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PSD4235G2-A-90M

PSD4235G2-A-90M

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

  • 描述:

    PSD4235G2-A-90M - Flash In-System Programmable ISP Peripherals For 16-bit MCUs 5V Supply - STMicroel...

  • 数据手册
  • 价格&库存
PSD4235G2-A-90M 数据手册
PSD4235G2 Flash In-System Programmable (ISP) Peripherals For 16-bit MCUs (5V Supply) PRELIMINARY DATA FEATURES SUMMARY PSD provides an integrated solution to 16-bit MCU based applications that includes configurable memories, PLD logic and I/O: s Dual Bank Flash Memories – 4 Mbit of Primary Flash Memory (8 uniform sectors, 32K x 16) – 256 Kbit Secondary Flash Memory with 4 sectors – Concurrent operation: read from one memory while erasing and writing the other s s s s Programmable power management High Endurance: – 100,000 Erase/Write Cycles of Flash Memory – 1,000 EraseWrite Cycles of PLD – 15 Year Data Retention s Single Supply Voltage – 5V ±10% Memory Speed – 70ns Flash memory and SRAM access time s 64 Kbit SRAM (Battery Backed) PLD with macrocells – Over 3000 Gates of PLD: CPLD and DPLD – CPLD with 16 Output Macrocells (OMCs) and 24 Input Macrocells (IMCs) – DPLD – user defined internal chip select decoding Figure 1. Packages s Seven l/O Ports with 52 I/O pins – 52 individually configurable I/O port pins that can be used for the following functions: – MCU I/Os – PLD I/Os – Latched MCU address output – Special function l/Os – l/O ports may be configured as open-drain outputs TQFP80 (U) s In-System Programming (ISP) with JTAG – Built-in JTAG compliant serial port allows fullchip In-System Programmability – Efficient manufacturing allow easy product testing and programming – Use low cost FlashLINK cable with PC s Page Register – Internal page register that can be used to expand the microcontroller address space by a factor of 256 December 2001 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. 1/89 PSD4235G2 TABLE OF CONTENTS Summary Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 In-System Programming (ISP) via JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 In-Application Programming (IAP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 PSDsoft Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 PSD Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 PLDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 I/O Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 MCU Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 ISP via JTAG Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 In-System Programming (ISP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 In-Application Programming (IAP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Page Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Power Management Unit (PMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Development System. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 PSD Register Description and Address Offsets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Register Bit Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Detailed Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Memory Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Reading Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Programming Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Erasing Flash Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Flash Memory Sector Protect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Memory Select Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Page Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 2/89 PSD4235G2 Memory ID Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 PLDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Decode PLD (DPLD). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Complex PLD (CPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 MCU Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 I/O Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Port Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Ports A, B and C – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Port D – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Port E – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Port F – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Port G – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 PLD Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 PSD Chip Select Input (CSI, PD2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Power On Reset, Warm Reset and Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Programming In-Circuit using the JTAG Serial Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Initial Delivery State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 AC/DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Table. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Table. Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Table. DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Table. CPLD Combinatorial Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Table. CPLD Macrocell Synchronous Clock Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Table. CPLD Macrocell Asynchronous Clock Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Table. Input Macrocell Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Table. Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Table. Write Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Table. Port F Peripheral Data Mode Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Table. Port F Peripheral Data Mode Write Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Table. Reset (Reset)Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 Table. VSTBYON Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 Table. Program, Write and Erase Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 Table. ISC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Table. Power-down Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 3/89 PSD4235G2 Package Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Table. TQFP80 - 80 lead Plastic Quad Flatpack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Table. Pin Assignments – TQFP80 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Table. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 4/89 PSD4235G2 SUMMARY DESCRIPTION The PSD family of memory systems for microcontrollers (MCUs) brings In-System-Programmability (ISP) to Flash memory and programmable logic. The result is a simple and flexible solution for embedded designs. PSD devices combine many of the peripheral functions found in MCU based applications. PSD devices integrate an optimized Macrocell logic architecture. The Macrocell was created to address the unique requirements of embedded system designs. It allows direct connection between the system address/data bus, and the internal PSD registers, to simplify communication between the MCU and other supporting devices. Table 1. Pin Names PA0-PA7 PB0-PB7 PC0-PC7 PD0-PD3 PE0-PE7 PF0-PF7 PG0-PG7 AD0-AD15 CNTL0-CNTL2 RESET VCC VSS Port-A Figure 2. Logic Diagram VCC 8 PA0-PA7 8 PB0-PB7 3 CNTL0CNTL2 4 PSD4xxxGx PD0-PD3 8 PE0-PE7 8 RESET 8 PG0-PG7 PF0-PF7 8 PC0-PC7 Port-B Port-C 16 AD0-AD15 Port-D Port-E Port-F Port-G Address/Data Control Reset Supply Voltage Ground VSS AI04916 The PSD family offers two methods to program the PSD Flash memory while the PSD is soldered to the circuit board: In-System Programming (ISP) via JTAG, and In-Application Programming (IAP). In-System Programming (ISP) via JTAG An IEEE 1149.1 compliant JTAG In-System Programming (ISP) interface is included on the PSD enabling the entire device (Flash memories, PLD, configuration) to be rapidly programmed while soldered to the circuit board. This requires no MCU participation, which means the PSD can be programmed anytime, even when completely blank. The innovative JTAG interface to Flash memories is an industry first, solving key problems faced by designers and manufacturing houses, such as: First time programming. How do I get firmware into the Flash memory the very first time? JTAG is the answer. Program the blank PSD with no MCU involvement. Inventory build-up of pre-programmed devices. How do I maintain an accurate count of preprogrammed Flash memory and PLD devices based on customer demand? How many and what version? JTAG is the answer. Build your hardware with blank PSDs soldered directly to the board and then custom program just before they are shipped to the customer. No more labels on chips, and no more wasted inventory. Expensive sockets. How do I eliminate the need for expensive and unreliable sockets? JTAG is the answer. Solder the PSD directly to the circuit board. Program first time and subsequent times with JTAG. No need to handle devices and bend the fragile leads. 5/89 PSD4235G2 Figure 3. TQFP Connections 70 GND 69 VCC 68 PB7 80 PD1 79 PD0 67 PB6 66 PB5 65 PB4 64 PB3 63 PB2 62 PB1 PD2 1 PD3 2 AD0 3 AD1 4 AD2 5 AD3 6 AD4 7 GND 8 VCC 9 AD5 10 AD6 11 AD7 12 AD8 13 AD9 14 AD10 15 AD11 16 AD12 17 AD13 18 AD14 19 AD15 20 61 PB0 78 PE7 77 PE6 76 PE5 75 PE4 74 PE3 73 PE2 72 PE1 71 PE0 60 CNTL1 59 CNTL0 58 PA7 57 PA6 56 PA5 55 PA4 54 PA3 53 PA2 52 PA1 51 PA0 50 GND 49 GND 48 PC7 47 PC6 46 PC5 45 PC4 44 PC3 43 PC2 42 PC1 41 PC0 PG0 21 PG1 22 PG2 23 PG3 24 PG4 25 PG5 26 PG6 27 PG7 28 VCC 29 GND 30 PF0 31 PF1 32 PF2 33 PF3 34 PF4 35 PF5 36 PF6 37 PF7 38 RESET 39 CNTL2 40 AI04943 In-Application Programming (IAP) Two independent Flash memory arrays are included so that the MCU can execute code from one while erasing and programming the other. Robust product firmware updates in the filed are possible over any communication channel (CAN, Ethernet, UART, J1850, etc) using this unique architecture. Designers are relieved of these problems: Simultaneous read and write to Flash memory. How can the MCU program the same memory from which it executing code? It cannot. The PSD allows the MCU to operate the two Flash memory blocks concurrently, reading code from one while erasing and programming the other during IAP. Complex memory mapping. How can I map these two memories efficiently? A programmable Decode PLD (DPLD) is embedded in the PSD. The concurrent PSD memories can be mapped anywhere in MCU address space, segment by segment with extermely high address resolution. As an option, the secondary Flash memory can be swapped out of the system memory map when IAP is complete. A built-in page register breaks the MCU address limit. Separate Program and Data space. How can I write to Flash memory while it resides in Program space during field firmware updates? My 80C51XA will not allow it. The PSD provides means to reclassify Flash memory as Data space during IAP, then back to Program space when complete. 6/89 ADDRESS/DATA/CONTROL BUS PLD INPUT BUS PAGE REGISTER EMBEDDED ALGORITHM 16 SECTORS 4 MBIT PRIMARY FLASH MEMORY VSTDBY (PE6 ) POWER MANGMT UNIT Figure 4. PSD Block Diagram 8 CNTL0, CNTL1, CNTL2 SECTOR SELECTS FLASH DECODE PLD (DPLD) 82 SECTOR SELECTS SRAM SELECT PROG. PORT PORT A PERIP I/O MODE SELECTS CSIOP RUNTIME CONTROL AND I/O REGISTERS 8 EXT CS TO PORT C or F 16 OUTPUT MACROCELLS PORT A & B 24 INPUT MACROCELLS CLKIN PORT A ,B & C 64 KBIT BATTERY BACKUP SRAM 256 KBIT SECONDARY FLASH MEMORY (BOOT OR DATA) 4 SECTORS PROG. MCU BUS INTRF. PSDsoft Express PSDsoft Express, a software development tool from ST, guides you through the design process step-by-step making it possible to complete an embedded MCU design capable of ISP/IAP in just hours. Select your MCU and PSDsoft Express takes you through the remainder of the design with point and click entry, covering PSD selection, pin AD0 – AD15 PA0 – PA7 ADIO PORT PF0 – PF7 PROG. PORT 82 FLASH ISP CPLD (CPLD) PROG. PORT PORT B PB0 – PB7 Note: Additional address lines can be brought in to the device via Port A, B, C, D or F. PROG. PORT PORT C MACROCELL FEEDBACK OR PORT INPUT CLKIN PORT F PROG. PORT PORT D PC0 – PC7 PD0 – PD3 GLOBAL CONFIG. & SECURITY PLD, CONFIGURATION & FLASH MEMORY LOADER JTAG SERIAL CHANNEL PROG. PORT PORT E PE0 – PE7 PORT F PG0 – PG7 PROG. PORT PORT G CLKIN definitions, programmable logic inputs and outpus, MCU memory map definition, ANSI-C code generation for your MCU, and merging your MCU firmware with the PSD design. When complete, two different device programmers are supported directly from PSDsoft Express: FlashLINK (JTAG) and PSDpro. PSD4235G2 AI04990 7/89 PSD4235G2 PSD ARCHITECTURAL OVERVIEW PSD devices contain several major functional blocks. Figure 4 shows the architecture of the PSD device family. The functions of each block are described briefly in the following sections. Many of the blocks perform multiple functions and are user configurable. Memory Each of the memory blocks is briefly discussed in the following paragraphs. A more detailed discussion can be found in the section entitled “Memory Blocks“ on page 20. The 4 Mbit primary Flash memory is the main memory of the PSD. It is divided into 8 equallysized sectors that are individually selectable. The 256 Kbit secondary Flash memory is divided into 4 equally-sized sectors. Each sector is individually selectable. The 64 Kbit SRAM is intended for use as a scratch-pad memory or as an extension to the MCU SRAM. If an external battery is connected to the PSD’s Voltage Stand-by (VSTBY, PE6) signal, data is retained in the event of power failure. Each memory block can be located in a different address space as defined by the user. The access times for all memory types includes the address latching and DPLD decoding time. PLDs The device contains two PLD blocks, the Decode PLD (DPLD) and the Complex PLD (CPLD), as shown in Table 2, each optimized for a different function. The functional partitioning of the PLDs reduces power consumption, optimizes cost/performance, and eases design entry. The DPLD is used to decode addresses and to generate Sector Select signals for the PSD internal memory and registers. The DPLD has combinatorial outputs, while the CPLD can implement more general user-defined logic functions. The CPLD has 16 Output Macrocells (OMC) and 8 combinatorial outputs. The PSD also has 24 Input Macrocells (IMC) that can be configured as inputs to the PLDs. The PLDs receive their inputs from the PLD Input Bus and are differentiated by their output destinations, number of product terms, and Macrocells. The PLDs consume minimal power. The speed and power consumption of the PLD is controlled by the Turbo bit in PMMR0 and other bits in PMMR2. These registers are set by the MCU at run-time. There is a slight penalty to PLD propagation time when not in the Turbo mode. I/O Ports The PSD has 52 I/O pins divided among seven ports (Port A, B, C, D, E, F and G). Each I/O pin can be individually configured for different func8/89 tions. Ports can be configured as standard MCU I/ O ports, PLD I/O, or latched address outputs for MCUs using multiplexed address/data buses The JTAG pins can be enabled on Port E for InSystem Programming (ISP). Table 2. PLD I/O Name Decode PLD (DPLD) Complex PLD (CPLD) Inputs 82 82 Outputs 17 24 Product Terms 43 150 MCU Bus Interface The PSD easily interfaces easily with most 16-bit MCUs, either with multiplexed or non-multiplexed address/data buses. The device is configured to respond to the MCU’s control pins, which are also used as inputs to the PLDs. ISP via JTAG Port In-System Programming (ISP) can be performed through the JTAG signals on Port E. This serial interface allows complete programming of the entire PSD device. A blank device can be completely programmed. The JTAG signals (TMS, TCK, TSTAT, TERR, TDI, TDO) can be multiplexed with other functions on Port E. Table 3 indicates the JTAG pin assignments. In-System Programming (ISP) Using the JTAG signals on Port E, the entire PSD device (memory, logic, configuration) can be programmed or erased without the use of the MCU. Table 3. JTAG SIgnals on Port E Port E Pins PE0 PE1 PE2 PE3 PE4 PE5 TMS TCK TDI TDO TSTAT TERR JTAG Signal In-Application Programming (IAP) The primary Flash memory can also be programmed, or re-programmed, in-system by the MCU executing the programming algorithms out of the secondary Flash memory, or SRAM. The secondary Flash memory can be programmed the same way by executing out of the primary Flash memory. Table 4 indicates which programming methods can program different functional blocks of the PSD. PSD4235G2 Page Register The 8-bit Page Register expands the address range of the MCU by up to 256 times. The paged address can be used as part of the address space to access external memory and peripherals, or internal memory and I/O. The Page Register can also be used to change the address mapping of the Flash memory blocks into different memory spaces for IAP. Power Management Unit (PMU) The Power Management Unit (PMU) gives the user control of the power consumption on selected functional blocks based on system requirements. The PMU includes an Automatic Power-down (APD) Unit that turns off device functions during MCU inactivity. The APD Unit has a Power-down mode that helps reduce power consumption. The PSD also has some bits that are configured at run-time by the MCU to reduce power consumption of the CPLD. The Turbo bit in PMMR0 can be reset to 0 and the CPLD latches its outputs and goes to Stand-by mode until the next transition on its inputs. Additionally, bits in PMMR2 can be set by the MCU to block signals from entering the CPLD to reduce power consumption. See the section entitled “Power Management” on page 59 for more details. Table 4. Methods of Programming Different Functional Blocks of the PSD Functional Block Primary Flash Memory Secondary Flash memory PLD Array (DPLD and CPLD) PSD Configuration JTAG-ISP Yes Yes Yes Yes Device Programmer Yes Yes Yes Yes IAP Yes Yes No No 9/89 PSD4235G2 DEVELOPMENT SYSTEM The PSD family is supported by PSDsoft Express, a Windows-based software development tool (Windows-95, Windows-98, Windows-2000, Windows-NT). A PSD design is quickly and easily produced in a point and click environment. The designer does not need to enter Hardware Description Language (HDL) equations, unless desired, to define PSD pin functions and memory map information. The general design flow is shown in Figure 5. PSDsoft Express is available from our web site (the address is given on the back Figure 5. PSDsoft Express Development Tool Choose MCU and PSD Automatically configures MCU bus interface and other PSD attributes page of this data sheet) or other distribution channels. PSDsoft Express directly supports two low cost device programmers form ST: PSDpro and FlashLINK (JTAG). Both of these programmers may be purchased through your local distributor/ representative, or directly from our web site using a credit card. The PSD is also supported by thid party device programmers. See our web site for the current list. Define PSD Pin and Node Functions Point and click definition of PSD pin functions, internal nodes, and MCU system memory map Define General Purpose Logic in CPLD Point and click definition of combinatorial and registered logic in CPLD. Access HDL is available if needed C Code Generation GENERATE C CODE SPECIFIC TO PSD FUNCTIONS Merge MCU Firmware with PSD Configuration A composite object file is created containing MCU firmware and PSD configuration MCU FIRMWARE HEX OR S-RECORD FORMAT USER'S CHOICE OF MICROCONTROLLER COMPILER/LINKER *.OBJ FILE PSD Programmer PSDPro, or FlashLINK (JTAG) *.OBJ FILE AVAILABLE FOR 3rd PARTY PROGRAMMERS (CONVENTIONAL or JTAG-ISC) AI04919 10/89 PSD4235G2 PIN DESCRIPTION Table 5 describes the signal names and signal functions of the PSD. Those that have multiple Table 5. Pin Description (for the TQFP package) Pin Name Pin Type Description This is the lower Address/Data port. Connect your MCU address or address/data bus according to the following rules: 1. If your MCU has a multiplexed address/data bus where the data is multiplexed with the lower address bits, connect AD0-AD7 to this port. 2. If your MCU does not have a multiplexed address/data bus, connect A0-A7 to this port. 3. If you are using an 80C51XA in burst mode, connect A4/D0 through A11/D7 to this port. ALE or AS latches the address. The PSD drives data out only if the read signal is active and one of the PSD functional blocks has been selected. The addresses on this port are passed to the PLDs. This is the upper Address/Data port. Connect your MCU address or address/data bus according to the following rules: 1. If your MCU has a multiplexed address/data bus where the data is multiplexed with the upper address bits, connect A8-A15 to this port. 2. If your MCU does not have a multiplexed address/data bus, connect A8-A15 to this port. 3. If you are using an 80C51XA in burst mode, connect A12/D8 through A19/D15 to this port. ALE or AS latches the address. The PSD drives data out only if the read signal is active and one of the PSD functional blocks has been selected. The addresses on this port are passed to the PLDs. The following control signals can be connected to this pin, based on your MCU: 1. WR – active Low, Write Strobe input. 2. R_W – active High, read/active Low write input. 