SMARTCARD

SMARTCARD MCU Ordering Information For Package And Delivery DATA BRIEFING INTRODUCTION The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – micromodules, – flat packages, – wafers. MICROMODULES Dedicated package for Smartcard products, the micromodule type depends on the size of the product and on the application. Table 1 lists all available micromodules. s FLAT PACKAGES For applications which require surface mount technology, suitable for PC cards, or other security modules, STMicroelectronics offers flat packages listed In Table 2. s WAFERS For issuer production need, ST offers sawn and unsawn wafers deliveries, listed in Table 3. Figure 1. Delivery form s 4 4 Table 1. Micromodules in super 35 standard tape Type D1, D2 D15 D3, D4 D5 D68 D7 C7 D8 Description 8 contacts for memory cards 6 contacts for memory cards 8 contacts with ring MCU cards 8 contacts for dual contact contactless MCU cards 8 contacts for MCU cards 6 contacts for dual contact contactless MCU cards Full contactless for MCU cards 8 contacts for MCU cards Table 2. Flat Packages Type O20 Description SO20 for MCU products TQFP44 for MCU products SO20 on tape and reel for MCU products SO20 QF4 R20 Table 3. Wafers 261a.ai 4 Micromodule W00 W20 Notch W40 S2x R4x S4x 8” Wafer T4x Unsawn wafers, 750 µm thickness Unsawn wafers, 275 µm thickness Unsawn wafers, 180 µm thickness 280 µm sawn wafers on UV tape 180 µm sawn wafers on insolated UV tape 180 µm sawn wafers on UV tape 180 µm sawn wafers on blue tape September 2001 This is Brief Data from STMicroelectronics. Details are subject to change without notice. For complete data, please contact your nearest Sales Office or SmartCard Products Divison, Rousset, France. Fax: (+33) 4 42 68 87 29. 4 Type Description 1/2 SMARTCARD MCU Table 4. Ordering Information Scheme Example: ST19SF08C D45 XXX Z Product name Pre-personalization name “+” if no pre-personalization Delivery Form Dxx: Module contact or dual Cxx: Contactless modules Oxx: SO package Wxx: Unsawn wafer Sxy*: Sawn wafer (std UV tape) Rxy*: Sawn wafer (insolated UV tape) or SO on tape and reel Note: *where “y” indicates the sawing orientation as shown in Figure 2 Customer ROM code name Figure 2. Sawing orientation VIEW: WAFER FRONT SIDE GND GND GND GND ORIENTATION 1 2 3 4 AI02171 Sawn wafers are scribed and mounted in a frame on adhesive tape. The orientation is defined by the position of the GND pad on the die, viewed with active area of product visible, relative to the notches of the frame (as shown in Figure 2). The orientation of the die with respect to the plastic frame notches is specified by the Customer. One further concern, when specifying devices to be delivered in this form, is that wafers mounted on adhesive tape must be used within a limited period from the mounting date: – two months, if wafers are stored at 25°C, 55% relative humidity – six months, if wafers are stored at 4°C, 55% relative humidity 2/2