SM30TxxAY, SM30TxxCAY
Datasheet
Automotive 3000 W TVS in SMC
Features
•
•
K
A
Bidirectional
Unidirectional
Product status link
SM30T6.8AY, SM30T6.8CAY,
•
•
•
•
AEC-Q101 qualified
Peak pulse power:
–
3000 W (10/1000 μs)
–
up to 40 kW (8/20 μs)
Stand-off voltage range from 5 V to 188 V
Unidirectional and bidirectional types
Low leakage current: 0.2 µA at 25 °C
Operating Tj max: 175 °C
•
•
•
JEDEC registered package outline
Resin meets UL94, V0
Lead finishing: matte tin plating
SM30T7.5AY, SM30T7.5CAY,
SM30T10AY, SM30T10CAY,
Complies with the following standards
SM30T12AY, SM30T12CAY,
•
•
•
•
•
•
SM30T15AY, SM30T15CAY,
SM30T18AY, SM30T18CAY,
SM30T19AY, SM30T19CAY,
SM30T21AY, SM30T21CAY,
SM30T23AY, SM30T23CAY,
SM30T26AY, SM30T26CAY,
SM30T28AY, SM30T28CAY,
•
SM30T30AY, SM30T30CAY,
SM30T33AY, SM30T33CAY,
•
SM30T35AY, SM30T35CAY,
SM30T39AY, SM30T39CAY,
SM30T42AY, SM30T42CAY,
•
UL94, V0
J-STD-020 MSL level 1
J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026
JESD-201 class 2 whisker test
IPC7531 footprint and JEDEC registered package outline
IEC 61000-4-4 level 4:
–
4kV
ISO 10605, IEC 61000-4-2, C = 150 pF, R = 330 Ω exceeds level 4:
–
30 kV (air discharge)
–
30 kV (contact discharge)
ISO 10605, C = 330 pF, R = 330 Ω exceeds level 4:
–
30 kV (air discharge)
–
30 kV (contact discharge)
ISO 7637-2 (not applicable to parts with VRM lower than battery voltage)
SM30T47AY, SM30T47CAY,
–
Pulse 1: VS = -150 V
SM30T56AY, SM30T56CAY
–
Pulse 2a: VS = +112 V
SM30T68AY, SM30T68CAY
–
Pulse 3a: VS = -220 V
SM30T75AY, SM30T75CAY,
–
Pulse3b: VS = +150 V
SM30T82AY, SM30T82CAY,
SM30T100AY, SM30T100CAY,
SM30T117AY, SM30T117CAY,
SM30T152AY, SM30T152CAY,
SM30T180AY, SM30T180CAY,
SM30T200AY, SM30T200CAY,
SM30T220AY, SM30T220CAY,
Description
The SM30TY series are designed to protect sensitive automotive circuits against
surges defined in ISO 7637-2 and against electrostatic discharges according to
ISO 10605.
The planar technology makes it compatible with high-end circuits where low leakage
current and high junction temperature are required to provide long-term reliability and
stability.
DS8599 - Rev 11 - March 2022
For further information contact your local STMicroelectronics sales office.
www.st.com
SM30TxxAY, SM30TxxCAY
Characteristics
1
Characteristics
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
ISO10605 (C = 330 pF, R = 330 Ω):
VPP
Peak pulse voltage
Contact discharge
30
Air discharge
30
kV
ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω)
PPP
Peak pulse power dissipation
Tstg
Contact discharge
30
Air discharge
30
Tj initial = Tamb
3000
W
Storage temperature range
-65 to +175
°C
Tj
Operating junction temperature range
-55 to +175
°C
TL
Maximum lead temperature for soldering during 10 s
260
°C
Figure 1. Electrical characteristics - parameter definitions
Figure 2. Pulse definition for electrical characteristics
DS8599 - Rev 11
page 2/16
SM30TxxAY, SM30TxxCAY
Characteristics
Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified)
Type
25 °C 85 °C
µA
10 / 1000 µs
VBR at IR (1)
IRM max at VRM
(2)(3)
VCL
Min. Typ. Max.