3. WRL – active Low, Write to Low-byte. This pin is connected to the PLDs. Therefore, these signals can be used in decode and other logic equations. The following control signals can be connected to this pin, based on your MCU: 1. RD – active Low, Read Strobe input. 2. E – E clock input. 3. DS – active Low, Data Strobe input. 4. LDS – active Low, Strobe for low data byte. This pin is connected to the PLDs. Therefore, these signals can be used in decode and other logic equations. Read or other Control input pin, with multiple configurations. Depending on the MCU interface selected, this pin can be: 1. PSEN – Program Select Enable, active Low in code fetch bus cycle (80C51XA mode). 2. BHE – High-byte enable, 16-bit data bus. 3. UDS – active Low, Strobe for high data byte, 16-bit data bus mode. 4. SIZ0 – Byte enable input. 5. LSTRB – Low Strobe input. This pin is also connected to the PLDs. Active Low input. Resets I/O Ports, PLD Macrocells and some of the Configuration Registers and JTAG registers. Must be Low at Power-up. Reset also aborts any Flash memory Program or Erase cycle that is currently in progress. names or functions are defined using PSDsoft Express. ADIO0ADIO7 3-7 10-12 I/O ADIO8ADIO15 13-20 I/O CNTL0 59 I CNTL1 60 I CNTL2 40 I Reset 39 I 11/89 PSD4235G2 Pin Name Pin Type I/O CMOS or Open Drain I/O CMOS or Open Drain I/O CMOS or Slew Rate I/O CMOS or Open Drain I/O CMOS or Open Drain I/O CMOS or Open Drain I/O CMOS or Open Drain I/O CMOS or Open Drain I/O CMOS or Open Drain I/O CMOS or Open Drain Description These pins make up Port A. These port pins are configurable and can have the following functions: 1. MCU I/O – standard output or input port. 2. CPLD Macrocell (McellA0-McellA7) outputs. 3. Latched, transparent or registered PLD inputs (can also be PLD input for address A16 and above). These pins make up Port B. These port pins are configurable and can have the following functions: 1. MCU I/O – standard output or input port. 2. CPLD Macrocell (McellB0-McellB7) outputs. 3. Latched, transparent or registered PLD inputs (can also be PLD input for address A16 and above). These pins make up Port C. These port pins are configurable and can have the following functions: 1. MCU I/O – standard output or input port. 2. External Chip Select (ECS0-ECS7) outputs. 3. Latched, transparent or registered PLD inputs (can also be PLD input for address A16 and above). PD0 pin of Port D. This port pin can be configured to have the following functions: 1. ALE/AS input – latches address on ADIO0-ADIO15. 2. AS input – latches address on ADIO0-ADIO15 on the rising edge. 3. MCU I/O – standard output or input port. 4. Transparent PLD input (can also be PLD input for address A16 and above). PD1 pin of Port D. This port pin can be configured to have the following functions: 1. MCU I/O – standard output or input port. 2. Transparent PLD input (can also be PLD input for address A16 and above). 3. CLKIN – clock input to the CPLD Macrocells, the APD Unit’s Power-down counter, and the CPLD AND Array. PD2 pin of Port D. This port pin can be configured to have the following functions: 1. MCU I/O – standard output or input port. 2. Transparent PLD input (can also be PLD input for address A16 and above). 3. PSD Chip Select Input (CSI). When Low, the MCU can access the PSD memory and I/O. When High, the PSD memory blocks are disabled to conserve power. The falling edge of this signal can be used to get the device out of Power-down mode. PD3 pin of Port D. This port pin can be configured to have the following functions: 1. MCU I/O – standard output or input port. 2. Transparent PLD input (can also be PLD input for address A16 and above). 3. WRH – for 16-bit data bus, write to high byte, active low. PE0 pin of Port E. This port pin can be configured to have the following functions: 1. MCU I/O – standard output or input port. 2. Latched address output. 3. TMS Input for the JTAG Serial Interface. PE1 pin of Port E. This port pin can be configured to have the following functions: 1. MCU I/O – standard output or input port. 2. Latched address output. 3. TCK Input for the JTAG Serial Interface. PE2 pin of Port E. This port pin can be configured to have the following functions: 1. MCU I/O – standard output or input port. 2. Latched address output. 3. TDI input for the JTAG Serial Interface. PA0-PA7 51-58 PB0-PB7 61-68 PC0-PC7 41-48 PD0 79 PD1 80 PD2 1 PD3 2 PE0 71 PE1 72 PE2 73 12/89 PSD4235G2 Pin Name Pin Type I/O CMOS or Open Drain I/O CMOS or Open Drain I/O CMOS or Open Drain I/O CMOS or Open Drain I/O CMOS or Open Drain Description PE3 pin of Port E. This port pin can be configured to have the following functions: 1. MCU I/O – standard output or input port. 2. Latched address output. 3. TDO output for the JTAG Serial Interface. PE4 pin of Port E. This port pin can be configured to have the following functions: 1. MCU I/O – standard output or input port. 2. Latched address output. 3. TSTAT output for the JTAG Serial Interface. 4. Ready/Busy output for parallel In-System Programming (ISP). PE5 pin of Port E. This port pin can be configured to have the following functions: 1. MCU I/O – standard output or input port. 2. Latched address output. 3. TERR active Low output for the JTAG Serial Interface. PE6 pin of Port E. This port pin can be configured to have the following functions: 1. MCU I/O – standard output or input port. 2. Latched address output. 3. VSTBY – SRAM stand-by voltage input for SRAM battery backup. PE7 pin of Port E. This port pin can be configured to have the following functions: 1. MCU I/O – standard output or input port. 2. Latched address output. 3. Battery-on Indicator (VBATON). Goes High when power is being drawn from the external battery. These pins make up Port F. These port pins are configurable and can have the following functions: 1. MCU I/O – standard output or input port. 2. External Chip Select (ECS0-ECS7) outputs, or inputs to CPLD. 3. Latched address outputs. 4. Address A1-A3 inputs in 80C51XA mode (PF0 is grounded) 5. Data bus port (D0-D7) in a non-multiplexed bus configuration. 6. Peripheral I/O mode. 7. MCU reset mode. These pins make up Port G. These port pins are configurable and can have the following functions: 1. MCU I/O – standard output or input port. 2. Latched address outputs. 3. Data bus port (D8-D15) in a non-multiplexed bus configuration. 4. MCU reset mode. Supply Voltage PE3 74 PE4 75 PE5 76 PE6 77 PE7 78 PF0-PF7 31-38 I/O CMOS or Open Drain PG0-PG7 21-28 I/O CMOS or Open Drain VCC 9, 29, 69 8, 30, 49, 50, 70 GND Ground pins 13/89 PSD4235G2 PSD REGISTER DESCRIPTION AND ADDRESS OFFSETS Table 6 shows the offset addresses to the PSD Table 6 provides brief descriptions of the registers registers relative to the CSIOP base address. The in CSIOP space. The following sections give a CSIOP space is the 256 bytes of address that is almore detailed description. located by the user to the internal PSD registers. Table 6. Register Address Offset Register Name Data In Control Data Out Direction Drive Select Input Macrocell Enable Out Output Macrocells A Output Macrocells B Mask Macrocells A Mask Macrocells B Flash Memory Protection Flash Boot Protection JTAG Enable PMMR0 PMMR2 Page VM Memory_ID0 Memory_ID1 Note: 1. Other registers that are not part of the I/O ports. Port Port Port Port Port Port Port Other1 A B C D E F G 00 01 10 11 30 32 04 06 08 0A 0C 20 21 22 23 C0 C2 C7 B0 B4 E0 E2 F0 F1 05 07 09 0B 0D 1C 14 16 18 15 17 19 1A 4C 34 36 38 40 42 44 46 48 41 43 45 47 49 Description Reads Port pin as input, MCU I/O input mode Selects mode between MCU I/O or Address Out Stores data for output to Port pins, MCU I/O output mode Configures Port pin as input or output Configures Port pins as either CMOS or Open Drain on some pins, while selecting high slew rate on other pins. Reads Input Macrocells Reads the status of the output enable to the I/O Port driver Read – reads output of Macrocells A Write – loads Macrocell Flip-flops Read – reads output of Macrocells B Write – loads Macrocell Flip-flops Blocks writing to the Output Macrocells A Blocks writing to the Output Macrocells B Read only – Primary Flash Sector Protection Read only – PSD Security and Secondary Flash memory Sector Protection Enables JTAG Port Power Management Register 0 Power Management Register 2 Page Register Places PSD memory areas in Program and/ or Data space on an individual basis. Read only – SRAM and Primary memory size Read only – Secondary memory type and size 14/89 PSD4235G2 REGISTER BIT DEFINITION All the registers of the PSD are included here, for reference. Detailed descriptions of these registers can be found in the following sections. Table 7. Data-In Registers – Ports A, B, C, D, E, F, G Bit 7 Port pin 7 Bit 6 Port pin 6 Bit 5 Port pin 5 Bit 4 Port pin 4 Bit 3 Port pin 3 Bit 2 Port pin 2 Bit 1 Port pin 1 Bit 0 Port pin 0 Note: Bit Definitions (Read-only registers): Read Port pin status when Port is in MCU I/O input mode. Table 8. Data-Out Registers – Ports A, B, C, D, E, F, G Bit 7 Port pin 7 Bit 6 Port pin 6 Bit 5 Port pin 5 Bit 4 Port pin 4 Bit 3 Port pin 3 Bit 2 Port pin 2 Bit 1 Port pin 1 Bit 0 Port pin 0 Note: Bit Definitions: Latched data for output to Port pin when pin is configured in MCU I/O output mode. Table 9. Direction Registers – Ports A, B, C, D, E, F, G Bit 7 Port pin 7 Bit 6 Port pin 6 Bit 5 Port pin 5 Bit 4 Port pin 4 Bit 3 Port pin 3 Bit 2 Port pin 2 Bit 1 Port pin 1 Bit 0 Port pin 0 Note: Bit Definitions: Port pin 0 = Port pin is configured in Input mode (default). Port pin 1 = Port pin is configured in Output mode. Table 10. Control Registers – Ports E, F, G Bit 7 Port pin 7 Bit 6 Port pin 6 Bit 5 Port pin 5 Bit 4 Port pin 4 Bit 3 Port pin 3 Bit 2 Port pin 2 Bit 1 Port pin 1 Bit 0 Port pin 0 Note: Bit Definitions: Port pin 0 = Port pin is configured in MCU I/O mode (default). Port pin 1 = Port pin is configured in Latched Address Out mode. Table 11. Drive Registers – Ports A, B, D, E, G Bit 7 Port pin 7 Bit 6 Port pin 6 Bit 5 Port pin 5 Bit 4 Port pin 4 Bit 3 Port pin 3 Bit 2 Port pin 2 Bit 1 Port pin 1 Bit 0 Port pin 0 Note: Bit Definitions: Port pin 0 = Port pin is configured for CMOS Output driver (default). Port pin 1 = Port pin is configured for Open Drain output driver. Table 12. Drive Registers – Ports C, F Bit 7 Port pin 7 Bit 6 Port pin 6 Bit 5 Port pin 5 Bit 4 Port pin 4 Bit 3 Port pin 3 Bit 2 Port pin 2 Bit 1 Port pin 1 Bit 0 Port pin 0 Note: Bit Definitions: Port pin 0 = Port pin is configured for CMOS Output driver (default). Port pin 1 = Port pin is configured in Slew Rate mode. 15/89 PSD4235G2 Table 13. Enable-Out Registers – Ports A, B, C, F Bit 7 Port pin 7 Bit 6 Port pin 6 Bit 5 Port pin 5 Bit 4 Port pin 4 Bit 3 Port pin 3 Bit 2 Port pin 2 Bit 1 Port pin 1 Bit 0 Port pin 0 Note: Bit Definitions (Read-only registers): Port pin 0 = Port pin is in tri-state driver (default). Port pin 1 = Port pin is enabled. Table 14. Input Macrocells – Ports A, B, C Bit 7 IMcell 7 Bit 6 IMcell 6 Bit 5 IMcell 5 Bit 4 IMcell 4 Bit 3 IMcell 3 Bit 2 IMcell 2 Bit 1 IMcell 1 Bit 0 IMcell 0 Note: Bit Definitions (Read-only registers): Read Input Macrocell (IMC7-IMC0) status on Ports A, B and C. Table 15. Output Macrocells A Register Bit 7 Mcella 7 Bit 6 Mcella 6 Bit 5 Mcella 5 Bit 4 Mcella 4 Bit 3 Mcella 3 Bit 2 Mcella 2 Bit 1 Mcella 1 Bit 0 Mcella 0 Note: Bit Definitions: Write Register: Load MCellA7-MCellA0 with 0 or 1. Read Register: Read MCellA7-MCellA0 output status. Table 16. Output Macrocells B Register Bit 7 Mcellb 7 Bit 6 Mcellb 6 Bit 5 Mcellb 5 Bit 4 Mcellb 4 Bit 3 Mcellb 3 Bit 2 Mcellb 2 Bit 1 Mcellb 1 Bit 0 Mcellb 0 Note: Bit Definitions: Write Register: Load MCellB7-MCellB0 with 0 or 1. Read Register: Read MCellB7-MCellB0 output status. Table 17. Mask Macrocells A Register Bit 7 Mcella 7 Bit 6 Mcella 6 Bit 5 Mcella 5 Bit 4 Mcella 4 Bit 3 Mcella 3 Bit 2 Mcella 2 Bit 1 Mcella 1 Bit 0 Mcella 0 Note: Bit Definitions: McellA_Prot 0 = Allow MCellA flip-flop to be loaded by MCU (default). McellA_Prot 1 = Prevent MCellA flip-flop from being loaded by MCU. Table 18. Mask Macrocells B Register Bit 7 Mcellb 7 Bit 6 Mcellb 6 Bit 5 Mcellb 5 Bit 4 Mcellb 4 Bit 3 Mcellb 3 Bit 2 Mcellb 2 Bit 1 Mcellb 1 Bit 0 Mcellb 0 Note: Bit Definitions: McellB_Prot 0 = Allow MCellB flip-flop to be loaded by MCU (default). McellB_Prot 1 = Prevent MCellB flip-flop from being loaded by MCU. Table 19. Flash Memory Protection Register Bit 7 Sec7_Prot Bit 6 Sec6_Prot Bit 5 Sec5_Prot Bit 4 Sec4_Prot Bit 3 Sec3_Prot Bit 2 Sec2_Prot Bit 1 Sec1_Prot Bit 0 Sec0_Prot Note: Bit Definitions (Read-only register): Sec_Prot 1 = Primary Flash memory Sector is write protected. Sec_Prot 0 = Primary Flash memory Sector is not write protected. 16/89 PSD4235G2 Table 20. Flash Boot Protection Register Bit 7 Security_Bit Bit 6 not used Bit 5 not used Bit 4 not used Bit 3 Sec3_Prot Bit 2 Sec2_Prot Bit 1 Sec1_Prot Bit 0 Sec0_Prot Note: Bit Definitions: Sec_Prot 1 = Secondary Flash memory Sector is write protected. Sec_Prot 0 = Secondary Flash memory Sector is not write protected. Security_Bit 0 = Security Bit in device has not been set. Security_Bit 1 = Security Bit in device has been set. Table 21. JTAG Enable Register Bit 7 not used Bit 6 not used Bit 5 not used Bit 4 not used Bit 3 not used Bit 2 not used Bit 1 not used Bit 0 JTAGEnable Note: Bit Definitions: JTAGEnable 1 = JTAG Port is enabled. JTAGEnable 0 = JTAG Port is disabled. Table 22. Page Register Bit 7 PGR 7 Bit 6 PGR 6 Bit 5 PGR 5 Bit 4 PGR 4 Bit 3 PGR 3 Bit 2 PGR 2 Bit 1 PGR 1 Bit 0 PGR 0 Note: Bit Definitions: Configure Page input to PLD. Default is PGR7-PGR0=0. 17/89 PSD4235G2 Table 23. PMMR0 Register Bit 7 not used (set to 0) Bit 6 not used (set to 0) Bit 5 PLD MCells CLK Bit 4 PLD Array CLK Bit 3 PLD Turbo Bit 2 not used (set to 0) Bit 1 APD Enable Bit 0 not used (set to 0) Note: The bits of this register are cleared to zero following Power-up. Subsequent Reset (Reset) pulses do not clear the registers. Note: Bit Definitions: APD Enable 0 = Automatic Power-down (APD) is disabled. 1 = Automatic Power-down (APD) is enabled. PLD Turbo 0 = PLD Turbo is on. 1 = PLD Turbo is off, saving power. PLD Array CLK 0 = CLKIN to the PLD AND array is connected. Every CLKIN change powers up the PLD when Turbo bit is off. 1 = CLKIN to the PLD AND array is disconnected, saving power. PLD MCells CLK 0 = CLKIN to the PLD Macrocells is connected. 1 = CLKIN to the PLD Macrocells is disconnected, saving power. Table 24. PMMR2 Register Bit 7 not used (set to 0) Bit 6 PLD Array WRH Bit 5 PLD Array ALE Bit 4 PLD Array CNTL2 Bit 3 PLD Array CNTL1 Bit 2 PLD Array CNTL0 Bit 1 not used (set to 0) Bit 0 PLD Array Addr Note: For Bit 4, Bit 3, Bit 2: See Table 34 for the signals that are blocked on pins CNTL0-CNTL2. Note: Bit Definitions: PLD Array Addr 0 = Address A7-A0 are connected to the PLD array. 1 = Address A7-A0 are blocked from the PLD array, saving power. (Note: in XA mode, A3-A0 come from PF3-PF0, and A7-A4 come from ADIO7-ADIO4) PLD Array CNTL2 0 = CNTL2 input to the PLD AND array is connected. 1 = CNTL2 input to the PLD AND array is disconnected, saving power. PLD Array CNTL1 0 = CNTL1 input to the PLD AND array is connected. 1 = CNTL1 input to the PLD AND array is disconnected, saving power. PLD Array CNTL0 0 = CNTL0 input to the PLD AND array is connected. 1 = CNTL0 input to the PLD AND array is disconnected, saving power. PLD Array ALE 0 = ALE input to the PLD AND array is connected. 1 = ALE input to the PLD AND array is disconnected, saving power. PLD Array WRH 0 = WRH/DBE input to the PLD AND array is connected. 1 = WRH/DBE input to the PLD AND array is disconnected, saving power. Table 25. VM Register Bit 7 Peripheral mode Bit 6 not used (set to 0) Bit 5 not used (set to 0) Bit 4 FL_data Bit 3 Boot_data Bit 2 FL_code Bit 1 Boot_code Bit 0 SR_code Note: On reset, Bit1-Bit4 are loaded to configurations that are selected by the user in PSDsoft Express. Bit0 and Bit7 are always cleared on reset. Bit0-Bit4 are active only when the device is configured in Philips 80C51XA mode. Note: Bit Definitions: SR_code 0 = PSEN cannot access SRAM in 80C51XA modes. 1 = PSEN can access SRAM in 80C51XA modes. Boot_code 0 = PSEN cannot access Secondary NVM in 80C51XA modes. 1 = PSEN can access Secondary NVM in 80C51XA modes. FL_code 0 = PSEN cannot access Primary Flash memory in 80C51XA modes. 1 = PSEN can access Primary Flash memory in 80C51XA modes. Boot_data 0 = RD cannot access Secondary NVM in 80C51XA modes. 1 = RD can access Secondary NVM in 80C51XA modes. FL_data 0 = RD cannot access Primary Flash memory in 80C51XA modes. 1 = RD can access Primary Flash memory in 80C51XA modes. Peripheral mode 0 = Peripheral mode of Port F is disabled. 1 = Peripheral mode of Port F is enabled. 18/89 PSD4235G2 Table 26. Memory_ID0 Register Bit 7 S_size 3 Bit 6 S_size 2 Bit 5 S_size 1 Bit 4 S_size 0 Bit 3 F_size 3 Bit 2 F_size 2 Bit 1 F_size 1 Bit 0 F_size 0 Note: Bit Definitions: F_size[3:0] S_size[3:0] 0h = There is no Primary Flash memory 1h = Primary Flash memory size is 256 Kbit 2h = Primary Flash memory size is 512 Kbit 3h = Primary Flash memory size is 1 Mbit 4h = Primary Flash memory size is 2 Mbit 5h = Primary Flash memory size is 4 Mbit 6h = Primary Flash memory size is 8 Mbit 0h = There is no SRAM 1h = SRAM size is 16 Kbit 2h = SRAM size is 32 Kbit 3h = SRAM size is 64 Kbit 4h = SRAM size is 128 Kbit 5h = SRAM size is 256 Kbit Table 27. Memory_ID1 Register Bit 7 not used (set to 0) Bit 6 not used (set to 0) Bit 5 B_type 1 Bit 4 B_type 0 Bit 3 B_size 3 Bit 2 B_size 2 Bit 1 B_size 1 Bit 0 B_size 0 Note: Bit Definitions: B_size[3:0] B_type[1:0] 0h = There is no Secondary NVM 1h = Secondary NVM size is 128 Kbit 2h = Secondary NVM size is 256 Kbit 3h = Secondary NVM size is 512 Kbit 0h = Secondary NVM is Flash memory 1h = Secondary NVM is EEPROM 19/89 PSD4235G2 DETAILED OPERATION As shown in Figure 4, the PSD consists of six major types of functional blocks: s Memory Blocks s s s s s PLD Blocks MCU Bus Interface I/O Ports Power Management Unit (PMU) JTAG-ISP Interface The functions of each block are described in the following sections. Many of the blocks perform multiple functions, and are user configurable. Table 28. Memory Block Size and Organization Primary Flash Memory Sector Number 0 1 2 3 4 5 6 7 Totals Sector Size (x16) 32K 32K 32K 32K 32K 32K 32K 32K 512KByte Sector Select Signal FS0 FS1 FS2 FS3 FS4 FS5 FS6 FS7 8 Sectors 32KByte Memory Blocks The PSD has the following memory blocks: – Primary Flash memory – Secondary Flash memory – SRAM The Memory Select signals for these blocks originate from the Decode PLD (DPLD) and are userdefined in PSDsoft Express. Table 28 sumamarizes the sizes and organisations of the memory blocks. Secondary Flash Memory Sector Size (x16) 4K 4K 4K 4K Sector Select Signal CSBOOT0 CSBOOT1 CSBOOT2 CSBOOT3 SRAM SRAM Size (x16) 4K SRAM Select Signal RS0 4 Sectors 8KByte 20/89 PSD4235G2 Primary Flash Memory and Secondary Flash memory Description. The primary Flash memory is divided evenly into 8 sectors. The secondary Flash memory is divided evenly into 4 sectors. Each sector of either memory block can be separately protected from Program and Erase cycles. Flash memory may be erased on a sector-by-sector basis, and programmed word-by-word. Flash sector erasure may be suspended while data is read from other sectors of the block and then resumed after reading. During a Program or Erase cycle in Flash memory, the status can be output on the Ready/Busy pin (PE4). This pin is set up using PSDsoft Express. Memory Block Select Signals. The DPLD generates the Select signals for all the internal memory blocks (see the section entitled “PLDs”, on page 31). Each of the sectors of the primary Flash memory has a Select signal (FS0-FS7) which can contain up to three product terms. Each of the sectors of the secondary Flash memory has a Select signal (CSBOOT0-CSBOOT3) which can contain up to three product terms. Having three product terms for each Select signal allows a given sector to be mapped in different areas of system memory. When using a MCU with separate Program and Data space (80C51XA), these flexible Select signals allow dynamic re-mapping of sectors from one memory space to the other before and after IAP. The SRAM block has a single Select signal (RS0). Ready/Busy (PE4). This signal can be used to output the Ready/Busy status of the PSD. The output is a 0 (Busy) when a Flash memory block is being written to, or when a Flash memory block is being erased. The output is a 1 (Ready) when no Write or Erase cycle is in progress. Memory Operation. The primary Flash memory and secondary Flash memory are addressed through the MCU Bus Interface. The MCU can access these memories in one of two ways: s The MCU can execute a typical bus Write or Read operation just as it would if accessing a RAM or ROM device using standard bus cycles. s The MCU can execute a specific instruction that consists of several Write and Read operations. This involves writing specific data patterns to special addresses within the Flash memory to invoke an embedded algorithm. These instructions are summarized in Table 29. Typically, the MCU can read Flash memory using Read operations, just as it would read a ROM device. However, Flash memory can only be erased and programmed using specific instructions. For example, the MCU cannot write a single byte directly to Flash memory as one would write a byte to RAM. To program a word into Flash memory, the MCU must execute a Program instruction, then test the status of the Programming event. This status test is achieved by a Read operation or polling Ready/Busy (PE4). Flash memory can also be read by using special instructions to retrieve particular Flash device information (sector protect status and ID). 