SD4933

SD4933 HF/VHF/UHF RF power N-channel MOSFET Datasheet - production data Features • Improved ruggedness V(BR)DSS > 200 V • Excellent thermal stability • 20:1 all phases load mismatch capability • POUT = 300 W min. with 24 dB gain @ 30 MHz • In compliance with the 2002/95/EEC European directive M177 Epoxy sealed Description The SD4933 is an N-channel MOS field-effect RF power transistor. It is intended for use in 50 V ISM applications up to 100 MHz. Figure 1. Pin connection 4 1 5 3 2 1. Drain 3. Gate 2. Source 4. Source 5. Source Table 1. Device summary Order code Marking Base qty. Package Packaging SD4933 SD4933(1) 25 pcs M177 Plastic tray 1. For more details please refer to Chapter 9: Marking, packing and shipping specifications. May 2017 This is information on a product in full production. DocID15487 Rev 9 1/17 www.st.com Contents SD4933 Contents 1 2 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Impedance data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Typical performance (30 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.1 Test circuit (30 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 Circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7 VGS/GFS sorts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 9 Marking, packing and shipping specifications . . . . . . . . . . . . . . . . . . . 15 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2/17 DocID15487 Rev 9 SD4933 Electrical data 1 Electrical data 1.1 Maximum ratings (TCASE = 25 °C) Table 2. Absolute maximum ratings Symbol Value Unit Drain source voltage 200 V Drain-gate voltage (RGS = 1 MΩ) 200 V Gate-source voltage ±20 V Drain current 40 A Power dissipation 648 W EAS Avalanche energy Single pulse (ID = 56 A - 800 µH coil) 1200 mJ TJ Max. operating junction temperature 200 °C -65 to +150 °C Value Unit 0.27 °C/W V(BR)DSS VDGR VGS ID PDISS TSTG 1.2 Parameter Storage temperature Thermal data Table 3. Thermal data Symbol RthJC Parameter Junction - case thermal resistance DocID15487 Rev 9 3/17 17 Electrical characteristics 2 SD4933 Electrical characteristics TCASE = +25 oC 2.1 Static Table 4. Static Symbol 2.2 Test conditions Min Typ 200 240 Max Unit V(BR)DSS VGS = 0 V IDS = 100 mA IDSS VGS = 0 V VDS = 100 V IGSS VGS = 20 V VDS = 0 V VGS(Q) VDS = 10 V ID = 250 mA VDS(ON) VGS = 10 V ID = 20 A GFS VDS = 10 V ID = 5 A CISS VGS = 0 V VDS = 50 V f = 1 MHz 1000 pF COSS VGS = 0 V VDS = 50 V f = 1 MHz 400 pF CRSS VGS = 0 V VDS = 50 V f = 1 MHz 16 pF 2.5 3.5 8 V 2 mA 500 nA 3.75 V 4.0 V 14 S Dynamic Table 5. Dynamic Symbol Test conditions Min Max Unit - W POUT VDD = 50 V IDQ = 250 mA f = 30 MHz 300 GPS VDD = 50 V IDQ = 250 mA POUT = 300 W f = 30 MHz 20 24 - dB hD VDD = 50 V IDQ = 250 mA POUT = 300 W f = 30 MHz 50 58 - % 10:1 20:1 - VSWR VDD = 50 V IDQ = 250 mA POUT = 300 W f = 30 MHz Load mismatch All phase angles 4/17 Typ DocID15487 Rev 9 SD4933 3 Impedance data Impedance data Figure 2. Impedance data ' ='/ 7\SLFDO'UDLQ /RDG,PSHGDQFH 7\SLFDO,QSXW ,PSHG DQFH * =,1 6 $09 Table 6. Impedance values Zin Zdl 1.6 - j 5.0 3.3 + j 1.0 DocID15487 Rev 9 5/17 17 Typical performance 4 SD4933 Typical performance Figure 3. Capacitance vs. drain voltage Figure 4. Drain current vs. drain-source voltage 35 1200 30 1000 25 800 Cgs