SM6T250CAY

SM6T250CAY Automotive 600 W Transil™ Datasheet - production data Complies with the following standards • IEC 61000-4-2 exceeds level 4: – 30 kV (air discharge) – 30 kV (contact discharge) %LGLUHFWLRQDO 60% -('(&'2$$ • ISO 10605, C = 330 pF, R = 330 Ω exceeds level 4: – 30 kV (air discharge) – 30 kV (contact discharge) • ISO 7637-2 Description Features • Peak pulse power: – 600 W (10/1000 µs) – 4 kW (8/20 µs) • Stand-off voltage 213 V • Bidirectional type • Low leakage current: – 200 nA at 25 °C – 1 µA at 85 °C The SM6T250CAY Transil series has been designed to protect sensitive automotive circuits against surges defined in ISO 7637-2 and against electrostatic discharges according to IEC 610004-2 and ISO 10605. The planar technology makes this device compatible with high-end circuits where low leakage current and high junction temperature are required to provide reliability and stability over time. SM6T250CAY is packaged in SMB (SMB footprint in accordance with IPC 7531 standard). • Operating Tj max: 175 °C • High power capability at Tj max • JEDEC registered package outline • Resin meets UL 94, V0 • AEC-Q101 qualified TM: Transil is a trademark of STMicroelectronics April 2015 This is information on a product in full production. DocID027594 Rev 2 1/9 www.st.com Characteristics 1 SM6T250CAY Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol VPP PPP Parameter Peak pulse voltage Value ISO 10605 (C = 330 pF, R = 330 Ω): Contact discharge Air discharge IEC61000-4-2: Contact discharge Air discharge Peak pulse power dissipation(1) Unit 30 30 kV 30 30 600 W Operating junction temperature range -55 to 175 °C Tstg Storage temperature range -65 to 175 °C TL Maximum lead temperature for soldering during 10 s. 260 °C Tj Tj initial = Tamb 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Figure 1. Electrical characteristics - definitions I Symbol V RM V BR V CL I RM I PP αT RD P arameter Stand-off voltage Breakdown voltage C lamping voltage Leakage current @ V RM P eak pulse current Voltage temperature coefficient Dynamic resistance I PP V CL V BR V RM IR I RM V I RM IR I PP Figure 2. Pulse definition for electrical characteristics Repetitive pulse current tr = rise time (µs) tp = pulse duration time (µs) tr 2/9 tp DocID027594 Rev 2 V RMV BR V CL Bidirectional SM6T250CAY Characteristics Table 2. Electrical characteristics, parameter values (Tamb = 25 °C) IRM max at VRM Order code 25 VBR at IR VCL at IPP 10/1000 µs (1) RD (2) 10/100 µs VCLat IPP 8/20 µs RD (2) 8/20 µs αT 85 min. typ. max. max. max. max. °C SM6T250CAY nA µA V 200 1 213 V 237 250 263 mA V(3) A Ω V(3) A Ω 10-4/°C 1 344 1.75 53.7 400 10 15 11 1. Pulse test: tp < 50 ms 2. To calculate maximum clamping voltage at another surge level, use the following formula: VCLmax = VCL - RD x (IPP - IPPappli) where IPPappli is the surge current in the application. 3. To calculate VBR or VCL versus junction temperature, use the following formulas: V BR @ TJ = VBR @ 25°C x (1 + αT x (TJ - 25)) VCL @ TJ = VCL @ 25°C x (1 + αT x (TJ - 25)) Figure 3. Peak power dissipation versus initial Figure 4. Peak pulse power versus exponential junction temperature pulse duration (Tj initial = 25 °C)  333: —V    333N: 7M ƒ&                 7Mƒ&  ( DocID027594 Rev 2 ( ( ( ( WSPV 3/9 9 Characteristics SM6T250CAY Figure 5. Clamping voltage versus peak pulse current exponential waveform (maximum values) ,33$   —V  —V 9&/9    Figure 6. Junction capacitance versus reverse applied (typical values) &S)  I 0+] 926& P9506 7M ƒ&  959  4/9    DocID027594 Rev 2  SM6T250CAY Characteristics Figure 7. Relative variation of thermal Figure 8. Thermal resistance junction to impedance, junction to ambient, versus pulse ambient versus copper surface under each lead duration =WKMD5WKMD 5WKMDƒ&:  5HFRPPHQGHGSDGOD\RXW 3ULQWHGFLUFXLWERDUGV)5 5HFRPPHQGHG SDGOD\RXW &RSSHUWKLFNQHVV —P 3ULQWHG FLUFXLWERDUG )5&RSSHUWKLFNQHVV —P  3ULQWHGFLUFXLWERDUGV)5 &RSSHUWKLFNQHVV —P    6LQJOHSXOVH    ( WSV ( ( ( ( (        6FXFP Figure 9. Leakage current versus junction temperature (typical values) ,5Q$     95 950 9 'LUHFWDQGUHYHUVH          7Mƒ& DocID027594 Rev 2 5/9 9 Application and design guidelines 2 SM6T250CAY Application and design guidelines More information is available in the ST Application note AN2689 “Protection of automotive electronics from electrical hazards, guidelines for design and component selection”. 3 Packaging information • Case: JEDEC DO-214AA molded plastic over planar junction • Terminals: solder plated, solderable as per MIL-STD-750, Method 2026 • Polarity: for unidirectional types the band indicates cathode • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 10. SMB outline (definitions) E1 D E A1 C 6/9 A2 L DocID027594 Rev 2 b SM6T250CAY Packaging information Table 3. SMB dimensions (values) Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 Figure 12. Marking layout(1) Figure 11. SMB footprint dimensions in mm (inches) 1.62 2.60 (0.064) (0.102) 1.62 (0.064) 2.18 (0.086) 5.84 (0.300) xxx z y ww ECOP ACK compliance XXX: Ma rkin g Z: Ma nufacturing location Y: Year WW: Week 1. Marking layout can vary according to assembly location. DocID027594 Rev 2 7/9 9 Ordering information 4 SM6T250CAY Ordering information Figure 13. Ordering information scheme 60  7 [[ &$ < 6XUIDFH0RXQW : %UHDNGRZQYROWDJH &$%LGLUHFWLRQDO