SM30T33CAY

SM30TxxAY, SM30TxxCAY Datasheet Automotive 3000 W TVS in SMC Features • • K A Bidirectional Unidirectional Product status link SM30T6.8AY, SM30T6.8CAY, • • • • AEC-Q101 qualified Peak pulse power: – 3000 W (10/1000 μs) – up to 40 kW (8/20 μs) Stand-off voltage range from 5 V to 188 V Unidirectional and bidirectional types Low leakage current: 0.2 µA at 25 °C Operating Tj max: 175 °C • • • JEDEC registered package outline Resin meets UL94, V0 Lead finishing: matte tin plating SM30T7.5AY, SM30T7.5CAY, SM30T10AY, SM30T10CAY, Complies with the following standards SM30T12AY, SM30T12CAY, • • • • • • SM30T15AY, SM30T15CAY, SM30T18AY, SM30T18CAY, SM30T19AY, SM30T19CAY, SM30T21AY, SM30T21CAY, SM30T23AY, SM30T23CAY, SM30T26AY, SM30T26CAY, SM30T28AY, SM30T28CAY, • SM30T30AY, SM30T30CAY, SM30T33AY, SM30T33CAY, • SM30T35AY, SM30T35CAY, SM30T39AY, SM30T39CAY, SM30T42AY, SM30T42CAY, • UL94, V0 J-STD-020 MSL level 1 J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 JESD-201 class 2 whisker test IPC7531 footprint and JEDEC registered package outline IEC 61000-4-4 level 4: – 4kV ISO 10605, IEC 61000-4-2, C = 150 pF, R = 330 Ω exceeds level 4: – 30 kV (air discharge) – 30 kV (contact discharge) ISO 10605, C = 330 pF, R = 330 Ω exceeds level 4: – 30 kV (air discharge) – 30 kV (contact discharge) ISO 7637-2 (not applicable to parts with VRM lower than battery voltage) SM30T47AY, SM30T47CAY, – Pulse 1: VS = -150 V SM30T56AY, SM30T56CAY – Pulse 2a: VS = +112 V SM30T68AY, SM30T68CAY – Pulse 3a: VS = -220 V SM30T75AY, SM30T75CAY, – Pulse3b: VS = +150 V SM30T82AY, SM30T82CAY, SM30T100AY, SM30T100CAY, SM30T117AY, SM30T117CAY, SM30T152AY, SM30T152CAY, SM30T180AY, SM30T180CAY, SM30T200AY, SM30T200CAY, SM30T220AY, SM30T220CAY, Description The SM30TY series are designed to protect sensitive automotive circuits against surges defined in ISO 7637-2 and against electrostatic discharges according to ISO 10605. The planar technology makes it compatible with high-end circuits where low leakage current and high junction temperature are required to provide long-term reliability and stability. DS8599 - Rev 11 - March 2022 For further information contact your local STMicroelectronics sales office. www.st.com SM30TxxAY, SM30TxxCAY Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit ISO10605 (C = 330 pF, R = 330 Ω): VPP Peak pulse voltage Contact discharge 30 Air discharge 30 kV ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω) PPP Peak pulse power dissipation Tstg Contact discharge 30 Air discharge 30 Tj initial = Tamb 3000 W Storage temperature range -65 to +175 °C Tj Operating junction temperature range -55 to +175 °C TL Maximum lead temperature for soldering during 10 s 260 °C Figure 1. Electrical characteristics - parameter definitions Figure 2. Pulse definition for electrical characteristics DS8599 - Rev 11 page 2/16 SM30TxxAY, SM30TxxCAY Characteristics Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified) Type 25 °C 85 °C µA 10 / 1000 µs VBR at IR (1) IRM max at VRM (2)(3) VCL Min. Typ. Max. V V IPP (4) 8 / 20µs RD Max. (2)(3) VCL Max. Max. IPP(4) RD αT Max. Max. mA V A mΩ V A mΩ 10-4/°C SM30T6.8AY/CAY 