PSD813F1A

PSD813F1A Flash in-system programmable (ISP) peripherals for 8-bit MCUs, 5 V NOT FOR NEW DESIGN FEATURES SUMMARY ■ ■ ■ ■ ■ bs O ■ ■ DUAL BANK FLASH MEMORIES – 1 Mbit of Primary Flash Memory (8 Uniform Sectors) – 256 Kbit Secondary EEPROM (4 Uniform Sectors) – Concurrent operation: read from one memory while erasing and writing the other 16 Kbit SRAM PLD WITH MACROCELLS – Over 3,000 Gates Of PLD: DPLD and CPLD – DPLD - User-defined Internal chip-select decoding – CPLD with 16 Output Macrocells (OMCs) and 24 Input Macrocells (IMCs) 27 RECONFIGURABLE I/Os – 27 individually configurable I/O port pins that can be used for the following functions (16 I/O ports configurable as open-drain outputs): MCU I/Os PLD I/Os Latched MCU address output; and Special function I/Os ENHANCED JTAG SERIAL PORT – Built-in JTAG-compliant serial port allows full-chip In-System Programmability (ISP) – Efficient manufacturing allows for easy product testing and programming PAGE REGISTER – Internal page register that can be used to expand the microcontroller address space by a factor of 256. PROGRAMMABLE POWER MANAGEMENT Figure 1. Packages PQFP52 (M) let o Pr e od ct u (s) so Ob ■ te le PLCC52 (J) ro P uc d s) t( TQFQ64 (U) ■ ■ ■ HIGH ENDURANCE: – 100,000 Erase/WRITE Cycles of Flash Memory – 10,000 Erase/WRITE Cycles of EEPROM – 1,000 Erase/WRITE Cycles of PLD – Data Retention: 15-year minimum at 90°C (for Main Flash, Boot, PLD and Configuration bits). SINGLE SUPPLY VOLTAGE: – 5V±10% for 5V STANDBY CURRENT AS LOW AS 50µA Packages are ECOPACK® October 2008 Rev 5 1/111 This is information on a product still in production but not recommended for new designs. PSD813F1A TABLE OF CONTENTS Features Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 In-System Programming (ISP) via JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 First time programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Inventory build-up of pre-programmed devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Expensive sockets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 In-Application Programming (IAP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Simultaneous read and write to Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Complex memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Separate program and data space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 PSDsoft Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 PSD ARCHITECTURAL OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 PLDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 I/O Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Microcontroller Bus Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 JTAG Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 In-System Programming (ISP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Page Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Power Management Unit (PMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 DEVELOPMENT SYSTEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 PSD Register Description and Address Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 DETAILED OPERATION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 MEMORY BLOCKS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Primary Flash Memory and Secondary EEPROM Description . . . . . . . . . . . . . . . . . . . . . . . . . 18 Memory Block Select Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Ready/Busy Pin (PC3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Memory Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Power-down Instruction and Power-up Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 EEPROM Power Down Instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Power-up Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Read Memory Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Read Main Flash Memory Identifier. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Read Main Flash Memory Sector Protection Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2/111 PSD813F1A Reading the OTP Row. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Reading the Erase/Program Status Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Data Polling Flag (DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Toggle Flag (DQ6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Error Flag (DQ5). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Erase Time-out Flag DQ3 (Flash Memory only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Writing to the EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Writing a Byte to EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Writing a Page to EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 EEPROM Software Data Protect (SDP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Writing the OTP Row . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 PROGRAMMING FLASH MEMORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Data Polling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Data Toggle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 ERASING FLASH MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Flash Bulk Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Flash Sector Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Flash Erase Suspend . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Flash Erase Resume . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 FLASH AND EEPROM MEMORY SPECIFIC FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Flash Memory and EEPROM Sector Protect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 MEMORY SELECT SIGNALS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Memory Select Configuration for MCUs with Separate Program and Data Spaces . . . . . . . . 31 Separate Space Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Combined Space Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 PAGE REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 bs O PLD’S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 The Turbo Bit in PSD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( DECODE PLD (DPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 COMPLEX PLD (CPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Output Macrocell (OMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Product Term Allocator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Loading and Reading the Output Macrocells (OMC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 The OMC Mask Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3/111 PSD813F1A The Output Enable of the OMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Input Macrocells (IMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 MCU BUS INTERFACE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 PSD Interface to a Multiplexed 8-Bit Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 PSD Interface to a Non-Multiplexed 8-Bit Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Data Byte Enable Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 MCU Bus Interface Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 80C31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 80C251 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 80C51XA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 68HC11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 I/O PORTS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 General Port Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Port Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 MCU I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 PLD I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Address Out Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Address In Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Data Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Peripheral I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 JTAG In-System Programming (ISP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Port Configuration Registers (PCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Direction Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Drive Select Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Port Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Data In. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Data Out Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Output Macrocells (OMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Mask Macrocell Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Input Macrocells (IMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Enable Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Ports A and B – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Port C – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Port D – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 External Chip Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( POWER MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Automatic Power-down (APD) Unit and Power-down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Power-down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 For Users of the HC11 (or compatible) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Other Power Saving Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 PLD Power Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 PSD Chip Select Input (CSI, PD2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 4/111 PSD813F1A Input Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Input Control Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 RESET TIMING AND DEVICE STATUS AT RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Power-On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Warm Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 I/O Pin, Register and PLD Status at Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE . . . . . . . . . . . . . . . . . . . . . . 71 Standard JTAG Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 JTAG Extensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Security, Flash memory and EEPROM Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 INITIAL DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 AC/DC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 5/111 PSD813F1A SUMMARY DESCRIPTION The PSD family of Programmable Microcontroller (MCU) Peripherals brings In-System Programmability (ISP) to Flash memory and programmable logic. The result is a simple and flexible solution for embedded designs. PSD devices combine many of the peripheral functions found in MCU based applications. PSD devices integrate an optimized “microcontroller macrocell” logic architecture. The Macrocell was created to address the unique requirements of embedded system designs. It allows direct connection between the system address/data bus and the internal PSD registers to simplify communication between the MCU and other supporting devices. The PSD family offers two methods to program PSD Flash memory while the PSD is soldered to a circuit board. In-System Programming (ISP) via JTAG An IEEE 1149.1 compliant JTAG interface is included on the PSD enabling the entire device (Flash memory, EEPROM, the PLD, and all configuration) to be rapidly programmed while soldered to the circuit board. This requires no MCU participation, which means the PSD can be programmed anytime, even while completely blank. The innovative JTAG interface to Flash memories is an industry first, solving key problems faced by designers and manufacturing houses, such as: First time programming. How do I get firmware into the Flash the very first time? JTAG is the answer, program the PSD while blank with no MCU involvement. Inventory build-up of pre-programmed devices. How do I maintain an accurate count of preprogrammed Flash memory and PLD devices based on customer demand? How many and what version? JTAG is the answer, build your hardware with blank PSDs soldered directly to the board and then custom program just before they are shipped to customer. No more labels on chips and no more wasted inventory. Expensive sockets. How do I eliminate the need for expensive and unreliable sockets? JTAG is the answer. Solder the PSD directly to the circuit board. Program first time and subsequent times with JTAG. No need to handle devices and bend the fragile leads. In-Application Programming (IAP) Two independent memory arrays (Flash and EEPROM) are included so the MCU can execute code from one memory while erasing and programming the other. Robust product firmware updates in the field are possible over any communication channel (CAN, Ethernet, UART, J1850, etc.) using this unique architecture. Designers are relieved of these problems: Simultaneous read and write to Flash memory. How can the MCU program the same memory from which it is executing code? It cannot. The PSD allows the MCU to operate the two memories concurrently, reading code from one while erasing and programming the other during IAP. Complex memory mapping. I have only a 64Kbyte address space to start with. How can I map these two memories efficiently? A Programmable Decode PLD is the answer. The concurrent PSD memories can be mapped anywhere in MCU address space, segment by segment with extremely high address resolution. As an option, the secondary Flash memory can be swapped out of the system memory map when IAP is complete. A built-in page register breaks the 64K-byte address limit. Separate program and data space. How can I write to Flash or EEPROM memory while it resides in “program” space during field firmware updates, my MCU won’t allow it! The Flash PSD provides means to “reclassify” Flash or EEPROM memory as “data” space during IAP, then back to “program” space when complete. PSDsoft Express PSDsoft Express, a software development tool from ST, guides you through the design process step-by-step making it possible to complete an embedded MCU design capable of ISP/IAP in just hours. Select your MCU and PSDsoft Express takes you through the remainder of the design with point and click entry, covering PSD selection, pin definitions, programmable logic inputs and outputs, MCU memory map definition, ANSI-C code generation for your MCU, and merging your MCU firmware with the PSD design. When complete, two different device programmers are supported directly from PSDsoft Express: FlashLINK (JTAG) and PSDpro. bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 6/111 PSD813F1A Figure 2. PQFP52 Connections 41 RESET 43 CNTL1 42 CNTL2 40 CNTL0 46 GND 52 PB0 51 PB1 50 PB2 49 PB3 48 PB4 47 PB5 45 PB6 44 PB7 PD2 1 PD1 2 PD0 3 PC7 4 PC6 5 PC5 6 PC4 7 VCC 8 GND 9 PC3 10 PC2 11 PC1 12 PC0 13 39 AD15 38 AD14 37 AD13 36 AD12 35 AD11 34 AD10 33 AD9 32 AD8 31 VCC 30 AD7 29 AD6 28 AD5 27 AD4 PA7 14 PA6 15 PA5 16 PA4 17 PA3 18 GND 19 PA2 20 PA1 21 PA0 22 AD0 23 AD1 24 AD2 25 bs O let o Pr e du o (s) ct Ob - so te le AD3 26 ro P uc d s) t( AI02858 7/111 PSD813F1A Figure 3. PLCC52 Connections CNTL2 RESET 48 CNTL1 CNTL0 47 PB0 PB1 PB2 PB3 PB4 PB5 GND PB6 52 PB7 51 4 7 5 3 2 50 49 6 1 PD2 PD1 PD0 PC7 PC6 PC5 PC4 VCC GND PC3 PC2 PC1 PC0 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 46 45 44 43 42 41 40 39 38 37 36 35 AD15 AD14 AD13 AD12 AD11 AD10 AD9 AD8 VCC bs O let o Pr e du o (s) ct so Ob PA2 PA1 PA0 GND AD0 PA7 PA6 PA5 PA4 PA3 AD1 AD2 AD3 eP let 31 32 33 34 27 28 29 30 ro uc d AD7 AD6 AD5 AD4 s) t( AI02857 8/111 PSD813F1A Figure 4. TQFP64 Connections 50 RESET 52 CNTL1 51 CNTL2 56 GND 55 GND 62 PB0 61 PB1 60 PB2 59 PB3 58 PB4 57 PB5 54 PB6 53 PB7 64 NC 63 NC 49 NC PD2 1 PD1 2 PD0 3 PC7 4 PC6 5 PC5 6 PC4 7 VCC 8 GND 9 GND 10 PC3 11 PC2 12 PC1 13 PC0 14 NC 15 16 48 CNTL0 47 AD15 46 AD14 45 AD13 44 AD12 43 AD11 42 AD10 41 AD9 40 AD8 39 VCC 38 VCC 37 AD7 36 AD6 35 AD5 34 AD4 33 AD3 NC 17 NC 18 PA7 19 PA6 20 PA5 21 PA4 22 PA3 23 GND 24 GND 25 PA2 26 PA1 27 PA0 28 AD0 29 AD1 30 ND 31 bs O let o Pr e du o (s) ct so Ob - AD2 32 eP let ro uc d s) t( AI09644 9/111 PSD813F1A PIN DESCRIPTION Table 1. Pin Description (for the PLCC52 package) Pin Name Pin Type Description(1) This is the lower Address/Data port. Connect your MCU address or address/data bus according to the following rules: 1. If your MCU has a multiplexed address/data bus where the data is multiplexed with the lower address bits, connect AD0-AD7 to this port. 2. If your MCU does not have a multiplexed address/data bus, or you are using an 80C251 in page mode, connect A0-A7 to this port. 3. If you are using an 80C51XA in burst mode, connect A4/D0 through A11/D7 to this port. ALE or AS latches the address. The PSD drives data out only if the READ signal is active and one of the PSD functional blocks was selected. The addresses on this port are passed to the PLDs. This is the upper Address/Data port. Connect your MCU address or address/data bus according to the following rules: 1. If your MCU has a multiplexed address/data bus where the data is multiplexed with the lower address bits, connect A8-A15 to this port. 2. If your MCU does not have a multiplexed address/data bus, connect A8-A15 to this port. 3. If you are using an 80C251 in page mode, connect AD8-AD15 to this port. 4. If you are using an 80C51XA in burst mode, connect A12/D8 through A19/D15 to this port. ALE or AS latches the address. The PSD drives data out only if the READ signal is active and one of the PSD functional blocks was selected. The addresses on this port are passed to the PLDs. The following control signals can be connected to this port, based on your MCU: 1. WR – active Low Write Strobe input. 2. R_W – active High READ/active Low write input. This port is connected to the PLDs. Therefore, these signals can be used in decode and other logic equations. The following control signals can be connected to this port, based on your MCU: 1. RD – active Low Read Strobe input. 2. E – E clock input. 3. DS – active Low Data Strobe input. 4. PSEN – connect PSEN to this port when it is being used as an active Low READ signal. For example, when the 80C251 outputs more than 16 address bits, PSEN is actually the READ signal. This port is connected to the PLDs. Therefore, these signals can be used in decode and other logic equations. ADIO0-7 30-37 I/O ADIO8-15 39-46 I/O CNTL0 47 I CNTL1 50 I CNTL2 bs O Reset let o 49 48 Pr e I I du o (s) ct so Ob - te le ro P uc d s) t( This port can be used to input the PSEN (Program Select Enable) signal from any MCU that uses this signal for code exclusively. If your MCU does not output a Program Select Enable signal, this port can be used as a generic input. This port is connected to the PLDs. Active Low Reset input. Resets I/O Ports, PLD macrocells and some of the Configuration Registers. Must be Low at Power-up. 10/111 PSD813F1A Pin Name Pin Type Description(1) These pins make up Port A. These port pins are configurable and can have the following functions: 1. MCU I/O – write to or read from a standard output or input port. 2. CPLD macrocell (McellAB0-7) outputs. 3. Inputs to the PLDs. 4. Latched address outputs (see Table 5). 5. Address inputs. For example, PA0-3 could be used for A0-A3 when using an 80C51XA in burst mode. 6. As the data bus inputs D0-D7 for non-multiplexed address/data bus MCUs. 7. D0/A16-D3/A19 in M37702M2 mode. 8. Peripheral I/O mode. Note: PA0-PA3 can only output CMOS signals with an option for high slew rate. However, PA4-PA7 can be configured as CMOS or Open Drain Outputs. These pins make up Port B. These port pins are configurable and can have the following functions: 1. MCU I/O – write to or read from a standard output or input port. 2. CPLD macrocell (McellAB0-7 or McellBC0-7) outputs. 3. Inputs to the PLDs. 4. Latched address outputs (see Table 5). Note: PB0-PB3 can only output CMOS signals with an option for high slew rate. However, PB4-PB7 can be configured as CMOS or Open Drain Outputs. PC0 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O – write to or read from a standard output or input port. 2. CPLD macrocell (McellBC0) output. 3. Input to the PLDs. 4. TMS Input2 for the JTAG Interface. This pin can be configured as a CMOS or Open Drain output. PC1 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O – write to or read from a standard output or input port. 2. CPLD macrocell (McellBC1) output. 3. Input to the PLDs. 4. TCK Input2 for the JTAG Interface. This pin can be configured as a CMOS or Open Drain output. PC2 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O – write to or read from a standard output or input port. 2. CPLD macrocell (McellBC2) output. 3. Input to the PLDs. This pin can be configured as a CMOS or Open Drain output. PC3 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O – write to or read from a standard output or input port. 2. CPLD macrocell (McellBC3) output. 3. Input to the PLDs. 4. TSTAT output2 for the JTAG Serial Interface. 5. Ready/Busy output for In-System parallel programming. This pin can be configured as a CMOS or Open Drain output. PC4 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O – write to or read from a standard output or input port. 2. CPLD macrocell (McellBC4) output. 3. Input to the PLDs. 4. TERR output2 for the JTAG Interface. This pin can be configured as a CMOS or Open Drain output. PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 29 28 27 25 24 23 22 21 I/O PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 7 6 5 4 3 2 52 51 I/O PC0 20 I/O PC1 19 I/O PC2 18 I/O PC3 bs O let o 17 14 Pr e I/O I/O du o (s) ct so Ob - te le ro P uc d s) t( PC4 11/111 PSD813F1A Pin Name Pin Type Description(1) PC5 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O – write to or read from a standard output or input port. 2. CPLD macrocell (McellBC5) output. 3. Input to the PLDs. 4. TDI input2 for the JTAG Interface. This pin can be configured as a CMOS or Open Drain output. PC6 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O – write to or read from a standard output or input port. 2. CPLD macrocell (McellBC6) output. 3. Input to the PLDs. 4. TDO output2 for the JTAG Interface. This pin can be configured as a CMOS or Open Drain output. PC7 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O – write to or read from a standard output or input port. 2. CPLD macrocell (McellBC7) output. 