SMA6FxxA
Datasheet
600 W TVS
Features
•
•
•
•
•
Peak pulse power: 600 W (10/1000 μs) and 4 kW (8/20 μs)
Stand-off voltage range from 5 V to 188 V
Unidirectional type
Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C
Operating Tj max: 175 °C
•
High power capability at Tj max.: up to 400 W (10/1000 µs)
•
Lead finishing: matte tin plating
Complies with the following standards
•
•
•
•
•
•
UL94, V0
J-STD-020 MSL level 1
J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026
JESD-201 class 2 whisker test
IPC7531 footprint and JEDEC registered package outline
IEC 61000-4-2, C = 150 pF - R = 330 Ω exceeds level 4:
–
25 kV (contact discharge)
–
30 kV (air discharge)
Description
Product status link
SMA6F
SMA6F5.0A, SMA6F6.0A,
SMA6F6.5A, SMA6F8.5A,
SMA6F10A, SMA6F11A,
SMA6F12A, SMA6F13A,
SMA6F14A, SMA6F15A,
SMA6F16A, SMA6F18A,
SMA6F20A, SMA6F22A,
SMA6F23A, SMA6F24A,
SMA6F26A, SMA6F28A,
SMA6F30A, SMA6F31A,
SMA6F33A, SMA6F36A,
SMA6F40A, SMA6F48A,
SMA6F58A, SMA6F70A,
SMA6F85A, SMA6F100A,
SMA6F130A, SMA6F154A,
SMA6F170A, SMA6F188A
The SMA6F Transil series are designed to protect sensitive circuits against transient
surges.
The planar technology makes it compatible with high-end circuits where low leakage
current and high junction temperature are required to provide long term reliability and
stability.
DS12564 - Rev 3 - February 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
SMA6FxxA
Characteristics
1
Characteristics
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
Contact discharge
25
kV
Air discharge
30
10/1000 µs, Tj initial = Tamb
600
W
IEC 61000-4-2 (C = 150 pF, R = 330 Ω)
VPP
Peak pulse voltage
PPP
Peak pulse power dissipation
Tstg
Storage temperature range
-65 to +175
°C
Tj
Operating junction temperature range
-55 to +175
°C
TL
Maximum lead temperature for soldering during 10 s
260
°C
Figure 1. Electrical characteristics - parameter definitions
Unidirectional device
VRM
IRM
VBR
VCL
IPP
VF
αT
RD
Stand-off voltage
Leakage current @ VRM
Breakdown voltage
Clamping voltage
Peak pulse current
Forward voltage drop
Voltage temperature coefficient
Dynamic resistance
IPP
IR
IRM
V
VRM VBR VCL
VF
I
IF
V
I
Figure 2. Pulse definition for electrical characteristics
DS12564 - Rev 3
page 2/13
SMA6FxxA
Characteristics
Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified)
IRM max at VRM
Type
25 °C
85 °C
µA
10 / 1000 µs
VBR at IR
Min.
V
Typ.
VCL(3)
Max.
V
IPP
Max.
αT(1)(2)
8 / 20 µs
RD
VCL(3)
Max.
Max.
IPP
RD
Max.
Max.
mA
V
A
Ω
V
A
Ω
10-4/°C
SMA6F5.0A
20
50
5.0
6.4
6.74
7.1
10
9.2
68
0.031
13.4
298
0.021
5.7
SMA6F6.0A
20
50
6.0
6.7
7.05
7.4
10
10.3
61
0.048
13.7
290
0.022
5.9
SMA6F6.5A
20
50
6.5
7.2
7.58
8
10
11.2
56
0.057
14.5
276
0.024
6.1
SMA6F8.5A
20
50
8.5
9.4
9.9
10.4
1
14.4
41.7
0.096
19.5
205
0.044
7.3
SMA6F10A
0.2
1
10
11.1
11.7
12.3
1
17
37
0.127
21.7
184
0.051
7.8
SMA6F11A
0.2
1
11
12.3
13
13.7
1
18
33.8
0.127
24.2
165
0.064
8.1
SMA6F12A
0.2
1
12
13.3
14
14.7
1
19.9
31
0.168
25.3
157
0.068
8.3
SMA6F13A
0.2
1
13
14.4
15.2
16
1
21.5
29
0.190
27.2
