SD4933MR
50 V moisture resistant DMOS transistor for ISM applications
Datasheet - production data
Features
• Improved ruggedness V(BR)DSS > 200 V
• Excellent thermal stability
• 20:1 all phases load mismatch capability
• POUT = 300 W min. with 24 dB gain @ 30 MHz
• In compliance with the 2002/95/EEC European
directive
• Moisture resistant package specifically
designed to operate under extreme
environments
M177MR
Epoxy sealed
Description
Figure 1. Pin connection
4
The SD4933MR is an N-channel MOS field-effect
RF power transistor. It is intended for use in 50 V
ISM applications up to 100 MHz.
1
The SD4933MR benefits from the latest
generation of environmentally designed
packaging, ruggedized against cyclic high
moisture operating and severe storage
conditions.
5
3
2
1. Drain
3. Gate
2. Source
4. Source
5. Source
Table 1. Device summary
Order code
Marking
Base qty.
Package
Packaging
SD4933MR
SD4933MR(1)
25 pcs
M177MR
Plastic tray
1. For more details please refer to Chapter 8: Marking, packing and shipping specifications..
May 2017
This is information on a product in full production.
DocID023664 Rev 3
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www.st.com
Contents
SD4933MR
Contents
1
2
Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2
Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Impedance data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5
Typical performance (30 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1
Test circuit (30 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6
Circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7
VGS/GFS sorts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8
Marking, packing and shipping specifications . . . . . . . . . . . . . . . . . . . 14
9
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
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SD4933MR
Electrical data
1
Electrical data
1.1
Maximum ratings
(TCASE = 25 °C)
Table 2. Absolute maximum ratings
Symbol
Value
Unit
Drain source voltage
200
V
Drain-gate voltage (RGS = 1 MΩ)
200
V
Gate-source voltage
±20
V
Drain current
40
A
Power dissipation
648
W
EAS
Avalanche energy
Single pulse (ID = 56 A - 800 µH coil)
1200
mJ
TJ
Max. operating junction temperature
200
°C
-65 to +150
°C
Value
Unit
0.27
°C/W
V(BR)DSS
VDGR
VGS
ID
PDISS
TSTG
1.2
Parameter
Storage temperature
Thermal data
Table 3. Thermal data
Symbol
RthJC
Parameter
Junction - case thermal resistance
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18
Electrical characteristics
2
SD4933MR
Electrical characteristics
(TCASE = 25 oC)
2.1
Static
Table 4. Static
Symbol
2.2
Test conditions
Min
Typ
200
240
Max
Unit
V(BR)DSS
VGS = 0 V
IDS = 100 mA
IDSS
VGS = 0 V
VDS = 100 V
2
mA
IGSS
VGS = 20 V
VDS = 0 V
1
µA
VTH
ID = 250 mA
3.75
V
VDS(ON)
VGS = 10 V
ID = 20 A
4.0
V
GFS
VDS = 10 V
ID = 5 A
14
S
CISS
VGS = 0 V
VDS = 50 V
f = 1 MHz
1000
pF
COSS
VGS = 0 V
VDS = 50 V
f = 1 MHz
400
pF
CRSS
VGS = 0 V
VDS = 50 V
f = 1 MHz
16
pF
2.5
3.5
8
V
Dynamic
Table 5. Dynamic