V
V
IPP
(4)
8 / 20µs
RD
Max.
(2)(3)
VCL
Max.
Max.
IPP(4)
RD
αT
Max.
Max.
mA
V
A
mΩ
V
A
mΩ
10-4/°C
SM30T6.8AY/CAY
500
50
5
6.4
6.8
7.1
10
9.2
327
6.42
14.4
1610
4.53
5.7
SM30T7.5AY/CAY
250
50
6.5
7.2
7.5
7.9
10
11.2
268
12.3
15.2
1530
4.77
6.1
SM30T10AY/CAY
10
50
8.5
9.4
10
10.5
1
14.4
208
18.8
18.6
1280
6.33
7.3
SM30T12AY/CAY
0.2
1
10
11.1
12
12.6
1
17
176
25
21.7
1170
7.78
7.8
SM30T15AY/CAY
0.2
1
13
14.4
15
15.8
1
21.5
140
40.7
27.2
993
11.5
8.4
SM30T18AY/CAY
0.2
1
15
16.7 17.6
18.5
1
24.4
123
48
32.5
926
15.1
8.8
SM30T19AY/CAY
0.2
1
16
17.8 18.7
19.6
1
26
115
55.7
34.4
868
17.1
8.8
SM30T21AY/CAY
0.2
1
18
21.1
22.2
1
29.2
103
68
39.3
800
21.4
9.2
SM30T23AY/CAY
0.2
1
20
22.2 23.4
24.6
1
32.4
93
83.9
42.8
747
24.4
9.4
SM30T26AY/CAY
0.2
1
22
24.4 25.7
27
1
35.5
85
100
48.3
701
30.4
9.6
SM30T28AY/CAY
0.2
1
24
26.7 28.1
29.5
1
38.9
77
122
50
660
31.1
9.6
SM30T30AY/CAY
0.2
1
26
28.9 30.4
31.9
1
42.1
71
143
53.5
626
34.5
9.7
SM30T33AY/CAY
0.2
1
28
31.1 32.7
34.3
1
45.4
66
168
59
596
41.4
9.8
SM30T35AY/CAY
0.2
1
30
33.3 35.1
36.9
1
48.4
62
185
64.3
569
48.2
9.9
SM30T39AY/CAY
0.2
1
33
36.7 38.6
40.5
1
53.3
56
227
69.7
526
55.5
10
SM30T42AY/CAY
0.2
1
36
44.2
1
58.1
48.4
287
76
503
63.2
10
SM30T47AY/CAY
0.2
1
40
44.4 46.7
49
1
64.5
43.5
356
84
469
74.6
10.1
SM30T56AY/CAY
0.2
1
48
53.2
56
58.8
1
76.6
38.0
468
100
409
101
10.3
SM30T68AY/CAY
0.2
1
58
64.6
68
71.4
1
93.6
32
694
121
325
153
10.4
SM30T75AY/CAY
0.2
1
64
71.3
75
78.8
1
103
29.1
832
134
289
191
10.5
SM30T82AY/CAY
0.2
1
70
77.9
82
86.1
1
113
26.5
1015
146
256
234
10.5
SM30T100AY/CAY
0.2
1
85
95
100
105
1
137
22
1455
178
205
356
10.6
SM30T117AY/CAY
0.2
1
100
111
117
123
1
162
19
2053
212
170
524
10.7
SM30T152AY/CAY
0.2
1
130
144
152
160
1
209
14
3500
265
125
840
10.8
SM30T180AY/CAY
0.2
1
154
171
180
189
1
246
12
4750
317
102
1255
10.8
SM30T200AY/CAY
0.2
1
170
190
200
210
1
275
11
5909
353
90
1589
10.8
SM30T220AY/CAY
0.2
1
188
209
220
231
1
328
9
10778
388
80
1963
10.8
20
40
42.1
1. To calculate VBR versus Tj : VBR at Tj = VBR at 25 °C x (1 + αT x (Tj - 25))
2. To calculate VCL versus Tj : VCL at Tj = VCL at 25 °C x (1 + αT x (Tj - 25))
