SD2943W

SD2943 HF/VHF/UHF RF power N-channel MOSFET Datasheet - production data Features         Figure 1: Pin connection High power capability POUT = 350 W min. with 22 dB gain@30 MHz PSAT = 450 W Low RDS(on) Thermally enhanced packing for lower junction temperatures Gold metallization Excellent thermal stability Common source configuration Description The SD2943 is a gold metallized N-channel MOS field-effect RF power transistor. It is used for 50 V DC large signal applications up to 150 MHz. The SD2943 offers a 20% higher power saturation than the SD2933, and is ideal for ISM applications where reliability and ruggedness are critical factors. Table 1: Device summary Order code Marking Package Packing SD2943W SD2943(1) M177 Plastic tray Notes: (1)For more details please refer to Section 6: "Marking, packing and shipping specifications" . December 2016 DocID11584 Rev 5 This is information on a product in full production. 1/13 www.st.com Contents SD2943 Contents 1 Electrical data .................................................................................. 3 1.1 Maximum ratings ............................................................................... 3 1.2 Thermal data ..................................................................................... 3 2 Electrical characteristics ................................................................ 4 3 Impedance data ............................................................................... 5 4 Typical performance ....................................................................... 6 5 Test circuit (175 MHz) ...................................................................... 8 6 7 Marking, packing and shipping specifications............................ 10 Package information ..................................................................... 11 7.1 8 2/13 M177 (.550 DIA 4L NHERM WFLG) package information .............. 11 Revision history ............................................................................ 12 DocID11584 Rev 5 SD2943 Electrical data 1 Electrical data 1.1 Maximum ratings TCASE = 25 °C Table 2: Absolute maximum ratings Symbol Value Unit Drain source voltage 130 V VDGR Drain-gate voltage (RGS = 1 MΩ) 130 V VGS Gate-source voltage ±40 V ID Drain current 40 A PDISS Power dissipation 648 W TJ Max. operating junction temperature +200 °C EAS Avalanche energy, single pulse (ID = 53 A, 800 μH coil) 1100 mJ TSTG Storage temperature -65 to +150 °C Value Unit 0.27 °C/W V(BR)DSS(1) Parameter Notes: (1)T 1.2 J = 150 °C Thermal data Table 3: Thermal data Symbol RthJC Parameter Junction-to-case thermal resistance DocID11584 Rev 5 3/13 Electrical characteristics 2 SD2943 Electrical characteristics TCASE = 25 °C Table 4: Static Symbol Test conditions Min. Typ. Max. Unit V(BR)DSS(1) VGS = 0 V IDS = 200 mA IDSS VGS = 0 V VDS = 50 V 200 µA IGSS VGS = 20 V VDS = 0 V 500 nA VGS(Q) VDS = 10 V ID = 250 mA 4 V VDS(ON) VGS = 10 V I D = 20 A 2 V GFS VDS = 10 V CISS VGS = 0 V VDS = 50 V f = 1 MHz 830 pF COSS VGS = 0 V VDS = 50 V f = 1 MHz 470 pF CRSS VGS = 0 V VDS = 50 V f = 1 MHz 35 pF 130 V 2 I D = 10 A 10 mho Notes: (1)T J = 150 °C Table 5: Dynamic Symbol Test conditions POUT VDD = 50 V IDQ = 250 mA GPS VDD = 50 V f = 30 MHz IDQ = 250 mA POUT = 350 W ηD VDD = 50 V f = 30 MHz IDQ = 250 mA POUT = 350 W Load mismatch VDD = 50 V IDQ = 250 mA f = 30 MHz All phase angles f = 30 MHz Min. Typ. 350 450 W 22 25 dB 60 65 % Unit POUT = 350 W VSWR 3:1 Table 6: GFS sorts 4/13 Max. Symbol Value A 10 to 10.99 B 11 to 11.99 C 12 to 12.99 D 13 to 13.99 E 14 to 14.99 F 15 to 15.99 G 16 to 16.99 H 17 to 18 DocID11584 Rev 5 SD2943 3 Impedance data Impedance data Figure 2: Impedance data Table 7: Impedance data f ZIN(Ω) ZDL(Ω) 30 MHz 1.3 - j 2.9 3.1 + j 2.3 108 MHz 1.4 - j 2.4 1.9 + j 1.4 175 MHz 1.4 - j 2.2 1.7 + j 1.6 DocID11584 Rev 