500 50 5 6.4 6.8 7.1 10 9.2 327 6.42 14.4 1610 4.53 5.7 SM30T7.5AY/CAY 250 50 6.5 7.2 7.5 7.9 10 11.2 268 12.3 15.2 1530 4.77 6.1 SM30T10AY/CAY 10 50 8.5 9.4 10 10.5 1 14.4 208 18.8 18.6 1280 6.33 7.3 SM30T12AY/CAY 0.2 1 10 11.1 12 12.6 1 17 176 25 21.7 1170 7.78 7.8 SM30T15AY/CAY 0.2 1 13 14.4 15 15.8 1 21.5 140 40.7 27.2 993 11.5 8.4 SM30T18AY/CAY 0.2 1 15 16.7 17.6 18.5 1 24.4 123 48 32.5 926 15.1 8.8 SM30T19AY/CAY 0.2 1 16 17.8 18.7 19.6 1 26 115 55.7 34.4 868 17.1 8.8 SM30T21AY/CAY 0.2 1 18 21.1 22.2 1 29.2 103 68 39.3 800 21.4 9.2 SM30T23AY/CAY 0.2 1 20 22.2 23.4 24.6 1 32.4 93 83.9 42.8 747 24.4 9.4 SM30T26AY/CAY 0.2 1 22 24.4 25.7 27 1 35.5 85 100 48.3 701 30.4 9.6 SM30T28AY/CAY 0.2 1 24 26.7 28.1 29.5 1 38.9 77 122 50 660 31.1 9.6 SM30T30AY/CAY 0.2 1 26 28.9 30.4 31.9 1 42.1 71 143 53.5 626 34.5 9.7 SM30T33AY/CAY 0.2 1 28 31.1 32.7 34.3 1 45.4 66 168 59 596 41.4 9.8 SM30T35AY/CAY 0.2 1 30 33.3 35.1 36.9 1 48.4 62 185 64.3 569 48.2 9.9 SM30T39AY/CAY 0.2 1 33 36.7 38.6 40.5 1 53.3 56 227 69.7 526 55.5 10 SM30T42AY/CAY 0.2 1 36 44.2 1 58.1 48.4 287 76 503 63.2 10 SM30T47AY/CAY 0.2 1 40 44.4 46.7 49 1 64.5 43.5 356 84 469 74.6 10.1 SM30T56AY/CAY 0.2 1 48 53.2 56 58.8 1 76.6 38.0 468 100 409 101 10.3 SM30T68AY/CAY 0.2 1 58 64.6 68 71.4 1 93.6 32 694 121 325 153 10.4 SM30T75AY/CAY 0.2 1 64 71.3 75 78.8 1 103 29.1 832 134 289 191 10.5 SM30T82AY/CAY 0.2 1 70 77.9 82 86.1 1 113 26.5 1015 146 256 234 10.5 SM30T100AY/CAY 0.2 1 85 95 100 105 1 137 22 1455 178 205 356 10.6 SM30T117AY/CAY 0.2 1 100 111 117 123 1 162 19 2053 212 170 524 10.7 SM30T152AY/CAY 0.2 1 130 144 152 160 1 209 14 3500 265 125 840 10.8 SM30T180AY/CAY 0.2 1 154 171 180 189 1 246 12 4750 317 102 1255 10.8 SM30T200AY/CAY 0.2 1 170 190 200 210 1 275 11 5909 353 90 1589 10.8 SM30T220AY/CAY 0.2 1 188 209 220 231 1 328 9 10778 388 80 1963 10.8 20 40 42.1 1. To calculate VBR versus Tj : VBR at Tj = VBR at 25 °C x (1 + αT x (Tj - 25)) 2. To calculate VCL versus Tj : VCL at Tj = VCL at 25 °C x (1 + αT x (Tj - 25)) 3. To calculate VCL max versus IPPappli: VCLmax = VBR max + RD x IPPappli 4. Surge capability given for both directions for unidirectional and bidirectional devices DS8599 - Rev 11 page 3/16 SM30TxxAY, SM30TxxCAY Characteristics (curves) 1.1 Characteristics (curves) Figure 3. Maximum peak power dissipation versus initial junction temperature PPP (W) 3500 Figure 4. Maximum peak pulse power versus exponential pulse duration PPP (kW) 1000 Tj initial = 25 °C 10/1000 µs 3000 VBR < 36 V 2500 100 VRM > 16 V 2000 VRM ≤ 16 V VBR ≥ 36 V 10 1500 1000 1 500 Tj (°C) 0 0 25 50 75 100 125 150 175 200 Figure 5. Maximum peak pulse current versus clamping voltage 10000 IPP (A) 0.1 0.001 10/1000 µs 0.1 1 10 100 Figure 6. Dynamic resistance versus pulse duration RD (Ω) 1000 8/20 µs t p (ms) 0.01 100 1000 10 100 1 10 SM30T82A/CAY SM30T220A/CAY SM30T39A/CAY SM30T56A/CAY SM30T18A/CAY SM30T6V8A/CAY 1 0.1 1 10 0.1 0.01 VCL (V) 100 1000 Figure 7. Junction capacitance versus reverse applied voltage (unidirectional type) 0.001 0.01 1 10 C (nF) 100 f = 1 MHz Vosc = 30 mVRMS Tj = 25 °C f = 1 MHz Vosc = 30 mVRMS Tj = 25 °C SM30T6V8AY 10 100 Figure 