3. To calculate VCL max versus IPPappli: VCLmax = VBR max + RD x IPPappli
4. Surge capability given for both directions for unidirectional and bidirectional devices
DS8599 - Rev 11
page 3/16
SM30TxxAY, SM30TxxCAY
Characteristics (curves)
1.1
Characteristics (curves)
Figure 3. Maximum peak power dissipation versus initial
junction temperature
PPP (W)
3500
Figure 4. Maximum peak pulse power versus exponential
pulse duration
PPP (kW)
1000
Tj initial = 25 °C
10/1000 µs
3000
VBR < 36 V
2500
100
VRM > 16 V
2000
VRM ≤ 16 V
VBR ≥ 36 V
10
1500
1000
1
500
Tj (°C)
0
0
25
50
75
100
125
150
175
200
Figure 5. Maximum peak pulse current versus clamping
voltage
10000
IPP (A)
0.1
0.001
10/1000 µs
0.1
1
10
100
Figure 6. Dynamic resistance versus pulse duration
RD (Ω)
1000
8/20 µs
t p (ms)
0.01
100
1000
10
100
1
10
SM30T82A/CAY
SM30T220A/CAY
SM30T39A/CAY
SM30T56A/CAY
SM30T18A/CAY
SM30T6V8A/CAY
1
0.1
1
10
0.1
0.01
VCL (V)
100
1000
Figure 7. Junction capacitance versus reverse applied
voltage (unidirectional type)
0.001
0.01
1
10
C (nF)
100
f = 1 MHz
Vosc = 30 mVRMS
Tj = 25 °C
f = 1 MHz
Vosc = 30 mVRMS
Tj = 25 °C
SM30T6V8AY
10
100
Figure 8. Junction capacitance versus applied voltage
(bidirectional type)
C (nF)
100
t p(ms)
0.1
10
SM30T6V8CAY
SM30T18AY
SM30T18CAY
SM30T39AY
SM30T56AY
1
1
SM30T39CAY
SM30T56CAY
SM30T82CAY
SM30T82AY
0.1
0.1
SM30T220AY
SM30T220CAY
VR (V)
0.01
1
DS8599 - Rev 11
10
100
1000
VR (V)
0.01
1
10
100
1000
page 4/16
SM30TxxAY, SM30TxxCAY
Characteristics (curves)
Figure 9. Leakage current versus junction temperature
Figure 10. Peak forward voltage drop versus peak forward
current
IR (nA)
IF (A)
100000
100.0
VR = VRM
single pulse
VRM < 10 V
10000
10.0
Tj=175 °C
1000
Tj=25 °C
VRM ≥ 10 V
100
Tj=150 °C
1.0
10
T j (°C)
1
25
50
75
100
125
150
VF (V)
175
0.1
0
Figure 11. Thermal impedance junction to ambient versus
pulse duration
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
Figure 12. Thermal resistance junction to ambient versus
copper area under each lead (SMC)
Rth(j-a) (°C/W)
Zth(j-a) (°C/W)
1000
120
Single pulse on recommended footprint.
Epoxy printed circuit board FR4, 70 µm Cu thickness
Single pulse on recommended footprint.
