SERC816/TR

SERCON816 SERCOS INTERFACE CONTROLLER ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Single-chip controller for SERCOS interface Real time communication for industrial control systems 8/16-bit bus interface, Intel and Motorola control signals Dual port RAM with 2048 word *16-bit Data communications via optical fiber rings, RS 485 rings and RS 485 busses Maximum transmission rate of 16 Mbaud with internal clock recovery Internal repeater for ring connections Full duplex operation Modulation of power of optical transmitter diode Automatic transmission of synchronous and data telegrams in the communication cycle Flexible RAM configuration, communication data stored in RAM (single or double buffer) or transfer via DMA Synchronization by external signal PQFP100 ORDERING NUMBERS: SERC816 SERC816/TR ■ ■ ■ ■ ■ Timing control signals Automatic service channel transmission Watchdog to monitor software and external synchronization signals Compatible mode to SERCON410B SERCOS interface controller 100-pin plastic flat-pack casing Figure 1. SERCON816 Block Diagram WRN D[15:0] RDN ADMUX BUSMODE[1:0] BUSWIDTH BYTEDIR A[15:0] ALEL ALEH BUSYN MCSN0/1 PCSN0 BHEN PCS1 bus interfac e interrupt INT0/1 c loc k reset SCLK SCLKO2/4 MCLK RSTN DMAREQR/T DMAACKNR/T DMA watc hdog telegramproc essing SBAUD SBAUD16 TM0/1 serial RxC RxD timingc ontrol interfac e WDOGN CYC_CLK CON_CLK DIV_CLK L_ERRN RECACTN IDLE TxC TxD[6:1] optical transm itter/ receiver or RS-485 bus drive January 2003 1/23 SERCON816 1 2 3 4 5 6 2/23 TABLE OF CONTENTS GENERAL DESCRIPTION.................................................................................................................3 Pin Description ...................................................................................................................................5 Electrical (DC and AC) Characteristics ..............................................................................................7 3.1 Absolute Maximum Ratings .....................................................................................................7 3.2 Recommended Operating Conditions ......................................................................................8 3.3 ELECTRICAL CHARACTERISTCS ........................................................................................8 3.4 Power Dissipation ....................................................................................................................9 3.4.1 Power Dissipation Considerations....................................................................................9 3.5 AC Electrical Characteristics..................................................................................................10 3.5.1 Clock Input MCLK...........................................................................................................10 3.5.2 Clock Input SCLK ...........................................................................................................11 3.5.3 Address Latch.................................................................................................................11 3.5.4 Read Access of Control Registers..................................................................................12 3.5.5 Read Access of Dual Port RAM .....................................................................................13 3.5.6 Write Access to Control Registers..................................................................................14 3.5.7 Write Access to DUAL Port RAM ...................................................................................15 Control Registers and RAM Data Structures....................................................................................16 4.1 Control Register Addresses ...................................................................................................16 4.2 Data Structures within the RAM .............................................................................................16 4.2.1 Telegram Headers..........................................................................................................16 4.2.2 Data Containers..............................................................................................................17 4.2.3 End Marker .....................................................................................................................18 4.2.4 Service Containers .........................................................................................................18 