SM30TY
Datasheet
Automotive 3000 W TVS in SMC
Features
•
•
•
•
•
•
AEC-Q101 qualified
Peak pulse power:
–
3000 W (10/1000 μs)
–
up to 36 kW (8/20 μs)
Stand-off voltage range from 5 V to 48 V
Unidirectional and bidirectional types
Low leakage current: 0.2 µA at 25 °C
Operating Tj max: 175 °C
•
•
•
JEDEC registered package outline
Resin meets UL94, V0
Lead finishing: matte tin plating
Complies with the following standards
•
•
•
•
•
•
•
•
•
UL94, V0
J-STD-020 MSL level 1
J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026
JESD-201 class 2 whisker test
IPC7531 footprint and JEDEC registered package outline
IEC 61000-4-4 level 4:
–
4kV
ISO 10605, IEC 61000-4-2, C = 150 pF, R = 330 Ω exceeds level 4:
–
30 kV (air discharge)
–
30 kV (contact discharge)
ISO 10605, C = 330 pF, R = 330 Ω exceeds level 4:
–
30 kV (air discharge)
–
30 kV (contact discharge)
ISO 7637-2 (not applicable to parts with VRM lower than battery voltage)
–
Pulse 1: VS = -150 V
–
Pulse 2a: VS = +112 V
–
Pulse 3a: VS = -220 V
–
Pulse3b: VS = +150 V
Description
The SM30TY series are designed to protect sensitive automotive circuits against
surges defined in ISO 7637-2 and against electrostatic discharges according to ISO
10605.
The Planar technology makes it compatible with high-end circuits where low leakage
current and high junction temperature are required to provide long term reliability and
stability.
DS8599 - Rev 8 - October 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
SM30TY
Characteristics
1
Characteristics
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
ISO10605 (C = 330 pF, R = 330 Ω):
VPP
Peak pulse voltage
Contact discharge
30
Air discharge
30
kV
ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω)
PPP
Peak pulse power dissipation
Tstg
Contact discharge
30
Air discharge
30
Tj initial = Tamb
3000
W
Storage temperature range
-65 to +175
°C
Tj
Operating junction temperature range
-55 to +175
°C
TL
Maximum lead temperature for soldering during 10 s
260
°C
Figure 1. Electrical characteristics - parameter definitions
Figure 2. Pulse definition for electrical characteristics
DS8599 - Rev 8
page 2/16
SM30TY
Characteristics
Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified)
Type
10 / 1000 µs
VBR at IR (1)
IRM max at VRM
(2)(3)
VCL
Min. Typ. Max.
µA
V
V
8 / 20µs
(4)
(2)(3)
IPP
RD
Max.
VCL
IPP(4)
Max.
mA
V
A
Ω
V
A
αT
RD
Ω
Max.