3. Input to the PLDs. 4. DBE – active Low Data Byte Enable input from 68HC912 type MCUs. This pin can be configured as a CMOS or Open Drain output. PD0 pin of Port D. This port pin can be configured to have the following functions: 1. ALE/AS input latches address output from the MCU. 2. MCU I/O – write or read from a standard output or input port. 3. Input to the PLDs. 4. CPLD output (External Chip Select). PC5 13 I/O PC6 12 I/O PC7 11 I/O PD0 10 I/O PD1 9 I/O PD1 pin of Port D. This port pin can be configured to have the following functions: 1. MCU I/O – write to or read from a standard output or input port. 2. Input to the PLDs. 3. CPLD output (External Chip Select). 4. CLKIN – clock input to the CPLD macrocells, the APD Unit’s Power-down counter, and the CPLD AND Array. PD2 pin of Port D. This port pin can be configured to have the following functions: 1. MCU I/O – write to or read from a standard output or input port. 2. Input to the PLDs. 3. CPLD output (External Chip Select). 4. PSD Chip Select Input (CSI). When Low, the MCU can access the PSD memory and I/ O. When High, the PSD memory blocks are disabled to conserve power. Supply Voltage Ground pins PD2 8 I/O VCC GND 15, 38 1, 16, 26 Note: 1. The pin numbers in this table are for the PLCC package only. See the Figure 2., page 7, for pin numbers on other package type. 2. These functions can be multiplexed with other functions. bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 12/111 bs O ADDRESS/DATA/CONTROL BUS PLD INPUT BUS PAGE REGISTER EMBEDDED ALGORITHM 8 SECTORS POWER MANGMT UNIT 1 MBIT MAIN FLASH MEMORY Figure 5. Block Diagram let o Pr e PROG. MCU BUS INTRF. FLASH DECODE PLD (DPLD) 4 SECTORS EEPROM - F1 SECTOR SELECTS SRAM SELECT PERIP I/O MODE SELECTS CSIOP RUNTIME CONTROL AND I/O REGISTERS 3 EXT CS TO PORT D 16 OUTPUT MACROCELLS PORT A ,B & C 24 INPUT MACROCELLS PORT A ,B & C PROG. PORT PORT C PROG. PORT PORT B PORT A 16 KBIT SRAM 73 du o SECTOR SELECTS 256 KBIT SECONDARY MEMORY (BOOT OR DATA) CNTL0, CNTL1, CNTL2 VSTDBY (PC2) (s) ct 73 FLASH ISP CPLD (CPLD) PROG. PORT PA0 – PA7 AD0 – AD15 ADIO PORT so Ob CLKIN PB0 – PB7 PC0 – PC7 te le GLOBAL CONFIG. & SECURITY CLKIN MACROCELL FEEDBACK OR PORT INPUT ro P PROG. PORT PLD, CONFIGURATION & FLASH MEMORY LOADER JTAG SERIAL CHANNEL PD0 – PD2 uc d CLKIN PORT D AI02861G s) t( PSD813F1A 13/111 PSD813F1A PSD ARCHITECTURAL OVERVIEW PSD devices contain several major functional blocks. Figure 5 shows the architecture of the PSD device. The functions of each block are described briefly in the following sections. Many of the blocks perform multiple functions and are user configurable. Memory The PSD contains the following memories: ■ a 1 Mbit Flash memory ■ a secondary 256 Kbit EEPROM memory ■ a 16 Kbit SRAM Each of the memory blocks is briefly discussed in the following paragraphs. A more detailed discussion can be found in the section entitled MEMORY BLOCKS, page 18. The 1 Mbit Flash memory is the main memory of the PSD. It is divided into 8 equally-sized sectors that are individually selectable. The 256 Kbit EEPROM or Flash memory is divided into 4 equally-sized sectors. Each sector is individually selectable. The 16 Kbit SRAM is intended for use as a scratchpad memory or as an extension to the microcontroller SRAM. Each sector of memory can be located in a different address space as defined by the user. The access times for all memory types includes the address latching and DPLD decoding time. PLDs The device contains two PLD blocks, each optimized for a different function, as shown in Table 2. The functional partitioning of the PLDs reduces power consumption, optimizes cost/performance, and eases design entry. The Decode PLD (DPLD) is used to decode addresses and generate chip selects for the PSD internal memory and registers. The CPLD can implement user-defined logic functions. The DPLD has combinatorial outputs. The CPLD has 16 Output macrocells and 3 combinatorial outputs. The PSD also has 24 Input macrocells that can be configured as inputs to the PLDs. The PLDs receive their inputs from the PLD Input Bus and are differentiated by their output destinations, number of Product Terms, and macrocells. The PLDs consume minimal power by using ZeroPower design techniques. The speed and power consumption of the PLD is controlled by the Turbo Bit (ZPSD only) in the PMMR0 register and other bits in the PMMR2 registers. These registers are set by the microcontroller at runtime. There is a slight penalty to PLD propagation time when invoking the ZPSD features. I/O Ports The PSD has 27 I/O pins divided among four ports (Port A, B, C, and D). Each I/O pin can be individually configured for different functions. Ports A, B, C and D can be configured as standard MCU I/O ports, PLD I/O, or latched address outputs for microcontrollers using multiplexed address/data busses. The JTAG pins can be enabled on Port C for InSystem Programming (ISP). Ports A and B can also be configured as a data port for a n on-multiplexed bus or multiplexed Address/Data buses for certain types of 16-bit microcontrollers. Microcontroller Bus Interface The PSD easily interfaces with most 8-bit microcontrollers that have either multiplexed or nonmultiplexed address/data busses. The device is configured to respond to the microcontroller’s control signals, which are also used as inputs to the PLDs. Where there is a requirement to use a 16bit data bus to interface to a 16-bit microcontroller, two PSDs must be used. For examples, please see the section entitled MCU Bus Interface Examples, page 47. bs O let o ro P e du (s) ct so Ob - te le ro P uc d s) t( Table 2. PLD I/O Name Decode PLD (DPLD) Complex PLD (CPLD) Inputs 73 73 Outputs 17 19 Product Terms 42 140 14/111 PSD813F1A JTAG Port In-System Programming can be performed through the JTAG pins on Port C. This serial interface allows complete programming of the entire PSD device. A blank device can be completely programmed. The JTAG signals (TMS, TCK, TSTAT, TERR, TDI, TDO) can be multiplexed with other functions on Port C. Table 3 indicates the JTAG signals pin assignments. In-System Programming (ISP) Using the JTAG signals on Port C, the entire PSD device can be programmed or erased without the use of the microcontroller. The main Flash memory can also be programmed in-system by the microcontroller executing the programming algorithms out of the EEPROM or SRAM. The EEPROM can be programmed the same way by executing out of the main Flash memory. The PLD logic or other PSD configuration can be programmed through the JTAG port or a device programmer. Table 4 indicates which programming methods can program different functional blocks of the PSD. Page Register The 8-bit Page Register expands the address range of the microcontroller by up to 256 times. The paged address can be used as part of the address space to access external memory and peripherals, or internal memory and I/O. The Page Register can also be used to change the address mapping of blocks of Flash memory into different memory spaces for in-circuit programming. Power Management Unit (PMU) The Power Management Unit (PMU) in the PSD gives the user control of the power consumption on selected functional blocks based on system requirements. The PMU includes an Automatic Power Down unit (APD) that will turn off device functions due to microcontroller inactivity. The APD unit has a Power Down Mode that helps reduce power consumption. The PSD also has some bits that are configured at run-time by the MCU to reduce power consumption of the CPLD. The turbo bit in the PMMR0 register can be turned off and the CPLD will latch its outputs and go to sleep until the next transition on its inputs. Additionally, bits in the PMMR2 register can be set by the MCU to block signals from entering the CPLD to reduce power consumption. Please see the section entitled POWER MANAGEMENT, page 64 for more details. Table 3. JTAG SIgnals on Port C Port C Pins PC0 PC1 PC3 PC4 TMS Table 4. Methods of Programming Different Functional Blocks of the PSD Functional Block Main Flash Memory EEPROM Memory PLD Array (DPLD and CPLD) PSD Configuration bs O Optional OTP Row let o Pr e du o (s) ct Yes Yes Yes Yes No Ob - PC5 PC6 so te le TCK ro P JTAG Signal uc d s) t( TSTAT TERR TDI TDO JTAG Programming Device Programmer Yes Yes Yes Yes Yes In-System Parallel Programming Yes Yes No No Yes 15/111 PSD813F1A DEVELOPMENT SYSTEM The PSD is supported by PSDsoft Express a Windows-based (95, 98, NT) software development tool. A PSD design is quickly and easily produced in a point and click environment. The designer does not need to enter Hardware Definition Language (HDL) equations (unless desired) to define PSD pin functions and memory map information. The general design flow is shown in Figure 6 below. PSDsoft Express is available from our web site (www.st.com/psm) or other distribution channels. PSDsoft Express directly supports two low cost device programmers from ST, PSDpro and FlashLINK (JTAG). Both of these programmers may be purchased through your local distributor/representative, or directly from our web site using a credit card. The PSD is also supported by third party device programmers, see web site for current list. Figure 6. PSDsoft Express Development Tool Choose MCU and PSD Automatically configures MCU bus interface and other PSD attributes Define PSD Pin and Node functions Point and click definition of PSD pin functions, internal nodes, and MCU system memory map C Code Generation Define General Purpose Logic in CPLD Point and click definition of combinatorial and registered logic in CPLD. Access to HDL is available if needed bs O let o Pr e Merge MCU Firmware with PSD Configuration A composite object file is created containing MCU firmware and PSD configuration. du o (s) ct *.OBJ FILE so Ob - te le Generate C Code Specific to PSD Functions ro P uc d s) t( MCU Firmware Hex or S-Record format User's choice of Microcontroller Compiler/Linker ST PSD Programmer PSDPro, or FlashLINK (JTAG) *.OBJ file available for 3rd party programmers (Conventional or JTAG-ISC) AI09215 16/111 PSD813F1A PSD REGISTER DESCRIPTION AND ADDRESS OFFSET Table 5 shows the offset addresses to the PSD registers relative to the CSIOP base address. The CSIOP space is the 256 bytes of address that is allocated by the user to the internal PSD registers. Table 6 provides brief descriptions of the registers in CSIOP space. The following section gives a more detailed description. Table 5. I/O Port Latched Address Output Assignments MCU(1) 8051XA (8-bit) 80C251 (page mode) All other 8-bit multiplexed 8-bit non-multiplexed bus N/A N/A Address a3-a0 N/A Port A(2) Port A (3:0) N/A Address a7-a4 N/A Port A (7:4) Address a7-a4 Port B (3:0) Address a11-a8 Address a11-a8 Address a3-a0 Address a3-a0 N/A Address a15-a12 Address a7-a4 Address a7-a4 Port B(2) Port B (7:4) Note: 1. See the section entitled I/O PORTS, page 52, on how to enable the Latched Address Output function. 2. N/A = Not Applicable Table 6. Register Address Offset Register Name Data In Control Data Out Direction Drive Select Input Macrocell Enable Out Output Macrocells AB Output Macrocells BC Mask Macrocells AB Mask Macrocells BC Port A 00 02 04 06 08 0A 0C 20 Port B 01 03 05 07 09 0B 0D 20 21 22 22 12 14 16 18 1A 13 15 17 Port C 10 Port D 11 Other(1) Description Reads Port pin as input, MCU I/O input mode Selects mode between MCU I/O or Address Out Stores data for output to Port pins, MCU I/O output mode Configures Port pin as input or output Configures Port pins as either CMOS or Open Drain on some pins, while selecting high slew rate on other pins. Reads the status of the output enable to the I/O Port driver READ – reads output of macrocells AB WRITE – loads macrocell flip-flops bs O Page VM Primary Flash Protection Secondary Flash memory Protection JTAG Enable PMMR0 PMMR2 let o ro P e 23 du 21 (s) ct 1B so Ob - te le ro P uc d s) t( Reads Input Macrocells READ – reads output of macrocells BC WRITE – loads macrocell flip-flops Blocks writing to the Output Macrocells AB Blocks writing to the Output Macrocells BC C0 C2 C7 B0 B4 E0 E2 Read only – Flash Sector Protection Read only – PSD Security and EEPROM Sector Protection Enables JTAG Port Power Management Register 0 Power Management Register 2 Page Register Places PSD memory areas in Program and/or Data space on an individual basis. 23 Note: 1. Other registers that are not part of the I/O ports. 17/111 PSD813F1A DETAILED OPERATION As shown in Figure 5., page 13, the PSD consists of six major types of functional blocks: ■ Memory Blocks ■ PLD Blocks ■ MCU Bus Interface ■ I/O Ports ■ Power Management Unit (PMU) ■ JTAG Interface The functions of each block are described in the following sections. Many of the blocks perform multiple functions, and are user configurable. MEMORY BLOCKS The PSD has the following memory blocks (see Table 7): – The Main Flash memory – Secondary EEPROM memory – SRAM The Memory Select signals for these blocks originate from the Decode PLD (DPLD) and are userdefined in PSDsoft Express. Primary Flash Memory and Secondary EEPROM Description The 1Mb primary Flash memory is divided evenly into eight 16-KByte sectors. The EEPROM memory is divided into four sectors of eight KBytes each. Each sector of either memory can be separately protected from Program and Erase operations. Flash memory may be erased on a sector-by-sector basis and programmed byte-by-byte. Flash sector erasure may be suspended while data is read from other sectors of memory and then resumed after reading. EEPROM may be programmed byte-by-byte or sector-by-sector, and erasing is automatic and transparent. The integrity of the data can be secured with the help of Software Data Protection (SDP). Any write operation to the EEPROM is inhibited during the first five milliseconds following power-up. During a program or erase of Flash, or during a write of the EEPROM, the status can be output on the Ready/Busy (PC3) pin of Port C3. This pin is set up using PSDsoft Express Configuration. Memory Block Select Signals. The decode PLD in the PSD generates the chip selects for all the internal memory blocks (refer to the section entitled PLD’S, page 34). Each of the eight Flash memory sectors have a Flash Select signal (FS0FS7) which can contain up to three product terms. Each of the four EEPROM memory sectors have a Select signal (EES0-3 or CSBOOT0-3) which can contain up to three product terms. Having three product terms for each sector select signal allows a given sector to be mapped in different areas of system memory. When using a microcontroller with separate Program and Data space, these flexible select signals allow dynamic re-mapping of sectors from one space to the other. Ready/Busy Pin (PC3). Pin PC3 can be used to output the Ready/Busy status of the PSD. The output on the pin will be a ‘0’ (Busy) when Flash or EEPROM memory blocks are being written to, or when the Flash memory block is being erased. The output will be a ‘1’ (Ready) when no write or erase operation is in progress. bs O let o Pr e du o (s) ct so Ob Device te le ro P uc d s) t( Table 7. Memory Blocks Main Flash 128KB EEPROM 32KB SRAM 2KB PSD813F1A 18/111 PSD813F1A Memory Operation The main Flash and EEPROM memory are addressed through the microcontroller interface on the PSD device. The microcontroller can access these memories in one of two ways: – The microcontroller can execute a typical bus WRITE or READ operation just as it would if accessing a RAM or ROM device using standard bus cycles. – The microcontroller can execute a specific instruction that consists of several WRITE and READ operations. This involves writing specific data patterns to special addresses within the Flash or EEPROM to invoke an embedded algorithm. These instructions are summarized in Table 8., page 20. Typically, Flash memory can be read by the microcontroller using READ operations, just as it would read a ROM device. However, Flash memory can only be erased and programmed with specific instructions. For example, the microcontroller cannot write a single byte directly to Flash memory as one would write a byte to RAM. To program a byte into Flash memory, the microcontroller must execute a program instruction sequence, then test the status of the programming event. This status test is achieved by a READ operation or polling the Ready/Busy pin (PC3). The Flash memory can also be read by using special instructions to retrieve particular Flash device information (sector protect status and ID). The EEPROM is a bit different. Data can be written to EEPROM memory using write operations, like writing to a RAM device, but the status of each WRITE event must be checked by the microcontroller. A WRITE event can be one to 64 contiguous bytes. The status test is very similar to that used for Flash memory (READ operation or Ready/Busy). Optionally, the EEPROM memory may be put into a Software Data Protect (SDP) mode where it requires instructions, rather than operations, to alter its contents. SDP mode makes writing to EEPROM much like writing to Flash memory. bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 19/111 PSD813F1A Table 8. Instructions Instruction EEPROM Flash Sector Sector Select Cycle 1 Cycle 2 Cycle 3 Select (FSi)(2) (EESi) Cycle 4 Read Identifier with (A6,A1,A0 at 0,0,1) Read byte Read 1 byte 2 Read identifier with (A6, A1; A0 = 0,1,0) Data@ address AAh@ X555h AAh@ X555h 55h@ XAAAh Read byte N Cycle 5 Cycle 6 Cycle 7 Read Flash Identifier3,5 Read OTP row4 Read Sector Protection Status3,5 Program a Flash Byte5 Erase one Flash Sector5 Erase the Whole Flash5 Suspend Sector Erase5 Resume Sector Erase5 EEPROM Power Down4 SDP Enable/ EEPROM Write4 SDP Disable4 Write in OTP Row4,6 Return (from OTP Read or EEPROM Power-Down)4 Reset3.5 0 1 AAh@ X555h 55h@ 90h@ XAAAh X555h 1 0 AAh@ X555h 55h@ 90h@ XAAAh X555h 0 1 AAh@ X555h 55h@ 90h@ XAAAh X555h 0 1 AAh@ X555h AAh@ X555h AAh@ X555h B0h@ XXXXh 30h@ XXXXh AAh@ X555h 55h@ A0h@ XAAAh X555h 55h@ 80h@ XAAAh X555h 55h@ 80h@ XAAAh X555h 0 1 0 0 0 1 1 1 1 0 1 0 1 O Reset (short instruction)5 bs let o Pr e 1 0 0 1 du o 0 0 1 1 0 (s) ct AAh@ X555h AAh@ X555h AAh@ X555h F0h@ XXXX AAh@ X555h F0h@ XXXX so Ob - te le AAh@ X555h ro P 55h@ XAAAh uc d 10h@ X555h 30h@ 30h@ Sector Sector address address1 s) t( 55h@ 30h@ XAAAh X555h 55h@ A0h@ XAAAh X555h 55h@ 80h@ XAAAh X555h 55h@ B0h@ XAAAh X555h Write byte Write 1 byte 2 55h@ XAAAh 20h@ X555h Write byte N Write byte N Write byte Write 1 byte 2 55h@ F0h@ XAAAh XXXX Note: 1. Additional sectors to be erased must be entered within 80 µs. A Sector Address is any address within the Sector. 2. Flash and EEPROM Sector Selects are active high. Addresses A15-A12 are don’t cares in Instruction Bus Cycles. 3. The Reset instruction is required to return to the normal READ mode if DQ5 goes high or after reading the Flash Identifier or Protection status. 4. The MCU cannot invoke these instructions while executing code from EEPROM. The MCU must be operating from some other memory when these instructions are performed. 5. The MCU cannot invoke these instructions while executing code from the same Flash memory for which the instruction is intended. The MCU must operate from some other memory when these instructions are executed. 6. Writing to OTP Row is allowed only when SDP mode is disabled. 20/111 PSD813F1A INSTRUCTIONS An instruction is defined as a sequence of specific operations. Each received byte is sequentially decoded by the PSD and not executed as a standard write operation. The instruction is executed when the correct number of bytes are properly received and the time between two consecutive bytes is shorter than the time-out value. Some instructions are structured to include READ operations after the initial WRITE operations. The sequencing of any instruction must be followed exactly. Any invalid combination of instruction bytes or time-out between two consecutive bytes while addressing Flash memory will reset the device logic into READ mode (Flash memory reads like a ROM device). An invalid combination or time-out while addressing the EEPROM block will cause the offending byte to be interpreted as a single operation. The PSD supports these instructions (see Table 8., page 20): Flash memory: ■ Erase memory by chip or sector ■ Suspend or resume sector erase ■ Program a Byte ■ Reset to READ mode ■ Read Flash Identifier value ■ Read Sector Protection Status EEPROM: ■ Write data to OTP Row ■ Read data from OTP Row ■ Power down memory ■ Enable Software Data Protect (SDP) ■ Disable SDP ■ Return from read OTP Row read mode or power down mode. These instructions are detailed in Table 8., page 20. For efficient decoding of the instructions, the first two bytes of an instruction are the coded cycles and are followed by a command byte or confirmation byte. The coded cycles consist of writing the data AAh to address X555h during the first cycle and data 55h to address XAAAh during the second cycle. Address lines A15-A12 are don’t cares during the instruction WRITE cycles. However, the appropriate sector select signal (FSi or EESi) must be selected. Power-down Instruction and Power-up Mode EEPROM Power Down Instruction. The EEPROM can enter power down mode with the help of the EEPROM power down instruction (see Table 8., page 20). Once the EEPROM power down instruction is decoded, the EEPROM memory cannot be accessed unless a Return instruction (also in Table 8., page 20) is decoded. Alternately, this power down mode will automatically occur when the APD circuit is triggered (see section entitled Automatic Power-down (APD) Unit and Powerdown Mode, page 65). Therefore, this instruction is not required if the APD circuit is used. Power-up Mode. The PSD internal logic is reset upon power-up to the READ mode. Any write operation to the EEPROM is inhibited during the first 5ms following power-up. The FSi and EESi select signals, along with the write strobe signal, must be in the false state during power-up for maximum security of the data contents and to remove the possibility of a byte being written on the first edge of a write strobe signal. Any write cycle initiation is locked when VCC is below VLKO. bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 21/111 PSD813F1A READ Under typical conditions, the microcontroller may read the Flash or EEPROM memory using READ operations just as it would a ROM or RAM device. Alternately, the microcontroller may use READ operations to obtain status information about a Program or Erase operation in progress. Lastly, the microcontroller may use instructions to read special data from these memories. The following sections describe these READ functions. Read Memory Contents. Main Flash is placed in the READ mode after power-up, chip reset, or a Reset Flash instruction (see Table 8., page 20). The microcontroller can read the memory contents of main Flash or