Additional Specifications, Tools and Support ...................................................................................21 5.1 Additional Specifications ........................................................................................................21 5.2 Hardware and Software Components ....................................................................................21 5.3 Tools ......................................................................................................................................21 Package Mechanical Data: SERCON816 100 Pin Plastic Quad Flat Pack Package (PQFP100) ...............................................22 SERCON816 1 GENERAL DESCRIPTION The SERCOS interface controller SERCON816 is an integrated circuit for SERCOS interface communication systems. The SERCOS interface is a digital interface for communication between systems which have to exchange information cyclically at short, fixed intervals (62,5 s to 65 ms). It is appropriate for the synchronous operation of distributed control or test equipment (e.g. connection between drives and numeric control). A SERCOS interface communication system consists of one master and several slaves. These units are connected by a fiber optical ring. This ring starts and ends at the master. The slaves regenerate and repeat their received data or send their own telegrams. By this method the telegrams sent by the master are received by all slaves while the master receives data telegrams from the slaves. The optical fiber assures a reliable high-speed data transmission with excellent noise immunity. The SERCOS interface controller contains all the hardware-related functions of the SERCOS interface and considerably reduces the hardware costs and the computing time requirements of the microprocessor. It is the direct link between the electro-optical receiver and transmitter and the microprocessor that executes the control algorithms. The SERCON816 can be used both for SERCOS interface masters and slaves. The circuit contains the following functions (Fig. 1): – Interface to the microprocessor with a data bus width of 8 or 16 bits and with control lines according to Intel or Motorola standards. – A serial interface for making a direct connection with the optical receiver and transmitter of the fiber optic ring or with drivers to an electric ring or bus. Data and clock regeneration, the repeater for ring topologies and the serial transmitter and receiver are integrated. The signals are monitored and test signals generated. The serial interface operates up to 16 Mbaud without external circuitry. – A dual port RAM (2048 * 16 bit) for control and communication data. The organization of the memory is flexible. – Telegram processing for automatic transmission and monitoring of synchronous and data telegrams. Only transmission data which is intended for the particular interface user is processed. The transmitted data is either stored in the internal RAM (single or double buffer) or transferred via direct memory access (DMA). The transmission of service channel information over several communication cycles is executed automatically. In addition to the SERCOS interface the SERCON816 can also be used for other real-time communications tasks. As an alternative to the fiber optical ring also bus topologies with RS-485 signals are supported (Fig. 4). The SERCON816 is therefore suitable for a wide range of applications. Remark: The SERCON816 is based on the former SERCON410B SERCOS interface controller. 80 D12 D13 D14 D15 VDD 75 BHEN A0 A1 A2 A3 70 VSS A4 A5 A6 A7 65 VDD A8 A9 A10 A11 60 VSS A12 A13 A14 A15 55 VDD ALEL ALEH WRN 51 RDN Figure 2. SERCON816 Pin Configuration SERCON816 50 VSS PCS1 PCSN0 MCSN1 MCSN0 45 BUSYN INT0 INT1 VSS DMAACKTN 40 DMAACKRN DMAREQT DMAREQR VDD DIV_CLK 35 CON_CLK CYC_CLK VSS L_ERRN 31 TM1 VDD 1 SCLK VSS MCLK SCLK04 5 SCLK02 TEST VDD NDTRO RSTN 10 OUTZ RxC TxC RxD VSS 15 TxD1 TxD2 TxD3 VDD TxD4 20 TxD5 TxD6 VSS WDOGN IDLE 25 RECACTN VDD SBAUD16 SBAUD TM0 30 VSS 81 D11 D10 D9 D8 85 VDD D7 D6 D5 D4 90 VSS D3 D2 D1 D0 95 ADMUX BUSMODE0 BUSMODE1 BUSWIDTH BYTDIR 100 3/23 SERCON816 Figure 3. SERCON816 with Ring Connection (SERCOS interface) µP bus interfac e SERCON816 m aster fibre RxD TxD optical RxD SERCON816 ring RxD TxD SERCON816 TxD SERCON816 bus interfac e bus interfac e bus interfac e µP µP µP slave 1 slave slave 2 Figure 4. SERCON816 with RS-485 bus connection µP bus interfac e SERCON816 m a ster IDLE IDLE IDLE IDLE SERCON816 SERCON816 SERCON816 b