SMA4F170A

SMA4FxxA Datasheet 400 W TVS Features • • • • • Peak pulse power: 400 W (10/1000 μs) and 2.5 kW (8/20 μs) Stand-off voltage range from 5 V to 188 V Unidirectional type Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C Operating Tj max: 175 °C • High power capability at Tj max.: up to 200 W (10/1000 µs) • Lead finishing: matte tin plating Complies with the following standards • • • • • • UL94, V0 J-STD-020 MSL level 1 J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 JESD-201 class 2 whisker test IPC7531 footprint and JEDEC registered package outline IEC 61000-4-2, C = 150 pF - R = 330 Ω exceeds level 4: – 25 kV (contact discharge) – 30 kV (air discharge) Description Product status link SMA4F SMA4F5.0A, SMA4F6.0A, SMA4F6.5A, SMA4F8.5A, SMA4F10A, SMA4F11A, SMA4F12A, SMA4F13A, SMA4F14A, SMA4F15A, SMA4F16A, SMA4F18A, SMA4F20A, SMA4F22A, SMA4F23A, SMA4F24A, SMA4F26A, SMA4F28A, SMA4F30A, SMA4F31A, SMA4F33A, SMA4F36A, SMA4F40A, SMA4F48A, SMA4F58A, SMA4F70A, SMA4F85A, SMA4F100A, SMA4F130A, SMA4F154A, SMA4F170A, SMA4F188A The SMA4F Transil series are designed to protect sensitive circuits against transient surges. The planar technology makes it compatible with high-end circuits where low leakage current and high junction temperature are required to provide long term reliability and stability. DS12542 - Rev 1 - May 2018 For further information contact your local STMicroelectronics sales office. www.st.com SMA4FxxA Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit Contact discharge 25 kV Air discharge 30 10/1000 µs, Tj initial = Tamb 400 W IEC 61000-4-2 (C = 150 pF, R = 330 Ω) VPP Peak pulse voltage PPP Peak pulse power dissipation Tstg Storage temperature range -65 to +175 °C Tj Operating junction temperature range -55 to +175 °C TL Maximum lead temperature for soldering during 10 s 260 °C Figure 1. Electrical characteristics - parameter definitions Unidirectional device VRM IRM VBR VCL IPP VF αT RD Stand-off voltage Leakage current @ VRM Breakdown voltage Clamping voltage Peak pulse current Forward voltage drop Voltage temperature coefficient Dynamic resistance IPP IR IRM V VRM VBR VCL VF I IF V I Figure 2. Pulse definition for electrical characteristics DS12542 - Rev 1 page 2/13 SMA4FxxA Characteristics Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified) IRM max at VRM Type 25 °C 85 °C µA 10 / 1000 µs VBR at IR Min. V Typ. VCL(3) Max. V IPP Max. αT(1)(2) 8 / 20 µs RD VCL(3) Max. Max. IPP RD Max. Max. mA V A Ω V A Ω 10-4/°C SMA4F5.0A 20 50 5.0 6.4 6.74 7.1 10 9.2 43.5 0.048 13.4 174 0.036 5.7 SMA4F6.0A 20 50 6.0 6.7 7.05 7.4 10 10.3 38.8 0.075 13.7 170 0.037 5.9 SMA4F6.5A 20 50 6.5 7.2 7.58 8 10 11.2 35.7 0.09 14.5 160 0.041 6.1 SMA4F8.5A 20 50 8.5 9.4 9.9 10.4 1 14.4 27.7 0.144 19.5 124 0.073 7.3 SMA4F10A 0.2 1 10 11.1 11.7 12.3 1 17 23.5 0.2 21.7 106 0.089 7.8 SMA4F11A 0.2 1 11 12.3 13 13.7 1 18 21.8 0.216 24.2 96 0.11 8.1 SMA4F12A 0.2 1 12 13.3 14 14.7 1 19.9 20.1 0.259 25.3 91 0.116 8.3 SMA4F13A 0.2 1 13 14.4 15.2 16 1 