EEPROM by using READ operations any time the READ operation is not part of an instruction sequence. Read Main Flash Memory Identifier. The main Flash memory identifier is read with an instruction composed of 4 operations: 3 specific write operations and a READ operation (see Table 8). During the READ operation, address bits A6, A1, and A0 must be 0,0,1, respectively, and the appropriate sector select signal (FSi) must be active. The Flash ID is E3h for the PSD. The MCU can read the ID only when it is executing from the EEPROM. Read Main Flash Memory Sector Protection Status. The main Flash memory sector protection status is read with an instruction composed of 4 operations: 3 specific WRITE operations and a READ operation (see Table 8., page 20). During the READ operation, address bits A6, A1, and A0 must be 0,1,0, respectively, while the chip select FSi designates the Flash sector whose protection has to be verified. The READ operation will produce 01h if the Flash sector is protected, or 00h if the sector is not protected. The sector protection status for all NVM blocks (main Flash or EEPROM) can be read by the microcontroller accessing the Flash Protection and PSD/EE Protection registers in PSD I/O space. See Flash Memory and EEPROM Sector Protect, page 30 for register definitions. bs O Table 9. Status Bit Device Flash EEPROM FSi/ CSBOOTi VIH VIL EESi VIL VIH DQ7 Data Polling Data Polling DQ6 Toggle Flag Toggle Flag DQ5 Error Flag X DQ4 X X DQ3 Erase Timeout X DQ2 X X DQ1 X X DQ0 X X let o Pr e du o (s) ct so Ob - Reading the OTP Row. There are 64 bytes of One-Time-Programmable (OTP) memory that reside in EEPROM. These 64 bytes are in addition to the 32 Kbytes of EEPROM memory. A READ of the OTP row is done with an instruction composed of at least 4 operations: 3 specific WRITE operations and one to 64 READ operations (see Table 8., page 20). During the READ operation(s), address bit A6 must be zero, while address bits A5A0 define the OTP Row byte to be read while any EEPROM sector select signal (EESi) is active. After reading the last byte, an EEPROM Return instruction must be executed (see Table 8., page 20). Reading the Erase/Program Status Bits. The PSD provides several status bits to be used by the microcontroller to confirm the completion of an erase or programming instruction of Flash memory. Bits are also available to show the status of WRITES to EEPROM. These status bits minimize the time that the microcontroller spends performing these tasks and are defined in Table 9. The status bits can be read as many times as needed. For Flash memory, the microcontroller can perform a READ operation to obtain these status bits while an Erase or Program instruction is being executed by the embedded algorithm. See the section entitled PROGRAMMING FLASH MEMORY, page 27 for details. For EEPROM not in SDP mode, the microcontroller can perform a READ operation to obtain these status bits just after a data WRITE operation. The microcontroller may write one to 64 bytes before reading the status bits. See the section entitled Writing to the EEPROM, page 24 for details. For EEPROM in SDP mode, the microcontroller will perform a READ operation to obtain these status bits while an SDP write instruction is being executed by the embedded algorithm. See section entitled EEPROM Software Data Protect (SDP), page 24 for details. te le ro P uc d s) t( Note: 1. X = not guaranteed value, can be read either 1 or 0. 2. DQ7-DQ0 represent the Data Bus Bits, D7-D0. 3. FSi and EESi are active High. 22/111 PSD813F1A Data Polling Flag (DQ7) When Erasing or Programming the Flash memory (or when Writing into the EEPROM memory), bit DQ7 outputs the complement of the bit being entered for Programming/Writing on DQ7. Once the Program instruction or the WRITE operation is completed, the true logic value is read on DQ7 (in a Read operation). Flash memory specific features: – Data Polling is effective after the fourth WRITE pulse (for programming) or after the sixth WRITE pulse (for Erase). It must be performed at the address being programmed or at an address within the Flash sector being erased. – During an Erase instruction, DQ7 outputs a ‘0.’ After completion of the instruction, DQ7 will output the last bit programmed (it is a ‘1’ after erasing). – If the byte to be programmed is in a protected Flash sector, the instruction is ignored. – If all the Flash sectors to be erased are protected, DQ7 will be set to ‘0’ for about 100µs, and then return to the previous addressed byte. No erasure will be performed. Toggle Flag (DQ6) The PSD offers another way for determining when the EEPROM write or the Flash memory Program instruction is completed. During the internal WRITE operation and when either the FSi or EESi is true, the DQ6 will toggle from ‘0’ to ‘1’ and ‘1’ to ‘0’ on subsequent attempts to read any byte of the memory. When the internal cycle is complete, the toggling will stop and the data read on the Data Bus D0-7 is the addressed memory byte. The device is now accessible for a new READ or WRITE operation. The operation is finished when two successive reads yield the same output data. Flash memory specific features: ■ The Toggle bit is effective after the fourth WRITE pulse (for programming) or after the sixth WRITE pulse (for Erase). ■ If the byte to be programmed belongs to a protected Flash sector, the instruction is ignored. ■ If all the Flash sectors selected for erasure are protected, DQ6 will toggle to ‘0’ for about 100 µs and then return to the previous addressed byte. Error Flag (DQ5) During a correct Program or Erase, the Error bit will set to ‘0.’ This bit is set to ‘1’ when there is a failure during Flash byte programming, Sector erase, or Bulk Erase. In the case of Flash programming, the Error Bit indicates the attempt to program a Flash bit(s) from the programmed state ('0') to the erased state ('1'), which is not a valid operation. The Error bit may also indicate a timeout condition while attempting to program a byte. In case of an error in Flash sector erase or byte program, the Flash sector in which the error occurred or to which the programmed byte belongs must no longer be used. Other Flash sectors may still be used. The Error bit resets after the Reset instruction. Erase Time-out Flag DQ3 (Flash Memory only) The Erase Timer bit reflects the time-out period allowed between two consecutive Sector Erase instructions. The Erase timer bit is set to ‘0’ after a Sector Erase instruction for a time period of 100µs + 20% unless an additional Sector Erase instruction is decoded. After this time period or when the additional Sector Erase instruction is decoded, DQ3 is set to ‘1.’ bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 23/111 PSD813F1A Writing to the EEPROM Data may be written a byte at a time to the EEPROM using simple write operations, much like writing to an SRAM. Unlike SRAM though, the completion of each byte write must be checked before the next byte is written. To speed up this process, the PSD offers a Page write feature to allow writing of several bytes before checking status. To prevent inadvertent writes to EEPROM, the PSD offers a Software Data Protect (SDP) mode. Once enabled, SDP forces the MCU to “unlock” the EEPROM before altering its contents, much like Flash memory programming. Writing a Byte to EEPROM. A write operation is initiated when an EEPROM select signal (EESi) is true and the write strobe signal (WR) into the PSD is true. If the PSD detects no additional writes within 120µsec, an internal storage operation is initiated. Internal storage to EEPROM memory technology typically takes a few milliseconds to complete. The status of the write operation is obtained by the MCU reading the Data Polling or Toggle bits (as detailed in section entitled READ, page 22), or the Ready/Busy output pin (section Ready/Busy Pin (PC3), page 18). Keep in mind that the MCU does not need to erase a location in EEPROM before writing it. Erasure is performed automatically as an internal process. Writing a Page to EEPROM. Writing data to EEPROM using page mode is more efficient than writing one byte at a time. The PSD EEPROM has a 64 byte volatile buffer that the MCU may fill before an internal EEPROM storage operation is initiated. Page mode timing approaches a 64:1 advantage over the time it takes to write individual bytes. To invoke page mode, the MCU must write to EEPROM locations within a single page, with no more than 120µs between individual byte writes. A single page means that address lines A14 to A6 must remain constant. The MCU may write to the 64 locations on a page in any order, which is determined by address lines A5 to A0. As soon as 120µs have expired after the last page write, the internal EEPROM storage process begins and the MCU checks programming status. Status is checked the same way it is for byte writes, described above. Note: Be aware that if the upper address bits (A14 to A6) change during page write operations, loss of data may occur. Ensure that all bytes for a given page have been successfully stored in the EEPROM before proceeding to the next page. Correct management of MCU interrupts during EEPROM page write operations is essential. EEPROM Software Data Protect (SDP). The SDP feature is useful for protecting the contents of EEPROM from inadvertent write cycles that may occur during uncontrolled MCU bus conditions. These may happen if the application software gets lost or when VCC is not within normal operating range. Instructions from the MCU are used to enable and disable SDP mode (see Table 8., page 20). Once enabled, the MCU must write an instruction sequence to EEPROM before writing data (much like writing to Flash memory). SDP mode can be used for both byte and page writes to EEPROM. The device will remain in SDP mode until the MCU issues a valid SDP disable instruction. PSD devices are shipped with SDP mode disabled. However, within PSDsoft Express, SDP mode may be enabled as part of programming the device with a device programmer (PSDpro). To enable SDP mode at run time, the MCU must write three specific data bytes at three specific memory locations, as shown in Figure 7., page 25. Any further writes to EEPROM when SDP is set will require this same sequence, followed by the byte(s) to write. The first SDP enable sequence can be followed directly by the byte(s) to be written. To disable SDP mode, the MCU must write specific bytes to six specific locations, as shown in Figure 8., page 26. The MCU must not be executing code from EEPROM when these instructions are invoked. The MCU must be operating from some other memory when enabling or disabling SDP mode. The state of SDP mode is not changed by power on/off sequences (nonvolatile). When either the SDP enable or SDP disable instructions are issued from the MCU, the MCU must use the Toggle bit (status bit DQ6) or the Ready/Busy output pin to check programming status. The Ready/Busy output is driven low from the first write of AAh @ 555h until the completion of the internal storage sequence. Data Polling (status bit DQ7) is not supported when issuing the SDP enable or SDP disable commands. Note: Using the SDP sequence (enabling, disabling, or writing data) is initiated when specific bytes are written to addresses on specific “pages” of EEPROM memory, with no more than 120µs between WRITES. The addresses 555h and AAAh are located on different pages of EEPROM. This is how the PSD distinguishes these instruction sequences from ordinary writes to EEPROM, which are expected to be within a single EEPROM page. bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 24/111 PSD813F1A Writing the OTP Row Writing to the OTP row (64 bytes) can only be done once per byte, and is enabled by an instruction. This instruction is composed of three specific WRITE operations of data bytes at three specific memory locations followed by the data to be stored in the OTP row (refer to Table 8., page 20). Figure 7. EEPROM SDP Enable Flowcharts SDP SDP Set not Set WRITE AAh to Address 555h During the WRITE operations, address bit A6 must be zero, while address bits A5-A0 define the OTP Row byte to be written while any EEPROM Sector Select signal (EESi) is active. Writing the OTP Row is allowed only when SDP mode is not enabled. WRITE AAh to Address 555h Page Write Instruction WRITE 55h to Address AAAh WRITE 55h to Address AAAh Page Write Instruction WRITE A0h to Address 555h WRITE A0h to Address 555h SDP is set SDP ENABLE ALGORITHM bs O let o Pr e du o (s) ct so Ob Write in Memory WRITE Data to be Written in any Address te le WRITE is enabled ro P uc d s) t( Write Data + SDP Set after tWC (Write Cycle Time) ai09219 25/111 PSD813F1A Figure 8. Software Data Protection Disable Flowchart WRITE AAh to Address 555h WRITE 55h to Address AAAh WRITE 80h to Address 555h Page Write Instruction WRITE AAh to Address 555h WRITE 55h to Address AAAh WRITE 20h to Address 555h bs O let o Pr e du o (s) ct Unprotected State after tWC (Write Cycle time) so Ob - te le ro P uc d s) t( ai09220 26/111 PSD813F1A PROGRAMMING FLASH MEMORY Flash memory must be erased prior to being programmed. The MCU may erase Flash memory all at once or by-sector, but not byte-by-byte. A byte of Flash memory erases to all logic ones (FF hex), and its bits are programmed to logic zeros. Although erasing Flash memory occurs on a sector basis, programming Flash memory occurs on a byte basis. The PSD main Flash and optional boot Flash require the MCU to send an instruction to program a byte or perform an erase function (see Table 8., page 20). This differs from EEPROM, which can be programmed with simple MCU bus write operations (unless EEPROM SDP mode is enabled). Once the MCU issues a Flash memory program or erase instruction, it must check for the status of completion. The embedded algorithms that are invoked inside the PSD support several means to provide status to the MCU. Status may be checked using any of three methods: Data Polling, Data Toggle, or the Ready/Busy output pin. Data Polling Polling on DQ7 is a method of checking whether a Program or Erase instruction is in progress or has completed. Figure 9 shows the Data Polling algorithm. When the MCU issues a programming instruction, the embedded algorithm within the PSD begins. The MCU then reads the location of the byte to be programmed in Flash to check status. Data bit DQ7 of this location becomes the compliment of data bit 7of the original data byte to be programmed. The MCU continues to poll this location, comparing DQ7 and monitoring the Error bit on DQ5. When the DQ7 matches data bit 7 of the original data, and the Error bit at DQ5 remains ‘0’, then the embedded algorithm is complete. If the Error bit at DQ5 is ‘1’, the MCU should test DQ7 again since DQ7 may have changed simultaneously with DQ5 (see Figure 9). The Error bit at DQ5 will be set if either an internal timeout occurred while the embedded algorithm attempted to program the byte or if the MCU attempted to program a ‘1’ to a bit that was not erased (not erased is logic ‘0’). It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed to compare the byte that was written to Flash with the byte that was intended to be written. When using the Data Polling method after an erase instruction, Figure 9 still applies. However, DQ7 will be ‘0’ until the erase operation is complete. A ‘1’ on DQ5 will indicate a timeout failure of the erase operation, a ‘0’ indicates no error. The MCU can read any location within the sector being erased to get DQ7 and DQ5. PSDsoft Express will generate ANSI C code functions which implement these Data Polling algorithms. Figure 9. Data Polling Flowchart START READ DQ5 & DQ7 at VALID ADDRESS bs O let o Pr e du o (s) ct Ob - so te le NO DQ7 = DATA ro P NO YES uc d s) t( YES DQ5 =1 READ DQ7 DQ7 = DATA NO FAIL YES PASS AI01369B 27/111 PSD813F1A Data Toggle Checking the Data Toggle bit on DQ6 is a method of determining whether a Program or Erase instruction is in progress or has completed. Figure 10 shows the Data Toggle algorithm. When the MCU issues a programming instruction, the embedded algorithm within the PSD begins. The MCU then reads the location of the byte to be programmed in Flash to check status. Data bit DQ6 of this location will toggle each time the MCU reads this location until the embedded algorithm is complete. The MCU continues to read this location, checking DQ6 and monitoring the Error bit on DQ5. When DQ6 stops toggling (two consecutive reads yield the same value), and the Error bit on DQ5 remains ‘0’, then the embedded algorithm is complete. If the Error bit on DQ5 is ‘1’, the MCU should test DQ6 again, since DQ6 may have changed simultaneously with DQ5 (see Figure 10). The Error bit at DQ5 will be set if either an internal timeout occurred while the embedded algorithm attempted to program the byte, or if the MCU attempted to program a ‘1’ to a bit that was not erased (not erased is logic ‘0’). It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed to compare the byte that was written to Flash with the byte that was intended to be written. When using the Data Toggle method after an erase instruction, Figure 10 still applies. DQ6 will toggle until the erase operation is complete. A ‘1’ on DQ5 will indicate a timeout failure of the erase operation, a ‘0’ indicates no error. The MCU can read any location within the sector being erased to get DQ6 and DQ5. PSDsoft Express will generate ANSI C code functions which implement these Data Toggling algorithms. Figure 10. Data Toggle Flowchart START READ DQ5 & DQ6 DQ6 = TOGGLE YES NO NO DQ5 =1 YES READ DQ6 bs O let o Pr e du o (s) ct Ob - so te le DQ6 = TOGGLE ro P YES uc d s) t( NO FAIL PASS AI01370B 28/111 PSD813F1A ERASING FLASH MEMORY Flash Bulk Erase The Flash Bulk Erase instruction uses six write operations followed by a Read operation of the status register, as described in Table 8., page 20. If any byte of the Bulk Erase instruction is wrong, the Bulk Erase instruction aborts and the device is reset to the Read Flash memory status. During a Bulk Erase, the memory status may be checked by reading status bits DQ5, DQ6, and DQ7, as detailed in section entitled PROGRAMMING FLASH MEMORY, page 27. The Error bit (DQ5) returns a ‘1’ if there has been an Erase Failure (maximum number of erase cycles have been executed). It is not necessary to program the array with 00h because the PSD will automatically do this before erasing to 0FFh. During execution of the Bulk Erase instruction, the Flash memory will not accept any instructions. Flash Sector Erase. The Sector Erase instruction uses six write operations, as described in Table 8., page 20. Additional Flash Sector Erase confirm commands and Flash sector addresses can be written subsequently to erase other Flash sectors in parallel, without further coded cycles, if the additional instruction is transmitted in a shorter time than the timeout period of about 100 µs. The input of a new Sector Erase instruction will restart the time-out period. The status of the internal timer can be monitored through the level of DQ3 (Erase time-out bit). If DQ3 is ‘0’, the Sector Erase instruction has been received and the timeout is counting. If DQ3 is ‘1’, the timeout has expired and the PSD is busy erasing the Flash sector(s). Before and during Erase timeout, any instruction other than Erase suspend and Erase Resume will abort the instruction and reset the device to READ mode. It is not necessary to program the Flash sector with 00h as the PSD will do this automatically before erasing (byte=FFh). During a Sector Erase, the memory status may be checked by reading status bits DQ5, DQ6, and DQ7, as detailed in section entitled PROGRAMMING FLASH MEMORY, page 27. During execution of the erase instruction, the Flash block logic accepts only Reset and Erase Suspend instructions. Erasure of one Flash sector may be suspended, in order to read data from another Flash sector, and then resumed. Flash Erase Suspend When a Flash Sector Erase operation is in progress, the Erase Suspend instruction will suspend the operation by writing 0B0h to any address when an appropriate Chip Select (FSi) is true. (See Table 8., page 20). This allows reading of data from another Flash sector after the Erase operation has been suspended. Erase suspend is accepted only during the Flash Sector Erase instruction execution and defaults to READ mode. An Erase Suspend instruction executed during an Erase timeout will, in addition to suspending the erase, terminate the time out. The Toggle Bit DQ6 stops toggling when the PSD internal logic is suspended. The toggle Bit status must be monitored at an address within the Flash sector being erased. The Toggle Bit will stop toggling between 0.1 µs and 15 µs after the Erase Suspend instruction has been executed. The PSD will then automatically be set to Read Flash Block Memory Array mode. If an Erase Suspend instruction was executed, the following rules apply: ■ Attempting to read from a Flash sector that was being erased will output invalid data. ■ Reading from a Flash sector that was not being erased is valid. ■ The Flash memory cannot be programmed, and will only respond to Erase Resume and Reset instructions (READ is an operation and is OK). ■ If a Reset instruction is received, data in the Flash sector that was being erased will be invalid. Flash Erase Resume If an Erase Suspend instruction was previously executed, the erase operation may be resumed by this instruction. The Erase Resume instruction consists of writing 030h to any address while an appropriate Chip Select (FSi) is true. (See Table 8., page 20.) bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 29/111 PSD813F1A FLASH AND EEPROM MEMORY SPECIFIC FEATURES Flash Memory and EEPROM Sector Protect Each Flash and EEPROM sector can be separately protected against Program and Erase functions. Sector Protection provides additional data security because it disables all program or erase operations. This mode can be activated through the JTAG Port or a Device Programmer. Sector protection can be selected for each sector using the PSDsoft Configuration program. This will automatically protect selected sectors when the device is programmed through the JTAG Port or a Device Programmer. Flash and EEPROM sectors can be unprotected to allow updating of their contents using the JTAG Port or a Device Programmer. The microcontroller can read (but cannot change) the sector protection bits. Any attempt to program or erase a protected Flash or EEPROM sector will be ignored by the device. The Verify operation will result in a READ of the protected data. This allows a guarantee of the retention of the Protection status. The sector protection status can be read by the MCU through the Flash protection and PSD/EE protection registers (CSIOP). See Table 10. Reset The Reset instruction resets the internal memory logic state machine in a few milliseconds. Reset is an instruction of either one write operation or three write operations (refer to Table 8., page 20). Table 10. Sector Protection/Security Bit Definition – Flash Protection Register Bit 7 Sec7_Prot Bit 6 Sec6_Prot Bit 5 Sec5_Prot Bit 4 Sec4_Prot Bit 3 Sec3_Prot Bit 2 Sec2_Prot Bit 1 Sec1_Prot Note: 1. Bit Definitions: Sec_Prot 1 = Flash is write protected. Sec_Prot 0 = Flash is not write protected. Table 11. Sector Protection/Security Bit Definition – PSD/EE Protection Register Bit 7 Security_Bit Bit 6 not used Bit 5 not used Bit 4 not used Note: 1. Bit Definitions: Sec_Prot 1 = EEPROM Boot Sector is write protected. Sec_Prot 0 = EEPROM Boot Sector is not write protected. Security_Bit 0 = Security Bit in device has not been set. 1 = Security Bit in device has been set. SRAM The SRAM is a 16 Kbit (2K x 8) memory. The SRAM is enabled when RS0 the SRAM chip select output from the DPLD is high. RS0 can contain up bs O let o Pr e du o (s) ct so Ob Sec3_Prot Bit 3 eP let Bit 2 Sec2_Prot od r uc Bit 0 Sec0_Prot s) t( Bit 1 Sec1_Prot Bit 0 Sec0_Prot to two product terms, allowing flexible memory mapping. 