147
0.076
8.4
SMA6F14A
0.2
1
14
15.7
16.5
17.3
1
23.1
26
0.223
29
136
0.086
8.6
SMA6F15A
0.2
1
15
16.7
17.6
18.5
1
24.4
25.1
0.235
32.5
123
0.114
8.8
SMA6F16A
0.2
1
16
17.9
18.8
19.8
1
26
23.1
0.268
34.7
115
0.130
9.0
SMA6F18A
0.2
1
18
20
21.1
22.2
1
29.2
21.5
0.326
39.3
102
0.168
9.2
SMA6F20A
0.2
1
20
22.2
23.4
24.6
1
32.4
19.4
0.402
42.8
93
0.196
9.4
SMA6F22A
0.2
1
22
24.4
25.7
27
1
35.5
17.7
0.480
48.3
83
0.257
9.6
SMA6F23A
0.2
1
23
25.7
27
28.4
1
37.8
16.4
0.573
49.2
81
0.257
9.6
SMA6F24A
0.2
1
24
26.7
28.1
29.5
1
38.9
16
0.588
50
80
0.256
9.6
SMA6F26A
0.2
1
26
28.9
30.4
31.9
1
42.1
14.9
0.685
53.5
75
0.288
9.7
SMA6F28A
0.2
1
28
31.1
32.7
34.3
1
45.4
13.8
0.804
59
68
0.363
9.8
SMA6F30A
0.2
1
30
33.2
35
36.8
1
48.4
13
0.885
64.3
62
0.442
9.9
SMA6F31A
0.2
1
31
34.2
36
37.8
1
50.2
12.3
1.01
65
61
0.45
9.9
SMA6F33A
0.2
1
33
36.7
38.6
40.5
1
53.3
11.8
1.08
69.7
57
0.512
10
SMA6F36A
0.2
1
36
40
42.1
44.2
1
58.1
10.3
1.35
76
52
0.612
10
SMA6F40A
0.2
1
40
44.4
46.7
49
1
64.5
9.7
1.60
84
48
0.729
10.1
SMA6F48A
0.2
1
48
53.2
56
58.8
1
77.4
8.1
2.28
100
40
1.03
10.3
SMA6F58A
0.2
1
58
64.6
68
71.4
1
93.6
6.7
3.34
121
33
1.51
10.4
SMA6F70A
0.2
1
70
77.9
82
86.1
1
113
5.5
4.91
146
27
2.22
10.5
SMA6F85A
0.2
1
85
95
100
105
1
137
4.6
7.17
178
22.5
3.29
10.6
SMA6F100A
0.2
1
100
111
117
123
1
162
3.8
10.3
212
19
4.68
10.7
SMA6F130A
0.2
1
130
144
152
160
1
209
3
16.3
265
15
7
10.8
SMA6F154A
0.2
1
154
171
180
189
1
246
2.4
23.8
317
12.6
10.2
10.8
SMA6F170A
0.2
1
170
190
200
210
1
275
2.2
30
353
11.3
12.7
10.8
SMA6F188A
0.2
1
188
209
220
231
1
328
2
48.5
388
10.3
15.2
10.8
1. To calculate VBR versus Tj: VBR at TJ = VBR at 25 °C x (1 + αT x (Tj - 25))
2. To calculate VCL versus Tj: VCL at TJ = VCL at 25 °C x (1 + αT x (Tj - 25))
3. To calculate VCLmax versus IPPappli: VCLmax = VBR max + RD x IPPappli
DS12564 - Rev 3
page 3/13
SMA6FxxA
Characteristics (curves)
1.1
Characteristics (curves)
Figure 3. Maximum peak power dissipation versus initial
junction temperature
800
Figure 4. Maximum peak pulse power versus exponential
pulse duration
Ppp (W)
PPP (W)
10000
Tj initial = 25 °C
600
VRM < 100 V
400
1000
VRM ≥ 100 V
100
200
Tj (°C)
0
0
25
50
75
100
125
150
175
200
Figure 5. Maximum clamping voltage versus peak pulse
current
1000
0.1
1
10
Figure 6. Dynamic resistance versus pulse duration
1000
Ipp (A)
tp (ms)
10
0.01
RD (Ω)
8/20 µs
100
10/1000 µs
100
SMA6F188A
10
SMA6F70A
1
SMA6F188A
0.1
SMA6F70A
1
SMA6F33A
SMA6F5.0A
10
0.1
SMA6F5.0A
0.01
V CL (V)
1
DS12564 - Rev 3
10
100
SMA6F33A
1000
0.001
0.01
tp (ms)
0.1
1
10
page 4/13
SMA6FxxA
Characteristics (curves)
Figure 7. Junction capacitance versus reverse applied
voltage
Figure 8. Leakage current versus junction temperature
C (nF)
10
IR (nA)
10000
VR=VRM
f = 1 MHz
Vosc = 30 mVRMS
Tj = 25 °C
VRM < 10V
1000
SMA6F5.0A
1
100
VRM ≥ 10V
SMA6F33A
0.1
10
SMA6F70A
SMA6F188A
0.01
V R (V)
1
10
100
1
1000
Figure 9. Peak forward voltage drop versus peak forward
current
50
1000
100
125
150
175
Zth(j-a) (°C/W)
Single pulse on recommended footprint.