21.5 18.6 0.296 27.2 85 0.132 8.4 SMA4F14A 0.2 1 14 15.7 16.5 17.3 1 23.1 17.2 0.337 29 79 0.148 8.6 SMA4F15A 0.2 1 15 16.7 17.6 18.5 1 24.4 16.4 0.36 32.5 71 0.197 8.8 SMA4F16A 0.2 1 16 17.9 18.8 19.8 1 26 15.4 0.403 34.7 67 0.222 9.0 SMA4F18A 0.2 1 18 20 21.1 22.2 1 29.2 13.7 0.511 39.3 59 0.29 9.2 SMA4F20A 0.2 1 20 22.2 23.4 24.6 1 32.4 12.3 0.634 42.8 54 0.337 9.4 SMA4F22A 0.2 1 22 24.4 25.7 27 1 35.5 11.2 0.759 48.3 48 0.444 9.6 SMA4F23A 0.2 1 23 25.7 27 28.4 1 37.8 10.6 0.888 49.2 47 0.444 9.6 SMA4F24A 0.2 1 24 26.7 28.1 29.5 1 38.9 10.3 0.913 50 46 0.446 9.6 SMA4F26A 0.2 1 26 28.9 30.4 31.9 1 42.1 9.5 1.07 53.5 43 0.502 9.7 SMA4F28A 0.2 1 28 31.1 32.7 34.3 1 45.4 8.8 1.26 59 39 0.633 9.8 SMA4F30A 0.2 1 30 33.2 35 36.8 1 48.4 8.3 1.39 64.3 36 0.761 9.9 SMA4F31A 0.2 1 31 34.2 36 37.8 1 50.2 8 1.56 65 35 0.77 9.9 SMA4F33A 0.2 1 33 36.7 38.6 40.5 1 53.3 7.5 1.71 69.7 33 0.885 10 SMA4F36A 0.2 1 36 40 42.1 44.2 1 58.1 6.9 2.01 76 30 1.06 10 SMA4F40A 0.2 1 40 44.4 46.7 49 1 64.5 6.2 2.5 84 27 1.3 10.1 SMA4F48A 0.2 1 48 53.2 56 58.8 1 77.4 5.2 3.56 100 23 1.79 10.3 SMA4F58A 0.2 1 58 64.6 68 71.4 1 93.6 4.3 5.21 121 19 2.62 10.4 SMA4F70A 0.2 1 70 77.9 82 86.1 1 113 3.5 7.71 146 16 3.75 10.5 SMA4F85A 0.2 1 85 95 100 105 1 137 2.9 11.4 178 13 5.69 10.6 SMA4F100A 0.2 1 100 111 117 123 1 162 2.5 15.6 212 11 8.09 10.7 SMA4F130A 0.2 1 130 144 152 160 1 209 1.9 25.8 265 9 11.7 10.8 SMA4F154A 0.2 1 154 171 180 189 1 246 1.6 35.6 317 7 18.3 10.8 SMA4F170A 0.2 1 170 190 200 210 1 275 1.4 47 353 6.5 22.2 10.8 SMA4F188A 0.2 1 188 209 220 231 1 328 1.4 69.3 388 6 26.2 10.8 1. To calculate VBR versus Tj: VBR at TJ = VBR at 25 °C x (1 + αT x (Tj - 25)) 2. To calculate VCL versus Tj: VCL at TJ = VCL at 25 °C x (1 + αT x (Tj - 25)) 3. To calculate VCLmax versus IPPappli: VCLmax = VBR max + RD x IPPappli DS12542 - Rev 1 page 3/13 SMA4FxxA Characteristics (curves) 1.1 Characteristics (curves) Figure 3. Maximum peak power dissipation versus initial junction temperature Ppp (W) 500 Figure 4. Maximum peak pulse power versus exponential pulse duration Ppp (W) 10000 Tj initial = 25 °C 10/1000 µs 400 1000 VRM < 100V 300 VRM ≥ 100V 200 100 100 Tj (°C) 0 0 25 50 75 100 125 150 175 200 Figure 5. Maximum clamping voltage versus peak pulse current 1000 Ipp (A) tp (ms) 10 0.01 0.1 1 10 Figure 6. Dynamic resistance versus pulse duration 1000 RD (Ω) 8/20 µs 10/1000 µs 100 100 SMA4F188A 10 10 1 SMA4F33A SMA4F188A SMA4F70A 0.1 SMA4F33A SMA4F5.0A 1 0.1 SMA4F5.0A VCL (V) 1 DS12542 - Rev 1 10 100 SMA4F70A 1000 0.01 0.01 tp (ms) 0.1 1 10 page 4/13 SMA4FxxA Characteristics (curves) Figure 7. Junction capacitance versus reverse applied voltage Figure 8. Leakage current versus junction temperature I (nA) 10000 R C (nF) 10 VR = VRM f = 1 MHz Vosc = 30mVRMS Tj = 25 °C VRM < 10V 1000 SMA4F5.0A 1 100 0.1 SMA4F33A VRM ≥ 10V 10 SMA4F70A SMA4F188A 0.01 VR (V) 1 10 100 1 1000 Figure 9. Peak forward voltage drop versus peak forward current 100 Tj (°C) 25 50 100 125 150 175 Figure 10. Thermal impedance