5 5/13 Typical performance 4 SD2943 Typical performance Figure 3: Capacitance vs. drain voltage Figure 4: Drain current vs. gate voltage Figure 5: Gate-source voltage vs. case temperature Figure 6: Maximum thermal resistance vs. case temperature 6/13 DocID11584 Rev 5 SD2943 Typical performance Figure 7: Output power vs. input power Figure 8: Output power vs. input power (at different temperature) Figure 9: Power gain vs. output power Figure 10: Efficiency vs. output power Figure 11: Output power vs. supply voltage Figure 12: Output power vs. gate voltage DocID11584 Rev 5 7/13 Test circuit (175 MHz) 5 SD2943 Test circuit (175 MHz) Figure 13: 30 MHz test circuit schematic Dimensions at component symbols are references for component placement. Gap between ground and transmission files are 0.056[1.42] (typ.). Transmission line is not 1:1 scale. Input and output transmission line are 50 Ω. Table 8: 30 MHz test circuit part list Component 8/13 Description C1, C9 0.01 μF / 500 V surface mount ceramic chip capacitor C2, C3 750 pF ATC 700B surface mount ceramic chip capacitor C4 300 pF ATC 700B surface mount ceramic chip capacitor C5, C10, C11, C14, C16 10000 pF ATC 200B surface mount ceramic chip capacitor C6 510 pF ATC 700B surface mount ceramic chip capacitor C7 300 pF ATC 700B surface mount ceramic chip capacitor C8 175-680 pF type 46 standard trimmer capacitor C12 47 μF / 63 V aluminum electrolytic radial lead capacitor C13 1200 pF ATC 700B surface mount ceramic chip capacitor C15 100 μF / 63 V aluminum electrolytic radial lead capacitor R1, R3 1 kΩ 1 W surface mount chip resistor R2 560 Ω 2 W wire-wound axil lead resistor T1 HF 2-30 MHz surface mount 9:1 transformer T2 RG - 142B/U 50 Ω coaxial cable OD = 0.165[4.18] L 15”[381.00] covered with 15”[381.00] tinned copper tubular brand 13/65” [5.1] width L1 1 3/4 turn air-wound 16 AWG ID = 0.219 [5.56] poly-coated magnet wire L2 1 3/4 turn air-wound 12 AWG ID = 0.250 [6.34] bus bar wire RFC1, RFC2 3 turns 14 AWG wire through fair rite toroid FB1 Surface mount shield bead DocID11584 Rev 5 SD2943 Test circuit (175 MHz) Component Description FB2 Toroid PCB ULTRALAM 2000. 0.030” THK, εr = 2.55, 2 Oz ED CU both sides Figure 14: 30 MHz test circuit Both the SD2933 and the SD2943 device use the same PCB. Figure 15: 30 MHz test circuit photomaster DocID11584 Rev 5 9/13 Marking, packing and shipping specifications 6 SD2943 Marking, packing and shipping specifications Table 9: Packing and shipping specifications Order code Packing Pieces per tray Dry pack humidity GFS code Lot code SD2943W Plastic tray 25 < 10% Not mixed Not mixed Figure 16: SD2943 marking layout Table 10: Marking specifications Symbol W Wafer process code X GFS sort CZ Assembly plant xxx Last 3 digits of diffusion lot VY Diffusion plant MAR CZ 10/13 Description Country of origin Test and finishing plant y Assembly year yy Assembly week DocID11584 Rev 5 SD2943 7 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 M177 (.550 DIA 4L NHERM WFLG) package information Figure 17: M177 (.550 DIA 4L N/HERM W/FLG) package outline Table 11: M177 (.550 DIA 4L N/HERM W/FLG) package mechanical data mm Dim. Min. Typ. Max. A 5.72 B 6.73 5.97 6.96 C 21.84 22.10 D E 28.70 13.84 28.96 14.10 F 0.08 0.18 G 2.49 2.74 H 3.81 4.32 I J K 7.11 27.43 15.88 DocID11584 Rev 5 28.45 16.13 11/13 Revision history 8 SD2943 Revision history Table 12: Document revision history 12/13 Date Revision Changes 18-Oct-2005 1 First issue. 04-Jan-2006 2 Complete version. 24-Aug-2011 3 Inserted Chapter 7: Marking, packing and shipping specifications. Minor text changes. 10-Aug-2015 4 Updated Table 2.: Absolute maximum rating. Minor text changes. 02-Dec-2016 5 Updated Table 2: "Absolute maximum ratings". Minor text changes. DocID11584 Rev 5 SD2943 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved DocID11584 Rev 5 13/13