Epoxy printed circuit board FR4, 35 µm Cu thickness
single pulse
10
75
Figure 10. Thermal impedance junction to ambient versus
pulse duration
IF (A)
100
Tj (°C)
25
100
Tj = 175 °C
Tj = 25 °C
10
1
VF (V)
0
0
0.5
1
1.5
2
2.5
tp (s)
1
0.01
3
0.1
1
10
100
1000
Figure 11. Thermal resistance junction to ambient versus copper area under each lead
200
Rth(j-a) (°C/W)
Single pulse on recommended footprint.
Epoxy printed circuit board FR4, 35 µm Cu thickness
150
100
50
0
DS12564 - Rev 3
SCu (cm²)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
page 5/13
SMA6FxxA
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
2.1
SMA Flat package information
Figure 12. SMA Flat package outline
Table 3. SMA Flat mechanical data
Symbol
A
Inches(1)1
Millimeters
Min
Typ
0.90
A1
Max
Min
1.10
0.035
0.05
Typ
Max
0.044
0.002
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.005
0.016
D
2.25
2.90
0.088
0.115
E
5.00
5.35
0.196
0.211
E1
3.95
4.60
0.155
0.182
G
2.00
0.079
G1
0.85
0.033
L
0.75
1.20
0.029
0.048
L1
0.45
0.018
L2
0.45
0.018
L3
0.05
0.002
V
8°
8°
V1
8°
8°
1. Values in inches are converted from mm and rounded to 3 decimal digits.
DS12564 - Rev 3
page 6/13
SMA6FxxA
SMA Flat package information
Figure 13. SMA Flat recommended footprint in mm
(inches)
Figure 14. SMA Flat marking
Figure 15. Package orientation in reel
Figure 16. Tape and reel orientation
Figure 17. 13'' reel dimension values
Figure 18. Inner box dimension values
DS12564 - Rev 3
page 7/13
SMA6FxxA
SMA Flat package information
Figure 19. Tape outline
Table 4. Tape dimension values
Dimensions
Ref.
DS12564 - Rev 3
Millimeters
Min.
Typ.
Max.
D0
1.5
1.55
1.6
D1
1.5
F
5.4
5.5
5.6
K0
1.1
1.2
1.3
P0
3.9
4.0
4.1
P1
3.9
4.0
4.1
P2
1.9
2.0
2.1
W
11.7
12
12.3
page 8/13
SMA6FxxA
Reflow profile
2.2
Reflow profile
Figure 20. ST ECOPACK® recommended soldering reflow profile for PCB mounting
250
240-245 °C
Temperature (°C)
-2 °C/s
2 - 3 °C/s
60 sec
(90 max)
200
-3 °C/s
150
-6 °C/s
100
0.9 °C/s
50
Time (s)
0
Note:
DS12564 - Rev 3
30
60
90
120
150
180
210
240
270
300
Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile
corresponds to the latest IPC/JEDEC J-STD-020.
page 9/13
SMA6FxxA
SMA6FxxA Ordering information
3
SMA6FxxA Ordering information
Figure 21. Ordering information scheme
SMA
6
F vv
A
Package:
SMA
Power capability (10 / 1000 µs):
600 W
Flat package
Stand-off voltage:
VRM
Type:
A : unidirectional
Table 5. Ordering information
DS12564 - Rev 3
Order code
Marking
Package
Weight
Base qty.
Delivery mode
SMA6FxxA
See Table 6. Marking.
SMA Flat
39 mg
10000
Tape and reel
page 10/13
SMA6FxxA
Marking
3.1
Marking
Table 6. Marking
Unidirectional
DS12564 - Rev 3
Order code
Marking
SMA6F5.0A
6AI
SMA6F6.0A
6AK
SMA6F6.5A
6AL
SMA6F8.5A
6AP
SMA6F10A
6AS
SMA6F11A
6AU
SMA6F12A
6AW
SMA6F13A
6AY
SMA6F14A
6BA
SMA6F15A
6BC
SMA6F16A
6BE
SMA6F18A
6BI
SMA6F20A
6BM
SMA6F22A
6BO
SMA6F23A
6BP
SMA6F24A
6BQ
SMA6F26A
6BS
SMA6F28A
6BU
SMA6F30A
6BW
SMA6F31A
6BX
SMA6F33A
6BZ
SMA6F36A
6CC
SMA6F40A
6CG
SMA6F48A
6CO
SMA6F58A
6CY
SMA6F70A
6DK
SMA6F85A
6DZ
SMA6F100A
6EO
SMA6F130A
6FS
SMA6F154A
6GQ
SMA6F170A
6HG
SMA6F188A
6HY
page 11/13
SMA6FxxA
Revision history
Table 7. Document revision history
DS12564 - Rev 3
Date
Version
Changes
18-May-2018
1
Initial release.
09-Jul-2018
2
Corrected typo error in Table 2. Electrical characteristics - parameter values
(Tamb = 25 °C, unless otherwise specified).
28-Feb-2019
3
Updated links syntax.
page 12/13
SMA6FxxA
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
DS12564 - Rev 3
page 13/13