21/89 PSD4235G2 Table 29. Instructions Instruction14 Read5 Read Main Flash ID6 Read Sector Protection6,8,13 Program a Flash Word13 Flash Sector Erase7,13 Flash Bulk Erase13 Suspend Sector Erase11 Resume Sector Erase12 Reset6 Unlock Bypass Unlock Bypass Program9 Unlock Bypass Reset10 FS0-FS7 or CSBOOT0CSBOOT3 1 1 Cycle 1 “Read” RD @ RA AAh@ XAAAh AAh@ XAAAh AAh@ XAAAh AAh@ XAAAh AAh@ XAAAh B0h@ XXXXh 30h@ XXXXh F0h@ XXXXh AAh@ XAAAh A0h@ XXXXh 90h@ XXXXh 55h@ X554h PD@ PA 00h@ XXXXh 20h@ XAAAh 55h@ X554h 55h@ X554h 55h@ X554h 55h@ X554h 55h@ X554h 90h@ XAAAh 90h@ XAAAh A0h@ XAAAh 80h@ XAAAh 80h@ XAAAh Read ID @ XX02h Read 00h or 01h @ XX04h PD@ PA AAh@ XAAAh AAh@ XAAAh 55h@ X554h 55h@ X554h 30h@ SA 10h@ XAAAh 30h7@ next SA Cycle 2 Cycle 3 Cycle 4 Cycle 5 Cycle 6 Cycle 7 1 1 1 1 1 1 1 1 1 1 Note: 1. All bus cycles are write bus cycles, except the ones with the “Read” label 2. All values are in hexadecimal: X = Don’t Care. Addresses of the form XXXXh, in this table, must be even addresses RA = Address of the memory location to be read RD = Data read from location RA during the Read cycle PA = Address of the memory location to be programmed. Addresses are latched on the falling edge of Write Strobe (WR, CNTL0). PA is an even address for PSD in word programming mode. PD = Data word to be programmed at location PA. Data is latched on the rising edge of Write Strobe (WR , CNTL0) SA = Address of the sector to be erased or verified. The Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) of the sector to be erased, or verified, must be Active (High). 3. Sector Select (FS0 to FS7 or CSBOOT0 to CSBOOT3) signals are active High, and are defined in PSDsoft Express. 4. Only address bits A11-A0 are used in instruction decoding. 5. No Unlock or instruction cycles are required when the device is in the Read mode 6. The Reset instruction is required to return to the Read mode after reading the Flash ID, or after reading the Sector Protection Status, or if the Error Flag (DQ5/DQ13) bit goes High. 7. Additional sectors to be erased must be written at the end of the Sector Erase instruction within 80 µs. 8. The data is 00h for an unprotected sector, and 01h for a protected sector. In the fourth cycle, the Sector Select is active, and (A1,A0)=(1,0) 9. The Unlock Bypass instruction is required prior to the Unlock Bypass Program instruction. 10. The Unlock Bypass Reset Flash instruction is required to return to reading memory data when the device is in the Unlock Bypass mode. 11. The system may perform Read and Program cycles in non-erasing sectors, read the Flash ID or read the Sector Protection Status when in the Suspend Sector Erase mode. The Suspend Sector Erase instruction is valid only during a Sector Erase cycle. 12. The Resume Sector Erase instruction is valid only during the Suspend Sector Erase mode. 13. The MCU cannot invoke these instructions while executing code from the same Flash memory as that for which the instruction is intended. The MCU must fetch, for example, the code from the secondary Flash memory when reading the Sector Protection Status of the primary Flash memory. 14. All write bus cycles in an instruction are byte write to an even address (XA4Ah or X554h). A Flash memory Program bus cycle writes a word to an even address. 22/89 PSD4235G2 Instructions An instruction consists of a sequence of specific operations. Each received byte is sequentially decoded by the PSD and not executed as a standard Write operation. The instruction is executed when the correct number of bytes are properly received and the time between two consecutive bytes is shorter than the time-out period. Some instructions are structured to include Read operations after the initial Write operations. The instruction must be followed exactly. Any invalid combination of instruction bytes or time-out between two consecutive bytes while addressing Flash memory resets the device logic into Read mode (Flash memory is read like a ROM device). The PSD supports the instructions summarized in Table 29: s Erase memory by chip or sector s s s s s s Suspend or resume sector erase Program a Word Reset to Read mode Read primary Flash Identifier value Read Sector Protection Status Bypass These instructions are detailed in Table 29. For efficient decoding of the instructions, the first two bytes of an instruction are the coded cycles and are followed by an instruction byte or confirmation byte. The coded cycles consist of writing the data AAh to address XAAAh during the first cycle and data 55h to address X554h during the second cycle (unless the Bypass instruction feature is used, as described later). Address signals A15-A12 are Don’t Care during the instruction Write cycles. However, the appropriate Sector Select signal (FS0-FS7, or CSBOOT0-CSBOOT3) must be selected. The primary and secondary Flash memories have the same instruction set (except for Read Primary Flash Identifier). The Sector Select signals determine which Flash memory is to receive and execute the instruction. The primary Flash memory is selected if any one of its Sector Select signals (FS0-FS7) is High, and the secondary Flash memory is selected if any one of its Sector Select signals (CSBOOT0-CSBOOT3) is High. Power-up Condition. The PSD internal logic is reset upon Power-up to the Read mode. Sector Select (FS0-FS7 and CSBOOT0-CSBOOT3) must be held Low, and Write Strobe (WR/WRL, CNTL0) High, during Power-up for maximum security of the data contents and to remove the possibility of data being written on the first edge of Write Strobe (WR /WRL, CNTL0). Any Write cycle initiation is locked when VCC is below V LKO. Reading Flash Memory Under typical conditions, the MCU may read the primary Flash memory, or secondary Flash memory, using Read operations just as it would a ROM or RAM device. Alternately, the MCU may use Read operations to obtain status information about a Program or Erase cycle that is currently in progress. Lastly, the MCU may use instructions to read special data from these memory blocks. The following sections describe these Read functions. Read Memory Contents. Primary Flash memory and secondary Flash memory are placed in the Read mode after Power-up, chip reset, or a Reset Flash instruction (see Table 29). The MCU can read the memory contents of the primary Flash memory, or the secondary Flash memory by using Read operations any time the Read operation is not part of an instruction. Read Primary Flash Identifier. The primary Flash memory identifier is read with an instruction composed of 4 operations: 3 specific Write operations and a Read operation (see Table 29). The identifier for the primary Flash memory is E8h. The secondary Flash memory does not support this instruction. Read Memory Sector Protection Status. The Flash memory Sector Protection Status is read with an instruction composed of four operations: three specific Write operations and a Read operation (see Table 29). The Read operation produces 01h if the Flash memory sector is protected, or 00h if the sector is not protected. The sector protection status for all NVM blocks (primary Flash memory, or secondary Flash memory) can be read by the MCU accessing the Flash Protection and Flash Boot Protection registers in PSD I/O space. See the section entitled “Flash Memory Sector Protect”, on page 27, for register definitions. Reading the Erase/Program Status Bits. The PSD provides several status bits to be used by the MCU to confirm the completion of an Erase or Program cycle of Flash memory. These status bits minimize the time that the MCU spends performing these tasks and are defined in Table 30. The status byte resides in an even location, and can be read as many times as needed. Also note that DQ15-DQ8 is an even byte for Motorola MCUs with a 16-bit data bus. For Flash memory, the MCU can perform a Read operation to obtain these status bits while an Erase or Program instruction is being executed by the embedded algorithm. See the section entitled “Programming Flash Memory”, on page 25, for details. 23/89 PSD4235G2 Table 30. Status Bits DQ7 Data Polling DQ6 Toggle Flag DQ5 Error Flag DQ4 X DQ3 Erase Timeout DQ2 X DQ1 X DQ0 X Table 31. Status Bits for Motorola DQ15 Data Polling DQ14 Toggle Flag DQ13 Error Flag DQ12 X DQ11 Erase Timeout DQ10 X DQ9 X DQ8 X Note: 1. X = Not guaranteed value, can be read either 1 or 0. 2. DQ15-DQ0 represent the Data Bus bits, D15-D0. 3. FS0-FS7/CSBOOT0-CSBOOT3 are active High. Data Polling (DQ7) – DQ15 for Motorola. When erasing or programming in Flash memory, the Data Polling (DQ7/DQ15) bit outputs the complement of the bit being entered for programming/ writing on the DQ7/DQ15 bit. Once the Program instruction or the Write operation is completed, the true logic value is read on the Data Polling (DQ7/ DQ15) bit (in a Read operation). s Data Polling is effective after the fourth Write pulse (for a Program instruction) or after the sixth Write pulse (for an Erase instruction). It must be performed at the address being programmed or at an address within the Flash memory sector being erased. s Write operation. The cycle is finished when two successive Reads yield the same output data. s The Toggle Flag (DQ6/DQ14) bit is effective after the fourth Write pulse (for a Program instruction) or after the sixth Write pulse (for an Erase instruction). s If the location to be programmed belongs to a protected Flash memory sector, the instruction is ignored. If all the Flash memory sectors selected for erasure are protected, the Toggle Flag (DQ6/ DQ14) bit toggles to 0 for about 100 µs and then returns to the value from the previously addressed location. s During an Erase cycle, the Data Polling (DQ7/ DQ15) bit outputs a 0. After completion of the cycle, the Data Polling (DQ7/DQ15) bit outputs the last bit programmed (it is a 1 after erasing). If the location to be programmed is in a protected Flash memory sector, the instruction is ignored. If all the Flash memory sectors to be erased are protected, the Data Polling (DQ7/DQ15) bit is reset to 0 for about 100 µs, and then returns to the value from the previously addressed location. No erasure is performed. s s Toggle Flag (DQ6) – DQ14 for Motorola. The PSD offers another way for determining when the Flash memory Program cycle is completed. During the internal Write operation and when either FS0FS7 or CSBOOT0-CSBOOT3 is true, the Toggle Flag (DQ6/DQ14) bit toggles from 0 to 1 and 1 to 0 on subsequent attempts to read any word of the memory. When the internal cycle is complete, the toggling stops and the data read on the Data Bus D0-D7 is the value from the addressed memory location. The device is now accessible for a new Read or Error Flag (DQ5) – DQ13 for Motorola. During a normal Program or Erase cycle, the Error Flag (DQ5/DQ13) bit is reset to 0. This bit is set to 1 when there is a failure during a Flash memory Program, Sector Erase, or Bulk Erase cycle. In the case of Flash memory programming, the Error Flag (DQ5/DQ13) bit indicates the attempt to program a Flash memory bit, or bits, from the programmed state, 0, to the erased state, 1, which is not a valid operation. The Error Flag (DQ5/DQ13) bit may also indicate a Time-out condition while attempting to program a word. In case of an error in a Flash memory Sector Erase or Word Program cycle, the Flash memory sector in which the error occurred or to which the programmed location belongs must no longer be used. Other Flash memory sectors may still be used. The Error Flag (DQ5/DQ13) bit is reset after a Reset instruction. A Reset instruction is required after detecting an error on the Error Flag (DQ5/ DQ13) bit. Erase Time-out Flag (DQ3) – DQ11 for Motorola. The Erase Time-out Flag (DQ3/DQ11) bit reflects the time-out period allowed between two consecutive Sector Erase instructions. The Erase Time-out Flag (DQ3/DQ11) bit is reset to 0 after a 24/89 PSD4235G2 Sector Erase cycle for a period of 100 µs + 20% unless an additional Sector Erase instruction is decoded. After this period, or when the additional Sector Erase instruction is decoded, the Erase Time-out Flag (DQ3/DQ11) bit is set to 1. Programming Flash Memory Flash memory must be erased prior to being programmed. The MCU may erase Flash memory all at once or by-sector. Although erasing Flash memory occurs on a sector or device basis, programming Flash memory occurs on a word basis. The primary and secondary Flash memories require the MCU to send an instruction to program a word or to erase sectors (see Table 29). Once the MCU issues a Flash memory Program or Erase instruction, it must check the status bits for completion. The embedded algorithms that are invoked inside the PSD support several means to provide status to the MCU. Status may be checked using any of three methods: Data Polling, Data Toggle, or Ready/Busy (PE4) signal. Data Polling. Polling on the Data Polling (DQ7/ DQ15) bit is a method of checking whether a Program or Erase cycle is in progress or has completed. Figure 6 shows the Data Polling algorithm. When the MCU issues a Program instruction, the embedded algorithm within the PSD begins. The MCU then reads the location of the word to be programmed in Flash memory to check the status. The Data Polling (DQ7/DQ15) bit becomes the complement of the corresponding bit of the original data word to be programmed. The MCU continues to poll this location, comparing data and monitoring the Error Flag (DQ5/DQ13) bit. When the Data Polling (DQ7/DQ15) bit matches the corresponding bit of the original data, and the Error Flag (DQ5/DQ13) bit remains 0, the embedded algorithm is complete. If the Error Flag (DQ5/DQ13) bit is 1, the MCU should test the Data Polling (DQ7/ DQ15) bit again since the Data Polling (DQ7/ DQ15) bit may have changed simultaneously with the Error Flag (DQ5/DQ13) bit (see Figure 6). The Error Flag (DQ5/DQ13) bit is set if either an internal time-out occurred while the embedded algorithm attempted to program the location or if the MCU attempted to program a 1 to a bit that was not erased (not erased is logic 0). It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed, to compare the word that was written to the Flash memory with the word that was intended to be written. When using the Data Polling method during an Erase cycle, Figure 6 still applies. However, the Data Polling (DQ7/DQ15) bit is 0 until the Erase cycle is complete. A 1 on the Error Flag (DQ5/ DQ13) bit indicates a time-out condition on the Erase cycle, a 0 indicates no error. The MCU can read any even location within the sector being erased to get the Data Polling (DQ7/DQ15) bit and the Error Flag (DQ5/DQ13) bit. PSDsoft Express generates ANSI C code functions that implement these Data Polling algorithms. Figure 6. Data Polling Flowchart START READ DQ5 and DQ7 (DQ13 and DQ15) at Valid Even Address DQ7 (DQ15) = Data7 (Data15) No Yes No DQ5 (DQ13) =1 Yes READ DQ7 (DQ15) DQ7 (DQ15) = Data7 (Data15) No Program or Erase Cycle failed Yes Program or Erase Cycle is complete Issue RESET instruction AI04920 Data Toggle. Checking the Toggle Flag (DQ6/ DQ14) bit is another method of determining whether a Program or Erase cycle is in progress or has completed. Figure 7 shows the Data Toggle algorithm. When the MCU issues a Program instruction, the embedded algorithm within the PSD begins. The MCU then reads the location to be programmed in Flash memory to check the status. The Toggle Flag (DQ6/DQ14) bit toggles each time the MCU 25/89 PSD4235G2 reads this location until the embedded algorithm is complete. The MCU continues to read this location, checking the Toggle Flag (DQ6/DQ14) bit and monitoring the Error Flag (DQ5/DQ13) bit. When the Toggle Flag (DQ6/DQ14) bit stops toggling (two consecutive reads yield the same value), and the Error Flag (DQ5/DQ13) bit remains 0, the embedded algorithm is complete. If the Error Flag (DQ5/DQ13) bit is 1, the MCU should test the Toggle Flag (DQ6/DQ14) bit again, since the Toggle Flag (DQ6/DQ14) bit may have changed simultaneously with the Error Flag (DQ5/DQ13) bit (see Figure 7). Figure 7. Data Toggle Flowchart START READ DQ5 and DQ6 (DQ13 and DQ14) at Valid Even Address DQ6 (DQ14) = Toggle Yes No No DQ5 (DQ13) =1 Yes READ DQ6 (DQ14) DQ6 (DQ14) = Toggle Yes Program or Erase Cycle failed No Program or Erase Cycle is complete Issue RESET instruction AI04921 The Error Flag (DQ5/DQ13) bit is set if either an internal time-out occurred while the embedded algorithm attempted to program, or if the MCU attempted to program a 1 to a bit that was not erased (not erased is logic 0). It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed, to compare the word that was written to Flash memory with the word that was intended to be written. When using the Data Toggle method after an Erase cycle, Figure 7 still applies. the Toggle Flag (DQ6/DQ14) bit toggles until the Erase cycle is complete. A 1 on the Error Flag (DQ5/DQ13) bit indicates a time-out condition on the Erase cycle, a 0 indicates no error. The MCU can read any even location within the sector being erased to get the Toggle Flag (DQ6/DQ14) bit and the Error Flag (DQ5/DQ13) bit. PSDsoft Express generates ANSI C code functions which implement these Data Toggling algorithms. Unlock Bypass. The Unlock Bypass instruction allows the system to program words to the Flash memories faster than using the standard Program instruction. The Unlock Bypass mode is entered by first initiating two Unlock cycles. This is followed by a third Write cycle containing the Unlock Bypass command, 20h (as shown in Table 29). The Flash memory then enters the Unlock Bypass mode. A two-cycle Unlock Bypass Program instruction is all that is required to program in this mode. The first cycle in this instruction contains the Unlock Bypass Program command, A0h. The second cycle contains the program address and data. Additional data is programmed in the same manner. This mode dispense with the initial two Unlock cycles required in the standard Program instruction, resulting in faster total programming time. During the unlock bypass mode, only the Unlock Bypass Program and Unlock Bypass Reset instructions are valid. To exit the Unlock Bypass mode, the system must issue the two-cycle Unlock Bypass Reset instruction. The first cycle must contain the data 90h; the second cycle the data 00h. Addresses are Don’t Care for both cycles. The Flash memory then returns to Read mode. Erasing Flash Memory Flash Bulk Erase. The Flash Bulk Erase instruction uses six Write operations followed by a Read operation of the status register, as described in Table 29. If any byte of the Bulk Erase instruction is wrong, the Bulk Erase instruction aborts and the device is reset to the Read Memory mode. During a Bulk Erase, the memory status may be checked by reading the Error Flag (DQ5/DQ13) bit, the Toggle Flag (DQ6/DQ14) bit, and the Data Polling (DQ7/DQ15) bit, as detailed in the section 26/89 PSD4235G2 entitled “Programming Flash Memory”, on page 25. The Error Flag (DQ5/DQ13) bit returns a 1 if there has been an Erase Failure (maximum number of Erase cycles have been executed). It is not necessary to program the memory with 00h because the PSD automatically does this before erasing to 0FFh. During execution of the Bulk Erase instruction, the Flash memory does not accept any instructions. Flash Sector Erase. The Sector Erase instruction uses six Write operations, as described in Table 29. Additional Flash Sector Erase confirm commands and Flash memory sector addresses can be written subsequently to erase other Flash memory sectors in parallel, without further coded cycles, if the additional commands are transmitted in a shorter time than the time-out period of about 100 µs. The input of a new Sector Erase command restarts the time-out period. The status of the internal timer can be monitored through the level of the Erase Time-out Flag (DQ3/ DQ11) bit. If the Erase Time-out Flag (DQ3/DQ11) bit is 0, the Sector Erase instruction has been received and the time-out period is counting. If the Erase Time-out Flag (DQ3/DQ11) bit is 1, the time-out period has expired and the PSD is busy erasing the Flash memory sector(s). Before and during Erase time-out, any instruction other than Suspend Sector Erase and Resume Sector Erase, abort the cycle that is currently in progress, and reset the device to Read mode. It is not necessary to program the Flash memory sector with 00h as the PSD does this automatically before erasing. During a Sector Erase, the memory status may be checked by reading the Error Flag (DQ5/DQ13) bit, the Toggle Flag (DQ6/DQ14) bit, and the Data Polling (DQ7/DQ15) bit, as detailed in the section entitled “Programming Flash Memory”, on page 25. During execution of the Erase cycle, the Flash memory accepts only Reset and Suspend Sector Erase instructions. Erasure of one