Symbol
Test conditions
Min
Max
Unit
-
W
POUT
VDD = 50 V
IDQ = 250 mA
f = 30 MHz
300
GPS
VDD = 50 V
IDQ = 250 mA POUT = 300 W f = 30 MHz
20
24
-
dB
hD
VDD = 50 V
IDQ = 250 mA POUT = 300 W f = 30 MHz
50
58
-
%
10:1
20:1
-
VSWR
VDD = 50 V IDQ = 250 mA POUT = 300 W f = 30 MHz
Load
mismatch All phase angles
4/18
Typ
DocID023664 Rev 3
SD4933MR
3
Impedance data
Impedance data
Figure 2. Impedance data
'
='/
7\SLFDO'UDLQ
/RDG,PSHGDQFH
7\SLFDO,QSXW
,PSHG DQFH
*
=,1
6
$09
Table 6. Impedance values
Zin
Zdl
1.6 - j 5.0
3.3 + j 1.0
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Typical performance
4
SD4933MR
Typical performance
Figure 3. Capacitance vs. drain voltage
Figure 4. Drain current vs. drain-source voltage
35
1200
30
1000
25
800
Cgs
Cgd
Ids (A)
Capacitance (pF)
1400
Cds
600
20
15
400
10
200
5
0
0
0
10
20
30
40
50
0
AM09243V1
Figure 5. Drain current vs. drain-source voltage
at different temperatures
40
35
25°C
30
80°C
-20°C
Ids (A)
25
20
15
10
5
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Vgs (V)
AM09245V1
6/18
2
4
6
8
10
Vds (V)
Drain-source voltage (V)
DocID023664 Rev 3
AM09244V1
SD4933MR
Typical performance
Figure 6. Transient thermal impedance
Single -repetitive pulse
single
pulse
10%
20%
0.25
30%
Thermal Impedance - ZTH
J -C
(°C / W)
0.30
40%
0.20
50%
60%
0.15
0.10
0.05
0.00
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
Rectangular power pulse Width (s)
AM09280V2
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Typical performance
SD4933MR
Figure 7. Transient thermal impedance model
'LVVLSDWHG3RZHU:DWWV
5
5
5 2KP
&
&
& )
5
5
5 2KP
&
&
& )
5
5
5 2KP
&
&
& )
5
5
5 2KP
&
&
& )
$09
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SD4933MR
5
Typical performance (30 MHz)
Typical performance (30 MHz)
80
26
70
24
60
22
50
20
40
30
18
Pgain
Figure 9. Output power vs. input power
Pout (W)
28
Efficiency (%)
Power gain (dB)
Figure 8. Gain and efficiency vs. output power
at Vdd = 50 V, Idq = 250 mA, freq = 30 MHz
Efficiency
20
16
14
0
50
100
150
200
250
300
350
400
450
400
350
300
250
200
150
100
50
0
10
450
0.0
50 V
40 V
0.5
1.0
1.5
2.0
2.5
Output Power (W)
AM09248V2
3.5
AM09246V1
Figure 10. Output power vs. supply voltage
Figure 11. Output power vs. gate voltage
400
500
Pin = 2.8W
350
400
300
Pout (W)
Pout (W)
3.0
Pin (W)
250
200
150
Pin = 2.8W
300
200
100
Pin = 1.4W
0
100
25
30
35
40
45
50
-3
-2
-1
0
1
2
3
4
Vgs (V)
Vdd (V)
AM09247V1
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AM09248V1
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18
Typical performance (30 MHz)
5.1
SD4933MR
Test circuit (30 MHz)
Figure 12. 30 MHz test circuit schematic
Table 7. Transmission line dimensions
10/18
Dim.
Inch
mm
A
0.532
13.51
B
0.250
6.35
C
0.181
4.59
D
0.383
9.37
E
0.351
8.91
F
0.633
16.08
G
0.477
12.12
H
0.438
11.12
J
0.200
5.08
K
0.164
4.16
L
0.174
4.42
M
0.817
20.75
N
0.350
8.89
P
0.779
19.79
R
0.639
16.23
DocID023664 Rev 3
SD4933MR
Typical performance (30 MHz)
Table 7. Transmission line dimensions (continued)
Dim.