10-4/°C
SM30T6.8AY/CAY
500
5
6.45
6.80
7.10
10
9.20
327
0.007
14.4
1610 0.004
5.7
SM30T7.5AY/CAY
250
6.5
7.13
7.50
7.90
10
11.2
268
0.014
15.2
1530 0.004
6.1
SM30T10AY/CAY
10
8.5
9.50
10.0
10.5
1
14.4
208
0.021
18.6
1280 0.007
7.3
SM30T12AY/CAY
0.2
10
11.4
12
12.6
1
17.0
176
0.028
21.7
1170
0.008
7.8
SM30T15AY/CAY
0.2
13
14.3
15
15.8
1
21.5
140
0.046
27.2
993
0.012
8.4
SM30T18AY/CAY
0.2
15
16.7
17.6
18.5
1
24.4
123
0.055
32.5
926
0.016
8.8
SM30T19AY/CAY
0.2
16
17.8
18.7
19.6
1
26.6
115.4
0.063
34.4
868
0.018
8.8
SM30T21AY/CAY
0.2
18
20
21.1
22.2
1
29.2
102.7
0.079
39.3
800
0.023
9.2
SM30T23AY/CAY
0.2
20
22.2
23.4
24.6
1
32.4
92.6
0.097
42.8
747
0.026
9.4
SM30T26AY/CAY
0.2
22
24.4
25.7
27.0
1
35.5
84.5
0.116
48.3
701
0.032
9.6
SM30T28AY/CAY
0.2
24
26.7
28.1
29.5
1
38.9
77.1
0.140
50.0
660
0.033
9.6
SM30T30AY/CAY
0.2
26
28.9
30.4
31.9
1
42.1
71.3
0.164
53.5
626
0.037
9.7
SM30T33AY/CAY
0.2
28
31.1
32.7
34.3
1
45.4
66.1
0.192
59.0
596
0.044
9.8
SM30T35AY/CAY
0.2
30
33.3
35.1
36.9
1
48.4
62.0
0.215
64.3
569
0.051
9.9
SM30T39AY/CAY
0.2
33
36.7
38.6
40.5
1
53.3
56.3
0.261
69.7
526
0.059
10.0
SM30T42AY/CAY
0.2
36
40.0
42.1
44.2
1
58.1
48.4
0.331
76.0
503
0.067
10.0
SM30T47AY/CAY
0.2
40
44.4
46.7
49
1
64.5
43.5
0.409
84.0
469
0.079
10.1
SM30T56AY/CAY
0.2
48
53.2
56.0
58.8
1
76.6
38.0
0.542
100
409
0.108
10.3
1. To calculate VBR versus Tj : VBR at Tj = VBR at 25 °C x (1 + αT x (Tj - 25))
2. To calculate VCL versus Tj : VCL at Tj = VCL at 25 °C x (1 + αT x (Tj - 25))
3. To calculate VCL max versus IPPappli: VCLmax = VBR max + RD x IPPappli
4. Surge capability given for both directions for unidirectional and bidirectional devices
DS8599 - Rev 8
page 3/16
SM30TY
Characteristics (curves)
1.1
Characteristics (curves)
Figure 3. Maximum peak power dissipation versus initial
junction temperature
Ppp (W)
3500
Figure 4. Maximum peak pulse power versus exponential
pulse duration
1000
PPP (kW)
Tj initial = 25 °C
10/1000 µs
3000
VBR < 36V
100
2500
2000
VBR ≥ 36V
10
1500
1000
1
500
0
Tj (°C)
0
25
50
75
100
125
150
175
200
Figure 5. Maximum peak pulse current versus clamping
voltage
10000
Ipp (A)
tp (ms)
0.1
0.01
0.1
1
10
Figure 6. Dynamic resistance versus pulse duration
10
RD (Ω)
8/20 µs
10/1000 µs
1000
1
100
0.1
DS8599 - Rev 8
10
SM30T39A/CAY
1
SM30T26A/CAY
0.1
SM30T18A/CAY
SM30T6V8A/CAY
1
SM30T56A/CAY
10
SM30T56AY/CAY
SM30T39AY/CAY
0.01
SM30T18AY/CAY
VCL (V)
100
SM30T6V8AY/CAY
0.001
0.01
tp (ms)
0.1
1
10
page 4/16
SM30TY
Characteristics (curves)
Figure 7. Junction capacitance versus reverse applied
voltage (unidirectional types)
Figure 8. Junction capacitance versus applied voltage
(bidirectional type)
C (nF)
100
10
C (nF)
100
f = 1 MHz
Vosc = 30 mVRMS
Tj = 25 °C
f = 1 MHz
Vosc = 30 mVRMS
Tj = 25 °C
SM30T6V8AY
10
SM30T6V8CAY
SM30T18AY
SM30T18CAY
SM30T39AY
1
SM30T39CAY
1
SM30T56AY
SM30T56CAY
0.1
VR (V)
1
10
100
Figure 9. Leakage current versus junction temperature
100000
IR (nA)
0.1
VR (V)
1
10
100
Figure 10. Peak forward voltage drop versus peak forward
current
IF (A)
100
VR = VRM
single pulse
VRM < 10V
10000
Tj = 175 °C
10
1000
Tj = 25 °C
100
Tj = 150 °C
1
VRM ≥ 10V
10
1
Tj (°C)
25
DS8599 - Rev 8
50
75
100
125
150
175
VF (V)
0.1
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
page 5/16
SM30TY
Characteristics (curves)
Figure 11. Thermal impedance junction to ambient versus
pulse duration
1000
Zth(j-a) (°C/W)
Figure 12. Thermal resistance junction to ambient versus
copper area under each lead (SMC)
Rth(j-a) (°C/W)
120
Single pulse on recommended footprint.