us b us bus interfa c e µP interfa ce µP interfac e µP SERCRING.CDR sla ve 4/23 1 slave 2 slave n n SERCON816 2 PIN DESCRIPTION Table 1. SERCON816 I/O Port Function Summary Signal(s) Pin(s) IO Function D15-0 77-80, 82-85, 87-90, 92-95 I/O Data bus: for 8-bit-wide bus interfaces, data is written to and read via D7-0, for 16-bit-wide bus interfaces via D15-0. When ADMUX is 1, the address which is stored in the address latch with ALEL and ALEH is input via D15-0. ALEL, ALEH 54, 53 I Address latch enable, low and high, active high: they are only used when ADMUX is 1. When ALEL/ALEH is 1, the signals go from the data bus to the address bus, when ALEL/ALEH = 0, they store the address. When ADMUX is 0, ALEL/ALEH have to be connected to VDD. RDN 51 I Read: for the Intel bus interface, data is read when RDN is 0. For the Motorola bus interface, data is read or written to when RDN is 0 (BUSMODE1 = 0) or RDN is 1 (BUSMODE1 = 1). WRN 52 I Write: for the Intel bus interface, data is written to when WRN is 0. For the Motorola bus interace, WRN selects read (WRN = 1) and write (WRN = 0) operations of the data bus. BHEN 75 I Byte high enable, active low: in the 16-bit bus mode, data is transferred via D15-8 when BHEN is 0. MCSN0, MCSN1 46,47 I Memory chip select, active low: to access the internal RAM MCSN0 and MCSN1 must be 0. PCSN0, PCS1 48,49 I Periphery chip select, active low (PCSN0) and active high (PCS1): to access the control registers PCSN0 must equal 0 and PCS1 must equal 1. BUSYN 45 O RAM busy, active low: becomes active if an access to an address of the dual port RAM is performed simultaneously to an access to the same memory location by the internal telegram processing. DMAREQR 38 O DMA request receive, active high: becomes active if data from the receive FIFO can be read. At the beginning of the read operation of the last word of the receive FIFO, DMAREQR becomes inactive. DMAACKRN 40 I DMA acknowledge receive, active low: when DMAACKRN is 0, the receive FIFO is read, independent of the levels on A6-1 and the chip select signals. DMAREQT 39 O DMA request transmit, active high: becomes active when data can be written to the transmit FIFO. DMAREQT becomes inactive again at the beginning of the last write access to the transmit FIFO. DMAACKTN 41 I DMA acknowledge transmit, active low: when DMAACKTN is 0, the transmit FIFO is written to when there is a bus write access independent of the levels on A6-1 and the chip select signals. ADMUX 96 I Address data bus: when ADMUX is 0 A15-0 are the address inputs, when ADMUX is 1 A15-0 are the outputs of the address latch. BUSMODE0, BUSMODE1 97,98 I Bus mode: BUSMODE0 = 0 turns on the Intel bus interface (RDN = read, WRN = write), BUSMODE0 = 1 selects the Motorola interface (RDN = data strobe, WRN = read/write). BUSMODE1 selects the 0-active data strobe (BUSMODE1 = 0) or the 1-active data strobe (BUSMODE1 = 1). BUSWIDTH 99 I Bus width: selects the 8-bit- (0) or the 16-bit-wide interface (1). BYTEDIR 100 I Byte address sequence: when BYTEDIR is 0, A0 = 0 addresses the lower 8 bits of a word (low byte first), when BYTEDIR is 1, the upper 8 bits of a word are addressed (high byte first). INT0, INT1 44,43 O Interrupts, active low or active high. Interrupt sources and signal polarity are programmable. SBAUD16 28 I Baud rate and SERCON410B compatible mode: SBAUD and SBAUD16 selects the baud rate for the serial interface. If SBAUD16 is ‘1’ the SERCON410B compatible mode is selected. SBAUD 29 I Baud rate. Can be overwritten by the microprocessor. 5/23 SERCON816 Table 1. SERCON816 I/O Port Function Summary (continued) Signal(s) Pin(s) IO Function RxD 14 I Receive data for the serial interface. RxC 12 O Receive clock for the serial interface. Output of the internally generated receive clock. RECACTN 26 O Receive active, active low. Indicates that the serial receiver is receiving a telegram. TxD1 16 O Transmit data. The pin can be switched to a high impedance state. TxD6-2 22,21,20, 18,17 O Transmit data or output port. The pins either output the serial data or can be used as parallel output ports. When they output transmit data, each pin can be switched to a high impedance state individually. TxC 13 O Transmit clock for the serial interface. Output for the internally generated transmit clock. IDLE 25 O Transmitter active, active low. When transmitting own data IDLE is 0. DMAREQT 39 O DMA request transmit, active high: becomes active when data can be written to the transmit FIFO. DMAREQT becomes inactive again at the beginning of the last