Inch
mm
S
0.165
4.19
T
1.017
25.84
U
0.375
9.52
V
0.456
11.58
W
0.325
8.24
X
0.650
16.50
Table 8. 30 MHz test circuit component list
Component
Description
C1,C9
0.01 μF / 500 V surface mount ceramic chip capacitor
C2, C3
750 pF ATC 700B surface mount ceramic chip capacitor
C4
300 pF ATC 700B surface mount ceramic chip capacitor
C5,C10,C11,C14,C16
10000 pF ATC 200B surface mount ceramic chip capacitor
C6
510 pF ATC 700B surface mount ceramic chip capacitor
C7
300 pF ATC 700B surface mount ceramic chip capacitor
C8
175-680 pF type 46 standard trimmer capacitor
C12
47 μF / 63 V aluminum electrolytic radial lead capacitor
C13
1200 pF ATC 700B surface mount ceramic chip capacitor
C15
100 μF / 63 V aluminum electrolytic radial lead capacitor
R1,R3
1 K OHM 1 W surface mount chip resistor
R2
560 OHM 2 W wire-wound axils lead resistor
T1
HF 2-30 MHz surface mount 9:1 transformer
T2
RG - 142B/U 50 OHM coaxial cable OD = 0.165[4.18] L 15”[381.00]
covered with 15”[381.00] tinned copper tubular brand 13/65” [5.1] width
L1
1 3/4 turn air-wound 16 AWG ID = 0.219 [5.56] poly-coated magnet wire
L2
1 3/4 turn air-wound 12 AWG ID = 0.250 [6.34] bus bar wire
RFC1,RFC2
3 turns 14 AWG wire through ferrite toroid
FB1
Surface mount EMI shield bead
FB2
Toroid
PCB
ULTRALAM 2000. 0.030” THK, εr = 2.55, 2 Oz ED CU both sides
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Circuit layout
6
SD4933MR
Circuit layout
Figure 13. Test fixture component layout
SD 4933
Figure 14. Test circuit photomasters
4
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SD4933MR
7
VGS/GFS sorts
VGS/GFS sorts
Table 9. VGS/GFS sorts
Marking
VGS(min)
VGS(max)
GFS(min)
GFS(max)
E4
2.50
2.75
8
9
E5
2.50
2.75
9
10
E6
2.50
2.75
10
11
E7
2.50
2.75
11
12
E8
2.50
2.75
12
13
E9
2.50
2.75
13
14
F4
2.75
3.00
8
9
F5
2.75
3.00
9
10
F6
2.75
3.00
10
11
F7
2.75
3.00
11
12
F8
2.75
3.00
12
13
F9
2.75
3.00
13
14
G4
3.00
3.25
8
9
G5
3.00
3.25
9
10
G6
3.00
3.25
10
11
G7
3.00
3.25
11
12
G8
3.00
3.25
12
13
G9
3.00
3.25
13
14
H4
3.25
3.50
8
9
H5
3.25
3.50
9
10
H6
3.25
3.50
10
11
H7
3.25
3.50
11
12
H8
3.25
3.50
12
13
H9
3.25
3.50
13
14
I4
3.50
3.75
8
9
I5
3.50
3.75
9
10
I6
3.50
3.75
10
11
I7
3.50
3.75
11
12
I8
3.50
3.75
12
13
I9
3.50
3.75
13
14
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Marking, packing and shipping specifications
8
SD4933MR
Marking, packing and shipping specifications
Table 10. Packing and shipping specifications
Order code
Packaging
Pcs per
tray
Dry pack
humidity
VGS and GFS
code
Lot code
SD4933MR
Plastic tray
25
< 10%
Not mixed
Not mixed
Figure 15. Marking layout
AM14751V1
Table 11.
14/18
Marking specifications
Symbol
Description
X
VGS and GFS sort
CZ
Assembly plant
xxx
Last 3 digits of diffusion lot
VY
Diffusion plant
MAR
Country of origin
CZ
Test and finishing plant
y
Assembly year
yy
Assembly week
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SD4933MR
9
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 12. M177MR mechanical data
mm
Dim.
Min.
Typ.
Max.
A
5.72
5.97
B
6.73
6.99
C
21.84
22.10
D
28.70
28.96
E
13.34
14.10
F
0.08
0.18
G
2.49
2.74
H
3.81
4.32
I
7.87
J
27.43
28.45
K
15.88
16.13
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Package mechanical data
SD4933MR
Figure 16. M177MR drawing
8410505_A
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SD4933MR
10
Revision history
Revision history
Table 13. Document revision history
Date
Revision
13-Sep-2012
1
Initial release.
22-May-2013
2
Modified: IGSS value in Table 4: Static
3
Document status promoted from preliminary to
production data.
Updated Table 4: Static and Table 9: VGS/GFS sorts.
Minor text changes.
09-May-2017
Changes
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SD4933MR
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improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2017 STMicroelectronics – All rights reserved
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