30/111 PSD813F1A MEMORY SELECT SIGNALS The main Flash (FSi), EEPROM (EESi), and SRAM (RS0) memory select signals are all outputs of the DPLD. They are setup by entering equations for them in PSDsoft Express. The following rules apply to the equations for the internal chip select signals: 1. Flash memory and EEPROM sector select signals must not be larger than the physical sector size. 2. Any main Flash memory sector must not be mapped in the same memory space as another Flash sector. 3. An EEPROM sector must not be mapped in the same memory space as another EEPROM sector. 4. SRAM, I/O, and Peripheral I/O spaces must not overlap. 5. An EEPROM sector may overlap a main Flash memory sector. In case of overlap, priority will be given to the EEPROM. 6. SRAM, I/O, and Peripheral I/O spaces may overlap any other memory sector. Priority will be given to the SRAM, I/O, or Peripheral I/O. Example FS0 is valid when the address is in the range of 8000h to BFFFh, EES0 is valid from 8000h to 9FFFh, and RS0 is valid from 8000h to 87FFh. Any address in the range of RS0 will always access the SRAM. Any address in the range of EES0 greater than 87FFh (and less than 9FFFh) will automatically address EEPROM segment 0. Any address greater than 9FFFh will access the Flash memory segment 0. You can see that half of the Flash memory segment 0 and one-fourth of EEPROM segment 0 can not be accessed in this example. Also note that an equation that defined FS1 to anywhere in the range of 8000h to BFFFh would not be valid. Figure 11 shows the priority levels for all memory components. Any component on a higher level can overlap and has priority over any component on a lower level. Components on the same level must not overlap. Level one has the highest priority and level 3 has the lowest. Memory Select Configuration for MCUs with Separate Program and Data Spaces The 8031 and compatible family of microcontrollers, which includes the 80C51, 80C151, 80C251, 80C51XA, and the C500 family, have separate address spaces for code memory (selected using PSEN) and data memory (selected using RD). Any of the memories within the PSD can reside in either space or both spaces. This is controlled through manipulation of the VM register that resides in the PSD’s CSIOP space. The VM register is set using PSDsoft Express to have an initial value. It can subsequently be changed by the microcontroller so that memory mapping can be changed on-the-fly. For example, I may wish to have SRAM and Flash in Data Space at boot, and EEPROM in Program Space at boot, and later swap EEPROM and Flash. This is easily done with the VM register by using PSDsoft Express to configure it for boot up and having the microcontroller change it when desired. Table 12 describes the VM Register. Figure 11. Priority Level of Memory and I/O Components Highest Priority bs O Table 12. VM Register Bit 7 PIO_EN Bit 6 Bit 5 Bit 4 FL_Data 0 = RD can’t access Flash memory 1 = RD access Flash memory Bit 3 EE_Data Bit 2 FL_Code Bit 1 EE_Code Bit 0 SRAM_Code let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( Level 1 SRAM, I /O, or Peripheral I /O Level 2 Secondary EEPROM Memory Level 3 Flash Memory Lowest Priority AI09221 0 = disable not used PIO mode not used 0 = PSEN 0 = RD can’t can’t access access EEPROM Flash memory 1 = RD access EEPROM 1 = PSEN access Flash memory 0 = PSEN 0 = PSEN can’t can’t access access EEPROM SRAM 1 = PSEN 1 = PSEN access access EEPROM SRAM 1= enable PIO mode not used not used 31/111 PSD813F1A Separate Space Modes Code memory space is separated from data memory space. For example, the PSEN signal is used to access the program code from the Flash Memory, while the RD signal is used to access data from the EEPROM, SRAM and I/O Ports. This configuration requires the VM register to be set to 0Ch. See Figure 12. Figure 12. 80C31 Memory Modes - Separate Space Combined Space Modes The program and data memory spaces are combined into one space that allows the main Flash Memory, EEPROM, and SRAM to be accessed by either PSEN or RD. For example, to configure the main Flash memory in combined space mode, bits 2 and 4 of the VM register are set to “1” (see Figure 13). DPLD RS0 EES0-EES3 FS0-FS7 Flash Memory EEPROM Memory SRAM CS OE CS OE CS OE PSEN RD Figure 13. 80C31 Memory Mode - Combined Space DPLD RS0 EES0-EES3 FS0-FS7 RD VM REG BIT 3 VM REG BIT 4 PSEN bs O VM REG BIT 1 let o ro P e uc d (s) t so Ob Flash Memory CS OE te le CS ro P uc d s) t( AI09222 EEPROM Memory SRAM CS OE OE VM REG BIT 2 RD VM REG BIT 0 AI09223 32/111 PSD813F1A PAGE REGISTER The 8-bit Page Register increases the addressing capability of the microcontroller by a factor of up to 256. The contents of the register can also be read by the microcontroller. The outputs of the Page Register (PGR0-PGR7) are inputs to the DPLD decoder and can be included in the Flash Memory, EEPROM, and SRAM chip select equations. If memory paging is not needed, or if not all 8 page register bits are needed for memory paging, then these bits may be used in the CPLD for general logic. Figure 14. Page Register RESET Figure 14 shows the Page Register. The eight flip flops in the register are connected to the internal data bus D0-D7. The microcontroller can write to or read from the Page Register. The Page Register can be accessed at address location CSIOP + E0h. D0 D1 D0 - D7 D2 D3 D4 D5 D6 R/W D7 Q0 Q1 Q2 Q3 Q4 Q5 PGR0 PGR1 PGR2 PGR3 PGR4 PGR5 PGR6 Flash DPLD AND Flash CPLD INTERNAL SELECTS AND LOGIC Q6 PGR7 Q7 PAGE REGISTER bs O let o Pr e du o (s) ct so Ob - te le PLD ro P uc d s) t( AI09224 33/111 PSD813F1A PLD’S The PLDs bring programmable logic functionality to the PSD. After specifying the logic for the PLDs using the PSDabel tool in PSDsoft Express, the logic is programmed into the device and available upon power-up. The PSD contains two PLDs: the Decode PLD (DPLD), and the Complex PLD (CPLD). The PLDs are briefly discussed in the next few paragraphs, and in more detail in the sections entitled DECODE PLD (DPLD) and COMPLEX PLD (CPLD). Figure 15., page 35 shows the configuration of the PLDs. The DPLD performs address decoding for internal and external components, such as memory, registers, and I/O port selects. The CPLD can be used for logic functions, such as loadable counters and shift registers, state machines, and encoding and decoding logic. These logic functions can be constructed using the 16 Output macrocells (OMCs), 24 Input macrocells (IMCs), and the AND array. The CPLD can also be used to generate external chip selects. The AND array is used to form product terms. These product terms are specified using PSDabel. An Input Bus consisting of 73 signals is connected to the PLDs. The signals are shown in Table 13. The Turbo Bit in PSD The PLDs in the PSD can minimize power consumption by switching off when inputs remain unchanged for an extended time of about 70ns. Setting the Turbo mode bit to off (Bit 3 of the PMMR0 register) automatically places the PLDs into standby if no inputs are changing. Turbo-off mode increases propagation delays while reducing power consumption. See the section entitled POWER MANAGEMENT, page 64, on how to set the Turbo Bit. Additionally, five bits are available in the PMMR2 register to block MCU control signals from entering the PLDs. This reduces power consumption and can be used only when these MCU control signals are not used in PLD logic equations. The PLDs in the PSD can minimize power consumption by switching off when inputs remain unchanged for an extended time of about 70ns. Each of the two PLDs has unique characteristics suited for its applications. They are described in the following sections. Table 13. DPLD and CPLD Inputs Input Source MCU Address Bus1 MCU Control Signals Reset Power-down Port A Input Macrocells Port B Input Macrocells Input Name A15-A0 CNTL2-CNTL0 RST PDN PA7-PA0 Number of Signals 16 bs O let o Pr e du o (s) ct so Ob - Port C Input Macrocells Port D Inputs Pr te le PB7-PB0 od uc s) t( 3 1 1 8 8 8 3 8 8 8 1 PC7-PC0 PD2-PD0 Page Register Macrocell AB Feedback Macrocell BC Feedback EEPROM Program Status Bit PGR7-PGR0 MCELLAB.FB7FB0 MCELLBC.FB7FB0 Ready/Busy Note: 1. The address inputs are A19-A4 in 80C51XA mode. 34/111 PLD INPUT BUS I/O PORTS bs O 8 Figure 15. PLD Diagram let o Pr e PAGE REGISTER DECODE PLD FLASH MEMORY SELECTS EEPROM SELECTS SRAM SELECT CSIOP SELECT PERIPHERAL SELECTS JTAG SELECT 4 1 1 2 1 8 DATA BUS du o 73 16 (s) ct OUTPUT MACROCELL FEEDBACK DIRECT MACROCELL ACCESS FROM MCU DATA BUS CPLD 16 OUTPUT MACROCELL so Ob 24 INPUT MACROCELL (PORT A,B,C) 73 PT ALLOC. MACROCELL ALLOC. MCELLAB TO PORT A OR B MCELLBC TO PORT B OR C 8 8 3 EXTERNAL CHIP SELECTS TO PORT D 24 INPUT MACROCELL & INPUT PORTS ro P DIRECT MACROCELL INPUT TO MCU DATA BUS te le uc d 3 PORT D INPUTS s) t( AI09225 PSD813F1A 35/111 PSD813F1A DECODE PLD (DPLD) The DPLD, shown in Figure 16, is used for decoding the address for internal and external components. The DPLD can be used to generate the following decode signals: ■ 8 sector selects for the main Flash memory (three product terms each) ■ 4 sector selects for the EEPROM (three product terms each) Figure 16. DPLD Logic Array 3 3 3 3 (INPUTS) I /O PORTS (PORT A,B,C) MCELLAB.FB [7:0] (FEEDBACKS) MCELLBC.FB [7:0] (FEEDBACKS) PGR0 - PGR7 A[15:0](1) PD[2:0] (ALE,CLKIN,CSI) PDN (APD OUTPUT) (24) 3 (8) 3 (8) (8) (16) (3) (1) 3 EES 0 EES 1 EES 2 EES 3 EEPROM SELECTS ■ ■ ■ ■ 1 internal SRAM select signal (two product terms) 1 internal CSIOP (PSD configuration register) select signal 1 JTAG select signal (enables JTAG on Port C) 2 internal peripheral select signals (peripheral I/O mode). FS0 CNTRL[2:0] (READ/WRITE CONTROL SIGNALS) (3) RESET RD_BSY (1) (1) bs O let o ro P e du (s) ct so Ob - te le 3 3 3 3 3 2 1 1 1 1 ro P FS1 uc d s) t( FS2 FS3 FS4 FS5 FS6 8 FLASH MEMORY SECTOR SELECTS FS7 RS0 CSIOP PSEL0 PSEL1 JTAGSEL SRAM SELECT I/O DECODER SELECT PERIPHERAL I/O MODE SELECT AI09226 Note: 1. The address inputs are A19-A4 in 80C51XA mode. 36/111 PSD813F1A COMPLEX PLD (CPLD) The CPLD can be used to implement system logic functions, such as loadable counters and shift registers, system mailboxes, handshaking protocols, state machines, and random logic. The CPLD can also be used to generate 3 external chip selects, routed to Port D. Although external chip selects can be produced by any Output Macrocell, these three external chip selects on Port D do not consume any Output macrocells. As shown in Figure 15., page 35, the CPLD has the following blocks: ■ 24 Input macrocells (IMCs) ■ 16 Output macrocells (OMCs) ■ Macrocell Allocator ■ Product Term Allocator Figure 17. Macrocell and I/O Port PLD INPUT BUS PRODUCT TERMS FROM OTHER MACROCELLS MCU ADDRESS / DATA BUS AND array capable of generating up to 137 product terms ■ Four I/O ports. Each of the blocks are described in the subsections that follow. The Input Macrocells (IMC) and Output Macrocells (OMC) are connected to the PSD internal data bus and can be directly accessed by the microcontroller. This enables the MCU software to load data into the Output Macrocells (OMC) or read data from both the Input and Output Macrocells (IMC and OMC). This feature allows efficient implementation of system logic and eliminates the need to connect the data bus to the AND logic array as required in most standard PLD macrocell architectures. ■ TO OTHER I/O PORTS CPLD MACROCELLS PT PRESET PRODUCT TERM ALLOCATOR MCU DATA IN MCU LOAD DATA LOAD CONTROL I/O PORTS AND ARRAY UP TO 10 PRODUCT TERMS PR DI LD PT CLOCK D/T MUX PLD INPUT BUS GLOBAL CLOCK CLOCK SELECT D/T/JK FF SELECT CK O bs MUX let o MUX ro P e PT CLEAR du (s) ct Q CL MUX POLARITY SELECT COMB. /REG SELECT so Ob MACROCELL OUT TO MCU CPLD OUTPUT MACROCELL TO I/O PORT ALLOC. te le DATA WR PDR LATCHED ADDRESS OUT ro P Q uc d s) t( I/O PIN D MUX CPLD OUTPUT SELECT INPUT D WR Q DIR REG. PT OUTPUT ENABLE (OE) MACROCELL FEEDBACK I/O PORT INPUT INPUT MACROCELLS QD PT INPUT LATCH GATE/CLOCK ALE/AS QD G AI02874 37/111 PSD813F1A Output Macrocell (OMC) Eight of the Output Macrocells (OMC) are connected to Ports A and B pins and are named as McellAB0-McellAB7. The other eight macrocells are connected to Ports B and C pins and are named as McellBC0-McellBC7. If an McellAB output is not assigned to a specific pin in PSDabel, the Macrocell Allocator will assign it to either Port A or B. The same is true for a McellBC output on Port B or C. Table 14 shows the macrocells and Port assignment. The Output Macrocell (OMC) architecture is shown in Figure 18., page 40. As shown in the figure, there are native product terms available from the AND array, and borrowed product terms available (if unused) from other OMCs. The polarity of the product term is controlled by the XOR gate. The OMC can implement either sequential logic, using the flip-flop element, or combinatorial logic. The multiplexer selects between the sequential or combinatorial logic outputs. The multiplexer output can drive a Port pin and has a feedback path to the AND array inputs. The flip-flop in the OMC can be configured as a D, T, JK, or SR type in the PSDabel program. The flip-flop’s clock, preset, and clear inputs may be driven from a product term of the AND array. Alternatively, the external CLKIN signal can be used for the clock input to the flip-flop. The flip-flop is clocked on the rising edge of the clock input. The preset and clear are active-high inputs. Each clear input can use up to two product terms. Table 14. Output Macrocell Port and Data Bit Assignments Output Macrocell McellAB0 McellAB1 McellAB2 McellAB3 McellAB4 McellAB5 McellAB6 McellAB7 McellBC0 McellBC1 McellBC2 McellBC3 McellBC4 McellBC5 McellBC6 Port Assignment Port A0, B0 Port A1, B1 Port A2, B2 Port A3, B3 Port A4, B4 Port A5, B5 Port A6, B6 Port A7, B7 Port B0, C0 Port B1, C1 Port B2, C2 Native Product Terms 3 3 3 3 3 3 3 Maximum Borrowed Product Terms 6 6 Data Bit for Loading or Reading O bs McellBC7 let o ro P e Port B3, C3 Port B4, C4 Port B5, C5 Port B6, C6 Port B7, C7 du ct (s) 4 4 4 4 4 4 4 4 3 so Ob - eP let 6 6 6 6 6 6 5 5 5 5 6 6 6 6 ro uc d D0 D1 D2 D3 D4 D5 D6 D7 s) t( D0 D1 D2 D3 D4 D5 D6 D7 38/111 PSD813F1A Product Term Allocator The CPLD has a Product Term Allocator. The PSDabel compiler uses the Product Term Allocator to borrow and place product terms from one macrocell to another. The following list summarizes how product terms are allocated: ■ McellAB0-McellAB7 all have three native product terms and may borrow up to six more ■ McellBC0-McellBC3 all have four native product terms and may borrow up to five more ■ McellBC4-McellBC7 all have four native product terms and may borrow up to six more. Each macrocell may only borrow product terms from certain other macrocells. Product terms already in use by one macrocell are not available for another macrocell. If an equation requires more product terms than are available to it, then “external” product terms are required, which will consume other Output Macrocells (OMC). If external product terms are used, extra delay will be added for the equation that required the extra product terms. This is called product term expansion. PSDsoft Express will perform this expansion as needed. Loading and Reading the Output Macrocells (OMC). The OMCs occupy a memory location in the MCU address space, as defined by the CSIOP (refer to the I/O section). The flip-flops in each of the 16 OMCs can be loaded from the data bus by a microcontroller. Loading the OMCs with data from the MCU takes priority over internal functions. As such, the preset, clear, and clock inputs to the flip-flop can be overridden by the MCU. The ability to load the flip-flops and read them back is useful in such applications as loadable counters bs O let o Pr e du o (s) ct so Ob - and shift registers, mailboxes, and handshaking protocols. Data can be loaded to the OMCs on the trailing edge of the WR signal (edge loading) or during the time that the WR signal is active (level loading). The method of loading is specified in PSDsoft Express Configuration. The OMC Mask Register There is one Mask Register for each of the two groups of eight OMCs. The Mask Registers can be used to block the loading of data to individual OMCs. The default value for the Mask Registers is 00h, which allows loading of the OMCs. When a given bit in a Mask Register is set to a ‘1’, the MCU will be blocked from writing to the associated OMC. For example, suppose McellAB0-3 are being used for a state machine. You would not want a MCU write to McellAB to overwrite the state machine registers. Therefore, you would want to load the Mask Register for McellAB (Mask Macrocell AB) with the value 0Fh. The Output Enable of the OMC The OMC can be connected to an I/O port pin as a PLD output. The output enable of each Port pin driver is controlled by a single product term from the AND array, ORed with the Direction Register output. The pin is enabled upon power up if no output enable equation is defined and if the pin is declared as a PLD output in PSDsoft Express. If the OMC output is declared as an internal node and not as a Port pin output in the PSDabel file, then the Port pin can be used for other I/O functions. The internal node feedback can be routed as an input to the AND array. te le ro P uc d s) t( 39/111 AND ARRAY PLD INPUT BUS bs O 40/111 MASK REG. MACROCELL CS INTERNAL DATA BUS D [ 7:0] RD PSD813F1A Figure 18. CPLD Output Macrocell let o Pr e du o PT ALLOCATOR DIRECTION REGISTER ENABLE (.OE) PRESET(.PR) COMB/REG SELECT WR PT POLARITY SELECT IN CLR PROGRAMMABLE FF (D / T/JK /SR) PORT DRIVER PT CLK CLKIN MUX (s) ct PT PT DIN PR MUX LD Q I/O PIN MACROCELL ALLOCATOR so Ob CLEAR (.RE) FEEDBACK (.FB) PORT INPUT te le ro P INPUT MACROCELL uc d s) t( AI02875B PSD813F1A Input Macrocells (IMC) The CPLD has 24 IMCs, one for each pin on Ports A, B, and C. The architecture of the IMC is shown in Figure 19., page 42. The IMCs are individually configurable, and can be used as a latch, register, or to pass incoming Port signals prior to driving them onto the PLD input bus. The outputs of the IMCs can be read by the microcontroller through the internal data bus. The enable for the latch and clock for the register are driven by a multiplexer whose inputs are a product term from the CPLD AND array or the MCU address strobe (ALE/AS). Each product term output is used to latch or clock four IMCs. Port inputs 3-0 can be controlled by one product term and 7-4 by another. Configurations for the IMCs are specified by equations written in PSDabel (see Application Note 55). Outputs of the IMCs can be read by the MCU via the IMC buffer. See the I/O Port section on how to read the IMCs. IMCs can use the address strobe to latch address bits higher than A15. Any latched addresses are routed to the PLDs as inputs. IMCs are particularly useful with handshaking communication applications where two processors pass data back and forth through a common mailbox. Figure 20., page 43 shows a typical configuration where the Master MCU writes to the Port A Data Out Register. This, in turn, can be read by the Slave MCU via the activation of the “SlaveRead” output enable product term. The Slave can also write to the Port A IMCs and the Master can then read the IMCs directly. Note that the “Slave-Read” and “Slave-wr” signals are product terms that are derived from the Slave MCU inputs RD, WR, and Slave_CS. bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 41/111 AND ARRAY PLD INPUT BUS bs O 42/111 PSD813F1A Figure 19. Input Macrocell let o Pr e INTERNAL DATA BUS D [ 7:0] INPUT MACROCELL _ RD DIRECTION REGISTER ENABLE ( .OE ) du o (s) ct PT OUTPUT MACROCELLS BC AND MACROCELL AB PT FEEDBACK PORT DRIVER I/O PIN so Ob MUX Q D MUX D FF Q D G LATCH PT ALE/AS te le ro P INPUT MACROCELL uc d s) t( AI02876B bs O Figure 20. Handshaking Communication Using Input Macrocells let o Pr e PSD SLAVE – CS RD WR SLAVE – READ PORT A DATA OUT REGISTER CPLD D MCU -WR Q D [ 7:0] PORT A MASTER MCU SLAVE– WR PORT A INPUT MACROCELL Q D D [ 7:0] du o MCU - RD MCU - WR (s) ct so Ob te le MCU -RD SLAVE MCU ro P uc d s) t( AI02877C PSD813F1A 43/111 PSD813F1A MCU BUS INTERFACE The “no-glue logic” PSD MCU Bus Interface block can be directly connected to most popular MCUs and their control signals. Key 8-bit MCUs, with their bus types and control signals, are shown in Table 15. The interface type is specified using the PSDsoft Express Configuration. Table 15. MCUs and their Control Signals MCU 8031 80C51XA 80C251 80C251 80198 68HC11 68HC912 Z80 Z8 68330 M37702M2 Data Bus Width 8 8 8 8 8 8 8 8 8 8 8 CNTL0 WR WR WR WR WR R/W R/W WR R/W R/W R/W CNTL1 RD RD PSEN RD RD E E RD DS DS E CNTL2 PSEN PSEN PC7 PD02 ADIO0 A0 A4 A0 A0 A0 A0 A0 PA3-PA0 (Note 1) A3-A0 (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) PA7-PA3 (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) ALE (Note 1) ALE (Note 1) (Note 1) ALE PSEN (Note 1) ALE (Note 1) (Note 1) ALE (Note 1) (Note 1) AS (Note 1) DBE AS (Note 1) (Note 1) (Note 1) A0 (Note 1) (Note 1) AS (Note 1) (Note 1) AS Note: 1. Unused CNTL2 pin can be configured as CPLD input. Other unused pins (PC7, PD0, PA3-0) can be configured for other I/O functions. 