write access to the transmit FIFO. DMAACKTN 41 I DMA acknowledge transmit, active low: when DMAACKTN is 0, the transmit FIFO is written to when there is a bus write access independent of the levels on A6-1 and the chip select signals. ADMUX 96 I Address data bus: when ADMUX is 0 A15-0 are the address inputs, when ADMUX is 1 A15-0 are the outputs of the address latch. BUSMODE0, BUSMODE1 97,98 I Bus mode: BUSMODE0 = 0 turns on the Intel bus interface (RDN = read, WRN = write), BUSMODE0 = 1 selects the Motorola interface (RDN = data strobe, WRN = read/write). BUSMODE1 selects the 0-active data strobe (BUSMODE1 = 0) or the 1-active data strobe (BUSMODE1 = 1). BUSWIDTH 99 I Bus width: selects the 8-bit- (0) or the 16-bit-wide interface (1). BYTEDIR 100 I Byte address sequence: when BYTEDIR is 0, A0 = 0 addresses the lower 8 bits of a word (low byte first), when BYTEDIR is 1, the upper 8 bits of a word are addressed (high byte first). INT0, INT1 44,43 O Interrupts, active low or active high. Interrupt sources and signal polarity are programmable. SBAUD16 28 I Baud rate and SERCON410B compatible mode: SBAUD and SBAUD16 selects the baud rate for the serial interface. If SBAUD16 is ‘1’ the SERCON410B compatible mode is selected. SBAUD 29 I Baud rate. Can be overwritten by the microprocessor. RxD 14 I Receive data for the serial interface. RxC 12 O Receive clock for the serial interface. Output of the internally generated receive clock. RECACTN 26 O Receive active, active low. Indicates that the serial receiver is receiving a telegram. TxD1 16 O Transmit data. The pin can be switched to a high impedance state. TxD6-2 22,21,20, 18,17 O Transmit data or output port. The pins either output the serial data or can be used as parallel output ports. When they output transmit data, each pin can be switched to a high impedance state individually. TxC 13 O Transmit clock for the serial interface. Output for the internally generated transmit clock. IDLE 25 O Transmitter active, active low. When transmitting own data IDLE is 0. TM0, TM1 30,31 I Turn on test generator: TM0 = 0 switches TxD1-6 to contiuous signal light, TM1 = 0 switch-over to zero bit stream. The processor can overwrite the level of TM1-0. Select repeater mode at reset time: TM1=0 and TM2=0 repeater off, all other repeater on. 6/23 SERCON816 Table 1. SERCON816 I/O Port Function Summary (continued) 3 Signal(s) Pin(s) IO Function WDOGN 24 O Watchdog output (active low) L_ERRN 32 O Line error, active low: goes low when signal distortion is too high or when the receive signal is missing. The operating mode is programmed by the processor. CYC_CLK 34 I SERCOS interface cycle clock: CYC_CLK synchronizes the communication cycles. The polarity is programmable. CON_CLK 35 O Control clock: becomes active within a communication cycle. Time, polarity and width are programmable. DIV_CLK 36 O Divided control clock: becomes active several times within a communication cycle or once in several communication cycles. Number of pulses, start time, repetition rate and polarity are programmable, the pulse width is 1 µs. SCLK 2 I Serial clock for clock regeneration: the maximum frequency is 64 MHz. SCLKO2 6 O Clock output: outputs the SCLK clock divided by 2 or 1. SCLKO4 5 O Clock output: outputs the SCLK clock divided by 4 or 2. MCLK 4 I Master clock for telegram processing and timing control, frequency 12 to 64 MHz. RSTN 10 I Reset, active low. Must be zero for at least 50 ns after power on. TEST 7 I Test, active high. Has to be tied to VSS. OUTZ 11 I Puts outputs into high impedance state, active high: OUTZ is 1 puts all pins into a high impedance state. The clocks are turned off and the circuit is reset. For the in-circuit test and for turning on the power-down mode. NDTRO 9 O NAND tree output. For the test at the semiconductor manufacturers and for the connection test after board production. NDTRO is not set to a high impedance state. VSS 3,15,23,33 ,42,50,60, 70,81,91 Ground pins: VDD 1,8,19,27, 37,55,65, 76,86 Power supply +5 V ± 5%. ELECTRICAL (DC AND AC) CHARACTERISTICS 3.1 Absolute Maximum Ratings Symbol VDD Parameter Supply voltage Value Unit -0.5 to 6.5 V VI Input voltage -0.5 to VDD + 0.5 V VO Output voltage -0.5 to VDD + 0.5 V -55 to +150 °C TSTG Storage temperature 7/23 SERCON816 3.2 Recommended Operating Conditions Symbol Parameter Min. Max. Unit TA Operating temperature -40 85 °C TJ Chip junction temperature -40 125 °C VDD Operating supply voltage 4.75 5.25 V fSCLK Clock frequency SCLK 321 64 MHz fMCLK Clock frequency MCLK 122 