Flash memory sector may be suspended, in order to read data from another Flash memory sector, and then resumed. Suspend Sector Erase. When a Sector Erase cycle is in progress, the Suspend Sector Erase instruction can be used to suspend the cycle by writing 0B0h to any even address when an appropriate Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) is High. (See Table 29). This allows reading of data from another Flash memory sector after the Erase cycle has been suspended. Suspend Sector Erase is accepted only during the Flash Sector Erase instruction execution and defaults to Read mode. A Suspend Sector Erase instruction executed during an Erase time-out period, in addition to suspending the Erase cycle, terminates the time out period. The Toggle Flag (DQ6/DQ14) bit stops toggling when the PSD internal logic is suspended. The status of this bit must be monitored at an address within the Flash memory sector being erased. The Toggle Flag (DQ6/DQ14) bit stops toggling between 0.1 µs and 15 µs after the Suspend Sector Erase instruction has been executed. The PSD is then automatically set to Read mode. If an Suspend Sector Erase instruction was executed, the following rules apply: – Attempting to read from a Flash memory sector that was being erased outputs invalid data. – Reading from a Flash memory sector that was not being erased is valid. – The Flash memory cannot be programmed, and only responds to Resume Sector Erase and Reset instructions (Read is an operation and is allowed). – If a Reset instruction is received, data in the Flash memory sector that was being erased is invalid. Resume Sector Erase. If a Suspend Sector Erase instruction was previously executed, the Erase cycle may be resumed with this instruction. The Resume Sector Erase instruction consists of writing 030h to any even address while an appropriate Sector Select (FS0-FS7 or CSBOOT0CSBOOT3) is High. (See Table 29.) Flash Memory Sector Protect Each sector of Primary or Secondary Flash memory can be separately protected against Program and Erase cycles. Sector Protection provides additional data security because it disables all Program or Erase cycles. This mode can be activated (or deactivated) through the JTAG-ISP Port or a Device Programmer. Sector protection can be selected for each sector using the PSDsoft Express program. This automatically protects selected sectors when the device is programmed through the JTAG Port or a Device Programmer. Flash memory sectors can be unprotected to allow updating of their contents using the JTAG Port or a Device Programmer. The MCU can read (but cannot change) the sector protection bits. Any attempt to program or erase a protected Flash memory sector is ignored by the device. The Verify operation results in a read of the protected data. This allows a guarantee of the retention of the Protection status. The sector protection status can be read by the MCU through the Flash memory protection and Secondary Flash memory protection registers (in 27/89 PSD4235G2 the CSIOP block) or use the Read Sector Protection instruction. See Table 19 to Table 20. Reset The Reset instruction consists of one Write cycle (see Table 29). It can also be optionally preceded by the standard two write decoding cycles (writing AAh to AAAh, and 55h to 554h). The Reset instruction must be executed after: – Reading the Flash Protection Status or Flash ID – An Error condition has occurred (and the device has set the Error Flag (DQ5/DQ13) bit to 1) during a Flash memory Program or Erase cycle. The Reset instruction immediately puts the Flash memory back into normal Read mode. However, if there is an error condition (with the Error Flag (DQ5/DQ13) bit set to 1) the Flash memory will return to the Read mode in 25 µs after the Reset instruction is issued. The Reset instruction is ignored when it is issued during a Program or Bulk Erase cycle of the Flash memory. The Reset instruction aborts any on-going Sector Erase cycle, and returns the Flash memory to the normal Read mode in 25 µs. Reset (RESET) Pin. A pulse on the Reset (RESET) pin aborts any cycle that is in progress, and resets the Flash memory to the Read mode. When the reset occurs during a Program or Erase cycle, the Flash memory takes up to 25 µs to return to the Read mode. It is recommended that the Reset (RESET) pulse (except for Power On Reset, as described on page 62) be at least 25 µs so that the Flash memory is always ready for the MCU to fetch the bootstrap instructions after the Reset cycle is complete. SRAM The SRAM is enabled when SRAM Select (RS0) from the DPLD is High. SRAM Select (RS0) can contain up to three product terms, allowing flexible memory mapping. The SRAM can be backed up using an external battery. The external battery should be connected to the Voltage Stand-by (VSTBY, PE6) line. If you have an external battery connected to the PSD, the contents of the SRAM are retained in the event of a power loss. The contents of the SRAM are retained so long as the battery voltage remains at 2 V or greater. If the supply voltage falls below the battery voltage, an internal power switch-over to the battery occurs. PE7 can be configured as an output that indicates when power is being drawn from the external battery. This Battery-on Indicator (VBATON, PE7) signal is High when the supply voltage falls below the battery voltage and the battery on Voltage Stand-by (VSTBY, PE6) is supplying power to the internal SRAM. SRAM Select (RS0), Voltage Stand-by (VSTBY, PE6) and Battery-on Indicator (VBATON, PE7) are all configured using PSDsoft Express. Memory Select Signals The Primary Flash Memory Sector Select (FS0FS7), Secondary Flash Memory Sector Select (CSBOOT0-CSBOOT3) and SRAM Select (RS0) signals are all outputs of the DPLD. They are defined using PSDsoft Express. The following rules apply to the equations for these signals: 1. Primary Flash memory and secondary Flash memory Sector Select signals must not be larger than the physical sector size. 2. Any primary Flash memory sector must not be mapped in the same memory space as another Flash memory sector. 3. A secondary Flash memory sector must not be mapped in the same memory space as another secondary Flash memory sector. 4. SRAM, I/O, and Peripheral I/O spaces must not overlap. 5. A secondary Flash memory sector may overlap a primary Flash memory sector. In case of overlap, priority is given to the secondary Flash memory sector. 6. SRAM, I/O, and Peripheral I/O spaces may overlap any other memory sector. Priority is given to the SRAM, I/O, or Peripheral I/O. Figure 8. Priority Level of Memory and I/O Components Highest Priority Level 1 SRAM, I /O, or Peripheral I /O Level 2 Secondary Non-Volatile Memory Level 3 Primary Flash Memory Lowest Priority AI02867D Example. FS0 is valid when the address is in the range of 8000h to BFFFh, CSBOOT0 is valid from 8000h to 9FFFh, and RS0 is valid from 8000h to 87FFh. Any address in the range of RS0 always accesses the SRAM. Any address in the range of CSBOOT0 greater than 87FFh (and less than 9FFFh) automatically addresses secondary Flash memory segment 0. Any address greater than 9FFFh accesses the primary Flash memory seg- 28/89 PSD4235G2 ment 0. You can see that half of the primary Flash memory segment 0 and one-fourth of secondary Flash memory segment 0 cannot be accessed in this example. Also note that an equation that defined FS1 to anywhere in the range of 8000h to BFFFh would not be valid. Figure 8 shows the priority levels for all memory components. Any component on a higher level can overlap and has priority over any component on a lower level. Components on the same level must not overlap. Level 1 has the highest priority and level 3 has the lowest. Memory Select Configuration for MCUs with Separate Program and Data Spaces. The 80C51XA and compatible family of MCUs, can be configured to have separate address spaces for Program memory (selected using Program Select Enable (PSEN, CNTL2)) and Data memory (selected using Read Strobe (RD, CNTL1)). Any of the memories within the PSD can reside in either space or both spaces. This is controlled through manipulation of the VM register that resides in the CSIOP space. Figure 9. 8031 Memory Modules – Separate Space The VM register is set using PSDsoft Express to have an initial value. It can subsequently be changed by the MCU so that memory mapping can be changed on-the-fly. For example, you may wish to have SRAM and primary Flash memory in the Data space at Boot-up, and secondary Flash memory in the Program space at Boot-up, and later swap the secondary Flash memory and primary Flash memory. This is easily done with the VM register by using PSDsoft Express to configure it for Boot-up and having the MCU change it when desired. Table 25 describes the VM Register. Separate Space Modes. Program space is separated from Data space. For example, Program Select Enable (PSEN , CNTL2) is used to access the program code from the primary Flash memory, while Read Strobe (RD, CNTL1) is used to access data from the secondary Flash memory, SRAM and I/O Port blocks. This configuration requires the VM register to be set to 0Ch (see Figure 9). DPLD RS0 CSBOOT0-3 FS0-FS7 Primary Flash Memory Secondary Flash Memory SRAM CS OE CS OE CS OE PSEN RD AI02869C Combined Space Modes. The Program and Data spaces are combined into one memory space that allows the primary Flash memory, secondary Flash memory, and SRAM to be accessed by either Program Select Enable (PSEN, CNTL2) or Read Strobe (RD , CNTL1). For example, to configure the primary Flash memory in Combined space, bits 2 and 4 of the VM register are set to 1 (see Figure 10). 80C51XA Memory Map Example. See the Application Notes for examples. 29/89 PSD4235G2 Figure 10. 8031 Memory Modules – Combined Space DPLD RS0 CSBOOT0-3 FS0-FS7 Primary Flash Memory Secondary Flash Memory SRAM RD CS OE CS OE CS OE VM REG BIT 3 VM REG BIT 4 PSEN VM REG BIT 1 VM REG BIT 2 RD VM REG BIT 0 AI02870C Page Register The 8-bit Page Register increases the addressing capability of the MCU by a factor of up to 256. The contents of the register can also be read by the MCU. The outputs of the Page Register (PGR0PGR7) are inputs to the DPLD decoder and can be included in the Sector Select (FS0-FS7, CSBOOT0-CSBOOT3), and SRAM Select (RS0) equations. If memory paging is not needed, or if not all eight page register bits are needed for memory paging, these bits may be used in the CPLD for general logic. See Application Note AN1154. Table 22 and Figure 11 show the Page Register. The eight flip-flops in the register are connected to the internal data bus (D0-D7). The MCU can write to or read from the Page Register. The Page Register can be accessed at address location CSIOP + E0h. Figure 11. Page Register RESET D0 D1 D0 - D7 D2 D3 D4 D5 D6 R/ W D7 Q0 Q1 Q2 Q3 Q4 Q5 PGR0 PGR1 PGR2 PGR3 PGR4 PGR5 PGR6 DPLD AND CPLD INTERNAL SELECTS AND LOGIC Q6 PGR7 Q7 PAGE REGISTER PLD AI02871B 30/89 PSD4235G2 Memory ID Registers The 8-bit read-only Memory Status Registers are included in the CSIOP space. The user can determine the memory configuration of the PSD device by reading the Memory ID0 and Memory ID1 registers. The content of the registers is defined as shown in Table 26 and Table 27. PLDs The PLDs bring programmable logic functionality to the PSD. After specifying the logic for the PLDs using PSDsoft Express, the logic is programmed into the device and available upon Power-up. Table 32. DPLD and CPLD Inputs Input Source MCU Address Bus1 MCU Control Signals Reset Power-down Port A Input Macrocells Port B Input Macrocells Port C Input Macrocells Port D Inputs Port F Inputs Page Register Macrocell A Feedback Macrocell B Feedback Flash memory Program Status Bit Input Name A15-A0 CNTL0-CNTL2 RST PDN PA7-PA0 PB7-PB0 PC7-PC0 PD3-PD0 PF7-PF0 PGR7-PGR0 MCELLA.FB7-FB0 MCELLB.FB7-FB0 Ready/Busy Number of Signals 16 3 1 1 8 8 8 4 8 8 8 8 1 The PSD contains two PLDs: the Decode PLD (DPLD), and the Complex PLD (CPLD). The PLDs are briefly discussed in the next few paragraphs, and in more detail in the following sections. Figure 12 shows the configuration of the PLDs. The DPLD performs address decoding for internal components, such as memory, registers, and I/O ports Select signals. The CPLD can be used for logic functions, such as loadable counters and shift registers, state machines, and encoding and decoding logic. These logic functions can be constructed using the 16 Output Macrocells (OMC), 24 Input Macrocells (IMC), and the AND Array. The CPLD can also be used to generate External Chip Select (ECS0ECS2) signals. The AND Array is used to form product terms. These product terms are specified using PSDsoft Express. An Input Bus consisting of 82 signals is connected to the PLDs. The signals are shown in Table 32. The Turbo Bit in PSD. The PLDs in the PSD4235G2 can minimize power consumption by switching to standby when inputs remain unchanged for an extended time of about 70 ns. Resetting the Turbo bit to 0 (Bit 3 of the PMMR0 register) automatically places the PLDs into standby if no inputs are changing. Turning the Turbo mode off increases propagation delays while reducing power consumption. See the section entitled “Power Management”, on page 59, on how to set the Turbo bit. Additionally, five bits are available in the PMMR2 register to block MCU control signals from entering the PLDs. This reduces power consumption and can be used only when these MCU control signals are not used in PLD logic equations. Each of the two PLDs has unique characteristics suited for its applications. They are described in the following sections. Note: 1. The address inputs are A19-A4 in 80C51XA mode. 31/89 PLD INPUT BUS I/O PORTS 32/89 8 PSD4235G2 Figure 12. PLD Diagram DATA BUS PAGE REGISTER DECODE PLD PRIMARY FLASH MEMORY SELECTS SECONDARY NON-VOLATILE MEMORY SELECTS SRAM SELECT CSIOP SELECT PERIPHERAL SELECTS JTAG SELECT 82 4 3 1 2 1 8 16 OUTPUT MACROCELL FEEDBACK DIRECT MACROCELL ACCESS FROM MCU DATA BUS CPLD 16 OUTPUT MACROCELL PT ALLOC. 82 MACROCELL ALLOC. MCELLA TO PORT A MCELLB TO PORT B 8 24 INPUT MACROCELL (PORT A,B,C) 8 8 EXTERNAL CHIP SELECTS TO PORT C or PORT F DIRECT MACROCELL INPUT TO MCU DATA BUS 24 INPUT MACROCELL & INPUT PORTS 12 PORT D and PORT F INPUTS AI05737 PSD4235G2 DECODE PLD (DPLD) The DPLD, shown in Figure 13, is used for decoding the address for internal and external components. The DPLD can be used to generate the following decode signals: s 8 Sector Select (FS0-FS7) signals for the primary Flash memory (three product terms each) s s 1 internal SRAM Select (RS0) signal (three product terms) 1 internal CSIOP Select (PSD Configuration Register) signal 1 JTAG Select signal (enables JTAG-ISP on Port E) 2 internal Peripheral Select signals (Peripheral I/O mode). s s 4 Sector Select (CSBOOT0-CSBOOT3) signals for the secondary Flash memory (three product terms each) s Figure 13. DPLD Logic Array 3 3 3 3 (INPUTS) I /O PORTS (PORT A,B,F) MCELLAB.FB [7:0] (FEEDBACKS) MCELLBC.FB [7:0] (FEEDBACKS) PGR0 -PGR7 A[15:0] * PD[3:0] (ALE,CLKIN,CSI) PDN (APD OUTPUT) CNTRL[2:0] (READ/WRITE CONTROL SIGNALS) RESET RD_BSY (32) 3 (8) 3 (8) 3 (8) 3 (16) 3 (4) 3 (1) 3 (3) (1) 3 (1) 1 1 1 1 CSIOP PSEL0 PSEL1 JTAGSEL AI05738 CSBOOT 0 CSBOOT 1 CSBOOT 2 CSBOOT 3 3 FS0 FS1 FS2 FS3 FS4 FS5 FS6 FS7 8 PRIMARY FLASH MEMORY SECTOR SELECTS RS0 SRAM SELECT I/O DECODER SELECT PERIPHERAL I/O MODE SELECT Note: 1. The address inputs are A19-A4 when in 80C51XA mode 2. Additional address lines can be brought ino the PSD via Port A, B, C, D, or F. 33/89 PSD4235G2 COMPLEX PLD (CPLD) The CPLD can be used to implement system logic functions, such as loadable counters and shift registers, system mailboxes, handshaking protocols, state machines, and random logic. The CPLD can also be used to generate eight External Chip Select (ECS0-ECS7), routed to Port C or Port F. Although External Chip Select (ECS0-ECS7) can be produced by any Output Macrocell (OMC), these eight External Chip Select (ECS0-ECS7) on Port C or Port F do not consume any Output Macrocells (OMC). As shown in Figure 12, the CPLD has the following blocks: s 24 Input Macrocells (IMC) s s s AND Array capable of generating up to 196 product terms Four I/O Ports. s 16 Output Macrocells (OMC) Product Term Allocator Each of the blocks are described in the sections that follow. The Input Macrocells (IMC) and Output Macrocells (OMC) are connected to the PSD internal data bus and can be directly accessed by the MCU. This enables the MCU software to load data into the Output Macrocells (OMC) or read data from both the Input and Output Macrocells (IMC and OMC). This feature allows efficient implementation of system logic and eliminates the need to connect the data bus to the AND Array as required in most standard PLD macrocell architectures. Figure 14. Macrocell and I/O Port PLD INPUT BUS PRODUCT TERMS FROM OTHER MACROCELLS MCU ADDRESS / DATA BUS CPLD MACROCELLS PT PRESET PRODUCT TERM ALLOCATOR MCU DATA IN MCU LOAD DATA LOAD CONTROL I/O PORTS LATCHED ADDRESS OUT DATA WR I/O PIN D Q MUX AND ARRAY UP TO 10 PRODUCT TERMS MACROCELL OUT TO MCU CPLD OUTPUT PR DI LD PT CLOCK D/T MUX Q COMB. /REG SELECT PDR INPUT SELECT PLD INPUT BUS GLOBAL CLOCK CLOCK SELECT PT CLEAR D/T/JK FF SELECT CK CL MUX POLARITY SELECT D WR Q DIR REG. PT OUTPUT ENABLE (OE) MACROCELL FEEDBACK I/O PORT INPUT INPUT MACROCELLS MUX QD PT INPUT LATCH GATE/CLOCK MUX ALE/AS QD G AI04945 34/89 PSD4235G2 Output Macrocell (OMC). Eight of the Output Macrocells (OMC) are connected to Ports A pins and are named as McellA0-McellA7. The other eight Macrocells are connected to Ports B pins and are named as McellB0-McellB7. The Output Macrocell (OMC) architecture is shown in Figure 15. As shown in the figure, there are native product terms available from the AND Array, and borrowed product terms available (if unused) from other Output Macrocells (OMC). The polarity of the product term is controlled by the XOR gate. The Output Macrocell (OMC) can implement either sequential logic, using the flip-flop element, or combinatorial logic. The multiplexer selects between the sequential or combinatorial logic outputs. The multiplexer output can drive a port pin and has a feedback path to the AND Array inputs. The flip-flop in the Output Macrocell (OMC) block can be configured as a D, T, JK, or SR type in the PSDsoft Express program. The flip-flop’s clock, preset, and clear inputs may be driven from a product term of the AND Array. Alternatively, the external CLKIN (PD1) signal can be used for the clock input to the flip-flop. The flip-flop is clocked on the rising edge of CLKIN (PD1). The preset and clear are active High inputs. Each clear input can use up to two product terms. Table 33. Output Macrocell Port and Data Bit Assignments Output Macrocell McellA0 McellA1 McellA2 McellA3 McellA4 McellA5 McellA6 McellA7 McellB0 McellB1 McellB2 McellB3 McellB4 McellB5 McellB6 McellB7 Port Assignment Port A0 Port A1 Port A2 Port A3 Port A4 Port A5 Port A6 Port A7 Port B0 Port B1 Port B2 Port B3 Port B4 Port B5 Port B6 Port B7 Native Product Terms 3 3 3 3 3 3 3 3 4 4 4 4 4 4 4 4 Maximum Borrowed Product Terms 6 6 6 6 6 6 6 6 5 5 5 5 6 6 6 6 Data Bit for Loading or Reading D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 Motorola 16-Bit MCU for Loading or Reading D8 D9 D10 D11 D12 D13 D14 D15 D0 D1 D2 D3 D4 D5 D6 D7 35/89 PSD4235G2 Figure 15. CPLD Output Macrocell MASK REG. MACROCELL CS RD INTERNAL DATA BUS PT ALLOCATOR WR DIRECTION REGISTER ENABLE (.OE) PRESET(.PR) COMB/REG SELECT AND ARRAY PT PT DIN PR PLD INPUT BUS MUX PT LD POLARITY SELECT CLEAR (.RE) PT CLK CLKIN MUX IN CLR PROGRAMMABLE FF (D/T/JK /SR) PORT DRIVER Q I/O PIN FEEDBACK (.FB) PORT INPUT INPUT MACROCELL AI04946 Product Term Allocator. The CPLD has a Product Term Allocator. PSDsoft Express, uses the Product Term Allocator to borrow and place product terms from one Macrocell to another. The following list summarizes how product terms are allocated: s McellA0-McellA7 all have three native product terms and may borrow up to six more s McellB0-McellB3 all have four native product terms and may borrow up to five more McellB4-McellB7 all have four native product terms and may borrow up to six more. s Each Macrocell may only borrow product terms from certain other Macrocells. Product terms already in use by one Macrocell are not available for another Macrocell. If an equation requires more product terms than are available to it, then “external” product terms are required, which consume other Output Macrocells (OMC). If external product terms are used, extra delay is added for the equation that required the extra product terms. This is called product term expansion. PSDsoft Express performs this expansion as needed. Loading and Reading the Output Macrocells (OMC). The Output Macrocells (OMC) block occupies a memory location in the MCU address space, as defined by the CSIOP (see the section entitled “I/O Ports”, on page 50). The flip-flops in each of the 16 Output Macrocells (OMC) can be loaded from the data bus by a MCU. Loading the Output Macrocells (OMC) with data from the MCU takes priority over internal functions. As such, the preset, clear, and clock inputs to the flip-flop can be overridden by the MCU. The ability