2. ALE/AS input is optional for MCUs with a non-multiplexed bus bs O let o Pr e du o (s) ct so Ob - (Note 1) (Note 1) ALE te le Pr A0 A0 A0 od D3-D0 uc s) t( D7-D4 D7-D4 (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) D3-D0 (Note 1) (Note 1) 44/111 PSD813F1A PSD Interface to a Multiplexed 8-Bit Bus Figure 21 shows an example of a system using a MCU with an 8-bit multiplexed bus and a PSD. The ADIO port on the PSD is connected directly to the MCU address/data bus. Address Strobe (ALE/AS, PD0) latches the address signals internally. Latched addresses can be brought out to Port A or B. The PSD drives the ADIO data bus only when one of its internal resources is accessed and Read Strobe (RD, CNTL1) is active. Should the system address bus exceed sixteen bits, Ports A, B, C, or D may be used as additional address inputs. Figure 21. An Example of a Typical 8-bit Multiplexed Bus Interface MCU AD [ 7:0] PSD PORT A A [ 7: 0] (OPTIONAL) A[ 15:8] ADIO PORT PORT B WR RD BHE WR (CNTRL0) RD (CNTRL1) BHE (CNTRL2) RST ALE ALE (PD0) A [ 15: 8] PORT C RESET bs O let o Pr e du o (s) ct so Ob - PORT D te le ro P uc d (OPTIONAL) s) t( AI02878C 45/111 PSD813F1A PSD Interface to a Non-Multiplexed 8-Bit Bus Figure 22 shows an example of a system using a microcontroller with an 8-bit non-multiplexed bus and a PSD. The address bus is connected to the ADIO Port, and the data bus is connected to Port A. Port A is in tri-state mode when the PSD is not accessed by the microcontroller. Should the system address bus exceed sixteen bits, Ports B, C, or D may be used for additional address inputs. Figure 22. An Example of a Typical 8-bit Non-Multiplexed Bus Interface MCU D [ 7:0] PSD PORT A D [ 7:0] ADIO PORT A [ 15:0] PORT B WR RD BHE WR (CNTRL0) RD (CNTRL1) BHE (CNTRL2) RST A[ 23:16] (OPTIONAL) PORT C ALE ALE (PD0) PORT D RESET bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( AI02879C 46/111 PSD813F1A Data Byte Enable Reference Microcontrollers have different data byte orientations. The following table shows how the PSD interprets byte/word operations in different bus WRITE configurations. Even-byte refers to locations with address A0 equal to zero and odd byte as locations with A0 equal to one. Table 16. Eight-Bit Data Bus BHE X X A0 0 1 D7-D0 Even Byte Odd Byte MCU Bus Interface Examples Figure 23 to 26 show examples of the basic connections between the PSD and some popular MCUs. The PSD Control input pins are labeled as to the MCU function for which they are configured. The MCU bus interface is specified using the PSDsoft Express Configuration. The first configuration is 80C31-compatible, and the bus interface to the PSD is identical to that shown in Figure 23. The second and third configurations have the same bus connection as shown in Table 17., page 48. There is only one READ input (PSEN) connected to the CNTL1 pin on the PSD. The A16 connection to the PA0 pin allows for a larger address input to the PSD. Configuration 4 is shown in Figure 24., page 49. The RD signal is connected to Cntl1 and the PSEN signal is connected to the CNTL2. 80C31 Figure 23 shows the bus interface for the 80C31, which has an 8-bit multiplexed address/data bus. The lower address byte is multiplexed with the data bus. The MCU control signals Program Select Enable (PSEN, CNTL2), Read Strobe (RD, CNTL1), and Write Strobe (WR, CNTL0) may be used for accessing the internal memory and I/O Ports. The ALE input (pin PD0) latches the address. Figure 23. Interfacing the PSD with an 80C31 80C31 31 19 18 9 EA/VP X1 X2 RESET bs O let o ro P e RESET INT0 INT1 T0 T1 P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 12 13 14 15 1 2 3 4 5 6 7 8 uc d P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 RD WR PSEN ALE/P TXD RXD P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 39 38 37 36 35 34 33 32 (s) t so Ob AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 te le 30 31 32 33 34 35 36 37 ro P uc d s) t( AD7-AD0 AD[ 7:0 ] PSD ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 29 28 27 25 24 23 22 21 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 21 22 23 24 25 26 27 28 17 16 29 30 11 10 A8 A9 A10 A11 A12 A13 A14 A15 RD WR PSEN ALE 39 40 41 42 43 44 45 46 ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 7 6 5 4 3 2 52 51 20 19 18 17 14 13 12 11 47 50 49 10 9 8 48 CNTL0 (WR) CNTL1(RD) CNTL2 (PSEN) PD0-ALE PD1 PD2 RESET RESET RESET AI02880C 47/111 PSD813F1A 80C251 The Intel 80C251 MCU features a user-configurable bus interface with four possible bus configurations, as shown in Table 18., page 49. The 80C251 has two major operating modes: Page Mode and Non-Page Mode. In Non-Page Mode, the data is multiplexed with the lower address byte, and ALE is active in every bus cycle. In Page Mode, data D[7:0] is multiplexed with address A[15:8]. In a bus cycle where there is a Page hit, the ALE signal is not active and only addresses A[7:0] are changing. The PSD supports both modes. In Page Mode, the PSD bus timing is identical to Non-Page Mode except the address hold time and setup time with respect to ALE is not required. The PSD access time is measured from address A[7:0] valid to data in valid. Table 17. Interfacing the PSD with the 80C251, with One READ Input 80C251SB 2 3 4 5 6 7 8 9 21 20 11 13 14 15 16 17 PSD P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 43 42 41 40 39 38 37 36 24 25 26 27 28 29 30 31 A0 A1 A2 A3 A4 A5 A6 A7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 A0 A1 A2 A3 A4 A5 A6 A7 30 31 32 33 34 35 36 37 P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 X1 X2 P3.0/RXD P3.1/TXD P3.2/INT0 P3.3/INT1 P3.4/T0 P3.5/T1 RST EA ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 RESET 10 ALE PSEN WR RD/A16 33 32 18 19 ALE RD WR A16 35 RESET RESET Note: 1. The A16 and A17 connections are optional. 2. In non-Page-Mode, AD7-AD0 connects to ADIO7-ADIO0. bs O let o ro P e du (s) ct Ob - so eP let 47 50 49 39 40 41 42 43 44 45 46 ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 ro uc d PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 s) t( 7 6 5 4 3 2 52 51 29 28 27 25 24 23 22 21 A161 A171 CNTL0 ( WR) CNTL1( RD) CNTL 2(PSEN) PD0-ALE PD1 PD2 RESET 10 9 8 20 19 18 17 14 13 12 11 48 AI02881C 48/111 PSD813F1A Figure 24. Interfacing the PSD with the 80C251, with RD and PSEN Inputs 80C251SB 2 3 4 5 6 7 8 9 21 20 11 13 14 15 16 17 PSD P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 43 42 41 40 39 38 37 36 24 25 26 27 28 29 30 31 A0 A1 A2 A3 A4 A5 A6 A7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 A0 A1 A2 A3 A4 A5 A6 A7 30 31 32 33 34 35 36 37 P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 X1 X2 P3.0/RXD P3.1/TXD P3.2/INT0 P3.3/INT1 P3.4/T0 P3.5/T1 RST EA ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 29 28 27 25 24 23 22 21 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 39 40 41 42 43 44 45 46 47 50 49 ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 CNTL0 ( WR) CNTL1( RD) CNTL 2(PSEN) PD0-ALE PD1 PD2 RESET 7 6 5 4 3 2 52 51 RESET 10 ALE PSEN WR RD/A16 33 32 18 19 ALE RD WR PSEN 35 10 9 8 RESET RESET 48 Table 18. 80C251 Configurations Configuration 80C251 READ/WRITE Pins WR RD PSEN WR PSEN only Connecting to PSD Pins CNTL0 CNTL1 CNTL2 1 2 3 4 bs O let o Pr e WR PSEN only WR RD PSEN du o (s) ct so Ob CNTL0 CNTL1 CNTL0 CNTL1 CNTL0 CNTL1 CNTL2 te le ro P uc d s) t( AI02882C PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 20 19 18 17 14 13 12 11 Page Mode Non-Page Mode, 80C31 compatible A7-A0 multiplex with D7-D0 Non-Page Mode A7-A0 multiplex with D7-D0 Page Mode A15-A8 multiplex with D7-D0 Page Mode A15-A8 multiplex with D7-D0 49/111 PSD813F1A 80C51XA The Philips 80C51XA microcontroller family supports an 8- or 16-bit multiplexed bus that can have burst cycles. Address bits (A3-A0) are not multiplexed, while (A19-A4) are multiplexed with data bits (D15-D0) in 16-bit mode. In 8-bit mode, (A11A4) are multiplexed with data bits (D7-D0). The 80C51XA can be configured to operate in eight-bit data mode. (shown in Figure 25). The 80C51XA improves bus throughput and performance by executing Burst cycles for code fetches. In Burst Mode, address A19-A4 are latched internally by the PSD, while the 80C51XA changes the A3-A0 lines to fetch up to 16 bytes of code. The PSD access time is then measured from address A3-A0 valid to data in valid. The PSD bus timing requirement in Burst Mode is identical to the normal bus cycle, except the address setup and hold time with respect to ALE does not apply. Figure 25. Interfacing the PSD with the 80C51X, 8-bit Data Bus 80C51XA 21 20 XTAL1 XTAL2 A0/WRH A1 A2 A3 A4D0 A5D1 A6D2 A7D3 A8D4 A9D5 A10D6 A11D7 A12D8 A13D9 A14D10 A15D11 A16D12 A17D13 A18D14 A19D15 2 3 4 5 43 42 41 40 39 38 37 36 24 25 26 27 28 29 30 31 A0 A1 A2 A3 A4D0 A5D1 A6D2 A7D3 A8D4 A9D5 A10D6 A11D7 A12 A13 A14 A15 A16 A17 A18 A19 A4D0 A5D1 A6D2 A7D3 A8D4 A9D5 A10D6 A11D7 30 31 32 33 34 35 36 37 PSD ADIO0 ADIO1 ADIO2 ADIO3 AD104 AD105 ADIO6 ADIO7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 29 28 27 25 24 23 22 21 11 13 6 7 RXD0 TXD0 RXD1 TXD1 9 8 16 T2EX T2 T0 RESET 10 14 15 RST INT0 INT1 A12 A13 A14 A15 A16 A17 A18 A19 35 17 EA/WAIT BUSW PSEN RD WRL ALE 32 19 18 33 PSEN bs O let o Pr e du o RESET ct (s) RD WR ALE so Ob - eP let 47 50 49 10 8 9 48 PD0-ALE PD1 PD2 RESET 39 ADIO8 40 ADIO9 41 ADIO10 42 ADIO11 43 AD1012 44 AD1013 45 ADIO14 46 ADIO15 ro uc d PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 s) t( A0 A1 A2 A3 7 6 5 4 3 2 52 51 CNTL0 (WR) CNTL1(RD) CNTL 2(PSEN) 20 19 18 17 14 13 12 11 AI02883C 50/111 PSD813F1A 68HC11 Figure 26 shows an interface to a 68HC11 where the PSD is configured in 8-bit multiplexed mode Figure 26. Interfacing the PSD with a 68HC11 AD7-AD0 AD7-AD0 with E and R/W settings. The DPLD can generate the READ and WR signals for external devices. PSD 68HC11 8 7 RESET 17 19 18 2 34 33 32 XT EX RESET IRQ XIRQ MODB PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 31 30 29 28 27 42 41 40 39 38 37 36 35 9 10 11 12 13 14 15 16 20 21 22 23 24 25 3 5 4 6 E AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 A8 A9 A10 A11 A12 A13 A14 A15 30 31 32 33 34 35 36 37 39 40 41 42 43 44 45 46 ADIO0 ADIO1 ADIO2 ADIO3 AD104 AD105 ADIO6 ADIO7 ADIO8 ADIO9 ADIO10 ADIO11 AD1012 AD1013 ADIO14 ADIO15 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 29 28 27 25 24 23 22 21 7 6 5 4 3 2 52 51 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 PD0 PD1 PD2 PD3 PD4 PD5 MODA 43 44 45 46 47 48 49 50 52 51 PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7 VRH VRL 47 50 49 CNTL0 (R _W) CNTL1(E) CNTL 2 bs O let o ro P e du ct E AS R/W (s) AS Ob - so te le 10 9 8 48 PD0 – AS PD1 PD2 RESET ro P uc d PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 s) t( 20 19 18 17 14 13 12 11 R/W RESET AI02884C 51/111 PSD813F1A I/O PORTS There are four programmable I/O ports: Ports A, B, C, and D. Each of the ports is eight bits except Port D, which is 3 bits. Each port pin is individually user configurable, thus allowing multiple functions per port. The ports are configured using PSDsoft Express Configuration or by the MCU writing to onchip registers in the CSIOP address space. The topics discussed in this section are: ■ General Port architecture ■ Port Operating Modes ■ Port Configuration Registers (PCR) ■ Port Data Registers ■ Individual Port Functionality. General Port Architecture The general architecture of the I/O Port is shown in Figure 27., page 53. Individual Port architectures are shown in Figure 29., page 60 to Figure 32., page 63. In general, once the purpose for a port pin has been defined, that pin will no longer be available for other purposes. Exceptions will be noted. As shown in Figure 27., page 53, the ports contain an output multiplexer whose selects are driven by the configuration bits in the Control Registers (Ports A and B only) and PSDsoft Express Configuration. Inputs to the multiplexer include the following: ■ Output data from the Data Out Register ■ Latched address outputs ■ CPLD Macrocell output ■ External Chip Select from CPLD. The Port Data Buffer (PDB) is a tri-state buffer that allows only one source at a time to be read. The PDB is connected to the Internal Data Bus for feedback and can be read by the microcontroller. The Data Out and Macrocell outputs, Direction and Control Registers, and port pin input are all connected to the PDB. The Port pin’s tri-state output driver enable is controlled by a two input OR gate whose inputs come from the CPLD AND array enable product term and the Direction Register. If the enable product term of any of the array outputs are not defined and that port pin is not defined as a CPLD output in the PSDabel file, then the Direction Register has sole control of the buffer that drives the port pin. The contents of these registers can be altered by the microcontroller. The PDB feedback path allows the microcontroller to check the contents of the registers. Ports A, B, and C have embedded Input Macrocells (IMCs). The IMCs can be configured as latches, registers, or direct inputs to the PLDs. The latches and registers are clocked by the address strobe (AS/ALE) or a product term from the PLD AND array. The outputs from the IMCs drive the PLD input bus and can be read by the microcontroller. See the section entitled Input Macrocell, page 42. Port Operating Modes The I/O Ports have several modes of operation. Some modes can be defined using PSDabel, some by the microcontroller writing to the Control Registers in CSIOP space, and some by both. The modes that can only be defined using PSDsoft Express must be programmed into the device and cannot be changed unless the device is reprogrammed. The modes that can be changed by the microcontroller can be done so dynamically at runtime. The PLD I/O, Data Port, Address Input, and Peripheral I/O modes are the only modes that must be defined before programming the device. All other modes can be changed by the microcontroller at run-time. Table 19., page 54 summarizes which modes are available on each port. Table 22., page 57 shows how and where the different modes are configured. Each of the port operating modes are described in the following subsections. bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 52/111 PSD813F1A Figure 27. General I/O Port Architecture DATA OUT REG. D WR ADDRESS ALE D G Q ADDRESS OUTPUT MUX PORT PIN Q DATA OUT MACROCELL OUTPUTS EXT CS INTERNAL DATA BUS READ MUX P D B DATA IN OUTPUT SELECT CONTROL REG. D WR DIR REG. D WR ENABLE PRODUCT TERM (.OE) Q Q ENABLE OUT CPLD-INPUT bs O let o Pr e du o (s) ct Ob - so te le ro P uc d s) t( INPUT MACROCELL AI02885 53/111 PSD813F1A MCU I/O Mode In the MCU I/O Mode, the microcontroller uses the PSD ports to expand its own I/O ports. By setting up the CSIOP space, the ports on the PSD are mapped into the microcontroller address space. The addresses of the ports are listed in Table 6., page 17. A port pin can be put into MCU I/O mode by writing a ‘0’ to the corresponding bit in the Control Register. The MCU I/O direction may be changed by writing to the corresponding bit in the Direction Register, or by the output enable product term. See the section entitled Peripheral I/O Mode, page 56. When the pin is configured as an output, the content of the Data Out Register drives the pin. When configured as an input, the microcontroller can read the port input through the Data In buffer. See Figure 27., page 53. Ports C and D do not have Control Registers, and are in MCU I/O mode by default. They can be used for PLD I/O if equation are written for them in PSDabel. PLD I/O Mode The PLD I/O Mode uses a port as an input to the CPLD’s Input Macrocells, and/or as an output from the CPLD’s Output Macrocells. The output can be tri-stated with a control signal. This output enable control signal can be defined by a product term Table 19. Port Operating Modes Port Mode MCU I/O PLD I/O McellAB Outputs McellBC Outputs Additional Ext. CS Outputs PLD Inputs Address Out Address In Data Port Yes Yes No No Yes Port A from the PLD, or by setting the corresponding bit in the Direction Register to ‘0.’ The corresponding bit in the Direction Register must not be set to ‘1’ if the pin is defined as a PLD input pin in PSDabel. The PLD I/O Mode is specified in PSDabel by declaring the port pins, and then writing an equation assigning the PLD I/O to a port. Address Out Mode For microcontrollers with a multiplexed address/ data bus, Address Out Mode can be used to drive latched addresses onto the port pins. These port pins can, in turn, drive external devices. Either the output enable or the corresponding bits of both the Direction Register and Control Register must be set to a ‘1’ for pins to use Address Out Mode. This must be done by the MCU at run-time. See Table 21., page 55 for the address output pin assignments on Ports A and B for various MCUs. For non-multiplexed 8-bit bus mode, address lines A7-A0 are available to Port B in Address Out Mode. Note: do not drive address lines with Address Out Mode to an external memory device if it is intended for the MCU to boot from the external device. The MCU must first boot from PSD memory so the Direction and Control register bits can be set. Yes bs O Peripheral I/O JTAG ISP let o Pr e Yes (A7-A0 Yes Yes (D7-D0) du o (s) ct so Ob Port B te le Yes No Yes No Yes No Yes No No Yes1 ro P uc d s) t( Port C Yes No No Yes Yes No Yes No No No Port D Yes Yes No Yes Yes (A7-A0) or (A15-A8) Yes No Yes No No No Note: 1. Can be multiplexed with other I/O functions. 54/111 PSD813F1A Table 20. Port Operating Mode Settings Mode Defined in PSDabel Defined in PSD Configuration Control Register Setting 0 N/A N/A 1 N/A N/A Direction Register Setting VM Register Setting JTAG Enable MCU I/O PLD I/O Data Port (Port A) Declare pins only Logic equations N/A N/A1 N/A Specify bus type N/A N/A N/A 1 = output, 0 = input N/A (Note 2) (Note 2) N/A 1 (Note 2) N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A Address Out (Port A,B) Declare pins only Address In (Port A,B,C,D) Peripheral I/O (Port A) JTAG ISP (Note 3) Logic equation for Input Macrocells Logic equations (PSEL0 & 1) JTAGSEL PIO bit = 1 N/A N/A JTAG_Enable JTAG Configuration N/A Note: 1. N/A = Not Applicable 2. The direction of the Port A,B,C, and D pins are controlled by the Direction Register ORed with the individual output enable product term (.oe) from the CPLD AND Array. 3. Any of these three methods enables the JTAG pins on Port C. Table 21. I/O Port Latched Address Output Assignments MCU 8051XA (8-Bit) 80C251 (Page Mode) All Other 8-Bit Multiplexed 8-Bit Non-Multiplexed Bus Port A (PA3-PA0) N/A1 N/A Address A3-A0 N/A Port A (PA7-PA4) Address a7-a4 N/A Address A11-A8 Address A7-A4 Note: 1. N/A = Not Applicable. bs O let o ro P e uc d (s) t N/A Ob - so Address A11-A8 te le Port B (PB3-PB0) ro P uc d N/A s) t( Port B (PB7-PB4) Address A15-A12 Address A7-A4 Address A7-A4 Address A3-A0 Address A3-A0 55/111 PSD813F1A Address In Mode For microcontrollers that have more than 16 address lines, the higher addresses can be connected to Port A, B, C, and D. The address input can be latched in the Input Macrocell by the address strobe (ALE/AS). Any input that is included in the DPLD equations for the PLD’s Flash, EEPROM, or SRAM is considered to be an address input. Data Port Mode Port A can be used as a data bus port for a microcontroller with a non-multiplexed address/data bus. The Data Port is connected to the data bus of the microcontroller. The general I/O functions are disabled in Port A if the port is configured as a Data Port. Figure 28. Peripheral I/O Mode RD PSEL0 PSEL PSEL1 D0 - D7 DATA BUS Peripheral I/O Mode Peripheral I/O Mode can be used to interface with external peripherals. In this mode, all of Port A serves as a tri-stateable, bi-directional data buffer for the microcontroller. Peripheral I/O Mode is enabled by setting Bit 7 of the VM Register to a ‘1.’ Figure 28 shows how Port A acts as a bi-directional buffer for the microcontroller data bus if Peripheral I/O Mode is enabled. An equation for PSEL0 and/or PSEL1 must be written in PSDabel. The buffer is tri-stated when PSEL 0 or PSEL1 is not active. VM REGISTER BIT 7 WR bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( PA0 - PA7 AI02886 56/111 PSD813F1A JTAG In-System Programming (ISP) Port C is JTAG compliant, and can be used for InSystem Programming (ISP). You can multiplex JTAG operations with other functions on Port C because ISP is not performed during normal system operation. For more information on the JTAG Port, see the section entitled PROGRAMMING INCIRCUIT USING THE JTAG SERIAL INTERFACE, page 71. Port Configuration Registers (PCR) Each Port has a set of Port Configuration Registers (PCR) used for configuration. The contents of the registers can be accessed by the MCU through normal READ/WRITE bus cycles at the addresses given in Table 6., page 17. The addresses in Table 6., page 17 are the offsets in hexadecimal from the base of the CSIOP register. The pins of a port are individually configurable and each bit in the register controls its respective pin. For example, Bit 0 in a register refers to Bit 0 of its port. The three Port Configuration Registers (PCR), shown in Table 22, are used for setting the Port configurations. The default Power-up state for each register in Table 22 is 00h. Control Register Any bit reset to ‘0’ in the Control Register sets the corresponding port pin to MCU I/O Mode, and a ‘1’ sets it to Address Out Mode. The default mode is MCU I/O. Only Ports A and B have an associated Control Register. Table 22. Port Configuration Registers (PCR) Register Name Control Direction Drive Select1 A,B A,B,C,D A,B,C,D Port MCU Access WRITE/READ Note: 1. See Table 26., page 58 for Drive Register bit definition. bs O let o Pr e du o (s) ct so Ob - te le ro P uc d WRITE/READ WRITE/READ s) t( 57/111 PSD813F1A Direction Register The Direction Register, in conjunction with the output enable (except for Port D), controls the direction of data flow in the I/O Ports. Any bit set to ‘1’ in the Direction Register will cause the corresponding pin to be an output, and any bit set to ‘0’ will cause it to be an input. The default mode for all port pins is input. Figure 29., page 60 and Figure 30., page 61 show the Port Architecture diagrams for Ports A/B and C, respectively. The direction of data flow for Ports A, B, and C are controlled not only by the direction register, but also by the output enable product term from the PLD AND array. If the output enable product term is not active, the Direction Register has sole control of a given pin’s direction. An example of a configuration for a port with the three least significant bits set to output and the remainder set to input is shown in Table 25. Since Port D only contains three pins (shown in Figure 32., page 63), the Direction Register for Port D has only the three least significant bits active. Drive Select Register The Drive Select Register configures the pin driver as Open Drain or CMOS for some port pins, and controls the slew rate for the other port pins. An external pull-up resistor should be used for pins configured as Open Drain. A pin can be configured as Open Drain if its corresponding bit in the Drive Select Register is set to a ‘1.’ The default pin drive is CMOS. Aside: the slew rate is a measurement of the rise and fall times of an output. A higher slew rate means a faster output response and may create Table 26. Drive Register Pin Assignment Drive Register Port A Port B Bit 7 Open Drain more electrical noise. A pin operates in a high slew rate when the corresponding bit in the Drive Register is set to ‘1.’ The default rate is slow slew. Table 26 shows the Drive Register for Ports A, B, C, and D. It summarizes which pins can be configured as Open Drain outputs and which pins the slew rate can be set for. Table 23. Port Pin Direction Control, Output Enable P.T. Not Defined Direction Register Bit 0 1 Input Output Port Pin Mode Table 24. Port Pin Direction Control, Output Enable P.T. Defined Direction Register Bit 0 0 1 1 Output Enable P.T. 0 1 bs O Port C Port D let o NA1 Open Drain Pr e Open Drain du o Bit 6 (s) ct Bit 5 so Ob Bit 7 0 0 Bit 4 Slew Rate Slew Rate Open Drain NA1 Table 25. Port Direction Assignment Example Bit 6 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 1 Bit 1 1 Bit 0 1 te le 1 0 ro P uc d Input Port Pin Mode s) t( Output Output Output Bit 3 Bit 2 Slew Rate Slew Rate Open Drain Slew Rate Bit 1 Slew Rate Slew Rate Open Drain Slew Rate Bit 0 Slew Rate Slew Rate Open Drain Slew Rate Open Drain Open Drain Open Drain Open Drain Open Drain Open Drain NA1 Open Drain Open Drain Open Drain NA1 NA1 Note: 1. NA = Not Applicable. 58/111 PSD813F1A Port Data Registers The Port Data Registers, shown in Table 27, are used by the MCU to write data to or read data from the ports. Table 27 shows the register name, the ports having each register type, and MCU access for each register type. The registers are described below. Data In Port pins are connected directly to the Data In buffer. In MCU I/O input mode, the pin input is read through the Data In buffer. Data Out Register Stores output data written by the MCU in the MCU I/O output mode. The contents of the Register are driven out to the pins if the Direction Register or the output enable product term is set to ‘1.’ The contents of the register can also be read back by the MCU. Output Macrocells (OMC) The CPLD Output Macrocells (OMC) occupy a location in the microcontroller’s address space. The microcontroller can read the output of the OMCs. If the Mask Macrocell Register bits are not set, writing to the Macrocell loads data to the Macrocell flip flops. See the section entitled PLD’S, page 34. Mask Macrocell Register Each Mask Register bit corresponds to an OMC flip flop. When the Mask Register bit is set to a “1”, loading data into the OMC flip flop is blocked. The default value is “0” or unblocked. Input Macrocells (IMC) The IMCs can be used to latch or store external inputs. The outputs of the IMCs are routed to the PLD input bus, and can be read by the microcontroller. Refer to the section entitled PLD’S, page 34 for a detailed description. Table 27. Port Data Registers Register Name Data In Data Out Output Macrocell Mask Macrocell Input Macrocell Enable Out Port A,B,C,D A,B,C,D A,B,C A,B,C A,B,C READ – input on pin WRITE/READ MCU Access READ – outputs of macrocells WRITE – loading macrocell flip-flop WRITE/READ – prevents loading into a given macrocell READ – outputs of the Input Macrocells READ – the output enable control of the port driver bs O let o Pr e du o (s) ct A,B,C so Ob - te le ro P uc d s) t( 59/111 PSD813F1A Enable Out The Enable Out register can be read by the microcontroller. It contains the output enable values for a given port. A ‘1’ indicates the driver is in output mode. A ‘0’ indicates the driver is in tri-state and the pin is in input mode. Ports A and B – Functionality and Structure Ports A and B have similar functionality and structure, as shown in Figure 29. The two ports can be configured to perform one or more of the following functions: ■ MCU I/O Mode ■ CPLD Output – Macrocells McellAB7McellAB0 can be connected to Port A or Port B. McellBC7-McellBC0 can be connected to Port B or Port C. Figure 29. Port A and Port B Structure DATA OUT REG. D WR ADDRESS ALE D G Q ADDRESS A[ 7:0] OR A[15:8] OUTPUT MUX Q ■ ■ ■ ■ ■ ■ ■ CPLD Input – Via the Input Macrocells (IMC). Latched Address output – Provide latched address output as per Table 21., page 55. Address In – Additional high address inputs using the Input Macrocells (IMC). Open Drain/Slew Rate – pins PA3-PA0 and PB3-PB0 can be configured to fast slew rate, pins PA7-PA4 and PB7-PB4 can be configured to Open Drain Mode. Data Port – Port A to D7-D0 for 8 bit nonmultiplexed bus Multiplexed Address/Data port for certain types of MCU bus interfaces. Peripheral Mode – Port A only DATA OUT MACROCELL OUTPUTS READ MUX P D B CONTROL REG. D WR Q INTERNAL DATA BUS DIR REG. bs O let o od Pr e WR ENABLE PRODUCT TERM (.OE) INPUT MACROCELL ct u D Q (s) Ob - DATA IN so OUTPUT SELECT te le ro P uc d s) t( PORT A OR B PIN ENABLE OUT CPLD - INPUT AI02887 60/111 PSD813F1A Port C – Functionality and Structure Port C can be configured to perform one or more of the following functions (see Figure 30): ■ MCU I/O Mode ■ CPLD Output – McellBC7-McellBC0 outputs can be connected to Port B or Port C. ■ CPLD Input – via the Input Macrocells (IMC) ■ Address In – Additional high address inputs using the Input Macrocells (IMC). ■ In-System Programming (ISP) – JTAG port can be enabled for programming/erase of the Figure 30. Port C Structure DATA OUT REG. D WR 1 SPECIAL FUNCTION PORT C PIN OUTPUT MUX Q DATA OUT PSD device. (See the section entitled PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE, page 71, for more information on JTAG programming.) ■ Open Drain – Port C pins can be configured in Open Drain Mode Port C does not support Address Out mode, and therefore no Control Register is required. Pin PC7 may be configured as the DBE input in certain MCU interfaces. MCELLBC[ 7:0] READ MUX INTERNAL DATA BUS P D B DATA IN OUTPUT SELECT DIR REG. D WR ENABLE PRODUCT TERM (.OE) Q Note: 1. ISP. bs O let o Pr e du o CPLD - INPUT ct (s) so Ob - te le ro P uc d s) t( ENABLE OUT INPUT MACROCELL 1 SPECIAL FUNCTION CONFIGURATION AI02888B BIT 61/111 PSD813F1A Port D – Functionality and Structure Port D has three I/O pins. See Figure 31 and Figure 32., page 63. This port does not support Address Out mode, and therefore no Control Register is required. Port D can be configured to perform one or more of the following functions: ■ MCU I/O Mode ■ CPLD Output – External Chip Select (ECS0ECS2) ■ CPLD Input – direct input to the CPLD, no Input Macrocells (IMC) ■ Slew rate – pins can be set up for fast slew rate Figure 31. Port D Structure DATA OUT REG. DATA OUT D WR Q Port D pins can be configured in PSDsoft Express as input pins for other dedicated functions: ■ PD0 – ALE, as address strobe input ■ PD1 – CLKIN, as clock input to the macrocells flip-flops and APD counter ■ PD2 – CSI, as active Low chip select input. A High input will disable the Flash memory, EEPROM, SRAM and CSIOP. PORT D PIN OUTPUT MUX ECS[ 2:0] READ MUX INTERNAL DATA BUS P D B DIR REG. D WR Q bs O let o Pr e du o (s) ct so Ob DATA IN OUTPUT SELECT te le ro P uc d s) t( ENABLE PRODUCT TERM (.OE) CPLD-INPUT AI02889 62/111 PSD813F1A External Chip Select The CPLD also provides three External Chip Select (ECS0-ECS2) outputs on Port D pins that can be used to select external devices. Each External Chip Select (ECS0-ECS2) consists of one product Figure 32. Port D External Chip Select Signals term that can be configured active High or Low. The output enable of the pin is controlled by either the output enable product term or the Direction Register. (See Figure 32.) ENABLE (.OE) DIRECTION REGISTER PT0 ECS0 POLARITY BIT ENABLE (.OE) DIRECTION REGISTER PD0 PIN CPLD AND ARRAY PLD INPUT BUS PT1 ECS1 POLARITY BIT ENABLE (.OE) PD1 PIN PT2 POLARITY BIT bs O let o Pr e du o (s) ct so Ob - te le DIRECTION REGISTER ro P PD2 PIN uc d s) t( ECS2 AI02890 63/111 PSD813F1A POWER MANAGEMENT The PSD offers configurable power saving options. These options may be used individually or in combinations, as follows: – All memory types in a PSD (Flash, EEPROM, and SRAM) are built with Zero-Power technology. In addition to using special silicon design methodology, Zero-Power technology puts the memories into standby mode when address/data inputs are not changing (zero DC current). As soon as a transition occurs on an input, the affected memory “wakes up”, changes and latches its outputs, then goes back to standby. The designer does not have to do anything special to achieve memory standby mode when no inputs are changing— it happens automatically. The PLD sections can also achieve standby mode when its inputs are not changing, as described in the section entitled PLD Power Management, page 66. – Like the Zero-Power feature, the Automatic Power Down (APD) logic allows the PSD to reduce to standby current automatically. The APD will block MCU address/data signals from reaching the memories and PLDs. This feature is available on all PSD devices. The APD Unit is described in more detail in the sections entitled Automatic Power-down (APD) Unit and Power-down Mode, page 65. Built in logic will monitor the address strobe of the MCU for activity. If there is no activity for a certain time period (MCU is asleep), the APD logic initiates Power Down Mode (if enabled). Once in Power Down Mode, all address/data signals are blocked from reaching PSD memories and PLDs, and the memories are deselected internally. This allows the memories and PLDs to remain in standby mode even if the address/data lines are changing state externally (noise, other devices on the MCU bus, etc.). Keep in mind that any unblocked PLD input signals that are changing states keeps the PLD out of standby mode, but not the memories. The PSD Chip Select Input (CSI) on all families can be used to disable the internal memories, placing them in standby mode even if inputs are changing. This feature does not block any internal signals or disable the PLDs. This is a good alternative to using the APD logic, especially if your MCU has a chip select output. There is a slight penalty in memory access time when the CSI signal makes its initial transition from deselected to selected. The PMMR registers can be written by the MCU at run-time to manage power. PSD supports “blocking bits” in these registers that are set to block designated signals from reaching both PLDs. Current consumption of the PLDs is directly related to the composite frequency of the changes on their inputs (see Figure 36., page 73 and Figure 37., page 73). Significant power savings can be achieved by blocking signals that are not used in DPLD or CPLD logic equations. The PSD has a Turbo Bit in the PMMR0 register. This bit can be set to disable the Turbo Mode feature (default is Turbo Mode on). While Turbo Mode is disabled, the PLDs can achieve standby current when no PLD inputs are changing (zero DC current). Even when inputs do change, significant power can be saved at lower frequencies (AC current), compared to when Turbo Mode is enabled. When the Turbo Mode is enabled, there is a significant DC current component and the AC component is higher. – – bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 64/111 PSD813F1A Automatic Power-down (APD) Unit and Power-down Mode The APD Unit, shown in Figure 33, puts the PSD setting the appropriate bits in the PMMR into Power-down mode by monitoring the activity registers. The blocked signals include MCU of Address Strobe (ALE/AS, PD0). If the APD Unit control signals and the common clock is enabled, as soon as activity on Address Strobe (CLKIN). Note that blocking CLKIN from the (ALE/AS, PD0) stops, a four bit counter starts PLDs will not block CLKIN from the APD unit. counting. If Address Strobe (ALE/AS, PD0) re– All PSD memories enter standby mode and mains inactive for fifteen clock periods of CLKIN are drawing standby current. However, the (PD1), the Power-down (PDN) signal becomes acPLDs and I/O ports do not go into standby tive, and the PSD enters Power-down mode, as mode because you don’t want to have to wait discussed next. for the logic and I/O to “wake-up” before their Power-down Mode outputs can change. See Table 28 for Power Down Mode effects on PSD ports. By default, if you enable the PSD APD unit, Power Down Mode is automatically enabled. The device – Typical standby current are of the order of the will enter Power Down Mode if the address strobe microampere (see Table 29). These standby (ALE/AS) remains inactive for fifteen CLKIN (pin current values assume that there are no PD1) clock periods. transitions on any PLD input. The following should be kept in mind when the PSD is in Power Down Mode: Table 28. Power-down Mode’s Effect on Ports – If the address strobe starts pulsing again, the Port Function Pin Level PSD will return to normal operation. The PSD MCU I/O No Change will also return to normal operation if either the CSI input returns low or the Reset input PLD Out No Change returns high. Address Out Undefined – The MCU address/data bus is blocked from all memories and PLDs. Data Port Tri-State – Various signals can be blocked (prior to Power Peripheral I/O Tri-State Down Mode) from entering the PLDs by Figure 33. APD Unit APD EN PMMR0 BIT 1=1 TRANSITION DETECTION ALE O bs let o Pr e RESET CSI CLKIN od uc (s) t so Ob CLR PD APD COUNTER PD te le ro P uc d s) t( DISABLE BUS INTERFACE EEPROM SELECT FLASH SELECT PLD SRAM SELECT POWER DOWN (PDN) SELECT EDGE DETECT DISABLE FLASH/EEPROM/SRAM AI02891 Table 29. PSD Timing and Standby Current during Power-down Mode Mode Power-down PLD Propagation Delay Normal tPD(1) Memory Access Time No Access Access Recovery Time to Normal Access tLVDV Typical Standby Current 5V VCC 50µA(2) 3V VCC 25µA(2) Note: 1. Power-down does not affect the operation of the PLD. The PLD operation in this mode is based only on the Turbo bit. 2. Typical current consumption assuming no PLD inputs are changing state and the PLD Turbo bit is 0. 65/111 PSD813F1A For Users of the HC11 (or compatible) The HC11 turns off its E clock when it sleeps. Therefore, if you are using an HC11 (or compatible) in your design, and you wish to use the Power-down mode, you must not connect the E clock to CLKIN (PD1). You should instead connect an independent clock signal to the CLKIN input (PD1). The clock frequency must be less than 15 times the frequency of AS. The reason for this is that if the frequency is greater than 15 times the frequency of AS, the PSD will keep going into Power-down mode. Other Power Saving Options The PSD offers other reduced power saving options that are independent of the Power-down mode. Except for the SRAM Standby and Chip Select Input (CSI, PD2) features, they are enabled by setting bits in the PMMR0 and PMMR2 registers. PLD Power Management The power and speed of the PLDs are controlled by the Turbo bit (bit 3) in the PMMR0. By setting the bit to ‘1’, the Turbo mode is disabled and the PLDs consume Zero Power current when the inputs are not switching for an extended time of 70ns. The propagation delay time will be increased by 10ns after the Turbo bit is set to ‘1’ (turned off) when the inputs change at a composite frequency of less than 15 MHz. When the Turbo bit is set to a ‘0’ (turned on), the PLDs run at full power and speed. The Turbo bit affects the PLD’s D.C. power, AC power, and propagation delay. Note: Blocking MCU control signals with PMMR2 bits can further reduce PLD AC power consumption. PSD Chip Select Input (CSI, PD2) Pin PD2 of Port D can be configured in PSDsoft Express as the CSI input. When low, the signal selects and enables the internal Flash, EEPROM, SRAM, and I/O for READ or WRITE operations involving the PSD. A high on the CSI pin will disable the Flash memory, EEPROM, and SRAM, and reduce the PSD power consumption. However, the PLD and I/O pins remain operational when CSI is High. Note: There may be a timing penalty when using the CSI pin depending on the speed grade of the PSD that you are using. See the timing parameter tSLQV in Table 63., page 95 or Table 64., page 95. Input Clock The PSD provides the option to turn off the CLKIN input to the PLD to save AC power consumption. The CLKIN is an input to the PLD AND array and the Output Macrocells. During Power Down Mode, or, if the CLKIN input is not being used as part of the PLD logic equation, the clock should be disabled to save AC power. The CLKIN will be disconnected from the PLD AND array or the Macrocells by setting bits 4 or 5 to a ‘1’ in PMMR0. Figure 34. Enable Power-down Flow Chart RESET Enable APD Set PMMR0 Bit 1 = 1 bs O let o od Pr e ct u (s) so Ob - te le No OPTIONAL Disable desired inputs to PLD by setting PMMR0 bits 4 and 5 and PMMR2 bits 2 through 6. ro P uc d s) t( ALE/AS idle for 15 CLKIN clocks? Yes PSD in Power Down Mode AI02892 66/111 PSD813F1A Table 30. Power Management Mode Registers PMMR0 (Note 1) Bit 0 Bit 1 Bit 2 Bit 3 X APD Enable 1 = on Automatic Power-down (APD) is enabled. X PLD Turbo 1 = off PLD Turbo mode is off, saving power. 0 = on Bit 4 PLD Array clk CLKIN (PD1) input to the PLD AND Array is connected. Every change of CLKIN (PD1) Powers-up the PLD when Turbo bit is 0. 0 Not used, and should be set to zero. 0 Not used, and should be set to zero. 0 = off Automatic Power-down (APD) is disabled. 0 = on PLD Turbo mode is on 1 = off CLKIN (PD1) input to PLD AND Array is disconnected, saving power. 0 = on CLKIN (PD1) input to the PLD macrocells is connected. Bit 5 Bit 6 Bit 7 PLD MCell clk 1 = off CLKIN (PD1) input to PLD macrocells is disconnected, saving power. X X 0 0 Not used, and should be set to zero. Not used, and should be set to zero. Note: 1. The bits of this register are cleared to zero following Power-up. Subsequent Reset (RESET) pulses do not clear the registers. Table 31. Power Management Mode Registers PMMR2 (Note 1) Bit 0 Bit 1 Bit 2 X X PLD Array CNTL0 PLD Array CNTL1 PLD Array CNTL2 PLD Array ALE PLD Array DBE 0 0 Not used, and should be set to zero. Not used, and should be set to zero. 0 = on Cntl0 input to the PLD AND Array is connected. 1 = off Cntl0 input to PLD AND Array is disconnected, saving power. 0 = on Cntl1 input to the PLD AND Array is connected. 1 = off Cntl1 input to PLD AND Array is disconnected, saving power. 0 = on Cntl2 input to the PLD AND Array is connected. 1 = off Cntl2 input to PLD AND Array is disconnected, saving power. 0 = on ALE input to the PLD AND Array is connected. 1 = off ALE input to PLD AND Array is disconnected, saving power. 0 = on DBE input to the PLD AND Array is connected. 1 = off DBE input to PLD AND Array is disconnected, saving power. 0 Not used, and should be set to zero. Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 bs O Note: 1. The bits of this register are cleared to zero following Power-up. Subsequent Reset (RESET) pulses do not clear the registers. let o X Pr e du o (s) ct so Ob - te le ro P uc d s) t( 67/111 PSD813F1A Input Control Signals The PSD provides the option to turn off the input control signals (CNTL0, CNTL1, CNTL2, ALE, and DBE) to the PLD to save AC power consumption. These control signals are inputs to the PLD AND array. During Power Down Mode, or, if any of them are not being used as part of the PLD logic equation, these control signals should be disabled to save AC power. They will be disconnected from the PLD AND array by setting bits 2, 3, 4, 5, and 6 to a ‘1’ in the PMMR2. Table 32. APD Counter Operation APD Enable Bit 0 1 1 1 ALE PD Polarity X X 1 0 ALE Level X Pulsing 1 0 Not Counting Not Counting Counting (Generates PDN after 15 Clocks) Counting (Generates PDN after 15 Clocks) APD Counter bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 68/111 PSD813F1A RESET TIMING AND DEVICE STATUS AT RESET Power-On Reset Upon Power-up, the PSD requires a Reset (RESET) pulse of duration tNLNH-PO (See Tables 67 and 68 for values) after VCC is steady. During this period, the device loads internal configurations, clears some of the registers and sets the Flash memory or EEPROM into Operating mode. After the rising edge of Reset (RESET), the PSD remains in the Reset mode for an additional period, tOPR (See Tables 67 and 68 for values), before the first memory access is allowed. The PSD Flash or EEPROM memory is reset to the READ mode upon power up. The FSi and EESi select signals along with the write strobe signal must be in the false state during power-up reset for maximum security of the data contents and to remove the possibility of a byte being written on the first edge of a write strobe signal. The PSD automatically prevents write strobes from reaching the EEPROM memory array for about 5ms (tEEHWL). Any Flash memory WRITE cycle initiation is prevented automatically when VCC is below VLKO. Figure 35. Reset (RESET) Timing Warm Reset Once the device is up and running, the device can be reset with a much shorter pulse of tNLNH (See Tables 67 and 68 for values). The same tOPR time is needed before the device is operational after warm reset. Figure 35 shows the timing of the power on and warm reset. I/O Pin, Register and PLD Status at Reset Table 33., page 70 shows the I/O pin, register and PLD status during Power On Reset, Warm reset and Power-down mode. PLD outputs are always valid during warm reset, and they are valid in Power On Reset once the internal PSD Configuration bits are loaded. This loading of PSD is completed typically long before the VCC ramps up to operating level. Once the PLD is active, the state of the outputs are determined by the PSDabel equations. VCC VCC(min) tNLNH-PO Power-On Reset tOPR RESET bs O let o Pr e du o (s) ct Ob - so te le ro P tNLNH tNLNH-A Warm Reset uc d s) t( tOPR AI02866b 69/111 PSD813F1A Table 33. Status During Power-On Reset, Warm Reset and Power-down Mode Port Configuration MCU I/O PLD Output Address Out Data Port Peripheral I/O Power-On Reset Input mode Valid after internal PSD configuration bits are loaded Tri-stated Tri-stated Tri-stated Warm Reset Input mode Valid Tri-stated Tri-stated Tri-stated Power-down Mode Unchanged Depends on inputs to PLD (addresses are blocked in PD mode) Not defined Tri-stated Tri-stated Register PMMR0 and PMMR2 Macrocells flip-flop status Power-On Reset Cleared to ‘0’ Cleared to ‘0’ by internal Power-On Reset Initialized, based on the selection in PSDsoft Express Configuration menu Cleared to ‘0’ Warm Reset Unchanged Depends on .re and .pr equations Initialized, based on the selection in PSDsoft Express Configuration menu Cleared to ‘0’ Power-down Mode Unchanged Depends on .re and .pr equations VM Register1 Unchanged All other registers Note: 1. The SR_cod and PeriphMode bits in the VM Register are always cleared to ‘0’ on Power-On Reset or Warm Reset. bs O let o Pr e du o (s) ct so Ob - te le ro P Unchanged uc d s) t( 70/111 PSD813F1A PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE The JTAG interface on the PSD can be enabled on Port C (see Table 34., page 72). All memory (Flash and EEPROM), PLD logic, and PSD configuration bits may be programmed through the JTAG interface. A blank part can be mounted on a printed circuit board and programmed using JTAG. The standard JTAG signals (IEEE 1149.1) are TMS, TCK, TDI, and TDO. Two additional signals, TSTAT and TERR, are optional JTAG extensions used to speed up program and erase operations. Note: By default, on a blank PSD (as shipped from factory or after erasure), four pins on Port C are enabled for the basic JTAG signals TMS, TCK, TDI, and TDO. Standard JTAG Signals The standard JTAG signals (TMS, TCK, TDI, and TDO) can be enabled by any of three different conditions that are logically ORed. When enabled, TDI, TDO, TCK, and TMS are inputs, waiting for a serial command from an external JTAG controller device (such as FlashLink or Automated Test Equipment). When the enabling command is received from the external JTAG controller, TDO becomes an output and the JTAG channel is fully functional inside the PSD. The same command that enables the JTAG channel may optionally enable the two additional JTAG pins, TSTAT and TERR. The following symbolic logic equation specifies the conditions enabling the four basic JTAG pins (TMS, TCK, TDI, and TDO) on their respective Port C pins. For purposes of discussion, the logic label JTAG_ON will be used. When JTAG_ON is true, the four pins are enabled for JTAG. When JTAG_ON is false, the four pins can be used for general PSD I/O. JTAG_ON = PSDsoft_enabled + /* An NVM configuration bit inside the PSD is set by the designer in the PSDsoft Express Configuration utility. This dedicates the pins for JTAG at all times (compliant with IEEE 1149.1) */ Microcontroller_enabled + /* The microcontroller can set a bit at runtime by writing to the PSD register, JTAG Enable. This register is located at address CSIOP + offset C7h. Setting the JTAG_ENABLE bit in this register will enable the pins for JTAG use. This bit is cleared by a PSD reset or the microcontroller. See Table 35., page 72 for bit definition. */ PSD_product_term_enabled; /* A dedicated product term (PT) inside the PSD can be used to enable the JTAG pins. This PT has the reserved name JTAGSEL. Once defined as a node in PSDabel, the designer can write an equation for JTAGSEL. This method is used when the Port C JTAG pins are multiplexed with other I/O signals. It is recommended to logically tie the node JTAGSEL to the JEN\ signal on the Flashlink cable when multiplexing JTAG signals. (AN1153) The PSD supports JTAG In-System-Configuration (ISC) commands, but not Boundary Scan. A definition of these JTAG-ISC commands and sequences are defined in a supplemental document available from ST. ST’s PSDsoft Express software tool and FlashLink JTAG programming cable implement these JTAG-ISC commands. This document is needed only as a reference for designers who use a FlashLink to program their PSD. bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 71/111 PSD813F1A JTAG Extensions TSTAT and TERR are two JTAG extension signals enabled by an “ISC_ENABLE” command received over the four standard JTAG pins (TMS, TCK, TDI, and TDO). They are used to speed programming and erase functions by indicating status on PSD pins instead of having to scan the status out serially using the standard JTAG channel. TERR will indicate if an error has occurred when erasing a sector or programming a byte in Flash memory. This signal will go Low (active) when an error condition occurs, and stay Low until an “ISC_CLEAR” command is executed or a chip reset pulse is received after an “ISC-DISABLE” command. TERR does not apply to EEPROM. TSTAT behaves the same as the Ready/Busy signal described in the section entitled Ready/Busy Pin (PC3), page 18. TSTAT will be High when the PSD device is in READ mode (Flash memory and EEPROM contents can be read). TSTAT will be Low when Flash memory programming or erase cycles are in progress, and also when data is being written to EEPROM. TSTAT and TERR can be configured as opendrain type signals during an “ISC_ENABLE” command. This facilitates a wired-OR connection of TSTAT signals from several PSD devices and a wired-OR connection of TERR signals from those same devices. This is useful when several PSD devices are “chained” together in a JTAG environment. Security, Flash memory and EEPROM Protection When the security bit is set, the device cannot be read on a device programmer or through the JTAG Port. When using the JTAG Port, only a full chip erase command is allowed. All other program/ erase/verify commands are blocked. Full chip erase returns the part to a non-secured blank state. The Security Bit can be set in PSDsoft Express Configuration. All Flash Memory and EEPROM sectors can individually be sector protected against erasures. The sector protect bits can be set in PSDsoft Express Configuration. Table 34. JTAG Port Signals Port C Pin PC0 PC1 PC3 PC4 PC5 PC6 JTAG Signals TMS TCK TSTAT TERR TDI Description Mode Select Clock INITIAL DELIVERY STATE When delivered from ST, the PSD device has all bits in the memory and PLDs set to '1.' The PSD Configuration Register bits are set to '0.' The code, configuration, and PLD logic are loaded using the Table 35. JTAG Enable Register Bit 0 bs O Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Bit 1 let o X X X X X X X JTAG_Enable Pr e 0 0 0 0 0 0 0 du o (s) ct so Ob - te le TDO ro P uc d Status s) t( Error Flag Serial Data In Serial Data Out programming procedure. Information for programming the device is available directly from ST. Please contact your local sales representative. 0 = off JTAG port is disabled. 1 = on JTAG port is enabled. Not used, and should be set to zero. Not used, and should be set to zero. Not used, and should be set to zero. Not used, and should be set to zero. Not used, and should be set to zero. Not used, and should be set to zero. Not used, and should be set to zero. Note: The state of Reset (RESET) does not interrupt (or prevent) JTAG operations if the JTAG signals are dedicated by an NVM Configuration bit (via PSDsoft Express). However, Reset (RESET) prevents or interrupts JTAG operations if the JTAG enable register is used to enable the JTAG signals. 72/111 PSD813F1A AC/DC PARAMETERS The following tables describe the AD and DC parameters of the PSD: ■ DC Electrical Specification ■ AC Timing Specification PLD Timing – Combinatorial Timing – Synchronous Clock Mode – Asynchronous Clock Mode – Input Macrocell Timing MCU Timing – READ Timing – WRITE Timing – Peripheral Mode Timing – Power-down and Reset Timing The following are issues concerning the parameters presented: ■ In the DC specification the supply current is given for different modes of operation. Before calculating the total power consumption, determine the percentage of time that the PSD is in each mode. Also, the supply power is considerably different if the Turbo bit is ‘0.’ ■ The AC power component gives the PLD, EEPROM and SRAM mA/MHz specification. Figures 36 and 37 show the PLD mA/MHz as a function of the number of Product Terms (PT) used. ■ In the PLD timing parameters, add the required delay when Turbo bit is ‘0.' Figure 36. PLD ICC /Frequency Consumption (5V range) 110 100 90 80 ICC – (mA) 70 FF O TUR BO VCC = 5V O 00 N (1 %) 60 TU RB 50 40 30 20 10 0 0 Figure 37. PLD ICC /Frequency Consumption (3V range) 60 50 40 TU 20 10 RB O ICC – (mA) FF bs let o Pr e 30 du o VCC = 3V HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz) (s) ct T 5 B UR O OF F so Ob 15 T O O URB te le ON (25% ) ro P uc d s) t( PT 100% PT 25% 10 20 25 AI02894 BO TUR ON ( 100% ) TURB (2 O ON O 5%) O TU 0 0 RB 5 O OF F PT 100% PT 25% 10 15 20 25 AI03100 HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz) 73/111 PSD813F1A Table 36. Example of PSD Typical Power Calculation at VCC = 5.0V (Turbo Mode On) Conditions Highest Composite PLD input frequency (Freq PLD) MCU ALE frequency (Freq ALE) % Flash memory Access % SRAM access % I/O access Operational Modes % Normal % Power-down Mode Number of product terms used (from fitter report) % of total product terms Turbo Mode = 45 PT = 45/182 = 24.7% = ON Calculation (using typical values) ICC total = 10% = 90% = 8MHz = 4MHz = 80% = 15% = 5% (no additional power above base) = Ipwrdown x %pwrdown + %normal x (ICC (ac) + ICC (dc)) = Ipwrdown x %pwrdown + % normal x (%flash x 2.5mA/MHz x Freq ALE + %SRAM x 1.5mA/MHz x Freq ALE = 50µA x 0.90 + 0.1 x (0.8 x 2.5mA/MHz x 4MHz bs O This is the operating power with no EEPROM WRITE or Flash memory Erase cycles. Calculation is based on IOUT = 0mA. let o Pr e du o (s) ct = 4.34mA so Ob - + % PLD x 2mA/MHz x Freq PLD + #PT x 400µA/PT) te le ro P uc d s) t( + 0.15 x 1.5mA/MHz x 4MHz + 2mA/MHz x 8MHz + 45 x 0.4mA/PT) = 45µA + 0.1 x (8 + 0.9 + 16 + 18mA) = 45µA + 0.1 x 42.9 = 45µA + 4.29mA 74/111 PSD813F1A Table 37. Example of PSD Typical Power Calculation at VCC = 5.0V (Turbo Mode Off) Conditions Highest Composite PLD input frequency (Freq PLD) MCU ALE frequency (Freq ALE) % Flash memory Access % SRAM access % I/O access Operational Modes % Normal % Power-down Mode Number of product terms used (from fitter report) % of total product terms Turbo Mode = 45 PT = 45/182 = 24.7% = Off Calculation (using typical values) ICC total = 10% = 90% = 8MHz = 4MHz = 80% = 15% = 5% (no additional power above base) = Ipwrdown x %pwrdown + %normal x (ICC (ac) + ICC (dc)) = Ipwrdown x %pwrdown + % normal x (%flash x 2.5mA/MHz x Freq ALE + %SRAM x 1.5mA/MHz x Freq ALE = 50µA x 0.90 + 0.1 x (0.8 x 2.5mA/MHz x 4MHz + 0.15 x 1.5mA/MHz x 4MHz + 24mA) This is the operating power with no EEPROM WRITE or Flash memory Erase cycles. Calculation is based on IOUT = 0mA. bs O let o Pr e du o (s) ct = 3.34mA so Ob - + % PLD x (from graph using Freq PLD)) te le ro P uc d s) t( = 45µA + 0.1 x (8 + 0.9 + 24) = 45µA + 0.1 x 32.9 = 45µA + 3.29mA 75/111 PSD813F1A MAXIMUM RATING Stressing the device above the rating listed in the Absolute Maximum Ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not imTable 38. Absolute Maximum Ratings Symbol TSTG TLEAD VIO VCC VPP VESD Storage Temperature Lead Temperature during Soldering (20 seconds max.)1 Input and Output Voltage (Q = VOH or Hi-Z) Supply Voltage Device Programmer Supply Voltage Electrostatic Discharge Voltage (Human Body model) 2 –0.6 –0.6 –0.6 –2000 Parameter Min. –65 Max. 125 235 7.0 7.0 14.0 2000 Unit °C °C V V plied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Note: 1. IPC/JEDEC J-STD-020A 2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 Ω, R2=500 Ω) bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( V V 76/111 PSD813F1A DC AND AC PARAMETERS This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the MeasureTable 39. Operating Conditions (5V devices) Symbol VCC TA Ambient Operating Temperature (Commercial) 0 70 °C Supply Voltage Ambient Operating Temperature (Industrial) Parameter Min. 4.5 –40 Max. 5.5 85 Unit V °C ment Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 40. Operating Conditions (3V devices) Symbol VCC TA Ambient Operating Temperature (Commercial) 0 Supply Voltage Ambient Operating Temperature (Industrial) Parameter Min. 3.0 –40 Max. 3.6 85 Table 41. AC Signal Letters for PLD Timings A C D E G I L N P Q R S Address Input CEout Output Input Data E Input Internal WDOG_ON signal Interrupt Input ALE Input Reset Input or Output Port Signal Output Output Data Table 42. AC Signal Behavior Symbols for PLD Timings t Time O bs T W M let o WR, UDS, LDS, DS, IORD, PSEN Inputs Chip Select Input Pr e du o ct (s) Ob - so L H V X Z Pr te le Valid Float Pulse Width od 70 uc s) t( V °C °C Unit Logic Level Low or ALE Logic Level High No Longer a Valid Logic Level PW Note: Example: tAVLX = Time from Address Valid to ALE Invalid. R/W Input Internal PDN Signal Output Macrocell Note: Example: tAVLX = Time from Address Valid to ALE Invalid. Table 43. AC Measurement Conditions Symbol CL Load Capacitance Parameter Min. 30 Max. Unit pF Note: 1. Output Hi-Z is defined as the point where data out is no longer driven. 77/111 PSD813F1A Table 44. Capacitance Symbol CIN COUT CVPP Parameter Input Capacitance (for input pins) Output Capacitance (for input/ output pins) Capacitance (for CNTL2/VPP) Test Condition VIN = 0V VOUT = 0V VPP = 0V Typ.2 4 8 18 Max. 6 12 25 Unit pF pF pF Note: 1. Sampled only, not 100% tested. 2. Typical values are for TA = 25°C and nominal supply voltages. Figure 38. AC Measurement I/O Waveform Figure 39. AC Measurement Load Circuit 2.01 V 3.0V Test Point 0V AI03103b 195 Ω 1.5V Device Under Test CL = 30 pF (Including Scope and Jig Capacitance) Figure 40. Switching Waveforms – Key WAVEFORMS bs O VIH VIL let o ro P e du (s) ct so Ob INPUTS STEADY INPUT DON'T CARE te le ro P uc d s) t( AI03104b OUTPUTS STEADY OUTPUT MAY CHANGE FROM HI TO LO MAY CHANGE FROM LO TO HI WILL BE CHANGING FROM HI TO LO WILL BE CHANGING LO TO HI CHANGING, STATE UNKNOWN OUTPUTS ONLY CENTER LINE IS TRI-STATE AI03102 Table 45. DC Characteristics (5V devices) Symbol Parameter Input High Voltage Input Low Voltage Test Condition (in addition to those in Table 39) 4.5V < VCC < 5.5V 4.5V < VCC < 5.5V Min. 2 –0.5 Typ. Max. VCC +0.5 0.8 Unit V V 78/111 PSD813F1A Test Condition (in addition to those in Table 39) (Note 1) (Note 1) Symbol VIH1 VIL1 VHYS VLKO Parameter Reset High Level Input Voltage Reset Low Level Input Voltage Reset Pin Hysteresis VCC (min) for Flash Erase and Program Min. 0.8VCC –0.5 0.3 2.5 Typ. Max. VCC +0.5 0.2VCC –0.1 Unit V V V 4.2 0.01 0.25 0.1 0.45 V V V V V VOL IOL = 20µA, VCC = 4.5V Output Low Voltage IOL = 8mA, VCC = 4.5V IOH = –20µA, VCC = 4.5V Output High Voltage IOH = –2mA, VCC = 4.5V Standby Supply Current for Power-down Mode Input Leakage Current Output Leakage Current CSI >VCC –0.3V (Notes 2,3) VSS < VIN < VCC 0.45 < VOUT < VCC ZPLD_TURBO = Off, f = 0MHz (Note 5) ZPLD_TURBO = On, f = 0MHz During Flash memory or EEPROM WRITE/Erase Only Read only, f = 0MHz SRAM ZPLD AC Adder f = 0MHz –1 –10 2.4 4.4 4.49 3.9 50 ±0.1 ±5 0 200 1 VOH ISB ILI ILO µA ZPLD Only ICC (DC) (Note 5) Operating Supply Current Flash memory or EEPROM ICC (AC) (Note 5) Flash memory or EEPROM AC Adder SRAM AC Adder bs O VIH VIL VIH1 VIL1 Note: 1. 2. 3. 4. 5. Reset (RESET) has hysteresis. VIL1 is valid at or below 0.2VCC –0.1. VIH1 is valid at or above 0.8VCC. CSI deselected or internal Power-down mode is active. PLD is in non-Turbo mode, and none of the inputs are switching. Please see Figure 36., page 73 for the PLD current calculation. IOUT = 0mA let o od Pr e Parameter ct u (s) so Ob - Pr te le See Figure 36, note 4 400 od uc 10 700 30 0 0 s) t( µA µA mA µA/PT 15 0 0 mA mA mA 2.5 1.5 3.5 3.0 mA/ MHz mA/ MHz Table 46. DC Characteristics (3V devices) Symbol Conditions 3.0V < VCC < 3.6V 3.0V < VCC < 3.6V (Note 1) (Note 1) Min. 0.7VCC –0.5 0.8VCC –0.5 Typ. Max. VCC +0.5 0.8 VCC +0.5 0.2VCC –0.1 Unit V V V V High Level Input Voltage Low Level Input Voltage Reset High Level Input Voltage Reset Low Level Input Voltage 79/111 PSD813F1A Symbol VHYS VLKO Parameter Reset Pin Hysteresis VCC (min) for Flash Erase and Program IOL = 20µA, VCC = 3.0V Output Low Voltage IOL = 4mA, VCC = 3.0V IOH = –20µA, VCC = 3.0V Output High Voltage IOH = –1mA, VCC = 3.0V Standby Supply Current for Power-down Mode Input Leakage Current Output Leakage Current CSI >VCC –0.3V (Notes 2) VSS < VIN < VCC 0.45 < VIN < VCC ZPLD_TURBO = Off, f = 0MHz (Note 3) ZPLD_TURBO = On, f = 0MHz During Flash memory or EEPROM WRITE/Erase Only Read only, f = 0MHz SRAM ZPLD AC Adder ICC (AC) (Note 3) Flash memory or EEPROM AC Adder SRAM AC Adder f = 0MHz –1 –10 2.7 2.8 25 ±0.1 ±5 0 200 100 1 10 V µA µA µA 2.9 0.15 2.99 0.45 V V Conditions Min. 0.3 1.5 0.01 2.2 0.1 Typ. Max. Unit V V V VOL VOH ISB ILI ILO ZPLD Only ICC (DC) (Note 3) Operating Supply Current Flash memory or EEPROM See Figure 37., page 73 Note: 1. Reset (RESET) has hysteresis. VIL1 is valid at or below 0.2VCC –0.1. VIH1 is valid at or above 0.8VCC. 2. CSI deselected or internal PD is active. 3. IOUT = 0mA Figure 41. Input to Output Disable / Enable O bs let o Pr e du o (s) ct so Ob - eP let od r 10 0 0 1.5 0.8 uc 400 25 0 0 s) t( µA/PT µA/PT mA mA mA 2.0 1.5 mA/ MHz mA/ MHz INPUT tER INPUT TO OUTPUT ENABLE/DISABLE tEA AI02863 80/111 PSD813F1A Figure 42. Combinatorial Timing PLD CPLD INPUT tPD CPLD OUTPUT ai09228 Table 47. CPLD Combinatorial Timing (5V devices) -90 Symbol Parameter CPLD Input Pin/ Feedback to CPLD Combinatorial Output CPLD Input to CPLD Output Enable CPLD Input to CPLD Output Disable CPLD Register Clear or Preset Delay CPLD Register Clear or Preset Pulse Width CPLD Array Delay Any macrocell 20 16 Conditions Min tPD Max 25 Min Max 30 Min -12 -15 Fast PT Max Aloc 32 +2 Turbo Slew Off2 rate1 Unit + 10 tEA tER tARP tARPW tARD 26 26 26 24 30 30 30 32 32 33 Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. Decrement times by given amount. 2. ZPSD versions only. bs O let o Pr e du o (s) ct so Ob 18 te le 29 ro P +2 uc d + 10 + 10 + 10 + 10 s) t( –2 –2 –2 –2 ns ns ns ns ns ns 22 81/111 PSD813F1A Table 48. CPLD Combinatorial Timing (3V devices) -15 Symbol Parameter CPLD Input Pin/Feedback to CPLD Combinatorial Output CPLD Input to CPLD Output Enable CPLD Input to CPLD Output Disable CPLD Register Clear or Preset Delay CPLD Register Clear or Preset Pulse Width CPLD Array Delay Any macrocell 30 29 Conditions Min tPD Max 48 Min Max 55 -20 PT Aloc Turbo Off2 + 20 Slew rate1 –6 Unit +4 ns tEA tER tARP tARPW tARD 43 43 48 35 50 50 55 + 20 + 20 + 20 + 20 –6 –6 –6 ns ns ns ns 33 +4 Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. Decrement times by given amount. 2. ZPSD versions only. Figure 43. Synchronous Clock Mode Timing – PLD tCH tCL CLKIN INPUT REGISTERED OUTPUT bs O let o Pr e du o (s) ct so Ob tS te le tH tCO ro P uc d s) t( ns AI02860 82/111 PSD813F1A Table 49. CPLD Macrocell Synchronous Clock Mode Timing (5V devices) -90 Symbol Parameter Maximum Frequency External Feedback Maximum Frequency Internal Feedback (fCNT) Maximum Frequency Pipelined Data tS tH tCH tCL tCO tARD tMIN Input Setup Time Input Hold Time Clock High Time Clock Low Time Clock to Output Delay CPLD Array Delay Minimum Clock Period 2 Clock Input Clock Input Clock Input Any macrocell tCH+tCL 20 Conditions Min Max 30.3 0 Min Max Min Max -12 -15 Fast PT Aloc Turbo Slew Off rate1 Unit 1/(tS+tCO) 26.3 23.8 MHz fMAX 1/(tS+tCO–10) 43.4 8 35.7 31.25 MHz 1/(tCH+tCL) 50.0 0 15 0 10 10 18 16 18 0 12 12 41.67 33.3 MHz 20 0 15 15 20 18 +2 + 10 Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. Decrement times by given amount. 2. CLKIN (PD1) tCLCL = tCH + tCL. bs O let o Pr e du o (s) ct so Ob 24 te le 30 22 22 ro P +2 uc d s) t( –2 ns ns ns ns ns ns ns 83/111 PSD813F1A Table 50. CPLD Macrocell Synchronous Clock Mode Timing (3V devices) -15 Symbol Parameter Maximum Frequency External Feedback fMAX Maximum Frequency Internal Feedback (fCNT) Maximum Frequency Pipelined Data tS tH tCH tCL tCO tARD tMIN Input Setup Time Input Hold Time Clock High Time Clock Low Time Clock to Output Delay CPLD Array Delay Minimum Clock Period2 Clock Input Clock Input Clock Input Any macrocell tCH+tCL 29 Conditions Min 1/(tS+tCO) 1/(tS+tCO–10) 1/(tCH+tCL) 27 0 15 15 35 29 32 Max 17.8 19.6 33.3 35 0 16 16 39 33 +4 –6 Min Max 14.7 17.2 31.2 +4 + 20 -20 PT Aloc Turbo Off Slew rate1 Unit MHz MHz MHz ns ns ns ns Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. 2. CLKIN (PD1) tCLCL = tCH + tCL. Figure 44. Asynchronous Reset / Preset tARPW RESET/PRESET INPUT tARP REGISTER OUTPUT Figure 45. Asynchronous Clock Mode Timing (Product Term Clock) tCHA tCLA bs O let o Pr e du o (s) ct so Ob - eP let od r uc s) t( ns ns ns AI02864 CLOCK tSA tHA INPUT tCOA REGISTERED OUTPUT AI02859 84/111 PSD813F1A Table 51. CPLD Macrocell Asynchronous Clock Mode Timing (5V devices) -90 Symbol Parameter Maximum Frequency External Feedback Maximum Frequency Internal Feedback (fCNTA) Maximum Frequency Pipelined Data tSA tHA tCHA tCLA tCOA tARDA tMINA Input Setup Time Input Hold Time Clock Input High Time Clock Input Low Time Clock to Output Delay CPLD Array Delay Minimum Clock Period Any macrocell 1/fCNTA Conditions Min Max 26.3 2 Min Max Min Max -12 -15 PT Aloc Turbo Slew Off1 Rate Unit 1/(tSA+tCOA) 23.25 20.4 MHz fMAXA 1/(tSA+tCOA–10) 35.7 1 30.30 25.64 MHz 1/(tCHA+tCLA) 41.6 7 35.71 33.3 MHz 8 12 12 12 30 10 14 14 14 12 14 15 +2 + 10 16 28 Note: 1. ZPSD versions only. bs O let o Pr e du o (s) ct so Ob 18 33 33 eP let 15 37 22 39 od r +2 + 10 + 10 uc s) t( –2 ns ns ns ns ns ns ns + 10 85/111 PSD813F1A Table 52. CPLD Macrocell Asynchronous Clock Mode Timing (3V devices) -15 Symbol Parameter Maximum Frequency External Feedback fMAXA Maximum Frequency Internal Feedback (fCNTA) Maximum Frequency Pipelined Data tSA tHA tCHA tCLA tCOA tARD tMINA Input Setup Time Input Hold Time Clock High Time Clock Low Time Clock to Output Delay CPLD Array Delay Minimum Clock Period Any macrocell 1/fCNTA 42 Conditions Min 1/(tSA+tCOA) Max 19.2 Min Max 16.9 -20 PT Aloc Turbo Slew Off1 Rate Unit MHz 1/(tSA+tCOA–10) 23.8 20.4 MHz 1/(tCHA+tCLA) 12 15 22 15 27 13 17 25 16 40 29 49 24.4 +4 + 20 MHz ns ns + 20 + 20 ns 46 33 +4 + 20 Note: 1. ZPSD Versions only. bs O let o Pr e du o (s) ct so Ob - eP let od r uc s) t( –6 ns ns ns ns 86/111 PSD813F1A Figure 46. Input Macrocell Timing (product term clock) t INH PT CLOCK t INL t IS INPUT t IH OUTPUT t INO AI03101 Table 53. Input Macrocell Timing (5V devices) -90 Symbol tIS tIH tINH tINL tINO Parameter Input Setup Time Input Hold Time NIB Input High Time NIB Input Low Time NIB Input to Combinatorial Delay Conditions Min (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) 0 20 12 12 46 Max Min 0 22 15 15 Max Min 0 26 18 Max -12 -15 PT Aloc Turbo Off2 Note: 1. Inputs from Port A, B, and C relative to register/ latch clock from the PLD. ALE/AS latch timings refer to tAVLX and tLXAX. 