200 µA TO-92 Tape and reel 13 inch X 200 µA SOT-223 Tape and reel 7 inch P0102DN 5AA4 X P0102MA 1AA3 X 200 µA TO-92 Bulk P0102MN 5AA4 X 200 µA SOT-223 Tape and reel 7 inch 1 µA SOT23-3L Tape and reel 7 inch P0109AL 5AA4 X P0109DA 1AA3 X 1 µA TO-92 Bulk P0109DA 5AL3 X 1 µA TO-92 Tape and reel 13 inch Table 7. Thermal resistance Symbol Parameter Rth(j-a) Junction to case (DC) Rth(j-t) Junction to tab (DC) Rth(j-a) Junction to ambient (DC) Rth(j-a) S(1) Junction to ambient (mounted on FR4 with recommended pad layout) 1. S = Copper surface under tab. 4/12 =5 cm 2 DocID15197 Rev 2 Maximum Unit TO-92 80 °C/W SOT-223 30 °C/W TO-92 150 SOT-223 60 SOT23-3L 400 °C/W °C/W P010xx Characteristics Figure 1. Maximum average power dissipation versus average on-state current P010xxA and P010xxN Figure 2. Maximum average power dissipation versus average on-state current P010xxL P(W) P(W) 1.0 0.9 0.30 0.28 0.26 0.24 0.22 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 α = 180° 0.8 0.7 0.6 0.5 0.4 0.3 360° 0.2 0.1 IT(AV)(A) α 0.0 0.0 0.1 0.2 0.3 0.4 0.5 360° IT(AV)(A) 0.00 0.6 Figure 3. Average and DC on-state current versus lead temperature P010xxA and P010xxN α = 180° 0.02 0.04 0.06 0.08 α 0.10 0.12 0.14 0.16 0.18 Figure 4. Average and DC on-state current versus ambient temperature P010xxA and P010xxN IT(AV)(A) IT(AV)(A) 1.1 1.2 D.C. (SOT-223) 1.0 1.1 0.8 Device mounted on FR4 with recomended pad layout for SOT-223 D.C. (SOT-223) 1.0 0.9 0.9 D.C. (TO-92) 0.8 0.7 0.7 0.6 0.5 D.C. (TO-92) 0.6 α = 180° (SOT-223) α = 180° (SOT-223) 0.5 0.4 0.4 0.3 0.3 α = 180° (TO-92) 0.2 α = 180° (TO-92) 0.2 0.1 0.1 Tlead(°C) Tamb(°C) 0.0 0.0 0 25 50 75 100 125 0 DocID15197 Rev 2 25 50 75 100 125 5/12 12 Characteristics P010xx Figure 5. Average and DC on-state current versus case temperature P010xxL Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration IT(AV)(A) K=[Zth(j-a)/Rth(j-a)] 0.30 1.00 0.25 D.C. SOT23-3L 0.20 α = 180° TO-92 0.15 0.10 SOT-223 0.10 0.05 tp(s) Tcase(°C) 0.00 0.01 0 25 50 75 100 125 Figure 7. Gate trigger, holding, and latching currents with gate trigger voltage versus junction temperature 6.0 1E-2 1E+0 1E-1 1E+1 5E+2 1E+2 Figure 8. Relative variation of holding current versus gate-cathode resistance IH[RGK] / IH[RGK=1kΩ] IGT, VGT , IH, IL[T j ] / I GT, VGT, iH, i L[T j=25 °C] 20 Relative variations Typical values 5.0 Tj = 25°C 18 16 14 4.0 12 IGT 3.0 2.0 Typical values 10 8 IH and IL (RGK =1 KΩ) 1.0 6 4 VGT Tj(°C) 0.0 -40 -20 0 2 20 40 60 80 100 120 140 Figure 9. Relative variation of dV/dt immunity versus gate-cathode resistance RGK(kΩ) 0 1E-2 1E-1 1E+0 1E+1 Figure 10. Relative variation of dV/dt immunity versus gate-cathode capacitance dV/dt[CGK] / dV/dt[RGK=1kΩ] dV/dt[RGK] / dV/dt[RGK=1kΩ] 10 10.0 VD = 0.67 x VDRM Tj = 125°C RGK = 1kΩ Tj = 125°C VD = 0.67 x VDRM 8 6 Typical values 1.0 4 Typical values 2 RGK(kΩ) 0.1 6/12 CGK(nF) 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 DocID15197 Rev 2 1 2 3 4 5 6 7 P010xx Characteristics Figure 11. Surge peak on-state current versus number of cycles Figure 12. Non-repetitive surge peak on-state current and corresponding value of I²t ITSM(A), I2t (A2s) ITSM(A) 100.0 8 Tj initial = 25°C 7 ITSM tp=10ms 6 One cycle 10.0 5 Non repetitive Tj initial=25°C 4 3 For a sinusoidal pulse with width tp < 10 ms Repetitive Tamb=25°C 1.0 2 I2t 1 tp(ms) Number of cycles 0 1 10 0.1 100 1000 Figure 13. On-state characteristics P010xxA, P010xxN 0.01 10.00 1.00 0.10 Figure 14. On-state characteristics P010xxL ITM(A) ITM(A) 1E+1 1E+1 Tj max.: Vt0=1.0V Rd=1Ω Tj max.: Vt0=0.95V Rd=600mΩ Maximum values Tj=max 1E+0 Tj=max 1E+0 