PD54008L-E

PD54008L-E RF power transistors The LdmoST Plastic family Features ■ ■ ■ ■ ■ ■ ■ Excellent thermal stability Common source configuration Broadband performances POUT = 8W with 15 dB gain @ 500MHz New leadless plastic package EDS protection Supplied in tape & reel of 3K units In compliance with the 2002/93/EC european directive PowerFLAT™ (5x5) Description The PD54008L-E is a common source N-Channel, enhancement-mode lateral FieldEffect RF power transistor. It is designed for high gain, broad band commercial and industrial applications. It operates at 7 V in common source mode at frequencies of up to 1 GHz. PD54008L-E boasts the excellent gain, linearity and reliability of STH1LV latest LDMOS technology mounted in the innovative leadless SMD plastic package, PowerFLAT™. PD54008L-E’s superior linearity performance makes it an ideal solution for portable radio. Pin connection Top view Order codes Part Number PD54008L-E Marking 54008 Package PowerFLAT (5x5) Packaging Tape & Reel January 2007 Rev 2 1/15 www.st.com 15 PD54008L-E Contents 1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 1.2 1.3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 3 Impedances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.1 Typical performance (Broadband) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 5 6 Test circuit schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2/15 PD54008L-E Electrical data 1 1.1 Electrical data Maximum ratings Table 1. Symbol V(BR)DSS VGS ID PDISS TJ TSTG Drain source voltage Gate-source voltage Drain current Power dissipation (tCASE = 70°C) Maximum operating junction temperature Storage temperature Absolute maximum ratings (TCASE = 25°C) Parameter Value 25 -0.5 to +15 5 26.7 150 -65 to +150 Unit V V A W °C °C 1.2 Thermal data Table 2. Symbol RthJC Thermal data Parameter Junction to case thermal resistance Value 3 Unit °C/W 3/15 Electrical data PD54008L-E 1.3 Electrical characteristics Table 3. Symbol IDSS IGSS VGS(Q) VDS(ON) CISS COSS CRSS VGS = 0V VGS = 5V VDS = 10V VGS = 10V VGS = 0V VGS = 0V VGS = 0V Static (TCASE = 25°C) Test conditions VDS = 25V VDS = 0V ID = 50mA ID = 0.5A VDS = 7.5V VDS = 7.5V VDS = 7.5V f = 1MHz f = 1MHz f = 1MHz 2.0 0.09 80 60 6.6 Min Typ Max 1 1 5.0 Unit µA µA V V pF pF pF Table 4. Symbol P1dB GPS ηD Load Mismatch Dynamic Test conditions VDD = 7.5 V VDD = 7.5 V VDD = 7.5 V VDD = 7.5 V IDQ = 200 mA IDQ = 200 mA POUT = 8 W IDQ = 200 mA POUT = 8 W IDQ = 200 mA POUT = 8W f = 500MHz f = 500MHz f = 500MHz f = 500MHz Min. 8 15 50 20:1 Typ. Max. Unit W dB % VSW R All Phase Angles Table 5. ESD protection characteristics Test conditions Human body model Machine model Class 2 M3 Table 6. Moisture sensitivity level Test methodology J-STD-020B Rating MSL 3 4/15 PD54008L-E Impedances 2 Figure 1. Impedances Impedance data schematic D ZDL Typical Input Impedance Typical Drain Load Impedance G Zin S SC13140 Table 7. f Impedance data (1) ZIN (Ω) 1.12 - j 2.02 1.3 - j 2.01 1.66 - j 2.55 ZDL (Ω) 2.01 + j 0.13 1.84 + j 0.7 1.66 + j 1.51 480MHz 500MHz 520MHz 1. In Broadband amplifier 5/15 Typical performance PD54008L-E 3 Typical performance Power gain vs output power Figure 3. 80 Figure 2. 