to load the flip-flops and read them back is useful in such applications as loadable counters and shift registers, mailboxes, and handshaking protocols. Data is loaded to the Output Macrocells (OMC) on the trailing edge of Write Strobe (WR/WRL, CNTL0). The OMC Mask Register. There is one Mask Register for each of the two groups of eight Output Macrocells (OMC). The Mask Registers can be used to block the loading of data to individual Output Macrocells (OMC). The default value for the Mask Registers is 00h, which allows loading of the Output Macrocells (OMC). When a given bit in a Mask Register is set to a 1, the MCU is blocked from writing to the associated Output Macrocells 36/89 PSD4235G2 (OMC). For example, suppose McellA0-McellA3 are being used for a state machine. You would not want a MCU write to McellA to overwrite the state machine registers. Therefore, you would want to load the Mask Register for McellA (Mask Macrocell A) with the value 0Fh. The Output Enable of the OMC. The Output Macrocells (OMC) can be connected to an I/O port pin as a PLD output. The output enable of each port pin driver is controlled by a single product term from the AND Array, ORed with the Direction Register output. The pin is enabled upon Powerup if no output enable equation is defined and if the pin is declared as a PLD output in PSDsoft Express. If the Output Macrocell (OMC) output is declared as an internal node and not as a port pin output in the PSDabel file, then the port pin can be used for other I/O functions. The internal node feedback can be routed as an input to the AND Array. Input Macrocells (IMC). The CPLD has 24 Input Macrocells (IMC), one for each pin on Ports A, B, and C. The architecture of the Input Macrocells (IMC) is shown in Figure 16. The Input Macrocells (IMC) are individually configurable, and can be used as a latch, register, or to pass incoming Port signals prior to driving them onto the PLD input bus. The outputs of the Input Macrocells (IMC) can be read by the MCU through the internal data bus. The enable for the latch and clock for the register are driven by a multiplexer whose inputs are a product term from the CPLD AND Array or the MCU Address Strobe (ALE/AS). Each product term output is used to latch or clock four Input Macrocells (IMC). Port inputs 3-0 can be controlled by one product term and 7-4 by another. Configurations for the Input Macrocells (IMC) are specified by PSDsoft Express (see Application Note AN1171). Outputs of the Input Macrocells (IMC) can be read by the MCU via the IMC buffer. See the section entitled “I/O Ports”, on page 50. Input Macrocells (IMC) can use Address Strobe (ALE/AS, PD0) to latch address bits higher than A15. Any latched addresses are routed to the PLDs as inputs. Input Macrocells (IMC) are particularly useful with handshaking communication applications where two processors pass data back and forth through a common mailbox. Figure 18 shows a typical configuration where the Master MCU writes to the Port A Data Out Register. This, in turn, can be read by the Slave MCU via the activation of the “SlaveRead” output enable product term. The Slave can also write to the Port A Input Macrocells (IMC) and the Master can then read the Input Macrocells (IMC) directly. Note that the “Slave-Read” and “Slave-Wr” signals are product terms that are derived from the Slave MCU inputs Read Strobe (RD , CNTL1), Write Strobe (WR /WRL, CNTL0), and Slave_CS. 37/89 PSD4235G2 Figure 16. Input Macrocell INTERNAL DATA BUS INPUT MACROCELL _ RD ENABLE ( .OE ) OUTPUT MACROCELLS A AND MACROCELLS B DIRECTION REGISTER PT AND ARRAY PLD INPUT BUS I/O PIN PT PORT DRIVER MUX Q D MUX PT ALE/AS D FF FEEDBACK Q D G LATCH INPUT MACROCELL AI04926 External Chip Select. The CPLD also provides eight External Chip Select (ECS0-ECS7) outputs that can be used to select external devices. Each External Chip Select (ECS0-ECS7) consists of one product term that can be configured active High or Low. The output enable of the pin is controlled by either the output enable product term or the Direction Register. (See Figure 17.) Figure 17. External Chip Select Signal Port C or Port F CPLD AND ARRAY PLD INPUT BUS ENABLE (.OE) PT DIRECTION REGISTER ECS PT ECS To Port C or F PORT PIN POLARITY BIT AI04927 38/89 PSD4235G2 Figure 18. Handshaking Communication Using Input Macrocells PSD SLAVE – CS RD WR SLAVE – READ PORT A DATA OUT REGISTER MCU -RD MASTER MCU MCU -WR CPLD MCU - WR D [ 7:0] D Q PORT A SLAVE MCU SLAVE – WR D [ 7:0] PORT A INPUT MACROCELL Q MCU - RD D AI02877C 39/89 PSD4235G2 MCU BUS INTERFACE The “no-glue logic” MCU Bus Interface block can be directly connected to most popular MCUs and their control signals. Key 16-bit MCUs, with their bus types and control signals, are shown in Table 34. The MCU interface type is specified using the PSDsoft Express. PSD Interface to a Multiplexed Bus. Figure 19 shows an example of a system using a MCU with a 16-bit multiplexed bus and a PSD4235G2. The ADIO port on the PSD is connected directly to the MCU address/data bus. Address Strobe (ALE/AS, PD0) latches the address signals internally. Latched addresses can be brought out to Port E, F or G. The PSD drives the ADIO data bus only when one of its internal resources is accessed and Table 34. MCUs and their Control Signals MCU 68302, 68306, MMC2001 68330, 68331, 68332, 68340 68LC302, MMC2001 68HC16 68HC912 68HC812 3 80196 80196SP 80186 80C161, 80C164-80C167 80C51XA H8/300 M37702M2 CNTL0 R/W R/W WEL R/W R/W R/W WR WRL WR WR WRL WRL R/W CNTL1 LDS DS OE DS E E RD RD RD RD RD RD E CNTL2 UDS SIZ0 — SIZ0 LSTRB LSTRB BHE (Note 1) BHE BHE PSEN (Note 1) BHE PD3 (Note 1) (Note 1) WEH (Note 1) DBE (Note 1) (Note 1) WRH (Note 1) (Note 1) WRH WRH (Note 1) PD02 AS AS AS AS E (Note 1) ALE ALE ALE ALE ALE AS ALE ADIO0 — A0 — A0 A0 A0 A0 A0 A0 A0 A4/D0 A0 A0 PF3-PF0 (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) A3-A1 — (Note 1) Read Strobe (RD, CNTL1) is active. Should the system address bus exceed sixteen bits, Ports A, B, C, or F may be used as additional address inputs. PSD Interface to a Non-Multiplexed 8-Bit Bus. Figure 20 shows an example of a system using a MCU with a 16-bit non-multiplexed bus and a PSD4235G2. The address bus is connected to the ADIO Port, and the data bus is connected to Ports F and G. Ports F and G are in tri-state mode when the PSD is not accessed by the MCU. Should the system address bus exceed sixteen bits, Ports A, B, or C may be used for additional address inputs. Note: 1. Unused CNTL2 pin can be configured as CPLD input. Other unused pins (PD3-PD0, PF3-PF0) can be configured for other I/O functions. 2. ALE/AS input is optional for MCUs with a non-multiplexed bus 40/89 PSD4235G2 Figure 19. An Example of a Typical 16-bit Multiplexed Bus Interface MCU AD [ 7:0] PSD PORT F A [ 7: 0] (OPTIONAL) AD[ 15:8] ADIO PORT PORT G WR RD BHE WR (CNTRL0) RD (CNTRL1) BHE (CNTRL2) RST ALE ALE (PD0) PORT D RESET PORT A, B or C A [ 15: 8] (OPTIONAL) A [ 23:16] (OPTIONAL) AI04928 Figure 20. An Example of a Typical 16-bit Non-Multiplexed Bus Interface MCU D [ 15:0] PSD PORT F D [ 7:0] ADIO PORT A [ 15:0] PORT G WR RD BHE WR (CNTRL0) RD (CNTRL1) BHE (CNTRL2) RST PORT A, B or C D[ 15:8] A [ 23:16] (OPTIONAL) ALE ALE (PD0) PORT D RESET AI04929 41/89 PSD4235G2 Data Byte Enable Reference. MCUs have different data byte orientations. Table 35 to Table 38 show how the PSD4235G2 interprets byte/word operations in different bus write configurations. Even-byte refers to locations with address A0 equal to 0, and odd byte as locations with A0 equal to 1. Table 35. 16-Bit Data Bus with BHE BHE 0 0 1 A0 0 1 0 D15-D8 Odd Byte Odd Byte — D7-D0 Even Byte — Even Byte Table 36. 16-Bit Data Bus with WRH and WRL WRH 0 0 1 WRL 0 1 0 D15-D8 Odd Byte Odd Byte — D7-D0 Even Byte — Even Byte Table 37. 16-Bit Data Bus with SIZ0, A0 (Motorola MCU) SIZ0 0 1 1 A0 0 0 1 D15-D8 Even Byte Even Byte — D7-D0 Odd Byte — Odd Byte MCU Bus Interface Examples. Figure 21 to Figure 26 show examples of the basic connections between the PSD4235G2 and some popular MCUs. The PSD4235G2 Control input pins are labeled as to the MCU function for which they are configured. The MCU bus interface is specified using PSDsoft Express. The Voltage Stand-by (VSTBY, PE6) line should be held at Ground if not in use. Table 38. 16-Bit Data Bus with LDS, UDS (Motorola MCU) WRH 0 1 0 WRL 0 0 1 D15-D8 Even Byte Even Byte — D7-D0 Odd Byte — Odd Byte 42/89 PSD4235G2 Figure 21. Interfacing the PSD with an 80C196 A19-A16 AD15-AD0 VCC A[ 19:16] AD[ 15:0 ] 80C196NT 19 X1 P3.0/AD0 P3.1/AD1 P3.2/AD2 P3.3/AD3 P3.4/AD4 P3.5/AD5 P3.6/AD6 P3.7/AD7 P4.0/AD8 P4.1/AD9 P4.2/AD10 P4.3/AD11 P4.4/AD12 P4.5/AD13 P4.6/AD14 P4.7/AD15 EP.0/A16 EP.1/A17 EP.2/A18 EP.3/A19 WR/WRL/P5.2 RD/P5.3 BHE/WRH/P5.5 ALE/ADV/P5.0 3 4 5 6 7 10 11 12 13 14 15 16 17 18 19 20 14 13 12 11 9 7 8 4 A16 A17 A18 A19 WR RD BHE ALE 59 60 40 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 3 4 5 6 7 10 11 12 13 14 15 16 17 18 19 20 PSD ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7 ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 9 VCC 29 VCC 69 VCC PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 31 32 33 34 35 36 37 38 18 32 49 6 48 44 45 46 47 58 59 60 61 62 63 64 65 X2 NMI VREF VPP ANGND ACH4/P0.4/PMD.0 ACH5/P0.5/PMD.1 ACH6/P0.6/PMD.2 ACH7/P0.7/PMD.3 PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 21 22 23 24 25 26 27 28 51 52 53 54 55 56 57 58 61 62 63 64 65 66 67 68 41 42 43 44 45 46 47 48 A16 A17 A18 A19 P6.0/EPA8 P6.1/EPA9 P6.2/T1CLK P6.3/T1DIR P6.4/SC0 P6.5/SD0 P6.6/SC1 P6.7/SD1 CNTL0 (WR) CNTL1 (RD) CNTL2 (BHE) PD0 (ALE) PD1 (CLKIN) PD2 (CSI) PD3 (WRH) 36 37 38 39 40 41 42 43 57 56 55 54 53 52 51 50 P2.0/TX/PVR P2.1/RXD/PALE P2.2/EXINT/PROG P2.3/INTB P2.4/INTINTOUT P2.5/HLD P2.6/HLDA/CPVER P2.7/CLKOUT/PAC EA 33 79 80 1 2 31 RESET RESET 39 RESET P1.0/EPA0/T2CLK P1.1/EPA1 P1.2/EPA2/T2DIR P1.3/EPA3 BUSWIDTH/P5.7 P1.4/EPA4 P1.5/EPA5 P1.6/EPA6 P1.7/EPA7 INST/P5.1 SLPINT/P5.4 READY/P5.6 2 10 3 1 71 72 73 74 75 76 77 78 PE0 (TMS) PE1 (TCK/ST) PE2 (TDI) PE3 (TDO) PE4 (TSTAT/RDY) PE5 (TERR) PE6 (VSTBY) PE7 (VBATON) GND GND GND GND GND 8 30 49 50 70 RESET AI04930 80C196 and 80C186. In Figure 21, the Intel 80C196 MCU, which has a 16-bit multiplexed address/data bus, is shown connected to a PSD4235G2. The Read Strobe (RD, CNTL1), and Write Strobe (WR/WRL, CNTL0) signals are connected to the CNTL pins. When BHE is not used, the PSD can be configured to receive WRL and Write Enable High-byte (WRH/DBE, PD3) from the MCU. Higher address inputs (A16-A19) can be routed to Ports A, B, or C as input ot the PLD. The AMD 80186 family has the same bus connection to the PSD as the 80C196. 43/89 PSD4235G2 Figure 22. Interfacing the PSD with an MC68331 D[15:0] D[15:0] A[23:0] VCC_BAR A[23:0] PSD MC68331 D0 D1 D2 D3 D4 D5 D6 D7 111 110 109 108 105 104 103 102 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19_CS6/ A20_CS7/ A21_CS8/ A22_CS9/ A23_CS10/ 90 20 21 22 23 24 25 26 27 30 31 32 33 35 36 37 38 41 42 121 122 123 124 125 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 3 4 5 6 7 10 11 12 13 14 15 16 17 18 19 20 ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7 ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 Vcc 9 Vcc 29 Vcc 69 PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 31 32 33 34 35 36 37 38 21 22 23 24 25 26 27 28 51 52 53 54 55 56 57 58 61 62 63 64 65 66 67 68 41 42 43 44 45 46 47 48 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D8 100 D9 99 D10 98 D11 97 D12 94 D13 93 D14 92 D15 91 R/W\ DS\ SIZ0 AS 59 60 40 79 80 1 2 39 71 72 73 74 75 76 77 78 CNTL0(R/W) CNTL1(DS) CNTL2 (SIZ0) PD0 (AS) PD1 (CLKIN) PD2 (CSI) PD3 RESET PE0 (TMS) PE1 (TCK/ST) PE2 (TDI) PE3 (TDO) PE4 (TSTAT/RDY) PE5 (TERR) PE6 (VSTBY) PE7 (VBATON) 89 88 77 76 75 74 73 72 71 DSACK0 DSACK1 IRQ1 IRQ2 IRQ3 IRQ4 IRQ5 IRQ6 IRQ7 79 R_W 85 DS 81 SIZ0 AS 82 RESET 68 RESET\ A16 A17 A18 A19 SIZ1 CLKOUT CSBOOT/ BR_CS0/ BG_CS1/ BGACK_CS2/ FC0_CS3/ FC1_CS4/ FC2_CS5/ RESET\ 80 66 112 113 114 115 118 119 120 8 30 49 50 70 GND GND GND GND GND AI04951b MC683xx and MC68HC16. Figure 22 shows a MC68331 with a 16-bit non-multiplexed data bus and 24-bit address bus. The data bus from the MC68331 is connected to Port F (D0-D7) and Port G (D8-D15). The SIZ0 and A0 inputs determine the high/low byte selection. The R/W, DS and SIZ0 signals are connected to the CNTL0-CNTL2 pins. The MC68HC16, and other members of the MC683xx family, has the same bus connection to the PSD as the MC68331 shown in Figure 22. 44/89 PSD4235G2 Figure 23. Interfacing the PSD with an 80C51XA-G3 D[15:0] D[15:0] A[3:1] VCC_BAR A[3:1] 29 Vcc PSD XA-G3 21 U3 CRYSTAL 20 11 13 6 7 9 8 16 XTAL1 A4D0 A5D1 A6D2 A7D3 A8D4 A9D5 A10D6 A11D7 A12D8 A13D9 A14D10 A15D11 A16D12 A17D13 A18D14 A19D15 A3 A2 A1 A0/WRH WRL RD PSEN 43 42 41 40 39 38 37 36 24 25 26 27 28 29 30 31 5 4 3 2 18 19 32 A3 A2 A1 WRH\ WRL\ RD\ PSEN\ 3 A4D0 4 A5D1 A6D2 5 6 A7D3 A8D4 7 A9D5 10 A10D6 11 A11D7 12 A12D8 13 A13D9 14 A14D10 15 A15D11 16 A16D12 17 A17D13 18 A18D14 19 A19D15 20 ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7 Vcc Vcc 69 9 XTAL2 RXD0 TXD0 RXD1 TXD1 T2EX T2 T0 PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 31 32 33 34 35 36 37 38 21 22 23 24 25 26 27 28 51 52 53 54 55 56 57 58 61 62 63 64 65 66 67 68 41 42 43 44 45 46 47 48 A1 A2 A3 ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 RESET\ 10 14 15 35 17 RST INT0 INT1 EA/WAIT 59 60 40 CNTL0(WR) CNTL1(RD) CNTL2(PSEN) ALE BUSW 33 ALE VCC_BAR RESET\ 79 80 1 2 PD0 (ALE) PD1 (CLKIN) PD2 (CSI) PD3 (WRH) RESET PE0 (TMS) PE1 (TCK/ST) PE2 (TDI) PE3 (TDO) PE4 (TSTAT/RDY) PE5 (TERR) PE6 (VSTBY) PE7 (VBATON) 39 71 72 73 74 75 76 77 78 8 30 49 50 70 GND GND GND GND GND AI04952b 80C51XA. The Philips 80C51XA MCU has a 16bit multiplexed bus with burst cycles. Address bits (A3-A1) are not multiplexed, while (A19-A4) are multiplexed with data bits (D15-D0). The PSD4235G2 supports the 80C51XA burst mode. The WRH signal is connected to PD3, and WHL is connected to CNTL0. The RD and PSEN signals are connected to the CNTL1 and CNTL2 pins. Figure 23 shows the schematic diagram. The 80C51XA improves bus throughput and performance by issuing burst cycles to fetch codes from memory. In burst cycles, address A19-A4 are latched internally by the PSD, while the 80C51XA drives the A3-A1 signals to fetch sequentially up to 16 bytes of code. The PSD access time is then measured from address A3-A1 valid to data in valid. The PSD bus timing requirement in a burst cycle is identical to the normal bus cycle, except the address setup and hold time with respect to Address Strobe (ALE/AS, PD0) is not required. 45/89 PSD4235G2 Figure 24. Interfacing the PSD with an H83/2350 D[15:0] D[15:0] A[23:0] A[23:0] VCC_BAR 29 Vcc H8S/2655 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 34 35 36 37 39 40 41 42 43 44 45 46 48 49 50 51 78 U3 CRYSTAL 77 XTAL 2 3 4 5 7 8 9 10 11 12 13 14 16 17 18 19 20 21 22 23 25 26 27 28 85 83 82 84 73 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 3 4 5 6 7 10 11 12 13 14 15 16 17 18 19 20 PSD PC0/A0 PC1/A1 PC2/A2 PC3/A3 PC4/A4 PC5/A5 PC6/A6 PC7/A7 PB0/A8 PB1/A9 PB2/A10 PB3/A11 PB4/A12 PB5/A13 PB6/A14 PB7/A15 PA0/A16 PA1/A17 PA2/A18 PA3/A19 PA4/A20/IRQ4 PA5/A21/IRQ5 PA6/A22/IRQ6 PA7/A23/IRQ7 LWR RD AS HWR RESET ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7 ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 Vcc 9 Vcc 69 PE0/D0 PE0/D1 PE0/D2 PE0/D3 PE0/D4 PE0/D5 PE0/D6 PE0/D7 PD0/D8 PD1/D9 PD2/D10 PD3/D11 PD4/D12 PD5/D13 PD6/D14 PD7/D15 EXTAL PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 31 32 33 34 35 36 37 38 21 22 23 24 25 26 27 28 51 52 53 54 55 56 57 58 61 62 63 64 65 66 67 68 41 42 43 44 45 46 47 48 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 WRL\ RD\ 59 60 40 CNTL0(WRL) CNTL1(RD) CNTL2 PD0 (AS) PD1 (CLKIN) PD2 (CSI) PD3 (WRH) RESET PE0 (TMS) PE1 (TCK/ST) PE2 (TDI) PE3 (TDO) PE4 (TSTAT/RDY) PE5 (TERR) PE6 (VSTBY) PE7 (VBATON) 29 30 31 32 55 53 57 56 54 58 90 89 91 88 87 86 74 71 70 69 68 67 66 65 64 60 61 62 63 113 114 115 80 CS7/IRQ3 CS6/IRQ2 IRQ1 IRQ0 RXD0 TXD0 SCK0 RXD1 TXD1 SCK1 RXD2 TXD2 SCK2 PF0/BREQ PF1/BACK PF2/LCAS/WAIT/B NMI PO0/TIOCA3 PO1/TIOCB3 PO2/TIOCC3/TMRI PO3/TIOCD3/TMCI PO4/TIOCA4/TMRI PO5/TIOCB4/TMRC PO6/TIOCA5/TMRO PO7/TIOCB5/TMRO DREQ/CS4 TEND0/CS5 DREQ1 TEND1 MOD0 MOD1 MOD2 PF0/PHI0 AS WRH\ RESET\ 79 80 1 2 39 71 72 73 74 75 76 77 78 WDTOVF STBY PO8/TIOCA0/DACK PO9/TIOCB0/DACK PO10/TIOCC0/TCL PO11/TIOCD0/TCL PO12/TIOCA1 PO13/TIOCB1/TCL PO14/TIOCA2 PO15/TIOCB2/TCL AN0 AN1 AN2 AN3 AN4 AN5 AN6/DA0 AN7/DA1 ADTRG PG0/CAS/OE PG1/CS3 PG2/CS2 PG3/CS1 PG4/CS0 72 75 112 111 110 109 108 107 106 105 95 96 97 98 99 100 101 102 92 116 117 118 119 120 A16 A17 A18 A19 RESET\ 8 30 49 50 70 GND GND GND GND GND AI04953b H8/300. Figure 24 shows an Hitachi H8/2350 with a 16-bit non-multiplexed data bus, and a 24-bit address bus. The H8 data bus is connected to Port F (D0-D7) and Port G (D8-D15). The WRH signal is connected to PD3, and WHL is connected to CNTL0. The RD signal is connected to CNTL1. The connection to the Address Strobe (AS) signal is optional, and is required if the addresses are to be latched. 46/89 PSD4235G2 Figure 25. Interfacing the PSD with an MMC2001 A[19:16] A[19:16] AD[15:0] VCC_BAR VCC_BAR ADIO[15:0] 144 136 126 109 93 Vcc 138 U3 CRYSTAL 137 65 66 67 68 69 70 73 74 75 76 77 78 80 81 27 28 29 30 31 32 33 34 35 36 39 40 41 42 43 44 1 2 3 4 5 6 7 8 19 20 21 22 23 24 25 26 9 10 11 12 13 14 15 16 37 97 XTAL1 XTAL2 P3.0/T0IN P3.1/T6OUT P3.2/CAPIN P3.3/T3OUT P3.4/T3EUD P3.5/T4IN P3.6/T3IN P3.7/T2IN P3.8/MRST P3.9/MTSR P3.10/TXD0 P3.11/RXD0 P3.13/SCLK P3.15/CLKOUT P5.0/AN0 P5.1/AN1 P5.2/AN2 P5.3/AN3 P5.4/AN4 P5.5/AN5 P5.6/AN6 P5.7/AN7 P5.8/AN8 P5.9/AN9 P5.10/AN10/T6UED P5.11/AN11/T5UED P5.12/AN12/T6IN P5.13/AN13/T5IN P5.14/AN14/T4UED P5.15/AN15/T2UED P6.0/!CS0 P6.1/!CS1 P6.2/!CS2 P6.3/!CS3 P6.4/!CS4 P6.5/!HOLD P6.6/!HLDA P6.7/!BREQ P7.0/POUT0 P7.1/POUT1 P7.2/POUT2 P7.3/POUT3 P7.4/CC28IO P7.5/CC29IO P7.6/CC30IO P7.7/CC31IO P8.0/CC16IO P8.1/CC17IO P8.2/CC18IO P8.3/CC19IO P8.4/CC20IO P8.5/CC21IO P8.6/CC22IO P8.7/CC23IO Vref READY AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 100 101 102 103 104 105 106 107 108 111 112 113 114 115 116 117 85 86 87 88 89 90 91 92 96 95 79 98 99 135 134 133 132 131 130 129 128 125 124 123 122 121 120 119 118 47 48 49 50 51 52 53 54 57 58 59 60 61 62 63 64 140 141 142 A16 A17 A18 A19 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 3 4 5 6 7 10 11 12 13 14 15 16 17 18 19 20 Vcc Vcc Infineon C167CR 82 72 56 46 17 9 PSD 29 69 ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7 ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 31 32 33 34 35 36 37 38 21 22 23 24 25 26 27 28 51 52 53 54 55 56 57 58 61 62 63 64 65 66 67 68 41 42 43 44 45 46 47 48 A16 A17 A18 A19 Vcc Vcc Vcc Vcc Vcc Vcc Vcc Vcc Vcc Vcc P4.0/A16 A17 A18 A19 A20 A21 A22 P4.7/A23 WR/WRL RD P3.12/BHE/WRH ALE EA P1H7 P1H6 P1H5 P1H4 P1H3 P1H2 P1H1 P1H0 P1L7 P1L6 P1L5 P1L4 P1L3 P1L2 P1L1 P1L0 P2.0/CC0IO P2.1/CC1IO P2.2/CC2IO P2.3/CC3IO P2.4/CC4IO P2.5/CC5IO P2.6/CC6IO P2.7/CC7IO P2.8/CC8IO/EX0IN P2.9/CC9IO/EX1IN P2.10/CC10IO/EX2IN P2.11/CC11IO/EX3IN P2.12/CC12IO/EX4IN P2.13/CC13IO/EX5IN P2.14/CC14IO/EX6IN P2.15/CC15IO/EX7IN RSTIN RSTOUT NMI WR\ RD\ BHE\ ALE 59 60 40 79 80 1 2 39 71 72 73 74 75 76 77 78 CNTL0(WR) CNTL1(RD) CNTL2(BHE) PD0 (ALE) PD1 (CLKIN) PD2 (CSI) PD3 (WRH) RESET PE0 (TMS) PE1 (TCK/ST) PE2 (TDI) PE3 (TDO) PE4 (TSTAT/RDY) PE5 (TERR) PE6 (VSTBY) PE7 (VBATON) RESET\ 143 139 127 110 94 83 71 55 45 18 RESET\ 38 Agnd Vss Vss Vss Vss Vss Vss Vss Vss Vss Vss 8 30 49 50 70 GND GND GND GND GND AI04954b MMC2001. The Motorola MCORE MMC2001 MCU has a MOD input pin that selects interal or external boot ROM. The PSD can be configured as the external flash boot ROM or as extension to the internal ROM. The MMC2001 has a 16-bit external data bus and 20 address lines with external chip select signals. The Chip Select Control Registers allow the user to customize the bus interface and timing to fit the individual system requirement. A typical interface configuaration to the PSD is shown in Figure 25. The MMC2001’s R/W signal is conneced to the CNTL0 pin, while EB0 and EB1 (enable byte-0 and enable byte-1) are connected to the CNTL1 (UDS) and CNTL2 (LDS) pins. The WEN bit in the Chip Select Control Register should be set to 1 to terminate the EB0-EB1 earlier to provide the wrtie data hold time for the PSD. The WSC and WWS bits in the Control Register are set to wait states that meet the PSD access time requirement. 