Maximum values Tj=25°C Tj=25°C 1E-1 1E-1 VTM(V) VTM(V) 1E-2 1E-2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.5 4.5 Figure 15. Thermal resistance junction to ambient versus copper surface under tab P010xxN 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Figure 16. Thermal resistance junction to ambient versus copper surface under tab P010xxL Rth(j-a)(°C/W) Rth(j-a)(°C/W) 130 120 110 100 90 80 70 60 50 40 30 20 10 0 500 Epoxy printed circuit board FR4, copper thickness = 35 µm Epoxy printed circuit board FR4, copper thickness = 35 µm 400 300 200 100 S(cm²) S(cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 DocID15197 Rev 2 10 20 30 40 50 60 70 80 90 100 7/12 12 Package information 2 P010xx Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 8. TO-92 dimensions dimensions Ref Millimeters Min Typ Inches Max Min Typ Max A A a B 1.35 B C 4.70 C D F E 0.053 0.185 2.54 0.100 D 4.40 0.173 E 12.70 0.500 F 3.70 0.146 a 0.50 0.019 Table 9. SOT-223 dimensions Dimensions Ref. V A A1 Millimeters Min. c Typ. A B A1 e1 Inches Max. Min. Typ. Max. 1.80 0.071 0.02 0.10 0.001 0.004 B 0.60 0.70 0.85 0.024 0.027 0.033 B1 2.90 3.00 3.15 0.114 0.118 0.124 c 0.24 0.26 0.35 0.009 0.010 0.014 D(1) 6.30 6.50 6.70 0.248 0.256 0.264 D B1 4 H E 1 2 e 3 e 2.3 0.090 e1 4.6 0.181 E(1) 3.30 3.50 3.70 0.130 0.138 0.146 H 6.70 7.00 7.30 0.264 0.276 0.287 V 10° max 1. Do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm (0.006inches) 8/12 DocID15197 Rev 2 P010xx Package information Figure 17. Footprint (dimensions in mm) 3.25 1.32 5.16 7.80 1.32 2.30 0.95 Table 10. SOT23-3L dimensions Dimensions Ref. Millimeters Inches A Min. Max. Min. Max. A 0.89 1.4 0.035 0.055 A1 0 0.1 0 0.004 B 0.3 0.51 0.012 0.02 c 0.085 0.18 0.003 0.007 D 2.75 3.04 0.108 0.12 e 0.85 1.05 0.033 0.041 e1 1.7 2.1 0.067 0.083 E 1.2 1.6 0.047 0.063 H 2.1 2.75 0.083 0.108 E e B D e1 S A1 L c H L S 0.6 typ. 0.35 0.65 0.024 typ. 0.014 0.026 Figure 18. Footprint (dimensions in mm) 0.95 0.61 1.26 0.73 3.25 DocID15197 Rev 2 9/12 12 Ordering information 3 P010xx Ordering information Figure 19. Ordering information scheme P 01 0x x x Blank xAxx Sensitive SCR series Current 01 up to 0.8 A Sensitivity 02 = 200 µA 09 = 1 µA Voltage A = 100 V B = 200 V D = 400 V M = 600 V Package A = TO-92 L = SOT23-3L N = SOT-223 Packing mode 1AA3 = Bulk 2AL3 = Ammopack 5AL3 = Tape and reel 13 inch 5AA4 = Tape and reel 7 inch Table 11. Ordering information 10/12 Order code Marking Package Weight Base qty Packing mode P0102AA 1AA3 P0102 AA TO-92 0.2 g 2500 Bulk P0102AA 5AL3 P0102 AA TO-92 0.2 g 2000 Tape and reel 13 inch P0102AL 5AA4 P2A SOT23-3L 0.01 g 3000 Tape and reel 7 inch P0102BA 1AA3 P0102 BA TO-92 0.2 g 1000 Bulk P0102BL 5AA4 P2B SOT23-3L 0.01 g 3000 Tape and reel 7 inch P0102DA 1AA3 P0102 DA TO-92 0.2 g 2500 Bulk P0102DA 2AL3 P0102 DA TO-92 0.2 g 2000 Ammopack P0102DA 5AL3 P0102 DA TO-92 0.2 g 2000 Tape and reel 13 inch P0102DN 5AA4 P2D SOT-223 0.11 g 3000 Tape and reel 7 inch P0102MA 1AA3 P0102 MA TO-92 0.2 g 2500 Bulk P0102MN 5AA4 P2M SOT-223 0.11 g 2000 Tape and reel 7 inch P0109AL 5AA4 P9A SOT23-3L 0.01 g 3000 Tape and reel 7 inch P0109DA 1AA3 P0109 DA TO-92 0.2 g 2500 Bulk P0109DA 5AL3 P0109 DA TO-92 0.2 g 2000 Tape and reel 13 inch DocID15197 Rev 2 P010xx 4 Revision history Revision history Table 12. Document revision history Date Revision Changes 24-Nov-2008 1 First issue. 01-Apr-2014 2 Added VGT in Figure 7, updated Figure 11 and Table 9 and reformatted to current standard. DocID15197 Rev 2 11/12 12 P010xx Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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