8. Junction capacitance versus applied voltage (bidirectional type) C (nF) 100 t p(ms) 0.1 10 SM30T6V8CAY SM30T18AY SM30T18CAY SM30T39AY SM30T56AY 1 1 SM30T39CAY SM30T56CAY SM30T82CAY SM30T82AY 0.1 0.1 SM30T220AY SM30T220CAY VR (V) 0.01 1 DS8599 - Rev 11 10 100 1000 VR (V) 0.01 1 10 100 1000 page 4/16 SM30TxxAY, SM30TxxCAY Characteristics (curves) Figure 9. Leakage current versus junction temperature Figure 10. Peak forward voltage drop versus peak forward current IR (nA) IF (A) 100000 100.0 VR = VRM single pulse VRM < 10 V 10000 10.0 Tj=175 °C 1000 Tj=25 °C VRM ≥ 10 V 100 Tj=150 °C 1.0 10 T j (°C) 1 25 50 75 100 125 150 VF (V) 175 0.1 0 Figure 11. Thermal impedance junction to ambient versus pulse duration 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 Figure 12. Thermal resistance junction to ambient versus copper area under each lead (SMC) Rth(j-a) (°C/W) Zth(j-a) (°C/W) 1000 120 Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness 100 100 80 60 10 40 20 tp (s) 1 0.1 1 10 100 1000 Figure 13. ISO7637-2 pulse 1 response (VS = -150 V) with 12 V battery DS8599 - Rev 11 SCu (cm²) 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Figure 14. ISO7637-2 pulse 2a response (VS = 112 V) with 12 V battery page 5/16 SM30TxxAY, SM30TxxCAY Characteristics (curves) Figure 15. ISO7637-2 pulse 3a response (VS = -220 V) with 12 V battery Figure 16. ISO7637-2 pulse 3b response (VS = 150 V) with 12 V battery Figure 17. ISO7637-2 pulse 5b definition Figure 18. Load dump capability (typical values, Us* = f(Ri) pulse 5b, Us = 87 V, tp = 150 ms) Figure 19. Load dump capability (typical values, Us* = f(Ri) pulse 5b, Us = 87 V, tp = 400 ms) Figure 20. ISO16750-2 test B definition DS8599 - Rev 11 page 6/16 SM30TxxAY, SM30TxxCAY Characteristics (curves) Figure 21. Load dump capability (typical values, Us* = f(Ri) test B, Us = 87 V, tp = 150 ms) DS8599 - Rev 11 Figure 22. Load dump capability (typical values, Us* = f(Ri) test B, Us = 87 V, tp = 400 ms) page 7/16 SM30TxxAY, SM30TxxCAY Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMC package information Figure 23. SMC package outline E1 D E A1 C A2 E2 L b Table 3. SMC package mechanical data Dimensions Millimeters Ref. DS8599 - Rev 11 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.20 0.114 0.126 c 0.15 0.40 0.006 0.016 D 5.55 6.25 0.218 0.246 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 L 0.75 1.50 0.030 0.060 page 8/16 SM30TxxAY, SM30TxxCAY SMC package information Figure 24. Footprint recommendation 1.54 (0.061) 5.11 (0.201) Figure 25. Marking layout 1.54 (0.061) 3.14 (0.124) 8.19 (0.323) millimeters (inches) Figure 26. Package orientation in reel Figure 27. Tape and reel orientation Figure 28. 