20 19 18 17 Efficiency vs output power Idq = 200 mA 70 60 Idq = 150 mA 16 Gp (dB) 15 14 13 12 11 10 0 1 2 3 4 5 Pout (W) 6 7 8 9 10 f = 500 MHz Vds = 7.5 V Nd (%) 50 40 30 20 10 0 0 1 2 3 4 5 Pout (W) 6 7 8 9 10 Idq = 200 mA f = 500 MHz Vds = 7.5 V Idq = 100 mA Figure 4. 0 Return loss vs output power Figure 5. 1000 Capacitance vs supply voltage f = 1 MHz -5 -10 RL (dB) 100 C (pF) Ciss Coss -15 -20 Idq = 200 mA f = 500 MHz Vds = 7.5 V 10 Crss -25 -30 0 1 2 3 4 5 Pout (W) 6 7 8 9 10 1 0 1 2 3 4 5 Vds (V) 6 7 8 9 6/15 PD54008L-E Typical performance 3.1 14 12 10 8 6 4 2 Typical performance (Broadband) Power gain vs frequency Figure 7. 70 60 Figure 6. Efficiency vs frequency 50 40 Gp (dB) Nd (%) 30 20 10 Idq = 150 mA Pin = 26 dBm 0 470 480 490 500 f (MHz) 510 520 530 0 470 480 490 500 f (MHz) 510 Idq = 150 mA Pin = 26 dBm 520 530 Figure 8. 0 Return loss vs frequency -4 -8 RL (dB) -12 -16 Idq = 150 mA Pin = 26 dBm -20 470 480 490 500 f (MHz) 510 520 530 7/15 Test circuit schematic PD54008L-E 4 Figure 9. Test circuit schematic Internal schematic Table 8. Test circuit component part list Description Ferrite bead 300 pF, 100 mil ATC 1 -:- 20 pF Trimmer cap - JOHANSON 0.8 -:- 10 pF Trimmer cap - JOHANSON 36 pF, 100 mil ATC 51 pF, 100 mil ATC 62 pF, 100 mil ATC 150 pF, 100 mil CHIP CAP 1 nF, 100 mil CHIP CAP 1000 pF, 100 mil CHIP CAP 0.1 nF, 100 mil CHIP CAP 10 µF 50 V Electrolytic Capacitor 15 pF, 100 mil ATC 43nH, Coilcraft 33 KΩ, 1W CHIP Resistor 1 KΩ, 1W CHIP Resistor 15 Ω, 1W CHIP Resistor 0.49" X 0.080" MICROSTRIP 1.024" X 0.080" MICROSTRIP 0.079" X 0.080" MICROSTRIP 0.24" X 0.223" MICROSTRIP Component B1, B2 C1, C16 C2, C3, C4, C13,C14 C15 C5 C6 C7 C8, C17 C9 C10, C18 C11, C19 C12, C20 C21 L R1 R3 R4 Z1 Z2 Z3 Z4 Z5 0.079" X 0.223" MICROSTRIP 8/15 PD54008L-E Table 8. Test circuit component part list Z6 Z7 Z8 Z9 Z10 Z11 N1, N2 Board 0.138" X 0.223" MICROSTRIP 0.259" X 0.223" MICROSTRIP 0.079" X 0.080" MICROSTRIP 0.413" X 0.080" MICROSTRIP 0.756" X 0.080" MICROSTRIP 0.61" X 0.080" MICROSTRIP Type N Flange Mount Test circuit schematic ROGER, ULTRA LAM 2000 THK 0.030", εr = 2.55 2oz. ED cu SIDES 9/15 Package mechanical data PD54008L-E 5 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/15 PD54008L-E Table 9. Dim. Min. A A1 A3 AA b c D d E E2 e f g h 2.49 0.15 0.43 0.64 Typ. 0.90 0.02 0.24 0.25 0.51 0.71 5.00 0.30 5.00 2.57 1.27 3.37 0.74 0.21 2.64 0.098 0.35 0.58 0.79 0.006 0.017 0.025 Max. 1.00 0.05 Min. Package mechanical data PowerFLAT™ mechanical data mm inch Typ. 0.035 0.001 0.009 0.01 0.020 0.028 0.197 0.011 0.197 0.101 0.050 0.132 0.03 0.008 0.104 0.014 0.023 0.031 Max. 0.039 0.002 Figure 10. PowerFLAT™ package dimensions 11/15 Package mechanical data PD54008L-E Table 10. DIM. PowerFLAT™ tape & reel dimensions mm. Min. Typ 5.25 5.25 1.1 Max. 5.35 5.35 1.2 Ao Bo Ko 5.15 5.15 1.0 Figure 11. PowerFLAT™ tape & reel 12/15 PD54008L-E Table 11. Recommended footprint Package mechanical data 13/15 Revision history PD54008L-E 6 Revision history Table 12. Date 19-Jan-2006 23-Jan-2007 Revision history Revision 1 2 First Issue Document has been reformatted Changes 14/15 PD54008L-E Please Read Carefully: Information in this document is provided solely in connection with ST products. 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