Cgd Ids (A) Capacitance (pF) 1400 Cds 600 20 15 400 10 200 5 0 0 0 10 20 30 40 50 0 AM09243V1 Figure 5. Drain current vs. drain-source voltage at different temperatures 40 35 25°C 30 80°C -20°C Ids (A) 25 20 15 10 5 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Vgs (V) AM09245V1 6/17 2 4 6 8 10 Vds (V) Drain-source voltage (V) DocID15487 Rev 9 AM09244V1 SD4933 Typical performance Figure 6. Transient thermal impedance Single -repetitive pulse single pulse 10% 20% 0.25 30% Thermal Impedance - ZTH J -C (°C / W) 0.30 40% 0.20 50% 60% 0.15 0.10 0.05 0.00 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Rectangular power pulse Width (s) AM09280V2 DocID15487 Rev 9 7/17 17 Typical performance SD4933 Figure 7. Transient thermal impedance model 'LVVLSDWHG3RZHU:DWWV 5 5 5  2KP & & &  ) 5 5 5  2KP & & &  ) 5 5 5 2KP & & &  ) 5 5 5 2KP & & &  ) $09 8/17 DocID15487 Rev 9 SD4933 Typical performance (30 MHz) 5 Typical performance (30 MHz) 80 26 70 24 60 22 50 20 40 30 18 Pgain Figure 9. Output power vs. input power Pout (W) 28 Efficiency (%) Power gain (dB) Figure 8. Gain and efficiency vs. output power_Vdd = 50 V, Idq = 250 mA, freq = 30 MHz Efficiency 20 16 14 0 50 100 150 200 250 300 350 400 450 400 350 300 250 200 150 100 50 0 10 450 0.0 50 V 40 V 0.5 1.0 1.5 2.0 2.5 Output Power (W) AM09248V2 3.5 AM09246V1 Figure 10. Output power vs. supply voltage Figure 11. Output power vs. gate voltage 400 500 Pin = 2.8W 350 400 300 Pout (W) Pout (W) 3.0 Pin (W) 250 200 150 Pin = 2.8W 300 200 100 Pin = 1.4W 0 100 25 30 35 40 45 50 -3 -2 -1 0 1 2 3 4 Vgs (V) Vdd (V) AM09247V1 DocID15487 Rev 9 AM09248V1 9/17 17 Typical performance (30 MHz) 5.1 SD4933 Test circuit (30 MHz) Figure 12. 30 MHz test circuit schematic Table 7. Transmission line dimensions 10/17 Dim. Inch mm A 0.532 13.51 B 0.250 6.35 C 0.181 4.59 D 0.383 9.37 E 0.351 8.91 F 0.633 16.08 G 0.477 12.12 H 0.438 11.12 J 0.200 5.08 K 0.164 4.16 L 0.174 4.42 M 0.817 20.75 N 0.350 8.89 P 0.779 19.79 R 0.639 16.23 DocID15487 Rev 9 SD4933 Typical performance (30 MHz) Table 7. Transmission line dimensions (continued) Dim. Inch mm S 0.165 4.19 T 1.017 25.84 U 0.375 9.52 V 0.456 11.58 W 0.325 8.24 X 0.650 16.50 Table 8. 30 MHz test circuit component list Component Description C1,C9 0.01 μF / 500 V surface mount ceramic chip capacitor C2, C3 750 pF ATC 700B surface mount ceramic chip capacitor C4 300 pF ATC 700B surface mount ceramic chip capacitor C5,C10,C11,C14,C16 10000 pF ATC 200B surface mount ceramic chip capacitor C6 510 pF ATC 700B surface mount ceramic chip capacitor C7 300 pF ATC 700B surface mount ceramic chip capacitor C8 175-680 pF type 46 standard trimmer capacitor C12 47 μF / 63 V aluminum electrolytic radial lead capacitor C13 1200 pF ATC 700B surface mount ceramic chip capacitor C15 100 μF / 63 V aluminum electrolytic radial lead capacitor R1,R3 1 kΩ, 1 W surface-mount chip resistor R2 560 Ω 2 W wire-wound axis lead resistor T1 HF 2-30 MHz surface mount 9:1 transformer T2 RG - 142B/U 50 coaxial cable OD = 0.165[4.18] L 15”[381.00] covered with 15” [381.00] tinned copper tubular brand 13/65” [5.1] width L1 1 3/4 turn air-wound 16 AWG ID = 0.219 [5.56] poly-coated magnet wire L2 1 3/4 turn air-wound 12 AWG ID = 0.250 [6.34] bus bar wire RFC1,RFC2 3 turns 14 AWG wire through ferrite toroid FB1 Surface mount EMI shield bead FB2 Toroid PCB ULTRALAM 2000. 