64 MHz Notes: 1. Only if PLL is used (SBAUD16=0) 2. For normal operation, during testing fMCLK = 0 is possible 3.3 ELECTRICAL CHARACTERISTCS (VDD = 5V ± 5% Tamb = -40 °C to +85 °C, unless otherwise specified) Symbol Parameter Test Condition Min. VIL Low level input voltage (TTL) All inputs VIH High level input voltage (TTL) All inputs 2.0 Vhyst Schmitt trigger hysteresis L_ERRN, TXD6-1, MCLK, SCLK, RSTN, ADMUX, BUSMODE1-0, BUSWIDTH, BYTEDIR, TM1-0, SBAUD16, SBAUD, TEST, OUTZ, RXD, CYC_CLK 0.4 IIL Low level input current with pullup D15-0, A15-0, TXD6-1, ADMUX, BUSMODE1-0, BYTEDIR, TM10, SBAUD16, SBAUD, TEST, OUTZ, RXD, CYC_CLK, BHEN, MCSN1-0, PCSN0, PCS1, DMAACKTN, DMAACKRN VI = VSS -40 IIH High level input current with pulldown MCLK, SCLK, RSTN, ALEH, ALEL VI = VDD Rup Equivalent pull-up resistance Rdn Typ. Max. Unit 0.8 V V 0.7 V -100 -240 µA 40 100 240 µA VI = VSS 23 50 112.5 KOhm Equivalent pull-down resistance VI = VDD 23 50 112.5 KOhm VOL Low level output voltage, all Oand I/O-pins except TXD6-1, L_ERRN IOI = -4 mA 0.4 V VOH High level output voltage, all Oand I/O-pins except TXD6-1, L_ERRN IOH = +4 mA 8/23 2.4 V SERCON816 3.3 ELECTRICAL CHARACTERISTCS (continued) (VDD = 5V ± 5% Tamb = -40 °C to +85 °C, unless otherwise specified) Symbol Parameter Test Condition Min. Typ. Max. Unit 0.4 V 1 µA VOL Low level output voltage, pins TXD6-1, L_ERRN IOI = -8 mA VOH High level output voltage, pins TXD6-1, L_ERRN IOH = +8 mA IOZ Tri-state output leakage VO = 0 V or VDD IKLU I/O latch-up current VVDD 200 mA VESD Electrostatic protection Leakage < 1 µA, human body model 2000 V CPIN Pin capacitance 2.4 10 pF 3.4 Power Dissipation (VDD = 5V ± 5% Tamb = -40 °C to +85 °C, unless otherwise specified) Symbol Parameter Test Condition PD Power dissipation 16 Mbaud, MCLK=64 MHz PDA Maximum allowed power dissipation TA=+85°, no air flow Min. Typ. Max. Unit mW 8501 1000 mW Notes: 1. estimated 3.4.1 Power Dissipation Considerations Most of the current consumed by CMOS devices is alternate current (AC) which is charging and discharging the capacitances of the pins and internal nodes. The current consumption rises with the frequency at which the pins and internal nodes will toggle and with the capacitances connected to the pins of the device: P = f · C · V2 (C=capacitance, V=voltage, f=frequency) For applications which require low power consumption or exceeds the maximum allowed power consumption the following is required: – Connect unused pins to pull-up or pull-down resistors – Minimize the capacitive load on the pins – Reduce clock frequency of SCLK and MCLK – Minimize accesses to the internal RAM and control registers The maximum allowed power consumption is limited by the maximum allowed chip junction temperature and by the number of VCC/VDD pins. The chip junction temperature is influenced by the ambient temperature and the package thermal resistance. The ambient temperature could be influenced by the application through a good temperature management like heat sinks or ambient air cooling. 9/23 SERCON816 Typical current consumption: measured at 5V (VCC/VDD) and 25°C Mode fSCLK (MHz) fMCLK (MHz) Current (mA) 410B 64 32 30 816 64 32 80 3.5 AC Electrical Characteristics (Cload = 50 pF, VDD = 5 V ± 5% Tamb = -40 °C to +85 °C) 3.5.1 Clock Input MCLK Figure 5. Timing of clock MCLK and related outputs 1 / fMCLK tMCLK0 tMCLK1 MCLK DMAREQR/T CON_CLK, DIV_CLK Symbol tMCLD Parameter Min. Typ. Max. Unit 64 MHz fMCLK Clock frequency MCLK 12 tMCLK0 MCLK low 6 ns tMCLK1 MCLK high 6 ns tMCLD Output delay rising edge MCLK to DMAREQR/T, CON_CLK, DIV_CLK fMCLK Baudrate 2 Mbit/s fMCLK Baudrate 4 Mbit/s 10/23 20 ns 12 64 MHz 12 64 MHz SERCON816 3.5.2 Clock Input SCLK Figure 6. Timing of Clock SCLK 1 / fSCLK tSCLK0 tSCLK1 SCLK Symbol fSCLK Parameter Min. Typ. Max. Unit 64 MHz 64 MHz Clock frequency SCLK PLL used (SBAUD16=0) 32 PLL unused (SBAUD16=1) tSCLK0 SCLK low 6 ns tSCLK1 SCLK high 6 ns 3.5.3 Address Latch Figure 7. Address Latch tALEW ALEH, ALEL tALESU tALEHD D15-0 tDA A15-0 Symbol Parameter Min. Typ. Max. Unit TALEW Pulse width ALEL, ALEH 10 ns TALESU Setup time D15-0 to falling edge ALEH, ALEL 5 ns TALEHD hold time falling edge ALEH, ALEL to D15-0 5 ns tDA Delay from D15-0 to A15-0 20 ns 11/23 SERCON816 3.5.4 Read Access of Control Registers Figure 8. Read Access of Control Registers A6-0, BHEN PCSN0, PCS1, DMAACKNR, WRN (Motorola mode) tPAD tASU tAHD RDN tRDZ tPRDD D15-0 tPRQ DMAREQR Symbol Parameter Min. Typ. Max. Unit Setup time A6-0, (Note 1) 10 ns Setup time BHEN, PCSN0, PCS1, DMAACKNR, WRN (only Motorola mode), (Note 1) 0 ns tAHD Hold time A6-0, BHEN, PCSN0, PCS1, DMAACKNR, WRN (only Motorola mode) to rising edge RDN (Intel Motorola mode with low active strobe) or falling edge RDN (Motorola mode with high active strobe) 0 ns tPAD Access time A6-0, BHEN, PCSN0, PCS1, DMAACKNR, WRN (only Motorola mode) to D15-0 valid 30 ns Access time RDN to D15-0 valid 30 ns tRDZ Delay RDN to D15-0 high-Z 20 ns tPRQ Delay RDN to DMAREQR low 20 ns tASU tPRDD Note: 1. Setup time input signals to falling edge RDN (Intel or Motorola mode with low active strobe) or rising edge RDN (Motorola mode with high active strobe) 12/23 SERCON816 3.5.5 Read Access of Dual Port RAM Figure 9. Read Access of Dual Port RAM A10-0, BHEN, MCSN0-1, WRN (Motorola mode) tASU tAHD tRD1 RDN tRDZ tMRDD D15-0 tMBSY tMBHD BUSYN Symbol tASU tAHD tRDNCLK Parameter Min. Typ. Max. Unit Setup time A11-0, (Note 1) 10 ns Setup time MCSN0-1, if both signals are activated simultaneously. (Note 1) 5 ns Setup time MCSN0-1, if one of these both signals is activated 10 ns earlier. (Note 1) 0 ns Setup time BHEN, WRN (only Motorola mode), (Note 1) 0 ns hold time A11-0, BHEN, MCSN0-1, WRN (only Motorola mode) to rising edge RDN (Intel Motorola mode with low active strobe) or falling edge RDN (Motorola mode with high active strobe) 0 ns Cycle time of RAM read clock SBAUD16 = 1 (fRDNCLK = fSCLK) 1 / fSCLK SBAUD16 = 0 (fRDNCLK = 2 * fSCLK) 0.5 / fSCLK tMRDD access time RDN to D15-0 valid tMBSY delay RDN to BUSYN low tMBHD Delay BUSYN high to D15-0 valid tRDZ Delay RDN to D15-0 high-Z tRD1 RDN and WRN high after end of read access 15 2 * tRDNCLK + 30 ns 15 ns 2 * tRDNCLK + 30 ns 20 ns ns Notes: 1. Setup time input signals to falling edge RDN (Intel or Motorola mode with low active strobe) or rising edge RDN (Motorola mode with high active strobe) 13/23 SERCON816 3.5.6 Write Access to Control Registers Figure 10. Write Access to Control Registers A6-0, BHEN, PCSN0, PCS1, DMAACKNT, WRN (Motorola mode) WRN (Intel mode) RDN (Motorola mode) tASU tAHD tPWRW tDSU tDHD Min. Typ. D15-0 tPRQ DMAREQT Symbol Parameter Max. Unit Setup time A6-0, (Note 1) 10 ns Setup time BHEN, PCSN0, PCS1, DMAACKNR, WRN (only Motorola mode), (Note 1) 0 ns hold time A6-0, BHEN, PCSN0, PCS1, DMAACKNT, WRN (only Motorola mode) to rising edge WRN (Intel mode) or RDN (Motorola mode, strobe active low) or falling edge RDN (Motorola mode, strobe active high) 0 ns pulse width WRN (Intel mode) or RDN (Motorola mode) 20 ns tDSU setup time D15-0 to end of write access 10 ns tDHD hold time D15-0 to end of write access 5 ns tPRQ delay WRN or RDN to DMAREQT low tASU tAHD tPWRW 20 ns Notes: 1. Setup time input signals to falling edge WRN (Intel mode) or RDN (Motorola mode with low active strobe) or rising edge RDN (Motorola mode with high active strobe) 14/23 SERCON816 3.5.7 Write Access to DUAL Port RAM Figure 11. Write Access to DUAL Port RAM A10-0, BHEN, MCSN0-1, WRN (Motorola mode) tASU tAHD tMWRW WRN (Intel mode) RDN (Motorola mode) tWR1 tDSU tDHD D15-0 tMBSY tMBHWH BUSYN Symbol Parameter Min. Typ. Max. Unit Setup time A11-0, (Note 1) 10 ns Setup time MCSN0-1, if both signals are activated simultaneously. (Note 1) 5 ns Setup time MCSN0-1, if one of these both signals is activated 10 ns earlier. (Note 1) 0 Setup time BHEN, WRN (only Motorola mode), (Note 1) 0 ns hold time A11-0, BHEN, MCSN0-1, WRN (only Motorola mode) to rising edge of WRN (Intel mode) or RDN (Motorola mode with low active strobe) or falling edge RDN (Motorola mode with high active strobe) 0 ns Pulse width WRN or RDN 20 ns tDSU Setup time D15-0 to end of write access 10 ns tDHD Hold time D15-0 after end of write access 5 ns tMBSY Delay WRN or RDN (begin of write access) to BUSYN low tASU tAHD tMWRW 15 ns tMBHWH Setup time BUSYN high to end of write access 15 ns tWR1 WRN and RDN high after end of write access 15 ns Notes: 1. Setup time input signals to falling edge WRN (Intel mode) or RDN (Motorola mode with low active strobe) or rising edge RDN (Motorola mode with high active strobe) 15/23 SERCON816 4 CONTROL REGISTERS AND RAM DATA STRUCTURES 4.1 Control Register Addresses The following table is an overview of the control registers. The address is the word address which is input by A6-1. To calculate the byte address, the value has to be multiplied by two. All control registers can be written to and read (R/W), with the exception of the control bits that initiate an action (W). The status registers can only be read (R). When control registers which contain bits that are not used or can only be read, are written to, these bits can be set to 0 or 1; they are not evaluated internally. If control registers are read with bits that are not used, these bits are set to 0. A6-1 Bits 00H 0-15 VERSION Name R/W Value R 0010H Function 01H - 2AH 0-15 Please refer to SERCON816 Reference Guide for a detailed description of the control registers. Circuit code (0010H) 4.2 Data Structures within the RAM In this RAM the first eleven words have a fixed meaning. A10-1 Contents 0-1 COMPT0-1: Start of transmission blocks 0-1 2-9 SCPT0-7: Address service containers 0-7 10 NMSTERR: Error counter MST The rest of the RAM can be divided into data structures as required. 