Epoxy printed circuit board FR4, 70 µm Cu thickness
Single pulse on recommended footprint.
Epoxy printed circuit board FR4, 70 µm Cu thickness
100
100
80
60
10
40
20
1
0.01
tp (s)
0.1
1
10
100
1000
0
SCu (cm²)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Figure 13. ISO7637-2 pulse 1 response (VS = -150 V) with
12 V battery
Figure 14. ISO7637-2 pulse 2a response (VS = 112 V) with
12 V battery
Figure 15. ISO7637-2 pulse 3a response (VS = -220 V) with
12 V battery
Figure 16. ISO7637-2 pulse 3b response (VS = 150 V) with
12 V battery
DS8599 - Rev 8
page 6/16
SM30TY
Characteristics (curves)
Figure 17. ISO7637-2 pulse 5b definition
Figure 18. Load dump capability (typical values, Us* =
f(Ri) pulse 5b, Us = 87 V, tp = 150 ms)
td
Us
Us *
10%
13.5 V
Battery voltage
0
t
Figure 20. ISO16750-2 test B definition
Figure 19. Load dump capability (typical values, Us* =
f(Ri) pulse 5b, Us = 87 V, tp = 400 ms)
td
Us
Us *
UA
10%
Battery voltage
Figure 21. Load dump capability (typical values, Us* =
f(Ri) test B, Us = 87 V, tp = 150 ms)
DS8599 - Rev 8
t
Figure 22. Load dump capability (typical values, Us* =
f(Ri) test B, Us = 87 V, tp = 400 ms)
page 7/16
SM30TY
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SMC package information
•
Epoxy meets UL94, V0
Figure 23. SMC package outline
E1
D
E
A1
A2
b
C
L
E2
Table 3. SMC package mechanical data
Dimensions
Ref.
DS8599 - Rev 8
Millimeters
Inches (for reference only)
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
2.90
3.20
0.114
0.126
c
0.15
0.40
0.006
0.016
D
5.55
6.25
0.218
0.246
E
7.75
8.15
0.305
0.321
E1
6.60
7.15
0.260
0.281
E2
4.40
4.70
0.173
0.185
L
0.75
1.50
0.030
0.060
page 8/16
SM30TY
SMC package information
Figure 24. Footprint recommendation, dimensions in mm
(inches)
1.54
(0.061)
5.11
(0.201)
Figure 25. Marking layout
1.54
(0.061)
3.14
(0.124)
8.19
(0.323)
millimeters
(inches)
Figure 26. Package orientation in reel
Figure 28. 13'' reel dimension values (mm)
DS8599 - Rev 8
Figure 27. Tape and reel orientation
Figure 29. Inner box dimension values
page 9/16
SM30TY
SMC package information
Figure 30. Tape outline
Table 4. Tape dimension values
Dimensions
Ref.
DS8599 - Rev 8
Millimeters
Min.
Typ.
Max.