0.030” THK, εr = 2.55, 2 Oz ED CU both sides DocID15487 Rev 9 11/17 17 Circuit layout 6 SD4933 Circuit layout Figure 13. Test fixture component layout SD 4933 Figure 14. Test circuit photomasters 4 12/17 DocID15487 Rev 9 SD4933 7 VGS/GFS sorts VGS/GFS sorts Table 9. VGS/GFS sorts Marking VGS(min) VGS(max) GFS(min) GFS(max) E4 2.50 2.75 8 9 E5 2.50 2.75 9 10 E6 2.50 2.75 10 11 E7 2.50 2.75 11 12 E8 2.50 2.75 12 13 E9 2.50 2.75 13 14 F4 2.75 3.00 8 9 F5 2.75 3.00 9 10 F6 2.75 3.00 10 11 F7 2.75 3.00 11 12 F8 2.75 3.00 12 13 F9 2.75 3.00 13 14 G4 3.00 3.25 8 9 G5 3.00 3.25 9 10 G6 3.00 3.25 10 11 G7 3.00 3.25 11 12 G8 3.00 3.25 12 13 G9 3.00 3.25 13 14 H4 3.25 3.50 8 9 H5 3.25 3.50 9 10 H6 3.25 3.50 10 11 H7 3.25 3.50 11 12 H8 3.25 3.50 12 13 H9 3.25 3.50 13 14 I4 3.50 3.75 8 9 I5 3.50 3.75 9 10 I6 3.50 3.75 10 11 I7 3.50 3.75 11 12 I8 3.50 3.75 12 13 I9 3.50 3.75 13 14 DocID15487 Rev 9 13/17 17 Package mechanical data 8 SD4933 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Table 10. M177 (.550 DIA 4/L N/HERM W/FLG) mechanical data mm. Inch Dim. Min Typ Max Min Typ Max A 5.72 5.97 0.225 0.235 B 6.73 6.96 0.265 0.275 C 21.84 22.10 0.860 0.870 D 28.70 28.96 1.130 1.140 E 13.84 14.10 0.545 0.555 F 0.08 0.18 0.003 0.007 G 2.49 2.74 0.098 0.108 H 3.81 4.32 0.150 0.170 I 7.11 0.280 J 27.43 28.45 1.080 1.120 K 15.88 16.13 0.625 0.635 Figure 15. Package dimensions Controlling dimension: Inches GAPMSMD00039 14/17 DocID15487 Rev 9 SD4933 9 Marking, packing and shipping specifications Marking, packing and shipping specifications Table 11. Packing and shipping specifications Order code Packaging Pcs per tray Dry pack humidity VGS and GFS code Lot code SD4933 Plastic tray 25 < 10% Not mixed Not mixed Figure 16. Marking layout SD4933 Table 12. Marking specifications Symbol X Description VGS and GFS sort CZ Assembly plant xxx Last 3 digits of diffusion lot VY Diffusion plant MAR CZ Country of origin Test and finishing plant y Assembly year yy Assembly week DocID15487 Rev 9 15/17 17 Revision history 10 SD4933 Revision history Table 13. Document revision history 16/17 Date Revision Changes 11-Mar-2009 1 Initial release 24-Feb-2010 2 Updated Table 9: VGS/GFS sorts on page 13. 29-Sep-2010 3 Document status promoted from preliminary to datasheet. 06-Apr-2011 4 Inserted Section 3: Impedance data, Section 4: Typical performance, Section 6: Circuit layout and Section 9: Marking, packing and shipping specifications. 24-May-2011 5 Inserted Figure 6: Transient thermal impedance, Figure 7: Transient thermal impedance model and Section 9: Marking, packing and shipping specifications. 11-Aug-2011 6 – EAS parameter inserted in Table 2: Absolute maximum ratings on page 3. – Minor text changes. 10-Jun-2013 7 – Corrected error in VGS(Q) symbol and test conditions in Table 4: Static. – Minor text edits. 01-Jul-2013 8 – Modified the VGS(Q) and GFS values in Table 4: Static. – Reduced the number of entries in Table 9: VGS/GFS sorts to include only the relevant selection codes. 09-May-2017 9 – Modified the GFS values in Table 4: Static. DocID15487 Rev 9 SD4933 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID15487 Rev 9 17/17 17