47/89 PSD4235G2 Another option is to configure the EB0 and EB1 as WRL and WRH signals. In this case, the PSD control setting will be: OE, WRL, WRH where OE is the read signal for the MMC2001. C16x Family. The PSD supports Infineon’s C16X family of MCUs (C161-C167) in both the multiplexed and non-multiplexed bus configuration. In Figure 26, the C167CR is shown connected to the PSD in a multiplexed bus configuration. The control signals from the MCU are WR, RD, BHE and ALE, and are routed to the corresponding PSD pins. The C167 has another control signal setting (RD, WRL, WRH, ALE) which is also supported by the PSD. 48/89 PSD4235G2 Figure 26. Interfacing the PSD with a C167CR A19-A16 AD15-AD0 Vcc 144136129109 93 82 72 56 46 17 VccVccVccVccVccVccVccVccVccVcc 138 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 P4.0/A16 P4.1/A17 P4.2/A18 P4.3/A19 P4.4/A20 P4.5/A21 P4.6/A22 P4.7/A23 100 101 102 103 104 105 106 107 108 111 112 113 114 115 116 117 85 86 87 88 89 90 91 92 96 95 79 98 99 135 134 133 132 131 130 129 128 125 124 123 122 121 120 119 118 47 48 49 50 51 52 53 54 57 58 59 60 61 62 63 64 140 RSTIN RSTOUT 141 142 A16 A17 A18 A19 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 3 4 5 6 7 10 11 12 13 14 15 16 17 18 19 20 VCC A[ 19:16] AD[ 15:0 ] PSD ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7 ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 9 VCC 29 VCC 69 VCC PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 31 32 33 34 35 36 37 38 XTAL1 C167CR 137 65 66 67 68 69 70 73 74 75 76 77 78 79 80 81 27 28 29 30 31 32 33 34 35 36 39 40 41 42 43 44 1 2 3 4 5 6 7 8 19 20 21 22 23 24 25 26 9 10 11 12 13 14 15 16 37 97 XTAL2 P3.0/T0IN P3.1/T6OUT P3.2/CAPIN P3.3/T3OUT P3.4/T3UED P3.5/T4IN P3.6/T3IN P3.7/T2IN P3.8/MRST P3.9/MTSR P3.10/TXD0 P3.11/RXD0 P3.12 P3.13/SCLK P3.15/CLKOUT PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 21 22 23 24 25 26 27 28 51 52 53 54 55 56 57 58 61 62 63 64 65 66 67 68 41 42 43 44 45 46 47 48 A16 A17 A18 A19 P5.0/AN0 WR/WRL P5.1/AN1 P5.2/AN2 RD P5.3/AN3 P312/BHE/WRH P5.4/AN4 P5.5/AN5 ALE P5.6/AN6 P5.7/AN7 EA P5.8/AN8 P5.9/AN9 P1H7 P5.10/AN10/T6UED P1H6 P5.11/AN11/T5UED P1H5 P5.12/AN12/T6IN P1H4 P5.13/AN13 P1H3 P5.14/AN14/T4UED P1H2 P5.15/AN15/T2UED P1H1 P1H0 P6.0/!CS0 P1L7 P6.1/!CS1 P1L6 P6.2/!CS2 P1L5 P6.3/!CS3 P1L4 P6.4/!CS4 P1L3 P6.5/!HOLD P1L2 P1L1 P6.6/!HLDA P1L0 P6.7/!BREQ P7.0/POUT0 P7.1/POUT1 P7.2/POUT2 P7.3/POUT3 P7.4/CC28IO P7.5/CC29IO P7.6/CC30IO P7.7/CC31IO P8.0/CC16IO P8.1/CC17IO P8.2/CC18IO P8.3/CC19IO P8.4/CC20IO P8.5/CC21IO P8.6/CC22IO P8.7/CC23IO Vref READY P2.0/CC0IO P2.1/CC1IO P2.2/CC2IO P2.3/CC3IO P2.4/CC4IO P2.5/CC5IO P2.6/CC6IO P2.7/CC7IO P2.8/CC8IO/EX0IN P2.9/CC9IO/EX1IN P2.10/CC10IO/EX2IN P2.11/CC11IO/EX3IN P2.12/CC12IO/EX4IN P2.13/CC13IO/EX5IN P2.14/CC14IO/EX6IN P2.15/CC15IO/EX7IN WR RD BHE ALE 59 60 40 79 80 1 2 CNTL0 (WR) CNTL1 (RD) CNTL2 (BHE) PD0 (ALE) PD1 (CLKIN) PD2 (CSI) PD3 (WRH) RESET PE0 (TMS) PE1 (TCK/ST) PE2 (TDI) PE3 (TDO) PE4 (TSTAT/RDY) PE5 (TERR) PE6 (VSTBY) PE7 (VBATON) GND GND GND GND GND 8 30 49 50 70 RESET 39 71 72 73 74 75 76 77 78 NMI AGND VssVssVssVssVssVssVssVssVssVss 143139127110 94 83 71 55 45 18 38 RESET AI04955 49/89 PSD4235G2 I/O PORTS There are seven programmable I/O ports: Ports A, B, C, D, E, F and G. Each port pin is individually user configurable, thus allowing multiple functions per port. The ports are configured using PSDsoft Express or by the MCU writing to on-chip registers in the CSIOP space. The topics discussed in this section are: s General Port architecture s s s s available for other purposes. Exceptions are noted. As shown in Figure 27, the ports contain an output multiplexer whose select signals are driven by the configuration bits in the Control Registers (Ports E, F and G only) and PSDsoft Express Configuration. Inputs to the multiplexer include the following: s Output data from the Data Out register s s s Port operating modes Port Configuration Registers (PCR) Port Data Registers Individual Port functionality. Latched address outputs CPLD Macrocell output External Chip Select from the CPLD. General Port Architecture. The general architecture of the I/O Port block is shown in Figure 27. Individual Port architectures are shown in Figure 29 to Figure 31. In general, once the purpose for a port pin has been defined, that pin is no longer The Port Data Buffer (PDB) is a tri-state buffer that allows only one source at a time to be read. The Port Data Buffer (PDB) is connected to the Internal Data Bus for feedback and can be read by the MCU. The Data Out and Macrocell outputs, Direction Register and Control Register, and port pin input are all connected to the Port Data Buffer (PDB). Figure 27. General I/O Port Architecture DATA OUT REG. D WR ADDRESS ALE D G Q Q DATA OUT ADDRESS OUTPUT MUX PORT PIN MACROCELL OUTPUTS EXT CS INTERNAL DATA BUS READ MUX P D B DATA IN OUTPUT SELECT CONTROL REG. D WR DIR REG. D WR ENABLE PRODUCT TERM (.OE) INPUT MACROCELL CPLD - INPUT AI02885 Q ENABLE OUT Q 50/89 PSD4235G2 The Port pin’s tri-state output driver enable is controlled by a two input OR gate whose inputs come from the CPLD AND Array enable product term and the Direction Register. If the enable product term of any of the Array outputs are not defined and that port pin is not defined as a CPLD output in the PSDabel file, the Direction Register has sole control of the buffer that drives the port pin. The contents of these registers can be altered by the MCU. The Port Data Buffer (PDB) feedback path allows the MCU to check the contents of the registers. Ports A, B, and C have embedded Input Macrocells (IMC). The Input Macrocells (IMC) can be configured as latches, registers, or direct inputs to the PLDs. The latches and registers are clocked by Address Strobe (ALE/AS, PD0) or a product term from the PLD AND Array. The outputs from the Input Macrocells (IMC) drive the PLD input bus and can be read by the MCU. See the section entitled “Input Macrocell”, on page 38. Port Operating Modes The I/O Ports have several modes of operation. Some modes can be defined using PSDsoft Express, some by the MCU writing to the registers in CSIOP space, and some by both. The modes that can only be defined using PSDsoft Express must be programmed into the device and cannot be changed unless the device is reprogrammed. The modes that can be changed by the MCU can be done so dynamically at run-time. The PLD I/O, Data Port, Address Input, Peripheral I/O and MCU Reset modes are the only modes that must be defined before programming the device. All other modes can be changed by the MCU at run-time. See Application Note AN1171 for more detail. Table 39 summarizes which modes are available on each port. Table 40 shows how and where the different modes are configured. Each of the port operating modes are described in the following sections. MCU I/O Mode. In the MCU I/O mode, the MCU uses the PSD Ports to expand its own I/O ports. By setting up the CSIOP space, the ports on the PSD are mapped into the MCU address space. The addresses of the ports are listed in Table 6. A port pin can be put into MCU I/O mode by writing a 0 to the corresponding bit in the Control Register (for Ports E, F and G). The MCU I/O direction may be changed by writing to the corresponding bit in the Direction Register, or by the output enable product term. See the section entitled “Port Operating Modes”, on page 51. When the pin is configured as an output, the content of the Data Out Register drives the pin. When configured as an input, the MCU can read the port input through the Data In buffer. See Figure 27. Ports A, B and C do not have Control Registers, and are in MCU I/O mode by default. They can be used for PLD I/O if they are specified in PSDsoft Express. PLD I/O Mode. The PLD I/O Mode uses a port as an input to the CPLD’s Input Macrocells (IMC), and/or as an output from the CPLD’s Output Macrocells (OMC). The output can be tri-stated with a control signal. This output enable control signal can be defined by a product term from the PLD, or by resetting the corresponding bit in the Direction Register to 0. The corresponding bit in the Direction Register must not be set to 1 if the pin is defined for a PLD input signal in PSDsoft Express. The PLD I/O mode is specified in PSDsoft Express by declaring the port pins, and then specifying an equation in PSDsoft Express. Address Out Mode. For MCUs with a multiplexed address/data bus, Address Out mode can be used to drive latched addresses onto the port pins. These port pins can, in turn, drive external devices. Either the output enable or the corresponding bits of both the Direction Register and Control Register must be set to a 1 for pins to use Address Out mode. This must be done by the MCU at run-time. See Table 41 for the address output pin assignments on Ports E, F and G for various MCUs. Note: Do not drive address signals with Address Out Mode to an external memory device if it is intended for the MCU to Boot from the external device. The MCU must first Boot from PSD memory so the Direction and Control register bits can be set. 51/89 PSD4235G2 Table 39. Port Operating Modes Port Mode MCU I/O PLD I/O McellA Outputs McellB Outputs Additional Ext. CS Outputs PLD Inputs Address Out Address In Data Port Peripheral I/O JTAG ISP MCU Reset Mode2 Port A Yes Yes No No Yes No Yes No Yes No No Port B Yes Yes Yes No Yes No Yes No No No No Port C Yes No No Yes Yes No Yes No No No No Port D Yes No No No Yes No Yes No Yes No No Port E Yes No No No No Yes (A7 – 0) No No No Yes1 No Port F Yes No No Yes Yes Yes (A7 – 0) Yes Yes Yes No Yes Port G Yes No No No No Yes (A7 – 0) or (A15 – 8) No Yes No No Yes Note: 1. Can be multiplexed with other I/O functions. 2. Available to Motorola 16-bit 683xx and HC16 families of MCUs. Table 40. Port Operating Mode Settings Mode Defined in PSDsoft Express Control Register Setting 0 (Note 4) Direction Register Setting 1 = output, 0 = input (Note 2) (Note 2) VM Register Setting JTAG Enable MCU I/O Declare pins only Declare pins and Logic equations Selected for MCU with non-multiplexed bus Declare pins only Declare pins or Logic equation for Input Macrocells Logic equations (PSEL0 and PSEL1) Declare pins only N/A N/A PLD I/O N/A N/A N/A Data Port (Port F, G) Address Out (Port E, F, G) Address In (Port A, B, C, D, F) Peripheral I/O (Port F) JTAG ISP 3 MCU Reset Mode N/A N/A N/A N/A 1 1 (Note 2) N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A PIO bit = 1 N/A N/A N/A JTAG_Enable N/A Specific pin logic level N/A Note: 1. N/A = Not Applicable 2. The direction of the Port A,B,C, and F pins are controlled by the Direction Register ORed with the individual output enable product term (.oe) from the CPLD AND Array. 3. Any of these three methods enables the JTAG pins on Port E. 4. Control Register setting is not applicable to Ports A, B and C. 52/89 PSD4235G2 Table 41. I/O Port Latched Address Output Assignments MCU 80C51XA All Other MCU with Multiplexed Bus Note: 1. N/A = Not Applicable. Port E (PE3-PE0) N/A1 Address a3-a0 Port E (PE7-PE4) Address a7-a4 Address a7-a4 Port F (PF3-PF0) N/A Address a3-a0 Port F (PF7-PF4) Address a7-a4 Address a7-a4 Port G (PG3-PG0) Address a11-a8 Address a11-a8 Port G (PG7-PG4) Address a15-a12 Address a15-a12 Address In Mode. For MCUs that have more than 16 address signals, the higher addresses can be connected to Port A, B, C, D or F, and are routed as inputs to the PLDs. The address input can be latched in the Input Macrocell (IMC) by Address Strobe (ALE/AS, PD0). Any input that is included in the DPLD equations for the primary Flash memory, secondary Flash memory or SRAM is considered to be an address input. Data Port Mode. Ports F and G can be used as a data bus port for a MCU with a non-multiplexed address/data bus. The Data Port is connected to the data bus of the MCU. The general I/O functions are disabled in Ports F and G if the ports are configured as a Data Port. Data Port mode is automatically configured in PSDsoft Express when a non-multiplexed bus MCU is selected. Peripheral I/O Mode. Peripheral I/O mode can be used to interface with external 8-bit peripherals. In this mode, all of Port F serves as a tri-state, bidirectional data buffer for the MCU. Peripheral I/O mode is enabled by setting bit 7 of the VM Register to a 1. Figure 28 shows how Port A acts as a bidirectional buffer for the MCU data bus if Peripheral I/O mode is enabled. An equation for PSEL0 and/or PSEL1 must be specified in PSDsoft Express. The buffer is tri-stated when PSEL0 or PSEL1 is not active. JTAG In-System Programming (ISP). Port E is JTAG compliant, and can be used for In-System Programming (ISP). You can multiplex JTAG operations with other functions on Port E because InSystem Programming (ISP) is not performed during normal system operation. For more information on the JTAG Port, see the section entitled “Reset (RESET) Timing”, on page 63. MCU Reset Mode. Ports F and G can be configured to operate in MCU Reset mode. This mode is available when PSD is configured for the Motorola 16-bit 683xx and HC16 family and is active only during reset. At the rising edge of the Reset input, the MCU reads the logic level on the data bus (D15-D0) pins. The MCU then configures some of its I/O pin functions according to the logic level input on the data bus lines. Two dedicated buffers are usually enabled during reset to drive the data bus lines to the desired logic level. The PSD can replace the two buffers by configuring Ports F and G to operate in MCU Reset mode. In this mode, the PSD will drive the pre-defined logic level or data pattern on to the MCU data bus when Reset is active and there is no ongoing bus cycle. After reset, Ports F and G return to the normal Data Port mode. The MCU Reset mode is enabled and configured in PSDsoft Express. The user defines the logic level (data pattern) that will be drive out from Ports F and G during reset. Port Configuration Registers (PCR). Each Port has a set of Port Configuration Registers (PCR) used for configuration. The contents of the registers can be accessed by the MCU through normal read/write bus cycles at the addresses given in Table 6. The addresses in Table 6 are the offsets in hexadecimal from the base of the CSIOP register. The pins of a port are individually configurable and each bit in the register controls its respective pin. For example, bit 0 in a register refers to bit 0 of its port. The three Port Configuration Registers (PCR), shown in Table 42, are used for setting the Port configurations. The default Power-up state for each register in Table 42 is 00h. Table 42. Port Configuration Registers (PCR) Register Name Control Direction Drive Select1 E, F, G A, B, C, D, E, F, G A, B, C, D, E, F, G Port MCU Access Write/Read Write/Read Write/Read Note: 1. See Table 46 for Drive Register bit definition. Control Register. Any bit reset to 0 in the Control Register sets the corresponding port pin to MCU I/ O mode, and a 1 sets it to Address Out mode. The default mode is MCU I/O. Only Ports E, F and G have an associated Control Register. 53/89 PSD4235G2 Figure 28. Peripheral I/O Mode RD PSEL0 PSEL PSEL1 D0 - D7 DATA BUS VM REGISTER BIT 7 PA0 - PA7 WR AI02886 Direction Register. The Direction Register controls the direction of data flow in the I/O Ports. Any bit set to 1 in the Direction Register causes the corresponding pin to be an output, and any bit set to 0 causes it to be an input. The default mode for all port pins is input. Table 43. Port Pin Direction Control, Output Enable P.T. Not Defined Direction Register Bit 0 1 Port Pin Mode Input Output Table 44. Port Pin Direction Control, Output Enable P.T. Defined Direction Register Bit 0 0 1 1 Output Enable P.T. 0 1 0 1 Port Pin Mode Input Output Output Output Table 45. Port Direction Assignment Example Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 1 Bit 1 1 Bit 0 1 Figure 29 and Figure 31 show the Port Architecture diagrams for Ports A/B/C and E/F/G, respectively. The direction of data flow for Ports A, B, C and F are controlled not only by the direction register, but also by the output enable product term from the PLD AND Array. If the output enable product term is not active, the Direction Register has sole control of a given pin’s direction. An example of a configuration for a Port with the three least significant bits set to output and the remainder set to input is shown in Table 45. Since Port D only contains four pins, the Direction Register for Port D has only the four least significant bits active. Drive Select Register. The Drive Select Register configures the pin driver as Open Drain or CMOS for some port pins, and controls the slew rate for the other port pins. An external pull-up resistor should be used for pins configured as Open Drain. A pin can be configured as Open Drain if its corresponding bit in the Drive Select Register is set to a 1. The default pin drive is CMOS. (The slew rate is a measurement of the rise and fall times of an output. A higher slew rate means a faster output response and may create more electrical noise. A pin operates in a high slew rate when the corresponding bit in the Drive Register is set to 1. The default rate is slow slew.) Table 46 shows the Drive Register for Ports A, B, C, D, E, F and G. It summarizes which pins can be configured as Open Drain outputs and which pins the slew rate can be set for. 54/89 PSD4235G2 Table 46. Drive Register Pin Assignment Drive Register Port A Port B Port C Port D Port E Port F Port G Bit 7 Open Drain Open Drain Slew Rate NA1 Open Drain Slew Rate Open Drain Bit 6 Open Drain Open Drain Slew Rate NA1 Open Drain Slew Rate Open Drain Bit 5 Open Drain Open Drain Slew Rate NA1 Open Drain Slew Rate Open Drain Bit 4 Open Drain Open Drain Slew Rate NA1 Open Drain Slew Rate Open Drain Bit 3 Open Drain Open Drain Slew Rate Open Drain Open Drain Slew Rate Open Drain Bit 2 Open Drain Open Drain Slew Rate Open Drain Open Drain Slew Rate Open Drain Bit 1 Open Drain Open Drain Slew Rate Open Drain Open Drain Slew Rate Open Drain Bit 0 Open Drain Open Drain Slew Rate Open Drain Open Drain Slew Rate Open Drain Note: 1. NA = Not Applicable. Table 47. Port Data Registers Register Name Data In Data Out Output Macrocell Mask Macrocell Input Macrocell Enable Out Port A, B, C, D, E, F, G Read – input on pin A, B, C, D, E, F, G Write/Read A, B A, B A, B, C A, B, C, F Read – outputs of Macrocells Write – loading Macrocells Flip-flop Write/Read – prevents loading into a given Macrocell Read – outputs of the Input Macrocells Read – the output enable control of the port driver MCU Access Port Data Registers. The Port Data Registers, shown in Table 47, are used by the MCU to write data to or read data from the ports. Table 47 shows the register name, the ports having each register type, and MCU access for each register type. The registers are described next. Data In. Port pins are connected directly to the Data In buffer. In MCU I/O Input mode, the pin input is read through the Data In buffer. Data Out Register. Stores output data written by the MCU in the MCU I/O Output mode. The contents of the Register are driven out to the pins if the Direction Register or the output enable product term is set to 1. The contents of the register can also be read back by the MCU. Output Macrocells (OMC). The CPLD Output Macrocells (OMC) occupy a location in the MCU’s address space. The MCU can read the output of the Output Macrocells (OMC). If the Mask Macrocell Register bits are not set, writing to the Macrocell loads data to the Macrocell flip-flops. See the section entitled “Macrocell and I/O Port”, on page 34. Mask Macrocell Register. Each Mask Macrocell Register bit corresponds to an Output Macrocell (OMC) flip-flop. When the Mask Macrocell Register bit is set to a 1, loading data into the Output Macrocell (OMC) flip-flop is blocked. The default value is 0, or unblocked. Input Macrocells (IMC). The Input Macrocells (IMC) can be used to latch or store external inputs. The outputs of the Input Macrocells (IMC) are routed to the PLD input bus, and can be read by the MCU. See the section entitled “Input Macrocells (IMC)”, on page 37. 55/89 PSD4235G2 Figure 29. Port A, B and C Structure DATA OUT Register D WR PORT Pin OUTPUT MUX Q DATA OUT MCELL7-MCELL0 (Port A) MCELLB7-MCELLB0 (Port B) Ext.CS (Port C) READ MUX P D B DATA IN INTERNAL DATA BUS OUTPUT SELECT ENABLE OUT DIR Register D WR ENABLE PRODUCT TERM (.OE) INPUT MACROCELL Q CPLD - INPUT AI04936 Enable Out. The Enable Out register can be read by the MCU. It contains the output enable values for a given port. A 1 indicates the driver is in output mode. A 0 indicates the driver is in tri-state and the pin is in input mode. Ports A, B and C – Functionality and Structure Ports A, B and C have similar functionality and structure, as shown in Figure 29. The ports can be configured to perform one or more of the following functions: s MCU I/O Mode s CPLD Output – Macrocells McellA7-McellA0 can be connected to Port A. McellB7-McellB0 can be connected to Port B. External Chip Select (ECS7-ECS0) can be connected to Port C or Port F. CPLD Input – Via the Input Macrocells (IMC). Address In – Additional high address inputs using the Input Macrocells (IMC). Open Drain/Slew Rate – pins PC7-PC0 can be configured to fast slew rate. Pins PA7-PA0 can be configured to Open Drain mode. s s s 56/89 PSD4235G2 Figure 30. Port D Structure DATA OUT Register DATA OUT D WR PORT D PIN OUTPUT MUX Q INTERNAL DATA BUS READ MUX P D B DATA IN OUTPUT SELECT DIR Register D WR Q CPLD - INPUT AI04937 Port D – Functionality and Structure Port D has four I/O pins. See Figure 30. Port D can be configured to perform one or more of the following functions: s MCU I/O mode s Port E – Functionality and Structure Port E can be configured to perform one or more of the following functions (see Figure 31): s MCU I/O Mode s CPLD Input – direct input to the CPLD, no Input Macrocells (IMC) Port D pins can be configured in PSDsoft Express as input pins for other dedicated functions: Address Strobe (ALE/AS, PD0) CLKIN (PD1) as input to the Macrocells Flipflops and APD counter PSD Chip Select Input (CSI, PD2). Driving this signal High disables the Flash memory, SRAM and CSIOP. Write Enable High-byte (WRH , PD3) input, or as DBE input from a MC68HC912. In-System Programming (ISP) – JTAG port can be enabled for programming/erase of the PSD device. (See the section entitled “Reset (RESET) Timing”, on page 63, for more information on JTAG programming.) Open Drain – pins can be configured in Open Drain Mode Battery Backup features – PE6 can be configured for a battery input supply, Voltage Stand-by (VSTBY). – PE7 can be configured as a Battery-on Indicator (VBATON), indicating when VCC is less than VBAT. s s s s s s s Latched Address output – Provide latched address output. 