junction to ambient versus pulse duration IF (A) 1000 Zth(j-a) (°C/W) single pulse 10 75 Single pulse on recommended footprint. Epoxy printed circuit board FR4, 35 µm Cu thickness 100 Tj = 175 °C Tj = 25 °C 1 10 V F (V) 0 0 0.5 1 1.5 2 2.5 3 tp (s) 1 0.01 3.5 0.1 1 10 100 1000 Figure 11. Thermal resistance junction to ambient versus copper area under each lead 200 Rth(j-a) (°C/W) Single pulse on recommended footprint. Epoxy printed circuit board FR4, 35 µm Cu thickness 150 100 50 0 DS12542 - Rev 1 SCu (cm²) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 page 5/13 SMA4FxxA Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 SMA Flat package information Figure 12. SMA Flat package outline Table 3. SMA Flat mechanical data Symbol A Inches(1) Millimeters Min Typ 0.90 A1 Max Min 1.10 0.035 0.05 Typ Max 0.044 0.002 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L 0.75 1.20 0.029 0.048 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° 1. Values in inches are converted from mm and rounded to 3 decimal digits. DS12542 - Rev 1 page 6/13 SMA4FxxA SMA Flat package information Figure 13. SMA Flat recommended footprint in mm (inches) Figure 14. SMA Flat marking Figure 16. Tape and reel orientation Figure 15. Package orientation in reel Figure 17. 13'' reel dimension values DS12542 - Rev 1 Figure 18. Inner box dimension values page 7/13 SMA4FxxA SMA Flat package information Figure 19. Tape outline Table 4. Tape dimension values Dimensions Ref. DS12542 - Rev 1 Millimeters Min. Typ. Max. D0 1.5 1.55 1.6 D1 1.5 F 5.4 5.5 5.6 K0 1.1 1.2 1.3 P0 3.9 4.0 4.1 P1 3.9 4.0 4.1 P2 1.9 2.0 2.1 W 11.7 12 12.3 page 8/13 SMA4FxxA Reflow profile 2.2 Reflow profile Figure 20. ST ECOPACK® recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS12542 - Rev 1 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. page 9/13 SMA4FxxA SMA4F Ordering information 3 SMA4F Ordering information Figure 21. Ordering information scheme SMA 4 F vv A Package: SMA Power capability (10 / 1000 µs): 400 W Flat package Stand-off voltage: VRM Type: A : unidirectional Table 5. Ordering information DS12542 - Rev 1 Order code Marking Package Weight Base qty. Delivery mode SMA4FxxxA See Section 3.1 Marking. SMA Flat 39 mg 10000 Tape and reel page 10/13 SMA4FxxA Marking 3.1 Marking Table 6. Marking DS12542 - Rev 1 Order code Marking SMA4F5.0A 4AI SMA4F6.0A 4AK SMA4F6.5A 4AL SMA4F8.5A 4AP SMA4F10A 4AS SMA4F11A 4AU SMA4F12A 4AW SMA4F13A 4AY SMA4F14A 4BA SMA4F15A 4BC SMA4F16A 4BE SMA4F18A 4BI SMA4F20A 4BM SMA4F22A 4BO SMA4F23A 4BP SMA4F24A 4BQ SMA4F26A 4BS SMA4F28A 4BU SMA4F30A 4BW SMA4F31A 4BX SMA4F33A 4BZ SMA4F36A 4CC SMA4F40A 4CG SMA4F48A 4CO SMA4F58A 4CY SMA4F70A 4DK SMA4F85A 4DZ SMA4F100A 4EO SMA4F130A 4FS SMA4F154A 4GQ SMA4F170A 4HG SMA4F188A 4HY page 11/13 SMA4FxxA Revision history Table 7. Document revision history DS12542 - Rev 1 Date Version 28-May-2018 1 Changes Initial release. page 12/13 SMA4FxxA IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS12542 - Rev 1 page 13/13