2. ZPSD versions only. Table 54. Input Macrocell Timing (3V Devices) Symbol tIS tIH tINH tINL Parameter Input Setup Time Input Hold Time NIB Input High Time bs O tINO Note: 1. Inputs from Port A, B, and C relative to register/latch clock from the PLD. ALE latch timings refer to tAVLX and tLXAX. 2. ZPSD Versions only. let o NIB Input Low Time NIB Input to Combinatorial Delay Pr e od ct u (s) Conditions (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) so Ob -15 Min 0 25 13 13 eP let 18 50 -20 Min 0 30 15 15 ro 59 uc d +2 + 10 s) t( Unit ns ns ns ns + 10 ns Max Max PT Aloc Turbo Off2 Unit ns + 20 ns ns ns 62 70 +4 + 20 ns 87/111 PSD813F1A Figure 47. READ Timing tAVLX ALE /AS tLVLX A /D MULTIPLEXED BUS ADDRESS NON-MULTIPLEXED BUS DATA NON-MULTIPLEXED BUS tSLQV CSI tRLQV tRLRH RD (PSEN, DS) tRHQZ tRHQX ADDRESS VALID tAVQV ADDRESS VALID DATA VALID tLXAX 1 DATA VALID tEHEL E tTHEH tELTL R/W tAVPV ADDRESS OUT Note: 1. tAVLX and tLXAX are not required for 80C251 in Page Mode or 80C51XA in Burst Mode. bs O let o Pr e du o (s) ct Ob - so te le ro P uc d s) t( AI02895 88/111 PSD813F1A Table 55. READ Timing (5V devices) -90 Symbol tLVLX tAVLX tLXAX tAVQV tSLQV Parameter ALE or AS Pulse Width Address Setup Time Address Hold Time Address Valid to Data Valid CS Valid to Data Valid RD to Data Valid 8-Bit Bus tRLQV RD or PSEN to Data Valid 8-Bit Bus, 8031, 80251 RD Data Hold Time RD Pulse Width RD to Data High-Z E Pulse Width R/W Setup Time to Enable R/W Hold Time After Enable Address Input Valid to Address Output Delay (Note 4) (Note 5) (Note 2) (Note 1) (Note 1) (Note 1) 32 10 0 0 32 25 36 13 (Note 3) (Note 3) (Notes 3,6) Conditions Min 20 6 8 90 100 32 38 0 35 35 38 Max Min 22 8 9 120 135 35 42 0 38 38 Max Min 28 10 11 150 150 40 45 + 10 Max -12 -15 Turbo Off Unit ns ns ns ns ns ns ns ns tRHQX tRLRH tRHQZ tEHEL tTHEH tELTL tAVPV Note: 1. 2. 3. 4. 5. 6. 25 RD timing has the same timing as DS, LDS, UDS, and PSEN signals. RD and PSEN have the same timing. Any input used to select an internal PSD function. In multiplexed mode, latched addresses generated from ADIO delay to address output on any Port. RD timing has the same timing as DS, LDS, and UDS signals. In Turbo Off mode, add 10ns to tAVQV. bs O let o Pr e du o (s) ct so Ob - eP let 0 28 od r 18 0 uc s) t( ns ns ns ns ns ns 32 89/111 PSD813F1A Table 56. READ Timing (3V devices) -15 Symbol tLVLX tAVLX tLXAX tAVQV tSLQV Parameter ALE or AS Pulse Width Address Setup Time Address Hold Time Address Valid to Data Valid CS Valid to Data Valid RD to Data Valid 8-Bit Bus tRLQV RD or PSEN to Data Valid 8-Bit Bus, 8031, 80251 RD Data Hold Time RD Pulse Width (also DS, LDS, UDS) tRLRH tRHQZ tEHEL tTHEH tELTL tAVPV Note: 1. 2. 3. 4. 5. 6. -20 Max Min 30 12 14 150 150 200 200 40 55 0 45 60 40 Max Conditions Min 26 (Note 3) (Note 3) (Note 3,6) 10 12 Turbo Off Unit ns ns ns + 20 ns ns ns ns ns (Note 5) (Note 2) (Note 1) 0 40 55 (Note 1) 45 18 0 (Note 4) 35 50 tRHQX RD or PSEN Pulse Width (8031, 80251) RD to Data High-Z E Pulse Width R/W Setup Time to Enable R/W Hold Time After Enable Address Input Valid to Address Output Delay 52 20 0 RD timing has the same timing as DS, LDS, UDS, and PSEN signals. RD and PSEN have the same timing for 8031. Any input used to select an internal PSD function. In multiplexed mode latched address generated from ADIO delay to address output on any Port. RD timing has the same timing as DS, LDS, and UDS signals. In Turbo Off mode, add 20ns to tAVQV. bs O let o Pr e du o (s) ct Ob - so eP let 35 ro uc d 45 40 s) t( ns ns ns ns ns ns ns 90/111 PSD813F1A Figure 48. WRITE Timing tAVLX ALE/AS t LVLX A/D MULTIPLEXED BUS ADDRESS VALID tAVWL ADDRESS NON-MULTIPLEXED BUS DATA NON-MULTIPLEXED BUS tSLWL CSI tDVWH WR (DS) t WLWH t WHDX t WHAX ADDRESS VALID DATA VALID DATA VALID t LXAX t EHEL E t THEH R/ W t WLMV tAVPV ADDRESS OUT bs O let o Pr e du o (s) ct so Ob - te le ro P t WHPV uc d t ELTL s) t( STANDARD MCU I/O OUT AI02896 91/111 PSD813F1A Table 57. WRITE, Erase and Program Timing (5V devices) -90 Symbol tLVLX tAVLX tLXAX tAVWL tSLWL tDVWH tWHDX tWLWH tWHAX1 tWHAX2 tWHPV Parameter ALE or AS Pulse Width Address Setup Time Address Hold Time Address Valid to Leading Edge of WR CS Valid to Leading Edge of WR WR Data Setup Time WR Data Hold Time WR Pulse Width Trailing Edge of WR to Address Invalid Trailing Edge of WR to DPLD Address Invalid Trailing Edge of WR to Port Output Valid Using I/O Port Data Register Data Valid to Port Output Valid Using Macrocell Register Preset/Clear Address Input Valid to Address Output Delay WR Valid to Port Output Valid Using Macrocell Register Preset/Clear (Note 1) (Note 1) (Notes 1,3) (Note 3) (Note 3) (Note 3) (Note 3) (Note 3) (Note 3,6) (Note 3) (Notes 3,5) (Note 2) Conditions Min 20 6 8 15 15 35 5 35 8 0 30 Max Min 22 8 9 18 18 40 5 40 9 0 Max Min 28 10 11 20 20 45 5 45 10 Max ns ns ns ns ns ns ns ns -12 -15 Unit tDVMV tAVPV tWLMV Note: 1. 2. 3. 4. 5. 6. Any input used to select an internal PSD function. In multiplexed mode, latched address generated from ADIO delay to address output on any port. WR has the same timing as E, LDS, UDS, WRL, and WRH signals. Assuming data is stable before active WRITE signal. Assuming WRITE is active before data becomes valid. TWHAX2 is the address hold time for DPLD inputs that are used to generate Sector Select signals for internal PSD memory. bs O let o Pr e du o (s) ct Ob - (Notes 3,4) so eP let 55 25 55 od r 35 60 28 60 uc 0 s) t( 38 65 ns ns ns ns 30 65 ns ns 92/111 PSD813F1A Table 58. WRITE Timing (3V devices) -15 Symbol tLVLX tAVLX tLXAX tAVWL tSLWL tDVWH tWHDX tWLWH tWHAX1 tWHAX2 tWHPV tDVMV tAVPV tWLMV Note: 1. 2. 3. 4. 5. 6. -20 Unit Max Min 30 12 14 25 25 50 10 53 17 0 45 ns ns ns ns ns ns ns Max Parameter ALE or AS Pulse Width Address Setup Time Address Hold Time Address Valid to Leading Edge of WR CS Valid to Leading Edge of WR WR Data Setup Time WR Data Hold Time WR Pulse Width Trailing Edge of WR to Address Invalid Trailing Edge of WR to DPLD Address Invalid Trailing Edge of WR to Port Output Valid Using I/O Port Data Register Data Valid to Port Output Valid Using Macrocell Register Preset/Clear Address Input Valid to Address Output Delay WR Valid to Port Output Valid Using Macrocell Register Preset/Clear Conditions Min 26 (Note 1) (Note 1) (Notes 1,3) (Note 3) (Note 3) (Note 3) (Note 3) (Note 3) (Note 3,6) (Note 3) (Notes 3,5) (Note 2) 10 12 20 20 45 8 48 12 0 Any input used to select an internal PSD function. In multiplexed mode, latched address generated from ADIO delay to address output on any port. WR has the same timing as E, LDS, UDS, WRL, and WRH signals. Assuming data is stable before active WRITE signal. Assuming WRITE is active before data becomes valid. TWHAX2 is the address hold time for DPLD inputs that are used to generate Sector Select signals for internal PSD memory. Table 59. Flash Program, WRITE and Erase Times (5V devices) Symbol Flash Program tWHQV3 O tWHQV2 tWHQV1 bs let o Flash Bulk Erase (pre-programmed) Flash Bulk Erase (not pre-programmed) Sector Erase (pre-programmed) Sector Erase (not pre-programmed) Byte Program Program / Erase Cycles (per Sector) 100,000 Pr e du o 1 (s) ct so Ob (Notes 3,4) Pr te le 90 48 90 od uc s) t( ns ns 50 ns ns ns ns 100 55 100 Parameter Min. Typ. 8.5 3 10 1 2.2 14 Max. Unit s 30 s s 30 s s 1200 µs cycles tWHWLO tQ7VQV Sector Erase Time-Out DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling)2 100 30 µs ns Note: 1. Programmed to all zero before erase. 2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading. 93/111 PSD813F1A Table 60. Flash Program, WRITE and Erase Times (3V devices) Symbol Flash Program Flash Bulk Erase1 (pre-programmed) Flash Bulk Erase (not pre-programmed) tWHQV3 tWHQV2 tWHQV1 Sector Erase (pre-programmed) Sector Erase (not pre-programmed) Byte Program Program / Erase Cycles (per Sector) tWHWLO tQ7VQV Sector Erase Time-Out DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling)2 100,000 100 30 Parameter Min. Typ. 8.5 3 10 1 2.2 14 1200 30 30 Max. Unit s s s s s µs cycles µs ns Note: 1. Programmed to all zero before erase. 2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading. Table 61. EEPROM WRITE Times (5V devices) Symbol tEEHWL tBLC tWCB tWCP Parameter Write Protect After Power Up EEPROM Byte Load Cycle Timing (Note 1) EEPROM Byte Write Cycle Time EEPROM Page Write Cycle Time (Note 2) Program/Erase Cycles (Per Sector) 0.2 Min Typ 5 Max Note: 1. If the maximum time has elapsed between successive WRITE cycles to an EEPROM page, the transfer of this data to EEPROM cells will begin. Also, bytes cannot be written (loaded) to a page any faster than the indicated minimum type. 2. These specifications are for writing a page to EEPROM cells. Table 62. EEPROM WRITE Times (3V devices) Symbol tEEHWL tBLC tWCB tWCP Parameter Write Protect After Power Up bs O Note: 1. If the maximum time has elapsed between successive WRITE cycles to an EEPROM page, the transfer of this data to EEPROM cells will begin. Also, bytes cannot be written (loaded) to a page any faster than the indicated minimum type. 2. These specifications are for writing a page to EEPROM cells. let o ro P e EEPROM Byte Load Cycle Timing (Note 1) EEPROM Byte Write Cycle Time du (s) ct Ob - so 10,000 eP let 4 6 Min od r 120 10 30 uc s) t( Unit ms µs ms ms cycles Typ 5 Max Unit ms 0.2 4 6 10,000 120 10 30 µs ms ms cycles EEPROM Page Write Cycle Time (Note 2) Program/Erase Cycles (Per Sector) 94/111 PSD813F1A Figure 49. Peripheral I/O Read Timing ALE/AS A/D BUS ADDRESS DATA VALID tAVQV (PA) tSLQV (PA) CSI tRLQV (PA) RD tRLRH (PA) tQXRH (PA) tRHQZ (PA) tDVQV (PA) DATA ON PORT A AI02897 Table 63. Port A Peripheral Data Mode READ Timing (5V devices) -90 Symbol tAVQV–PA tSLQV–PA tRLQV–PA tDVQV–PA tQXRH–PA tRLRH–PA tRHQZ–PA Parameter Address Valid to Data Valid CSI Valid to Data Valid RD to Data Valid RD to Data Valid 8031 Mode Data In to Data Out Valid RD Data Hold Time RD Pulse Width RD to Data High-Z (Notes 1,4) Conditions Min (Note 3) Max 40 35 -12 Min Max 45 Table 64. Port A Peripheral Data Mode READ Timing (3V devices) Symbol bs O tAVQV–PA tSLQV–PA let o ro P e du ct (s) Ob (Note 1) (Note 1) so 0 32 eP let 40 35 42 35 0 35 ro Min -15 uc d Max 45 45 40 45 38 s) t( Unit ns ns ns ns ns ns ns Turbo Off + 10 + 10 38 30 0 38 28 30 32 25 ns -15 Conditions Min (Note 3) Max 55 45 (Notes 1,4) 40 45 60 0 (Note 1) (Note 1) 36 40 0 46 Min -20 Max 60 50 45 50 65 Parameter Turbo Off + 20 + 20 Unit ns ns ns ns ns ns ns Address Valid to Data Valid CSI Valid to Data Valid RD to Data Valid tRLQV–PA tDVQV–PA tQXRH–PA tRLRH–PA tRHQZ–PA RD to Data Valid 8031 Mode Data In to Data Out Valid RD Data Hold Time RD Pulse Width RD to Data High-Z 45 ns 95/111 PSD813F1A Figure 50. Peripheral I/O WRITE Timing ALE/AS A / D BUS ADDRESS DATA OUT tWLQV WR (PA) tWHQZ (PA) tDVQV (PA) PORT A DATA OUT AI02898 Table 65. Port A Peripheral Data Mode WRITE Timing (5V devices) -90 Symbol tWLQV–PA tDVQV–PA tWHQZ–PA Note: 1. 2. 3. 4. 5. -12 Min Max Parameter WR to Data Propagation Delay Data to Port A Data Propagation Delay WR Invalid to Port A Tri-state Conditions Min (Note 2) (Note 5) (Note 2) Max 35 30 25 RD has the same timing as DS, LDS, UDS, and PSEN (in 8031 combined mode). WR has the same timing as the E, LDS, UDS, WRL, and WRH signals. Any input used to select Port A Data Peripheral mode. Data is already stable on Port A. Data stable on ADIO pins to data on Port A. Table 66. Port A Peripheral Data Mode WRITE Timing (3V devices) -15 Conditions Min (Note 2) (Note 5) (Note 2) Max 45 40 33 Min Max 55 45 35 ns ns ns -20 Unit Symbol tWLQV–PA tDVQV–PA tWHQZ–PA Note: 1. 2. 3. 4. 5. Parameter WR to Data Propagation Delay Data to Port A Data Propagation Delay WR Invalid to Port A Tri-state bs O RD has the same timing as DS, LDS, UDS, and PSEN (in 8031 combined mode) signals. WR has the same timing as the E, LDS, UDS, WRL, and WRH signals. Any input used to select Port A Data Peripheral mode. Data is already stable on Port A. Data stable on ADIO pins to data on Port A. let o Pr e du o (s) ct so Ob - Pr te le od 38 35 30 uc Min -15 s) t( Max 40 38 33 Unit ns ns ns 96/111 PSD813F1A Figure 51. Reset (RESET) Timing VCC VCC(min) tNLNH tNLNH-A Warm Reset tNLNH-PO Power-On Reset tOPR tOPR RESET AI02866b Table 67. Reset (RESET) Timing (5V devices) Symbol tNLNH tNLNH–PO tOPR Parameter RESET Active Low Time 1 Power On Reset Active Low Time RESET High to Operational Device Conditions Min 150 1 Max Unit Note: 1. Reset (RESET) does not reset Flash memory Program or Erase cycles. 2. Warm reset aborts Flash memory Program or Erase cycles, and puts the device in READ Mode. Table 68. Reset (RESET) Timing (3V devices) Symbol tNLNH tNLNH–PO tOPR Parameter RESET Active Low Time 1 Power On Reset Active Low Time2 RESET High to Operational Device Conditions Note: 1. Reset (RESET) does not reset Flash memory Program or Erase cycles. 2. tNLNH-PO is 10ms for devices manufactured before the rev.A. bs O let o Pr e du o (s) ct so Ob - eP let Min 300 1 od r uc 120 Max s) t( ns ms ns Unit ns ms 300 ns 97/111 PSD813F1A Figure 52. ISC Timing t ISCCH TCK t ISCCL t ISCPSU t ISCPH TDI/TMS t ISCPZV t ISCPCO ISC OUTPUTS/TDO t ISCPVZ ISC OUTPUTS/TDO Table 69. ISC Timing (5V devices) Symbol Parameter Clock (TCK, PC1) Frequency (except for PLD) Clock (TCK, PC1) High Time (except for PLD) Clock (TCK, PC1) Low Time (except for PLD) Conditions tISCCF tISCCH tISCCL tISCCFP tISCCHP tISCCLP tISCPSU tISCPH tISCPCO Clock (TCK, PC1) Frequency (PLD only) Clock (TCK, PC1) High Time (PLD only) Clock (TCK, PC1) Low Time (PLD only) O tISCPZV bs let o ISC Port Set Up Time ISC Port Hold Up Time ISC Port Clock to Output ISC Port High-Impedance to Valid Output ISC Port Valid Output to High-Impedance Pr e od uc (s) t so Ob (Note 1) (Note 1) (Note 1) (Note 2) (Note 2) (Note 2) te le -90 Min 18 26 26 2 240 240 8 5 23 23 23 ro P -12 Min 29 29 uc d AI02865 s) t( Unit Max 14 MHz ns ns 2 MHz ns ns ns ns 25 25 25 ns ns ns -15 Min Max Max 16 31 31 2 240 240 10 5 24 24 24 240 240 10 5 tISCPVZ Note: 1. For non-PLD Programming, Erase or in ISC by-pass mode. 2. For Program or Erase PLD only. 98/111 PSD813F1A Table 70. ISC Timing (3V devices) -15 Symbol tISCCF tISCCH tISCCL tISCCFP tISCCHP tISCCLP tISCPSU tISCPH tISCPCO tISCPZV tISCPVZ Parameter Clock (TCK, PC1) Frequency (except for PLD) Clock (TCK, PC1) High Time (except for PLD) Clock (TCK, PC1) Low Time (except for PLD) Clock (TCK, PC1) Frequency (PLD only) Clock (TCK, PC1) High Time (PLD only) Clock (TCK, PC1) Low Time (PLD only) ISC Port Set Up Time ISC Port Hold Up Time ISC Port Clock to Output ISC Port High-Impedance to Valid Output ISC Port Valid Output to High-Impedance Conditions Min (Note 1) (Note 1) (Note 1) (Note 2) (Note 2) (Note 2) 240 240 13 10 36 36 36 45 45 2 240 240 15 10 40 Max 10 51 51 2 Min Max 9 MHz ns ns MHz ns ns ns ns -20 Unit 40 Note: 1. For non-PLD Programming, Erase or in ISC by-pass mode. 2. For Program or Erase PLD only. Table 71. Power-down Timing (5V devices) Symbol tLVDV tCLWH Parameter ALE Access Time from Power-down Maximum Delay from APD Enable to Internal PDN Valid Signal Conditions Note: 1. tCLCL is the period of CLKIN (PD1). Table 72. Power-down Timing (3V devices) -15 Conditions Min Max 150 Using CLKIN (PD1) 15 * tCLCL1 Min Max 200 ns µs -20 Unit Symbol tLVDV Parameter bs O tCLWH let o ALE Access Time from Power-down Maximum Delay from APD Enable to Internal PDN Valid Signal od Pr e ct u (s) Ob - so te le -90 Min 90 ro P -12 Min uc d Min 40 s) t( ns ns ns -15 Unit Max 150 ns µs Max Max 120 Using CLKIN (PD1) 15 * tCLCL1 Note: 1. tCLCL is the period of CLKIN (PD1). 99/111 PSD813F1A PACKAGE MECHANICAL In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 53. PQFP52 - 52-pin Plastic, Quad, Flat Package Mechanical Drawing D D1 D2 A2 e Ne E2 E1 E N 1 Nd Note: Drawing is not to scale. bs O let o Pr e QFP-A du o (s) ct so Ob - te le ro P A L1 uc d b s) t( CP c A1 α L 100/111 PSD813F1A Table 73. PQFP52 - 52-pin Plastic, Quad, Flat Package Mechanical Dimensions mm Symb. Typ. A A1 A2 b c D D1 D2 E E1 E2 e L L1 α N Nd Ne CP 13.20 10.00 7.80 13.20 10.00 7.80 0.65 0.88 1.60 2.00 1.80 0.22 0.11 13.15 9.95 – 13.15 9.95 – – 0.73 – 0° 52 13 13 Min. Max. 2.35 0.25 2.10 0.38 0.23 13.25 10.05 – 13.25 10.05 – – 1.03 – 7° 0.520 0.394 0.307 0.520 0.394 0.307 0.026 0.035 0.063 0.079 0.077 0.009 0.004 0.518 0.392 – 0.518 0.392 – Typ. Min. Max. 0.093 0.010 0.083 0.015 0.009 0.522 0.396 – 0.522 inches bs O let o Pr e du o (s) ct Ob 0.10 so te le ro P 0° 52 13 13 0.029 uc d s) t( 0.396 – 0.041 7° 0.004 101/111 PSD813F1A Figure 54. PLCC52 - 52-lead Plastic Lead, Chip Carrier Package Mechanical Drawing D D1 M 1N A1 A2 M1 b1 E1 E D2/E2 D3/E3 b L1 L e A CP PLCC-B Note: Drawing is not to scale. Table 74. PLCC52 - 52-lead Plastic Lead, Chip Carrier Package Mechanical Dimensions mm Symbol Typ. A A1 A2 B B1 C D D1 D2 Min. 4.19 2.54 Max. 0.33 O bs E E1 E2 e R N let o Pr e 1.27 0.89 du o 0.66 0.246 (s) ct – Ob 4.57 2.79 0.91 0.53 0.81 0.261 20.19 19.15 18.54 20.19 19.15 18.54 – – so te le Typ. ro P Min. – uc d s) t( Max. 0.180 0.110 0.036 0.021 0.032 0.0103 0.795 0.754 0.730 0.795 0.754 0.730 – – C inches 0.165 0.100 0.013 0.026 0.0097 0.785 0.750 0.690 0.785 0.750 0.690 0.050 0.035 – – 52 13 13 19.94 19.05 17.53 19.94 19.05 17.53 – – 52 13 13 Nd Ne 102/111 PSD813F1A Figure 55. TQFP64 - 64-lead Thin Quad Flatpack, Package Outline D D1 D2 A2 e Ne E2 E1 E b N 1 Nd L1 A QFP-A Note: Drawing is not to scale. bs O let o Pr e du o (s) ct so Ob - te le A1 α ro P L uc d c s) t( CP 103/111 PSD813F1A Table 75. TQFP64 - 64-lead Thin Quad Flatpack, Package Mechanical Data mm Symb. Typ. A A1 A2 α b c D D1 D2 E E1 E2 e L L1 CP N Nd Ne 16.00 14.00 12.00 16.00 14.00 12.00 0.80 0.60 1.00 0.10 64 16 16 15.90 13.98 11.95 15.90 13.98 11.95 0.75 0.45 0.94 0.10 1.40 3.5° 0.35 Min. 1.42 0.07 1.36 0.0° 0.33 Max. 1.54 0.14 1.44 7.0° 0.38 0.17 16.10 14.03 12.05 16.10 14.03 12.05 0.85 0.75 1.06 0.630 0.551 0.472 0.630 0.551 0.472 0.031 0.024 0.626 0.550 0.470 0.626 0.550 0.470 0.030 0.004 0.055 3.5° 0.014 Typ. Min. 0.056 0.003 0.054 0.0° 0.013 Max. 0.061 0.005 0.057 7.0° 0.015 0.006 0.634 0.552 0.474 inches bs O let o Pr e du o (s) ct Ob - so te le 0.004 0.039 Pr 0.018 od 64 16 16 uc s) t( 0.634 0.552 0.474 0.033 0.030 0.042 0.037 104/111 PSD813F1A PART NUMBERING Table 76. Ordering Information Scheme Example: PSD8 1 3 F 1 A – 15 J 1 T Device Type PSD8 = 8-bit PSD with Register Logic SRAM Capacity 1 = 16 Kbit Flash Memory Capacity 3 = 1 Mbit (128Kb x 8) 2nd Flash Memory 1 = 256 Kbit EEPROM Operating Voltage blank = VCC = 4.5 to 5.5V Speed 70 = 70ns 90 = 90ns 12 = 120ns 15 = 150ns Package J = ECOPACK PLCC52 M = ECOPACK PQFP52 U = ECOPACK TQFP64 bs O Option Temperature Range blank = 0 to 70°C (commercial) 1 = –40 to 85°C (industrial) let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( T = Tape & Reel Packing 105/111 PSD813F1A For other options, or for more information on any aspect of this device, please contact the ST Sales Office nearest you. bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 106/111 PSD813F1A APPENDIX A. PQFP52 PIN ASSIGNMENTS Table 77. PQFP52 Connections (Figure 2) Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Pin Assignments PD2 PD1 PD0 PC7 PC6 PC5 PC4 VCC GND PC3 PC2 PC1 PC0 PA7 PA6 PA5 PA4 PA3 GND PA2 Pin Number 27 28 29 30 31 32 33 34 35 36 37 38 39 Pin Assignments AD4 AD5 AD6 AD7 VCC AD8 AD9 AD10 AD11 AD12 bs O let o 25 26 ro P e uc d PA1 PA0 (s) t so Ob - te le 41 42 43 44 45 46 47 48 49 50 51 52 40 ro P uc d AD13 AD14 AD15 s) t( CNTL0 RESET CNTL2 CNTL1 PB7 PB6 GND PB5 PB4 PB3 PB2 PB1 PB0 AD0 AD1 AD2 AD3 107/111 PSD813F1A APPENDIX B. PLCC52 PIN ASSIGNMENTS Table 78. PLCC52 Connections (Figure 3) Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Pin Assignments GND PB5 PB4 PB3 PB2 PB1 PB0 PD2 PD1 PD0 PC7 PC6 PC5 PC4 VCC GND PC3 PC2 PC1 PC0 Pin Number 27 28 29 30 31 32 33 34 35 36 37 38 39 Pin Assignments PA2 PA1 PA0 AD0 AD1 AD2 AD3 AD4 AD5 AD6 bs O let o 25 26 ro P e uc d PA7 PA6 PA5 PA4 PA3 (s) t so Ob - te le 41 42 43 44 45 46 47 48 49 50 51 52 40 ro P uc d AD7 VCC s) t( AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 CNTL0 RESET CNTL2 CNTL1 PB7 PB6 GND 108/111 PSD813F1A APPENDIX C. TQFP64 PIN ASSIGNMENTS Table 79. TQFP64 Connections (Figure 4) Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Pin Assignments PD2 PD1 PD0 PC7 PC6 PC5 PC4 VCC VCC GND GND PC3 PC2 PC1 PC0 NC NC NC PA7 PA6 Pin Number 33 34 35 36 37 38 39 40 41 42 43 44 45 Pin Assignments AD3 AD4 AD5 AD6 AD7 VCC VCC AD8 AD9 AD10 O bs let o 25 26 27 28 29 30 31 32 Pr e od uc PA5 PA4 PA3 (s) t Ob - so te le 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 46 ro P uc d AD11 s) t( AD12 AD13 AD14 AD15 CNTL0 NC RESET CNTL2 CNTL1 PB7 PB6 GND GND PB5 PB4 PB3 PB2 PB1 PB0 NC NC GND GND PA2 PA1 PA0 AD0 AD1 N/D AD2 109/111 PSD813F1A REVISION HISTORY Table 80. Document Revision History Date August-2000 04-Jan-03 06-Dec-03 03-Jun-04 04-Aug-04 Rev. 1.0 1.1 2.0 3.0 4.0 Document written in WSI format. Front page, and back two pages, in ST format, added to the PDF file. References to Waferscale, WSI, EasyFLASH and PSDsoft 2000 updated to ST, ST, Flash+PSD and PSDsoft Express. Document converted to ST format. Package references corrected (Figure 1). Document reformatted for DMS; Ordering Information corrected (Table 76); added TQFP64 package (Figure 1, 55; Table 75) Correct connection, assignment (Figure 4; Table 79) Part number changed to PSD813F1A. Added ECOPACK text in cover page and in section PACKAGE MECHANICAL, page 100. Updated datasheet status to “not for new design”. Backup battery feature removed: updated Features Summary, Table 1 (pins PC2 and PC4), Block Diagram figure, Memory section, SRAM section, Port C – Functionality and Structure section. Removed SRAM standby mode in POWER MANAGEMENT. Updated PC2 in Table 78. Removed VSTBY, ISTBY, VOH1, VDF, and IIDLE from Table 45 and Table 46. Removed VSTBYON timings tables. Added 15ns speed in Table 76 Ordering information scheme. Updated disclaimer text. Description of Revision 02-Oct-2008 5 bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 110/111 PSD813F1A Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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Information in this document supersedes and replaces all information previously supplied. bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 111/111