57/89 PSD4235G2 Figure 31. Port E, F and G Structure DATA OUT Register D WR ADDRESS ALE D G Q ADDRESS A[ 7:0] OR A[15:8] OUTPUT MUX PORT Pin Q DATA OUT Ext. CS (Port F) READ MUX P D B CONTROL Register D WR DIR Register D WR ENABLE PRODUCT TERM (.OE) CPLD - INPUT (Port F) Q Q ENABLE OUT DATA IN OUTPUT SELECT INTERNAL DATA BUS ISP or Battery Back-Up (Port E) Configuration Bit AI04938 Port F – Functionality and Structure Port F can be configured to perform one or more of the following functions: s MCU I/O Mode s s MCU Reset Mode – for 16-bit Motorola 683xx and HC16 MCUs CPLD Output – External Chip Select (ECS7ECS0) can be connected to Port F or Port C. CPLD Input – direct input to the CPLD, no Input Macrocells (IMC) Latched Address output – Provide latched address output as per Table 41. Slew Rate – pins can be configured for fast Slew Rate Data Port – connected to D7-D0 when Port F is configured as Data Port for a non-multiplexed bus Peripheral Mode Port G – Functionality and Structure Port G can be configured to perform one or more of the following functions: s MCU I/O Mode s s Latched Address output – Provide latched address output as per Table 41. Open Drain – pins can be configured in Open Drain Mode Data Port – connected to D15-D8 when Port G is configured as Data Port for a non-multiplexed bus MCU Reset Mode – for 16-bit Motorola 683xx and HC16 MCUs s s s s s s s 58/89 PSD4235G2 POWER MANAGEMENT The PSD device offers configurable power saving options. These options may be used individually or in combinations, as follows: s All memory blocks in a PSD (primary Flash memory, secondary Flash memory, and SRAM) are built with power management technology. In addition to using special silicon design methodology, power management technology puts the memories into standby mode when address/data inputs are not changing (zero DC current). As soon as a transition occurs on an input, the affected memory “wakes up”, changes and latches its outputs, then goes back to standby. The designer does not have to do anything special to achieve memory Stand-by mode when no inputs are changing—it happens automatically. The PLD sections can also achieve Stand-by mode when its inputs are not changing, as described for the Power Management Mode Registers (PMMR), later. The Automatic Power Down (APD) block allows the PSD to reduce to stand-by current automatically. The APD Unit also blocks MCU address/data signals from reaching the memories and PLDs. This feature is available on all PSD devices. The APD Unit is described in more detail in the section entitled “APD Unit”, on page 60. Built in logic monitors the Address Strobe of the MCU for activity. If there is no activity for a certain period (the MCU is asleep), the APD Unit initiates Power-down mode (if enabled). Once in Power-down mode, all address/data signals are blocked from reaching the PSD memories and PLDs, and the memories are deselected internally. This allows the memories and PLDs to remain in Stand-by mode even if the address/data signals are changing state externally (noise, other devices on the MCU bus, etc.). Keep in s mind that any unblocked PLD input signals that are changing states keeps the PLD out of Stand-by mode, but not the memories. PSD Chip Select Input (CSI, PD2) can be used to disable the internal memories, placing them in Stand-by mode even if inputs are changing. This feature does not block any internal signals or disable the PLDs. This is a good alternative to using the APD Unit, especially if your MCU has a chip select output. There is a slight penalty in memory access time when PSD Chip Select Input (CSI, PD2) makes its initial transition from deselected to selected. The Power Management Mode Registers (PMMR) can be written by the MCU at run-time to manage power. All PSD devices support “blocking bits” in these registers that are set to block designated signals from reaching both PLDs. Current consumption of the PLDs is directly related to the composite frequency of the changes on their inputs (see Figure 35). Significant power savings can be achieved by blocking signals that are not used in DPLD or CPLD logic equations at run-time. PSDsoft Express creates a fuse map that automatically blocks the low address byte (A7-A0) or the control signals (CNTL0-CNTL2, ALE and Write Enable High-byte (WRH /DBE, PD3)) if none of these signals are used in PLD logic equations. PSD devices have a Turbo bit in PMMR0. This bit can be set to turn the Turbo mode off (the default is with Turbo mode turned on). While Turbo mode is off, the PLDs can achieve Stand-by current when no PLD inputs are changing (zero DC current). Even when inputs do change, significant power can be saved at lower frequencies (AC current), compared to when Turbo mode is on. When the Turbo mode is on, there is a significant DC current component, and the AC component is higher. s s 59/89 PSD4235G2 Figure 32. APD Unit APD EN PMMR0 BIT 1=1 TRANSITION DETECTION ALE CLR PD Secondary Flash Memory Select Primary Flash Memory Select PLD SRAM Select POWER DOWN (PDN) Select DISABLE BUS INTERFACE RESET CSI CLKIN EDGE DETECT APD COUNTER PD DISABLE Primary and Secondary FLASH Memory and SRAM AI04939 Automatic Power-down (APD) Unit and Powerdown Mode. The APD Unit, shown in Figure 32, puts the PSD into Power-down mode by monitoring the activity of Address Strobe (ALE/AS, PD0). If the APD Unit is enabled, as soon as activity on Address Strobe (ALE/AS, PD0) stops, a four bit counter starts counting. If Address Strobe (ALE/ AS, PD0) remains inactive for fifteen clock periods of CLKIN (PD1), Power-down (PDN) goes High, and the PSD enters Power-down mode, as discussed next. Table 48. Effect of Power-down Mode on Ports Port Function MCU I/O PLD Out Address Out Data Port Peripheral I/O Pin Level No Change No Change Undefined Tri-State Tri-State s If Address Strobe (ALE/AS, PD0) starts pulsing again, the PSD returns to normal operation. The PSD also returns to normal operation if either PSD Chip Select Input (CSI , PD2) is Low or the Reset (RESET) input is High. The MCU address/data bus is blocked from all memory and PLDs. Various signals can be blocked (prior to Powerdown mode) from entering the PLDs by setting the appropriate bits in the Power Management Mode Registers (PMMR). The blocked signals include MCU control signals and the common CLKIN (PD1). Note that blocking CLKIN (PD1) from the PLDs does not block CLKIN (PD1) from the APD Unit. All PSD memories enter Stand-by mode and are drawing Stand-by current. However, the PLDs and I/O ports blocks do not go into Stand-by mode because you do not want to have to wait for the logic and I/O to “wake-up” before their outputs can change. See Table 48 for Powerdown mode effects on PSD ports. Typical Stand-by current is or the order of µA. This Stand-by current value assumes that there are no transitions on any PLD input. s s s Power-down Mode. By default, if you enable the APD Unit, Power-down mode is automatically enabled. The device enters Power-down mode if Address Strobe (ALE/AS, PD0) remains inactive for fifteen periods of CLKIN (PD1). The following should be kept in mind when the PSD is in Power-down mode: s Table 49. PSD Timing and Stand-by Current during Power-down Mode Mode Power-down PLD Propagation Delay Normal tPD (Note 1) Memory Access Time No Access Access Recovery Time to Normal Access tLVDV Typical Stand-by Current ISB (Note 2) Note: 1. Power-down does not affect the operation of the PLD. The PLD operation in this mode is based only on the Turbo bit. 2. Typical current consumption, see Table 60, assuming no PLD inputs are changing state and the PLD Turbo bit is 0. 60/89 PSD4235G2 Figure 33. Enable Power-down Flow Chart RESET Enable APD Set PMMR0 Bit 1 = 1 OPTIONAL Disable desired inputs to PLD by setting PMMR0 bits 4 and 5 and PMMR2 bits 0 to 6. No ALE/AS idle for 15 CLKIN clocks? Yes PSD in Power Down Mode AI04940 Other Power Saving Options. The PSD offers other reduced power saving options that are independent of the Power-down mode. Except for the SRAM Stand-by and PSD Chip Select Input (CSI, PD2) features, they are enabled by setting bits in PMMR0 and PMMR2 (as summarised in Table 23 and Table 24). PLD Power Management The power and speed of the PLDs are controlled by the Turbo bit (bit 3) in PMMR0. By setting the bit to 1, the Turbo mode is off and the PLDs consume the specified Stand-by current when the inputs are not switching for an extended time of 70 ns. The propagation delay time is increased after the Turbo bit is set to 1 (turned off) when the inputs change at a composite frequency of less than 15 MHz. When the Turbo bit is reset to 0 (turned on), the PLDs run at full power and speed. The Turbo bit affects the PLD’s DC power, AC power, Table 50. APD Counter Operation APD Enable Bit 0 1 1 1 ALE PD Polarity X X 1 0 ALE Level X Pulsing 1 0 and propagation delay. See the AC and DC characteristics tables for PLD timing values (Table 67). Blocking MCU control signals with the PMMR2 bits can further reduce PLD AC power consumption. SRAM Stand-by Mode (Battery Backup). The PSD supports a battery backup mode in which the contents of the SRAM are retained in the event of a power loss. The SRAM has Voltage Stand-by (VSTBY, PE6) that can be connected to an external battery. When VCC becomes lower than V STBY then the PSD automatically connects to Voltage Stand-by (VSTBY, PE6) as a power source to the SRAM. The SRAM Stand-by current (I STBY) is typically 0.5 µA. The SRAM data retention voltage is 2 V minimum. The Battery-on Indicator (VBATON) can be routed to PE7. This signal indicates when the VCC has dropped below V STBY, and that the SRAM is running on battery power. PSD Chip Select Input (CSI, PD2) PD2 of Port D can be configured in PSDsoft Express as PSD Chip Select Input (CSI). When Low, the signal selects and enables the internal primary Flash memory, secondary Flash memory, SRAM, and I/O blocks for Read or Write operations involving the PSD. A High on PSD Chip Select Input (CSI , PD2) disables the primary Flash memory, secondary Flash memory, and SRAM, and reduces the PSD power consumption. However, the PLD and I/O signals remain operational when PSD Chip Select Input (CSI, PD2) is High. There may be a timing penalty when using PSD Chip Select Input (CSI, PD2) depending on the speed grade of the PSD that you are using. See the timing parameter tSLQV in Table 67. Input Clock. The PSD provides the option to turn off CLKIN (PD1) to the PLD to save AC power consumption. CLKIN (PD1) is an input to the PLD AND Array and the Output Macrocells (OMC). During Power-down mode, or, if CLKIN (PD1) is not being used as part of the PLD logic equation, the clock should be disabled to save AC power. CLKIN (PD1) is disconnected from the PLD AND Array or the Macrocells block by setting bits 4 or 5 to a 1 in PMMR0. APD Counter Not Counting Not Counting Counting (Generates PDN after 15 Clocks) Counting (Generates PDN after 15 Clocks) 61/89 PSD4235G2 Input Control Signals. The PSD provides the option to turn off the address input (A7-A0) and input control signals (CNTL0, CNTL1, CNTL2, Address Strobe (ALE/AS, PD0) and Write Enable High-byte (WRH/DBE, PD3)) to the PLD to save AC power consumption. These signals are inputs to the PLD AND Array. During Power-down mode, or, if any of them are not being used as part of the PLD logic equation, these control signals should be disabled to save AC power. They are disconnected from the PLD AND Array by setting bits 0, 2, 3, 4, 5 and 6 to a 1 in PMMR2. Power On Reset, Warm Reset and Power-down Power On Reset. Upon Power-up, the PSD requires a Reset (RESET) pulse of duration tNLNHPO (minimum 1 ms) after VCC is steady. During this period, the device loads internal configurations, clears some of the registers and sets the Flash memory into Operating mode. After the rising edge of Reset (RESET), the PSD remains in the Reset mode for an additional period, t OPR (maximum 120 ns), before the first memory access is allowed. The PSD Flash memory is reset to the Read mode upon Power-up. Sector Select (FS0-FS7 and CSBOOT0-CSBOOT3) must all be Low, Write Strobe (WR/WRL, CNTL0) High, during Power On Reset for maximum security of the data contents and to remove the possibility of data being written on the first edge of Write Strobe (WR/WRL, CNTL0). Any Flash memory Write cycle initiation is prevented automatically when V CC is below VLKO. Warm Reset. Once the device is up and running, the device can be reset with a pulse of a much shorter duration, tNLNH (minimum 150 ns). The same t OPR period is needed before the device is operational after warm reset. Figure 34 shows the timing of the Power-up and warm reset. I/O Pin, Register and PLD Status at Reset. Table 51 shows the I/O pin, register and PLD status during Power On Reset, warm reset and Powerdown mode. PLD outputs are always valid during warm reset, and they are valid in Power On Reset once the internal PSD Configuration bits are loaded. This loading of PSD is completed typically long before the VCC ramps up to operating level. Once the PLD is active, the state of the outputs are determined by equations specified in PSDsoft Express. Reset of Flash Memory Erase and Program Cycles. An external Reset (RESET) also resets the internal Flash memory state machine. During a Flash memory Program or Erase cycle, Reset (RESET) terminates the cycle and returns the Flash memory to the Read mode within a period of tNLNH-A (minimum 25 µs). Table 51. Status During Power-On Reset, Warm Reset and Power-down Mode Port Configuration MCU I/O PLD Output Address Out Data Port Peripheral I/O Power-On Reset Input mode Valid after internal PSD configuration bits are loaded Tri-stated Tri-stated Tri-stated Warm Reset Input mode Valid Tri-stated Tri-stated Tri-stated Power-down Mode Unchanged Depends on inputs to PLD (addresses are blocked in PD mode) Not defined Tri-stated Tri-stated Register PMMR0 and PMMR2 Macrocells Flip-flop status Power-On Reset Cleared to 0 Cleared to 0 by internal Power-On Reset Initialized, based on the selection in PSDsoft Express Configuration menu Cleared to 0 Warm Reset Unchanged Depends on .re and .pr equations Initialized, based on the selection in PSDsoft Express Configuration menu Cleared to 0 Power-down Mode Unchanged Depends on .re and .pr equations VM Register1 Unchanged All other registers Unchanged Note: 1. The SR_code and Peripheral Mode bits in the VM Register are always cleared to 0 on Power-On Reset or Warm Reset. 62/89 PSD4235G2 Figure 34. Reset (RESET) Timing VCC VCC(min) tNLNH tNLNH-A Warm Reset tNLNH-PO Power-On Reset tOPR tOPR RESET AI02866b Programming In-Circuit using the JTAG Serial Interface The JTAG Serial Interface on the PSD can be enabled on Port E (see Table 52). All memory blocks (primary Flash memory and secondary Flash memory), PLD logic, and PSD Configuration bits may be programmed through the JTAG-ISC Serial Interface. A blank device can be mounted on a printed circuit board and programmed using JTAG In-System Programming (ISP). The standard JTAG signals (IEEE 1149.1) are TMS, TCK, TDI, and TDO. Two additional signals, TSTAT and TERR, are optional JTAG extensions used to speed up Program and Erase cycles. By default, on a blank PSD (as shipped from the factory, or after erasure), four pins on Port E are enabled for the basic JTAG signals TMS, TCK, TDI, and TDO . See Application Note AN1153 for more details on JTAG In-System Programming (ISP). Standard JTAG Signals. The standard JTAG signals (TMS, TCK, TDI, and TDO) can be enabled by any of three different conditions that are logically ORed. When enabled, TDI, TDO, TCK, and TMS are inputs, waiting for a serial command from an external JTAG controller device (such as FlashLINK or Automated Test Equipment). When the enabling command is received from the external JTAG controller device, TDO becomes an output and the JTAG channel is fully functional inside the PSD. The same command that enables the JTAG channel may optionally enable the two additional JTAG pins, TSTAT and TERR. The following symbolic logic equation specifies the conditions enabling the four basic JTAG pins (TMS, TCK, TDI, and TDO) on their respective Port E pins. For purposes of discussion, the logic label JTAG_ON is used. When JTAG_ON is true, the four pins are enabled for JTAG. When JTAG_ON is false, the four pins can be used for general PSD I/O. JTAG_ON = PSDsoft Express_enabled + /* An NVM configuration bit inside the PSD is set by the designer in the PSDsoft Express Configuration utility. This dedicates the pins for JTAG at all times (compliant with IEEE 1149.1 */ Microcontroller_enabled + /* The microcontroller can set a bit at run-time by writing to the PSD register, JTAG Enable. This register is located at address CSIOP + offset C7h. Setting the JTAG_ENABLE bit in this register will enable the pins for JTAG use. This bit is cleared by a PSD reset or the microcontroller. See Table 21 for bit definition. */ PSD_product_term_enabled; /* A dedicated product term (PT) inside the PSD can be used to enable the JTAG pins. This PT has the reserved name JTAGSEL. Once defined as a node in PSDabel, the designer can write an equation for JTAGSEL. This method is used when the Port E JTAG pins are multiplexed with other I/O signals. It is recommended to tie logically the node JTAGSEL to the JEN\ signal on the Flashlink cable when multiplexing JTAG signals. See Application Note 1153 for details. */ The state of the PSD Reset (RESET) signal does not interrupt (or prevent) JTAG operations if the JTAG pins are dedicated by an NVM configuration bit (via PSDsoft Express). However, Reset (RESET) will prevent or interrupt JTAG operations if the JTAG Enable Register (as shown in Table 21) is used to enable the JTAG pins. The PSD supports JTAG In-System-Programmability (ISP) commands, but not Boundary Scan. ST’s PSDsoft Express software tool and FlashLINK JTAG programming cable implement the JTAG In-System-Programmability (ISP) commands. Table 52. JTAG Port Signals Port E Pin PE0 PE1 PE2 PE3 JTAG Signals TMS TCK TDI TDO Description Mode Select Clock Serial Data In Serial Data Out 63/89 PSD4235G2 Port E Pin PE4 PE5 JTAG Signals TSTAT TERR Description Status Error Flag JTAG Extensions. TSTAT and TERR are two JTAG extension signals enabled by a JTAG command received over the four standard JTAG pins (TMS, TCK, TDI, and TDO). They are used to speed Program and Erase cycles by indicating status on PSD pins instead of having to scan the status out serially using the standard JTAG channel. See Application Note AN1153. TERR indicates if an error has occurred when erasing a sector or programming in Flash memory. This signal goes Low (active) when an Error condition occurs, and stays Low until a specific JTAG command is executed or a Reset (RESET) pulse is received after an “ISC_DISABLE” command. TSTAT behaves the same as Ready/Busy (PE4) described in the section entitled “Ready/Busy (PE4)”, on page 21. TSTAT is High when the PSD4235G2 device is in Read mode (primary Flash memory and secondary Flash memory contents can be read). TSTAT is Low when Flash memory Program or Erase cycles are in progress, and also when data is being written to the secondary Flash memory . TSTAT and TERR can be configured as opendrain type signals with a JTAG command. Note: The state of Reset (Reset) does not interrupt (or prevent) JTAG operations if the JTAG signals are dedicated by an NVM Configuration bit (via PSDsoft Express). However, Reset (Reset) prevents or interrupts JTAG operations if the JTAG Enable Register (as shown in Table 21) is used to enable the JTAG signals. Security and Flash memory Protection. When the security bit is set, the device cannot be read on a Device Programmer or through the JTAG Port. When using the JTAG Port, only a Full Chip Erase command is allowed. All other Program, Erase and Verify commands are blocked. Full Chip Erase returns the device to a non-secured blank state. The Security Bit can be set in PSDsoft Express. All primary Flash memory and secondary Flash memory sectors can individually be sector protected against erasure. The sector protect bits can be set in PSDsoft Express. INITIAL DELIVERY STATE When delivered from ST, the PSD device has all bits in the memory and PLDs set to 1. The PSD Configuration Register bits are set to 0. The code, configuration, and PLD logic are loaded using the programming procedure. Information for programming the device is available directly from ST. Please contact your local sales representative. 