13'' reel dimension values (mm) Figure 29. Inner box dimension values (mm) DS8599 - Rev 11 page 9/16 SM30TxxAY, SM30TxxCAY SMC package information Figure 30. Tape outline Table 4. Tape dimension values Dimensions Millimeters Ref. DS8599 - Rev 11 Min. Typ. Max. D0 1.4 1.5 1.6 D1 1.5 F 7.4 7.5 7.6 K0 2.39 2.49 2.59 P0 3.9 4.0 4.1 P1 7.9 8.0 8.1 P2 1.9 2.0 2.1 W 15.7 16 16.3 page 10/16 SM30TxxAY, SM30TxxCAY Reflow profile 2.2 Reflow profile Figure 31. ST ECOPACK recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS8599 - Rev 11 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. page 11/16 SM30TxxAY, SM30TxxCAY Application and design guidelines 3 Application and design guidelines More information is available in the application note AN2689 “Protection of automotive electronics from electrical hazards, guidelines for design and component selection”. DS8599 - Rev 11 page 12/16 SM30TxxAY, SM30TxxCAY Ordering information 4 Ordering information Figure 32. Ordering information scheme SM 30T xx CA Y Surface mount Surge rating 30 = 3000 W Transil in SMC Breakdown voltage Type A = Unidirectinal CA = Bidirectional Automotive grade Table 5. Ordering information Order code Marking Package Weight Base qty. Delivery mode SM30TxxAY/CAY(1) See Table 6. Marking. SMC 0.25 g 2500 Tape and reel 1. Where xx is nominal value of VBR and A or CA indicates unidirectional or bidirectional type. DS8599 - Rev 11 page 13/16 SM30TxxAY, SM30TxxCAY Marking 4.1 Marking Table 6. Marking DS8599 - Rev 11 Order code Marking Order code Marking SM30T6.8AY 3AAAY SM30T6.8CAY 3BAAY SM30T7.5AY 3AACY SM30T7.5CAY 3BACY SM30T10AY 3AADY SM30T10CAY 3BADY SM30T12AY 3AAWY SM30T12CAY 3BAWY SM30T15AY 3AAGY SM30T15CAY 3BAGY SM30T18AY 3AAHY SM30T18CAY 3BAHY SM30T19AY 3AAIY SM30T19CAY 3BAIY SM30T21AY 3AAJY SM30T21CAY 3BAJY SM30T23AY 3AAKY SM30T23CAY 3BAKY SM30T26AY 3AALY SM30T26CAY 3BALY SM30T28AY 3AAEY SM30T28CAY 3BAEY SM30T30AY 3AAMY SM30T30CAY 3BAMY SM30T33AY 3AANY SM30T33CAY 3BANY SM30T35AY 3AAOY SM30T35CAY 3BAOY SM30T39AY 3AAPY SM30T39CAY 3BAPY SM30T42AY 3AAQY SM30T42CAY 3BAQY SM30T47AY 3AARY SM30T47CAY 3BARY SM30T56AY 3AASY SM30T56CAY 3BASY SM30T68AY 3ACYY SM30T68CAY 3BCYY SM30T75AY 3ADEY SM30T75CAY 3BDEY SM30T82AY 3ADKY SM30T82CAY 3BDKY SM30T100AY 3ADZY SM30T100CAY 3BDZY SM30T117AY 3AEOY SM30T117CAY 3BEOY SM30T152AY 3AFSY SM30T152CAY 3BFSY SM30T180AY 3AGQY SM30T180CAY 3BGQY SM30T200AY 3AHGY SM30T200CAY 3BHGY SM30T220AY 3AHYY SM30T220CAY 3BHYY page 14/16 SM30TxxAY, SM30TxxCAY Revision history Table 7. Document revision history Date Version 28-Jul-2011 1 27-Mar-2012 2 02-Jun-2014 3 09-Jan-2015 4 Changes Initial release. Updated footnote on page 1. Removed Table 2. Thermal parameter. Updated : Features, Table 2, Table 4 and reformatted to current standard. Updated Features, Table 2, Table 4, Figure 5 to Figure 8 and Figure 11 to Figure 21. Updated features in cover page, Table 1, Table 2 and Table 4. DS8599 - Rev 11 13-Jul-2015 5 Updated Figure 3, Figure 5, Figure 6, Figure 7, Figure 8,Figure 9, Figure 11, Figure 12, Figure 13, Figure 14, Figure 15, Figure 17, Figure 18, Figure 20 and Figure 21. 27-Jul-2015 6 Updated Figure 10 and Figure 15. 02-Sep-2019 7 Updated Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified) and Section 1.1 Characteristics (curves). 17-Oct-2019 8 Updated Section 2.1 SMC package information. 03-Nov-2021 9 Updated Figure 11. 31-Jan-2022 10 Range extension up to 188 V. 21-Mar-2022 11 Minor text changes. page 15/16 SM30TxxAY, SM30TxxCAY IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2022 STMicroelectronics – All rights reserved DS8599 - Rev 11 page 16/16