4.2.1 Telegram Headers A telegram header for receive telegram contains the following five control words: Index Bit Name 0 0-7 ADR Telegram address 8 DMA Data storage in the internal RAM (DMA = 0) or DMA transfer (DMA = 1) 9 DBUF Data in the RAM: single buffer (DBUF = 0) or double buffer (DBUF = 1) 10 VAL 11 ACHK Telegrams are received if the address is valid (ACHK = 1) or independent on the received address (ACHK = 0). The received address is stored at ADR. TCHK The time of receiving is checked (TCHK = 1) or not checked (TCHK = 0). 13 RERR The last telegram was free of error (RERR = 0) or errored or not received (RERR = 1). 14 0 15 0 0-15 TRT 2 0-15 TLEN 3 0-10 PT 9-15 16/23 For single buffering (DMA = 0, DBUF = 0) or DMA transfer (DMA = 1): telegram data is invalid (VAL = 0) or valid (VAL = 1); for double buffering (DMA = 0, DBUF = 1): data in buffer 0 (VAL = 0) or buffer 1 (VAL = 1) is valid. Modified by controller at beginning and end of receive telegrams. 12 1 4 Function 0-15 Marker bit for telegram header of receive telegram. Marker bit for telegram header. Time for the start of telegram in µs after end of MST. Length of telegram in data words (not including address). Word address within the RAM of the next telegram header or the end marker. (Not used) NERR Error counter SERCON816 4.2.2 Data Containers A data container comprises one or two 16-bit control words as well as a variable number of data words. If the data is stored in the internal RAM (DMA = 0) and a single buffer is used (DBUF = 0), the data container has one buffer. Using RAM storage and double buffering (DBUF = 1), two data buffers are needed. In case of DMA transfer (DMA = 1) the data container only comprises the control words (Fig. 12). The structure of the two control words depends on whether a telegram is transmitted or received: Index Bit Name 0 0-9 LEN 10 SVFL Flag, whether data block uses service container (SVFL = 1). 11-13 NSV Number of service container, which is used (0 - 7). 14 SCMASTER 15 LASTDC 0-15 POS 1 Function Number of 16-bit data words of the data block. Processing of service container in slave mode (SCMASTER = 0) or master mode (SCMASTER = 1). Last data container of the telegram (1) or further data containers follow (0). Position of the data block within the telegram in number of words. The first data record of a telegram has POS = 0 (only in case of receive telegrams). Figure 12. Structure of Data Containers DMA = 0, DBUF = 0 0 DMA = 0, DBUF = 1 0 c ontrol word 0 1 control word 0 1 buffer DMA = 1 0 c ontrol word 0 1 buffer 0 LEN + 1 LEN + 1 transm it telegrams buffer 1 2* LEN + 1 DMA = 0, DBUF = 0 0 1 c ontrol word 0 c ontrol word 1 2 DMA = 0, DBUF = 1 0 1 2 buffer LEN + 2 control word 0 control word 1 DMA = 1 0 1 c ontrol word 0 c ontrol word 1 2 buffer 0 rec eive telegrams LEN + 2 buffer 1 2* LEN + 2 17/23 SERCON816 4.2.3 End Marker The end marker comprises two 16-bit words: Index Bit 0 0-13 1 Name Function (Not used) 14 1 Marker bit for the end marker. 15 1 Marker bit for the end marker. 0-15 TEND Time after end of MST at which the last telegram has ended (in µs). 4.2.4 Service Containers A service container contains 5 control words and a buffer (BUFLEN words, max. length 255) Figure 13. Structure of Service Container 0 1 2 3 4 5 5 + BUFLEN 18/23 control word 0 control word 1 control word 2 control word 3 control word 4 write and read buffer SERCON816 For master mode (SCMASTER = 1) the control words are coded as follows: Index Bit Name 0 0 HS_MDT Handshake-bit in MDT 1 L/S_MDT Read/write in MDT 2 END_MDT 3-5 ELEM_MDT 6 SETEND END_MDT is to be set 7 M_BUSY Service container waits for interaction of microprocessor (M_BUSY = 1) 8-9 NINFO_WRITE 10-11 4 Number of info words in write buffer (1 to 4) INT_ERR 13 INT_END_WRBUF End of write buffer is reached 14 INT_END_RDBUF End of read buffer is reached Slave reports error (Not used) 0 HS_AT 1 BUSY_AT Busy bit in AT 2 ERR_AT Error bit in AT 3 CMD_AT Command modification bit in AT 7 RECERR 8-9 NINFO_READ Last transmission was correct (0) or erroneous (1) Number of info words in read buffer (1 to 4) (Not used) 0-7 WRDATPT 8-15 WRDATLAST 0-7 RDDATPT 8-15 RDDATLAST 0-7 ERR_CNT 8 BUSY_CNT 9 INT_SC_ERR 10 INT_HS_TIMEOUT 11 INT_BUSY_TIMEOUT 12 INT_CMD 13-15 Handshake bit in AT (Not used) 10-15 3 Data element type in MDT 12 4-6 2 End in MDT (Not used) 15 1 Function Pointer to present position in write buffer Pointer to last position in write buffer Pointer to present position in read buffer Pointer to last position in read buffer Error counter Error counts differences of handshake (0) or BUSY cycles (1) Interrupt due to protocol error Interrupt due to handshake timeout Interrupt BUSY timeout Slave has set command modification bit (Not used) 19/23 SERCON816 The coding of the five control words depends on the mode of the service channel. Using the slave mode (SCMASTER = 0) they have the following structure: Index Bit Name 0 0 HS_AT 1 BUSY_AT 2 ERR_AT Error bit in AT 3 CMD_AT Command modification bit in AT 4-6 ELEM 7 L/S 8-9 NINFO_WRITE 10-11 1 4 Data element of present transmission Read (0)/write (1) of present transmission Number of info words in write buffer (1 to 4) INT_ELEM_CHANGE 13 INT_END_WRBUF End of write buffer is reached 14 INT_END_RDBUF End of read buffer is reached 15 INT_END_MDT 0 HS_MDT Handshake bit in MDT 1 L/S_MDT Read/write in MDT 2 END_MDT 3-5 ELEM_MDT RECERR 8-9 NINFO_READ Master reports end via END_MDT-bit End bit in MDT Data element in MDT Last transmission was correct (0) or erroneous (1) Number of info words in read buffer (1 to 4) (Not used) 0-7 WRDATPT 8-15 WRDATLAST 0-7 RDDATPT 8-15 RDDATLAST 0-8 10-15 Master has modified data element or read/write (Not used) 7 9 20/23 Busy bit in AT, also waiting for microprocessor interaction 12 10-15 3 Handshake bit in AT (Not used) 6 2 Function Pointer to present position in write buffer Pointer to last position in write buffer Pointer to present position in read buffer Pointer to last position in read buffer (Not used) INT_SC_ERR Interrupt due to protocol error (Not used) SERCON816 5 ADDITIONAL SPECIFICATIONS, TOOLS AND SUPPORT 5.1 Additional Specifications Reference Manual SERCON816 The reference manual (160 pages) for the SERCON816 Asic contains a complete and very detailed specification of the SERCON816 Asic, including a description of the pinning of the controller, microprocessor interface, serial interface, telegram processing, master and slave modes, additional modes, control and RAM data structures, programming examples, electrical and mechanical characteristics of the chip, differences between SERCON816 and SERCON410B controller. SERCOS interface specification The SERCOS interface specification (IEC/EN 61491) contains a detailed description of the transfer medium and physical layer, data transfer and data link layer, protocol structure and data contents, communication phases, functional handling and error handling, list and description of identifier numbers. I/O functions are described in a separate document. 5.2 Hardware and Software Components Master and slave routines (driver software) for the SERCON816 controller are available from several suppliers world-wide. Furthermore different boards for a wide range of computer interfaces are offered, including ISA-, VME-, PCI- and PC/104 bus systems. 5.3 Tools Different development and testing tools are available for SERCOS interface. These tools include bus monitors, configuration and simulation tools, as well as tools for conformance testing. For all specification and additional application notes please contact: Interests Group SERCOS interface e. V. 21/23 SERCON816 6 PACKAGE MECHANICAL DATA: SERCON816 100 PIN PLASTIC QUAD FLAT PACK PACKAGE (PQFP100) mm DIM. MIN. TYP. A MAX. MIN. TYP. 3.40 A1 0.25 A2 2.55 B MAX. 0.010 0.100 0.22 0.38 0.0087 0.015 C 0.13 0.23 0.005 0.009 D 22.95 23.20 23.45 0.903 0.913 0.923 D1 19.90 20.00 20.10 0.783 0.787 0.791 2.80 0.110 D3 18.85 0.742 e 0.65 0.026 0.120 E 16.95 17.20 17.45 0.667 0.677 0.687 E1 13.90 14.00 14.10 0.547 0.551 0.555 L L1 K 12.35 0.65 OUTLINE AND MECHANICAL DATA 0.134 3.05 E3 22/23 inch 0.80 0.486 0.95 0.026 1.60 0.031 0.063 0°(min.), 7°(max.) 0.037 PQFP100 SERCON816 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. STMicroelectronics acknowledges the trademarks of all companies referred to in this document. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 23/23