D0
1.4
1.5
1.6
D1
1.5
F
7.4
7.5
7.6
K0
2.39
2.49
2.59
P0
3.9
4.0
4.1
P1
7.9
8.0
8.1
P2
1.9
2.0
2.1
W
15.7
16
16.3
page 10/16
SM30TY
Reflow profile
2.2
Reflow profile
Figure 31. ST ECOPACK recommended soldering reflow profile for PCB mounting
250
240-245 °C
Temperature (°C)
-2 °C/s
2 - 3 °C/s
60 sec
(90 max)
200
-3 °C/s
150
-6 °C/s
100
0.9 °C/s
50
Time (s)
0
Note:
DS8599 - Rev 8
30
60
90
120
150
180
210
240
270
300
Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile
corresponds to the latest IPC/JEDEC J-STD-020.
page 11/16
SM30TY
Application and design guidelines
3
Application and design guidelines
More information is available in the application note AN2689 “Protection of automotive electronics from electrical
hazards, guidelines for design and component selection”.
DS8599 - Rev 8
page 12/16
SM30TY
Ordering information
4
Ordering information
Figure 32. Ordering information scheme
SM
30T
xx
CA Y
Surface mount
Surge rating
30 = 3000 W Transil in SMC
Breakdown voltage
Type
A = Unidirectinal
CA = Bidirectional
Automotive grade
Table 5. Ordering information
DS8599 - Rev 8
Order code
Marking
Package
Weight
Base qty.
Delivery mode
SM30TxxAY/CAY
See Table 6. Marking.
SMC
0.25 g
2500
Tape and reel
page 13/16
SM30TY
Marking
4.1
Marking
Table 6. Marking
DS8599 - Rev 8
Order code
Marking
Order code
Marking
SM30T6.8AY
3AAAY
SM30T6.8CAY
3BAAY
SM30T7.5AY
3AACY
SM30T7.5CAY
3BACY
SM30T10AY
3AADY
SM30T10CAY
3BADY
SM30T12AY
3AAWY
SM30T12CAY
3BAWY
SM30T15AY
3AAGY
SM30T15CAY
3BAGY
SM30T18AY
3AAHY
SM30T18CAY
3BAHY
SM30T19AY
3AAIY
SM30T19CAY
3BAIY
SM30T21AY
3AAJY
SM30T21CAY
3BAJY
SM30T23AY
3AAKY
SM30T23CAY
3BAKY
SM30T26AY
3AALY
SM30T26CAY
3BALY
SM30T28AY
3AAEY
SM30T28CAY
3BAEY
SM30T30AY
3AAMY
SM30T30CAY
3BAMY
SM30T33AY
3AANY
SM30T33CAY
3BANY
SM30T35AY
3AAOY
SM30T35CAY
3BAOY
SM30T39AY
3AAPY
SM30T39CAY
3BAPY
SM30T42AY
3AAQY
SM30T42CAY
3BAQY
SM30T47AY
3AARY
SM30T47CAY
3BARY
SM30T56AY
3AASY
SM30T56CAY
3BASY
page 14/16
SM30TY
Revision history
Table 7. Document revision history
Date
Version
28-Jul-2011
1
27-Mar-2012
2
02-Jun-2014
3
09-Jan-2015
4
Changes
Initial release.
Updated footnote on page 1. Removed Table 2. Thermal
parameter.
Updated : Features, Table 2, Table 4 and reformatted to
current standard.
Updated Features, Table 2, Table 4, Figure 5 to Figure 8
and Figure 11 to Figure 21.
Updated features in cover page, Table 1, Table 2 and Table 4.
DS8599 - Rev 8
13-Jul-2015
5
Updated Figure 3, Figure 5, Figure 6, Figure 7, Figure 8,Figure 9, Figure 11,
Figure 12, Figure 13, Figure 14, Figure 15, Figure 17, Figure 18, Figure 20
and Figure 21.
27-Jul-2015
6
Updated Figure 10 and Figure 15.
02-Sep-2019
7
Updated Table 2. Electrical characteristics - parameter values (Tamb = 25 °C,
unless otherwise specified) and Section 1.1 Characteristics (curves).
17-Oct-2019
8
Updated Section 2.1 SMC package information.
page 15/16
SM30TY
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© 2019 STMicroelectronics – All rights reserved
DS8599 - Rev 8
page 16/16