Epoxy printed circuit board FR4, 70 µm Cu thickness
100
100
80
60
10
40
20
tp (s)
1
0.1
1
10
100
1000
Figure 13. ISO7637-2 pulse 1 response (VS = -150 V) with
12 V battery
DS8599 - Rev 11
SCu (cm²)
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Figure 14. ISO7637-2 pulse 2a response (VS = 112 V) with
12 V battery
page 5/16
SM30TxxAY, SM30TxxCAY
Characteristics (curves)
Figure 15. ISO7637-2 pulse 3a response (VS = -220 V) with
12 V battery
Figure 16. ISO7637-2 pulse 3b response (VS = 150 V) with
12 V battery
Figure 17. ISO7637-2 pulse 5b definition
Figure 18. Load dump capability (typical values,
Us* = f(Ri) pulse 5b, Us = 87 V, tp = 150 ms)
Figure 19. Load dump capability (typical values,
Us* = f(Ri) pulse 5b, Us = 87 V, tp = 400 ms)
Figure 20. ISO16750-2 test B definition
DS8599 - Rev 11
page 6/16
SM30TxxAY, SM30TxxCAY
Characteristics (curves)
Figure 21. Load dump capability (typical values,
Us* = f(Ri) test B, Us = 87 V, tp = 150 ms)
DS8599 - Rev 11
Figure 22. Load dump capability (typical values,
Us* = f(Ri) test B, Us = 87 V, tp = 400 ms)
page 7/16
SM30TxxAY, SM30TxxCAY
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SMC package information
Figure 23. SMC package outline
E1
D
E
A1
C
A2
E2
L
b
Table 3. SMC package mechanical data
Dimensions
Millimeters
Ref.
DS8599 - Rev 11
Inches (for reference only)
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
2.90
3.20
0.114
0.126
c
0.15
0.40
0.006
0.016
D
5.55
6.25
0.218
0.246
E
7.75
8.15
0.305
0.321
E1
6.60
7.15
0.260
0.281
E2
4.40
4.70
0.173
0.185
L
0.75
1.50
0.030
0.060
page 8/16
SM30TxxAY, SM30TxxCAY
SMC package information
Figure 24. Footprint recommendation
1.54
(0.061)
5.11
(0.201)
Figure 25. Marking layout
1.54
(0.061)
3.14
(0.124)
8.19
(0.323)
millimeters
(inches)
Figure 26. Package orientation in reel
Figure 27. Tape and reel orientation
Figure 28. 13'' reel dimension values (mm)
Figure 29. Inner box dimension values (mm)
DS8599 - Rev 11
page 9/16
SM30TxxAY, SM30TxxCAY
SMC package information
Figure 30. Tape outline
Table 4. Tape dimension values
Dimensions
Millimeters
Ref.
DS8599 - Rev 11
Min.
Typ.
Max.
D0
1.4
1.5
1.6
D1
1.5
F
7.4
7.5
7.6
K0
2.39
2.49
2.59
P0
3.9
4.0
4.1
P1
7.9
8.0
8.1
P2
1.9
2.0
2.1
W
15.7
16
16.3
page 10/16
SM30TxxAY, SM30TxxCAY
Reflow profile
2.2
Reflow profile
Figure 31. ST ECOPACK recommended soldering reflow profile for PCB mounting
250
240-245 °C
Temperature (°C)
-2 °C/s
2 - 3 °C/s
60 sec
(90 max)
200
-3 °C/s
150
-6 °C/s
100
0.9 °C/s
50
Time (s)
0
Note:
DS8599 - Rev 11
30
60
90
120
150
180
210
240
270
300
Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile
corresponds to the latest IPC/JEDEC J-STD-020.
page 11/16
SM30TxxAY, SM30TxxCAY
Application and design guidelines
3
Application and design guidelines
More information is available in the application note AN2689 “Protection of automotive electronics from electrical
hazards, guidelines for design and component selection”.
DS8599 - Rev 11
page 12/16
SM30TxxAY, SM30TxxCAY
Ordering information
4
Ordering information
Figure 32. Ordering information scheme
SM
30T
xx
CA Y
Surface mount
Surge rating
30 = 3000 W Transil in SMC
Breakdown voltage
Type
A = Unidirectinal
CA = Bidirectional
Automotive grade
Table 5. Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
SM30TxxAY/CAY(1)
See Table 6. Marking.