64/89 PSD4235G2 AC/DC PARAMETERS These tables describe the AD and DC parameters of the PSD4235G2: t DC Electrical Specification t AC Timing Specification s PLD Timing – Combinatorial Timing – Synchronous Clock Mode – Asynchronous Clock Mode – Input Macrocell Timing s – Power-down and Reset Timing The following are issues concerning the parameters presented: s In the DC specification the supply current is given for different modes of operation. Before calculating the total power consumption, determine the percentage of time that the PSD is in each mode. Also, the supply power is considerably different if the Turbo bit is 0. s MCU Timing – Read Timing – Write Timing – Peripheral Mode Timing s The AC power component gives the PLD, Flash memory, and SRAM mA/MHz specification. Figure 35 show the PLD mA/MHz as a function of the number of Product Terms (PT) used. In the PLD timing parameters, add the required delay when Turbo bit is 0. Figure 35. PLD ICC /Frequency Consumption 110 100 90 80 TURBO ON (100%) 70 TURBO OFF Icc - (mA) 60 50 TURBO ON (25%) 40 30 20 TURBO OFF 10 0 0 5 10 15 20 25 HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz) AI05739 Vcc = 5V PT 100% PT 25% 65/89 PSD4235G2 Table 53. Example of PSD Typical Power Calculation at VCC = 5.0 V (with Turbo Mode On) Conditions Highest Composite PLD input frequency (Freq PLD) MCU ALE frequency (Freq ALE) % Flash memory Access % SRAM access % I/O access Operational Modes % Normal % Power-down Mode Number of product terms used (from fitter report) % of total product terms Turbo Mode = 45 PT = 45/193 = 23.3% = ON Calculation (using typical values) ICC total = Ipwrdown x %pwrdown + %normal x (ICC (ac) + ICC (dc)) = Ipwrdown x %pwrdown + % normal x (%flash x 2.5 mA/MHz x Freq ALE + %SRAM x 1.5 mA/MHz x Freq ALE + % PLD x 2 mA/MHz x Freq PLD + #PT x 400 µA/PT) = 50 µA x 0.90 + 0.1 x (0.8 x 2.5 mA/MHz x 4 MHz + 0.15 x 1.5 mA/MHz x 4 MHz + 2 mA/MHz x 8 MHz + 45 x 0.4 mA/PT) = 45 µA + 0.1 x (8 + 0.9 + 16 + 18 mA) = 45 µA + 0.1 x 42.9 = 45 µA + 4.29 mA = 4.34 mA This is the operating power with no Flash memory Program or Erase cycles in progress. Calculation is based on IOUT = 0 mA. = 10% = 90% = 8 MHz = 4 MHz = 80% = 15% = 5% (no additional power above base) 66/89 PSD4235G2 Table 54. Example of PSD Typical Power Calculation at VCC = 5.0 V (with Turbo Mode Off) Conditions Highest Composite PLD input frequency (Freq PLD) MCU ALE frequency (Freq ALE) % Flash memory Access % SRAM access % I/O access Operational Modes % Normal % Power-down Mode Number of product terms used (from fitter report) % of total product terms Turbo Mode = 45 PT = 45/193 = 23.3% = Off Calculation (using typical values) ICC total = Ipwrdown x %pwrdown + %normal x (ICC (ac) + ICC (dc)) = Ipwrdown x %pwrdown + % normal x (%flash x 2.5 mA/MHz x Freq ALE + %SRAM x 1.5 mA/MHz x Freq ALE + % PLD x (from graph using Freq PLD)) = 50 µA x 0.90 + 0.1 x (0.8 x 2.5 mA/MHz x 4 MHz + 0.15 x 1.5 mA/MHz x 4 MHz + 24 mA) = 45 µA + 0.1 x (8 + 0.9 + 24) = 45 µA + 0.1 x 32.9 = 45 µA + 3.29 mA = 3.34 mA This is the operating power with no Flash memory Program or Erase cycles in progress. Calculation is based on IOUT = 0 mA. = 10% = 90% = 8 MHz = 4 MHz = 80% = 15% = 5% (no additional power above base) 67/89 PSD4235G2 MAXIMUM RATING Stressing the device above the rating listed in the Absolute Maximum Ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not imTable 55. Absolute Maximum Ratings Symbol TSTG TLEAD VIO VCC VPP VESD Storage Temperature Lead Temperature during Soldering (20 seconds max.)1 Input and Output Voltage (Q = VOH or Hi-Z) Supply Voltage Device Programmer Supply Voltage Electrostatic Discharge Voltage (Human Body model) 2 –0.6 –0.6 –0.6 –2000 Parameter Min. –65 Max. 125 235 7.0 7.0 14.0 2000 Unit °C °C V V V V plied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Note: 1. IPC/JEDEC J-STD-020A 2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 Ω, R2=500 Ω) 68/89 PSD4235G2 DC AND AC PARAMETERS This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the MeasureTable 56. Operating Conditions Symbol VCC TA Ambient Operating Temperature (commercial) 0 70 °C Supply Voltage Ambient Operating Temperature (industrial) Parameter Min. 4.5 –40 Max. 5.5 85 Unit V °C ment Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 57. AC Symbols for PLD Timing Signal Letters A C D E G I L N P Q R S T W B M Address Input CEout Output Input Data E Input Internal WDOG_ON signal Interrupt Input ALE Input Reset Input or Output Port Signal Output Output Data WR, UDS, LDS, DS, IORD, PSEN Inputs Chip Select Input R/W Input Internal PDN Signal VSTBY Output Output Macrocell t L H V X Z PW Time Logic Level Low or ALE Logic Level High Valid No Longer a Valid Logic Level Float Pulse Width Signal Behavior Example: tAVLX – Time from Address Valid to ALE Invalid. 69/89 PSD4235G2 Table 58. AC Measurement Conditions Symbol CL Load Capacitance Parameter Min. 30 Max. Unit pF Note: 1. Output Hi-Z is defined as the point where data out is no longer driven. Table 59. Capacitance Symbol CIN COUT CVPP Parameter Input Capacitance (for input pins) Output Capacitance (for input/ output pins) Capacitance (for CNTL2/VPP) Test Condition VIN = 0V VOUT = 0V VPP = 0V Typ.2 4 8 18 Max. 6 12 25 Unit pF pF pF Note: 1. Sampled only, not 100% tested. 2. Typical values are for T A = 25°C and nominal supply voltages. Figure 36. AC Measurement I/O Waveform Figure 37. AC Measurement Load Circuit 2.01 V 3.0V Test Point 0V AI03103b 195 Ω 1.5V Device Under Test CL = 30 pF (Including Scope and Jig Capacitance) AI03104b Figure 38. Switching Waveforms – Key WAVEFORMS INPUTS OUTPUTS STEADY INPUT STEADY OUTPUT MAY CHANGE FROM HI TO LO MAY CHANGE FROM LO TO HI WILL BE CHANGING FROM HI TO LO WILL BE CHANGING LO TO HI DON'T CARE CHANGING, STATE UNKNOWN OUTPUTS ONLY CENTER LINE IS TRI-STATE AI03102 70/89 PSD4235G2 Table 60. DC Characteristics Symbol VIH VIL VIH1 VIL1 VHYS VLKO Parameter Input High Voltage Input Low Voltage Reset High Level Input Voltage Reset Low Level Input Voltage Reset Pin Hysteresis VCC (min) for Flash Erase and Program IOL = 20 µA, VCC = 4.5 V Output Low Voltage IOL = 8 mA, VCC = 4.5 V Output High Voltage Except VSTBY On Output High Voltage VSTBY On SRAM Stand-by Voltage SRAM Stand-by Current Idle Current (VSTBY input) SRAM Data Retention Voltage Stand-by Supply Current for Power-down Mode Input Leakage Current Output Leakage Current VCC = 0 V VCC > VSTBY Only on VSTBY CSI >VCC –0.3 V (Notes 2,3) VSS < VIN < VCC 0.45 < VOUT < VCC PLD_TURBO = Off, f = 0 MHz (Note 5) PLD_TURBO = On, f = 0 MHz During Flash memory Write/ Erase Only Read Only, f = 0 MHz SRAM PLD AC Adder ICC (AC) (Note 5) Flash memory AC Adder SRAM AC Adder Note: 1. 2. 3. 4. Test Condition (in addition to those in Table 56) 4.5 V < VCC < 5.5 V 4.5 V < VCC < 5.5 V (Note 1) (Note 1) Min. 2 –0.5 0.8VCC –0.5 0.3 2.5 Typ. Max. VCC +0.5 0.8 VCC +0.5 0.2VCC –0.1 Unit V V V V V 4.2 0.01 0.25 0.1 0.45 V V V V V V VOL VOH VOH1 VSTBY ISTBY IIDLE VDF ISB ILI ILO IOH = –20 µA, VCC = 4.5 V IOH = –2 mA, VCC = 4.5 V IOH1 = 1 µA 4.4 2.4 VSTBY – 0.8 2.0 4.49 3.9 VCC 0.5 1 0.1 V µA µA V –0.1 2 100 –1 –10 ±0.1 ±5 0 400 15 0 0 200 1 10 µA µA µA µA/PT PLD Only ICC (DC) (Note 5) Operating Supply Current Flash memory 700 30 0 0 note 4 µA/PT mA mA mA f = 0 MHz 2.5 1.5 3.5 3.0 mA/ MHz mA/ MHz Reset (Reset) has hysteresis. VIL1 is valid at or below 0.2VCC –0.1. VIH1 is valid at or above 0.8VCC . CSI deselected or internal Power-down mode is active. PLD is in non-Turbo mode, and none of the inputs are switching. Please see Figure 35 for the PLD current calculation. 71/89 PSD4235G2 Table 61. CPLD Combinatorial Timing -70 Symbol Parameter CPLD Input Pin/ Feedback to CPLD Combinatorial Output CPLD Input to CPLD Output Enable CPLD Input to CPLD Output Disable CPLD Register Clear or Preset Delay CPLD Register Clear or Preset Pulse Width CPLD Array Delay Any Macrocell 10 11 Conditions Min tPD Max 20 Min Max 25 -90 Fast Turbo Slew PT Off rate1 Aloc +2 + 12 –2 Unit ns tEA tER tARP tARPW tARD 21 21 21 20 26 26 26 + 12 + 12 + 12 + 12 –2 –2 –2 ns ns ns ns ns 16 +2 Note: 1. Fast Slew Rate output available on Port C and Port F. Table 62. CPLD Macrocell Synchronous Clock Mode Timing -70 Symbol Parameter Maximum Frequency External Feedback fMAX Maximum Frequency Internal Feedback (fCNT) Maximum Frequency Pipelined Data tS tH tCH tCL tCO tARD tMIN Input Setup Time Input Hold Time Clock High Time Clock Low Time Clock to Output Delay CPLD Array Delay Minimum Clock Period 2 Clock Input Clock Input Clock Input Any Macrocell tCH+tCL 12 Conditions Min 1/(tS+tCO) Max 34.4 Min Max 30.30 -90 Fast PT Aloc Turbo Slew Off rate1 Unit MHz 1/(tS+tCO–10) 52.6 43.48 MHz 1/(tCH+tCL) 14 0 6 6 83.3 15 0 10 10 15 11 20 50.00 +2 + 12 MHz ns ns ns ns 18 16 +2 –2 ns ns ns Note: 1. Fast Slew Rate output available on Port C and Port F. 2. CLKIN (PD1) t CLCL = tCH + tCL . 72/89 PSD4235G2 Table 63. CPLD Macrocell Asynchronous Clock Mode Timing -70 Symbol Parameter Maximum Frequency External Feedback Maximum Frequency Internal Feedback (fCNTA) Maximum Frequency Pipelined Data tSA tHA tCHA tCLA tCOA tARDA tMINA Input Setup Time Input Hold Time Clock Input High Time Clock Input Low Time Clock to Output Delay CPLD Array Delay Minimum Clock Period Any Macrocell 1/fCNTA 16 Conditions Min Max Min Max -90 PT Turbo Slew Aloc Off Rate Unit 1/(tSA+tCOA) 38.4 26.32 MHz fMAXA 1/(tSA+tCOA–10) 62.5 35.71 MHz 1/(tCHA+tCLA) 47.6 37.03 MHz 6 7 9 12 21 11 8 12 12 15 30 16 28 +2 + 12 ns ns + 12 + 12 + 12 +2 –2 ns ns ns ns ns 73/89 PSD4235G2 Figure 39. Input to Output Disable / Enable INPUT tER INPUT TO OUTPUT ENABLE/DISABLE tEA AI02863 Figure 40. Asynchronous Reset / Preset tARPW RESET/PRESET INPUT tARP REGISTER OUTPUT AI02864 Figure 41. Synchronous Clock Mode Timing – PLD tCH tCL CLKIN tS INPUT tH tCO REGISTERED OUTPUT AI02860 Figure 42. Asynchronous Clock Mode Timing (product term clock) tCHA tCLA CLOCK tSA tHA INPUT tCOA REGISTERED OUTPUT AI02859 74/89 PSD4235G2 Table 64. Input Macrocell Timing -70 Symbol tIS tIH tINH tINL tINO Parameter Input Setup Time Input Hold Time NIB Input High Time NIB Input Low Time NIB Input to Combinatorial Delay Conditions Min (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) 0 15 9 9 34 Max Min 0 20 12 12 46 +2 + 12 + 12 Max -90 PT Aloc Turbo Off Unit ns ns ns ns ns Note: 1. Inputs from Port A, B, and C relative to register/latch clock from the PLD. ALE latch timings refer to t AVLX and tLXAX . Figure 43. Input Macrocell Timing (product term clock) t INH PT CLOCK t INL t IS INPUT t IH OUTPUT t INO AI03101 75/89 PSD4235G2 Table 65. Read Timing -70 Symbol tLVLX tAVLX tLXAX tAVQV tSLQV Parameter ALE or AS Pulse Width Address Setup Time Address Hold Time Address Valid to Data Valid CS Valid to Data Valid RD to Data Valid 8-Bit Bus tRLQV RD or PSEN to Data Valid 8-Bit Bus, 8031, 80251 RD Data Hold Time RD Pulse Width RD to Data High-Z E Pulse Width R/W Setup Time to Enable R/W Hold Time After Enable Address Input Valid to Address Output Delay (Note 4) (Note 5) (Note 2) (Note 1) (Note 1) (Note 1) 27 6 0 20 0 27 20 32 10 0 25 (Note 3) (Note 3) (Note 3) Conditions Min 15 4 7 70 75 24 31 0 32 25 Max Min 20 6 8 90 100 32 38 + 12 Max -90 Turbo Off Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns tRHQX tRLRH tRHQZ tEHEL tTHEH tELTL tAVPV Note: 1. 2. 3. 4. 5. RD timing has the same timing as DS, LDS, UDS, and PSEN signals. RD and PSEN have the same timing. Any input used to select an internal PSD function. In multiplexed mode, latched addresses generated from ADIO delay to address output on any Port. RD timing has the same timing as DS, LDS, and UDS signals. 76/89 PSD4235G2 Figure 44. Read Timing tAVLX ALE /AS tLVLX A /D MULTIPLEXED BUS ADDRESS NON-MULTIPLEXED BUS DATA NON-MULTIPLEXED BUS tSLQV CSI tRLQV tRLRH RD (PSEN, DS) tRHQZ tRHQX ADDRESS VALID tAVQV ADDRESS VALID DATA VALID tLXAX 1 DATA VALID tEHEL E tTHEH tELTL R/W tAVPV ADDRESS OUT AI02895 Note: 1. tAVLX and tLXAX are not required for 80C251 in Page Mode or 80C51XA in Burst Mode. 77/89 PSD4235G2 Table 66. Write Timing -70 Symbol tLVLX tAVLX tLXAX tAVWL tSLWL tDVWH tWHDX tWLWH tWHAX1 tWHAX2 tWHPV Parameter ALE or AS Pulse Width Address Setup Time Address Hold Time Address Valid to Leading Edge of WR CS Valid to Leading Edge of WR WR Data Setup Time WR Data Hold Time WR Pulse Width Trailing Edge of WR to Address Invalid Trailing Edge of WR to DPLD Address Invalid Trailing Edge of WR to Port Output Valid Using I/O Port Data Register Data Valid to Port Output Valid Using Macrocell Register Preset/Clear Address Input Valid to Address Output Delay WR Valid to Port Output Valid Using Macrocell Register Preset/Clear (Note 1) (Note 1) (Notes 1,3) (Note 3) (Note 3) (Note 3,7) (Note 3) (Note 3) (Note 3,6) (Note 3) (Notes 3,5) (Note 2) (Notes 3,4) Conditions Min 15 4 7 8 12 25 4 28 6 0 27 Max Min 20 6 8 15 15 35 5 35 8 0 30 Max ns ns ns ns ns ns ns ns ns ns ns -90 Unit tDVMV 42 55 ns tAVPV tWLMV Note: 1. 2. 3. 4. 5. 6. 7. 20 48 25 55 ns ns Any input used to select an internal PSD function. In multiplexed mode, latched address generated from ADIO delay to address output on any port. WR has the same timing as E, DS, LDS, UDS, WRL, and WRH signals. Assuming data is stable before active write signal. Assuming write is active before data becomes valid. tWHAX2 is the address hold time for DPLD inputs that are used to generate Sector Select signals for internal PSD memory. tWHAX is 6 ns when writing to the Output Macrocell Registers AB and BC. 78/89 PSD4235G2 Figure 45. Write Timing tAVLX ALE / AS t LVLX A/D MULTIPLEXED BUS ADDRESS VALID tAVWL ADDRESS NON-MULTIPLEXED BUS DATA NON-MULTIPLEXED BUS tSLWL CSI tDVWH WR (DS) t WLWH t WHDX t WHAX ADDRESS VALID DATA VALID DATA VALID t LXAX t EHEL E t THEH R/ W t WLMV tAVPV ADDRESS OUT t WHPV STANDARD MCU I/O OUT t ELTL AI02896 79/89 PSD4235G2 Table 67. Port F Peripheral Data Mode Read Timing -70 Symbol Parameter Address Valid to Data Valid CSI Valid to Data Valid RD to Data Valid RD to Data Valid 8031 Mode tDVQV–PF tQXRH–PF tRLRH–PF tRHQZ–PF Data In to Data Out Valid RD Data Hold Time RD Pulse Width RD to Data High-Z (Note 1) (Note 1) 0 27 23 (Notes 1,4) Conditions Min tAVQV–PF tSLQV–PF tRLQV–PF (Note 3) Max 30 25 21 31 22 0 32 25 Min Max 35 35 32 38 30 -90 Turbo Off + 12 + 12 Unit ns ns ns ns ns ns ns ns Figure 46. Peripheral I/O Read Timing ALE /AS A/D BUS ADDRESS DATA VALID tAVQV (PF) tSLQV (PF) CSI tRLQV (PF) RD tRLRH (PF) tQXRH (PF) tRHQZ (PF) tDVQV (PF) DATA ON PORT F AI05740 80/89 PSD4235G2 Table 68. Port F Peripheral Data Mode Write Timing -70 Symbol tWLQV–PF tDVQV–PF tWHQZ–PF Note: 1. 2. 3. 4. 5. -90 Unit Max 25 22 20 Min Max 35 30 25 ns ns ns Parameter WR to Data Propagation Delay Data to Port F Data Propagation Delay WR Invalid to Port F Tri-state Conditions Min (Note 2) (Note 5) (Note 2) RD has the same timing as DS, LDS, UDS, and PSEN (in 8031 combined mode). WR has the same timing as the E, LDS, UDS, WRL, and WRH signals. Any input used to select Port F Data Peripheral mode. Data is already stable on Port F. Data stable on ADIO pins to data on Port F. Figure 47. Peripheral I/O Write Timing ALE /AS A / D BUS ADDRESS DATA OUT tWLQV WR (PF) tWHQZ (PF) tDVQV (PF) PORT F DATA OUT AI05741 81/89 PSD4235G2 Table 69. Reset (Reset)Timing Symbol tNLNH tNLNH–PO tNLNH–A tOPR Parameter RESET Active Low Time 1 Power On Reset Active Low Time Warm Reset 2 RESET High to Operational Device Conditions Min 150 1 25 120 Max Unit ns ms µs ns Note: 1. Reset (RESET) does not reset Flash memory Program or Erase cycles. 2. Warm reset aborts Flash memory Program or Erase cycles, and puts the device in Read mode. Figure 48. Reset (RESET) Timing VCC VCC(min) tNLNH tNLNH-A Warm Reset tNLNH-PO Power-On Reset tOPR tOPR RESET AI02866b Table 70. VSTBYON Timing Symbol tBVBH tBXBL Parameter VSTBY Detection to VSTBYON Output High VSTBY Off Detection to VSTBYON Output Low Conditions (Note 1) (Note 1) Min Typ 20 20 Max Unit µs µs Note: 1. VSTBYON timing is measured at VCC ramp rate of 2 ms. Table 71. Program, Write and Erase Times Symbol Flash Program Flash Bulk Erase1 (pre-programmed) Flash Bulk Erase (not pre-programmed) tWHQV3 tWHQV2 tWHQV1 Sector Erase (pre-programmed) Sector Erase (not pre-programmed) Byte Program Program / Erase Cycles (per Sector) tWHWLO tQ7VQV Sector Erase Time-Out DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling)2 100,000 100 30 Parameter Min. Typ. 8.5 3 10 1 2.2 14 1200 30 30 Max. Unit s s s s s µs cycles µs ns Note: 1. Programmed to all zero before erase. 2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading. 3. DQ7 is DQ15 for Motorola MCU with 16-bit data bus. 82/89 PSD4235G2 Table 72. ISC Timing -70 Symbol Parameter Clock (TCK, PC1) Frequency (except for PLD) Clock (TCK, PC1) High Time (except for PLD) Clock (TCK, PC1) Low Time (except for PLD) Clock (TCK, PC1) Frequency (PLD only) Clock (TCK, PC1) High Time (PLD only) Clock (TCK, PC1) Low Time (PLD only) ISC Port Set Up Time ISC Port Hold Up Time ISC Port Clock to Output ISC Port High-Impedance to Valid Output ISC Port Valid Output to High-Impedance Conditions Min tISCCF tISCCH tISCCL tISCCFP tISCCHP tISCCLP tISCPSU tISCPH tISCPCO tISCPZV tISCPVZ (Note 1) (Note 1) (Note 1) (Note 2) (Note 2) (Note 2) 240 240 6 5 21 21 21 23 23 2 240 240 8 5 23 23 23 Max 20 26 26 2 Min Max 18 MHz ns ns MHz ns ns ns ns ns ns ns -90 Unit Note: 1. For non-PLD Programming, Erase or in ISC by-pass mode. 2. For Program or Erase PLD only. Figure 49. ISC Timing t ISCCH TCK t ISCCL t ISCPSU t ISCPH TDI/TMS t ISCPZV t ISCPCO ISC OUTPUTS/TDO t ISCPVZ ISC OUTPUTS/TDO AI02865 83/89 PSD4235G2 Table 73. Power-down Timing -70 Symbol tLVDV tCLWH Parameter ALE Access Time from Power-down Maximum Delay from APD Enable to Internal PDN Valid Signal Using CLKIN (PD1) Conditions Min Max 80 15 * tCLCL1 Min Max 90 ns µs -90 Unit Note: 1. tCLCL is the period of CLKIN (PD1). 84/89 PSD4235G2 PACKAGE MECHANICAL TQFP80 - 80 lead Plastic Quad Flatpack D D1 D2 A2 e Ne E2 E1 E b N 1 Nd L1 A CP c QFP-A A1 α L Note: Drawing is not to scale. TQFP80 - 80 lead Plastic Quad Flatpack Symb. A A1 A2 α b c D D1 D2 E E1 E2 e L L1 CP N Nd Ne 14.000 12.000 9.500 14.000 12.000 9.500 0.500 0.600 1.000 0.080 80 20 20 — — 0.450 — — 0.750 — — 3.5° 0.220 0.050 0.950 0.0° 0.170 0.090 mm Typ. Min. Max. 1.200 0.150 1.050 7.0° 0.270 0.200 0.5512 0.4724 0.3740 0.5512 0.4724 0.3740 0.0197 0.0236 0.0394 0.0031 80 20 20 — — 0.0177 — — 0.0295 — — 3.5° 0.0087 0.0020 0.0374 0.0° 0.0067 0.0035 Typ. inches Min. Max. 0.0472 0.0059 0.0413 7.0° 0.0106 0.0079 85/89 PSD4235G2 Table 74. Pin Assignments – TQFP80 Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Pin Assign ments PD2 PD3 AD0 AD1 AD2 AD3 AD4 GND VCC AD5 AD6 AD7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 Pin No. 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Pin Assign ments PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 VCC GND PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 RESET CNTL2 Pin No. 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 Pin Assign ments PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 GND GND PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 CNTL0 CNTL1 Pin No. 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 Pin Assign ments PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 VCC GND PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7 PD0 PD1 86/89 PSD4235G2 PART NUMBERING Table 75. Ordering Information Scheme Example: Device Type PSD42 = Flash PSD for 16-bit MCUs (with CPLD) SRAM Size 0 = none 1 = 16 Kbit 2 = 32 Kbit Flash Memory Size 1 = 256 Kbit 2 = 512 Kbit 3 = 1 Mbit I/O Count F = 27 I/O G = 5 2 I/O 2nd Non Volatile Memory 1 = 256 Kbit EEPROM 2 = 256 Kbit Flash memory 3 = none 6 = 512 Kbit Flash memory Operating Voltage blank = VCC = 4.5 to 5.5V V1 = VCC = 3.0 to 3.6V Speed 70 = 70 ns 90 = 90 ns PSD42 3 5G 2 V – 90 U I T 3 = 64 Kbit 4 = 128 Kbit 5 = 256 Kbit 4 = 2 Mbit 5 = 4 Mbit 6 = 8 Mbit 12 = 120 ns 15 = 150 ns 20 = 200 ns Package U = TQFP80 Temperature Range blank = 0 to 70 °C (commercial) I = –40 to 85 °C (industrial) Option T = Tape & Reel Packing Note: 1. The 3.3V±10% devices are not covered by this data sheet, but by the PSD4235G2V data sheet. For a list of available options (speed, package, etc.) or for further information on any aspect of this device, please contact your nearest ST Sales Office. 87/89 PSD4235G2 REVISION HISTORY Table 76. Document Revision History Date 01-May-2001 01-Aug-2001 12-Sep-2001 14-Dec-2001 Rev. 1.0 1.1 2.0 2.1 Initial release as a WSI document Timing parameters updated Document rewritten using the ST template Information on the 3.3V±10% range removed to a separate data sheet Description of Revision 88/89 PSD4235G2 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is registered trademark of STMicroelectronics All other names are the property of their respective owners © 2001 STMicroelectronics - All Rights Reserved STMicroelectronics group of companies Austalia - Brazil - Canada - China - Finland - France - Germany - Hong Kong India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. www.st.com 89/89
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