SMC
0.25 g
2500
Tape and reel
1. Where xx is nominal value of VBR and A or CA indicates unidirectional or bidirectional type.
DS8599 - Rev 11
page 13/16
SM30TxxAY, SM30TxxCAY
Marking
4.1
Marking
Table 6. Marking
DS8599 - Rev 11
Order code
Marking
Order code
Marking
SM30T6.8AY
3AAAY
SM30T6.8CAY
3BAAY
SM30T7.5AY
3AACY
SM30T7.5CAY
3BACY
SM30T10AY
3AADY
SM30T10CAY
3BADY
SM30T12AY
3AAWY
SM30T12CAY
3BAWY
SM30T15AY
3AAGY
SM30T15CAY
3BAGY
SM30T18AY
3AAHY
SM30T18CAY
3BAHY
SM30T19AY
3AAIY
SM30T19CAY
3BAIY
SM30T21AY
3AAJY
SM30T21CAY
3BAJY
SM30T23AY
3AAKY
SM30T23CAY
3BAKY
SM30T26AY
3AALY
SM30T26CAY
3BALY
SM30T28AY
3AAEY
SM30T28CAY
3BAEY
SM30T30AY
3AAMY
SM30T30CAY
3BAMY
SM30T33AY
3AANY
SM30T33CAY
3BANY
SM30T35AY
3AAOY
SM30T35CAY
3BAOY
SM30T39AY
3AAPY
SM30T39CAY
3BAPY
SM30T42AY
3AAQY
SM30T42CAY
3BAQY
SM30T47AY
3AARY
SM30T47CAY
3BARY
SM30T56AY
3AASY
SM30T56CAY
3BASY
SM30T68AY
3ACYY
SM30T68CAY
3BCYY
SM30T75AY
3ADEY
SM30T75CAY
3BDEY
SM30T82AY
3ADKY
SM30T82CAY
3BDKY
SM30T100AY
3ADZY
SM30T100CAY
3BDZY
SM30T117AY
3AEOY
SM30T117CAY
3BEOY
SM30T152AY
3AFSY
SM30T152CAY
3BFSY
SM30T180AY
3AGQY
SM30T180CAY
3BGQY
SM30T200AY
3AHGY
SM30T200CAY
3BHGY
SM30T220AY
3AHYY
SM30T220CAY
3BHYY
page 14/16
SM30TxxAY, SM30TxxCAY
Revision history
Table 7. Document revision history
Date
Version
28-Jul-2011
1
27-Mar-2012
2
02-Jun-2014
3
09-Jan-2015
4
Changes
Initial release.
Updated footnote on page 1. Removed Table 2. Thermal
parameter.
Updated : Features, Table 2, Table 4 and reformatted to
current standard.
Updated Features, Table 2, Table 4, Figure 5 to Figure 8
and Figure 11 to Figure 21.
Updated features in cover page, Table 1, Table 2 and Table 4.
DS8599 - Rev 11
13-Jul-2015
5
Updated Figure 3, Figure 5, Figure 6, Figure 7, Figure 8,Figure 9, Figure 11,
Figure 12, Figure 13, Figure 14, Figure 15, Figure 17, Figure 18, Figure 20
and Figure 21.
27-Jul-2015
6
Updated Figure 10 and Figure 15.
02-Sep-2019
7
Updated Table 2. Electrical characteristics - parameter values (Tamb = 25 °C,
unless otherwise specified) and Section 1.1 Characteristics (curves).
17-Oct-2019
8
Updated Section 2.1 SMC package information.
03-Nov-2021
9
Updated Figure 11.
31-Jan-2022
10
Range extension up to 188 V.
21-Mar-2022
11
Minor text changes.
page 15/16
SM30TxxAY, SM30TxxCAY
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© 2022 STMicroelectronics – All rights reserved
DS8599 - Rev 11
page 16/16