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SMBJ43CA-TR

SMBJ43CA-TR

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SMB(DO-214AA)

  • 描述:

    TVS DIODE 43VWM SMB

  • 数据手册
  • 价格&库存
SMBJ43CA-TR 数据手册
SMBJ Datasheet 600 W TVS in SMB Features K • • • • • Peak pulse power: 600 W (10/1000 μs) and 4 kW (8/20 μs) Stand-off voltage range from 5 V to 188 V Unidirectional and bidirectional types Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C Operating Tj max: 150 °C • High power capability at Tj max.: up to 515 W (10/1000 µs) • Lead finishing: matte tin plating Complies with the following standards A Bidirectional Unidirectional Product status link SMBJ SMBJ5.0A, SMBJ5.0CA, SMBJ6.0A, SMBJ6.0CA, SMBJ6.5A, SMBJ6.5CA, SMBJ8.5A, SMBJ8.5CA, SMBJ10A, SMBJ10CA, SMBJ12A, SMBJ12CA, SMBJ13A, SMBJ13CA, SMBJ15A, SMBJ15CA, SMBJ16A, SMBJ16CA, SMBJ18A, SMBJ18CA, SMBJ20A, SMBJ20CA, SMBJ22A, SMBJ22CA, SMBJ24A, SMBJ24CA, SMBJ26A, SMBJ26CA, SMBJ28A, SMBJ28CA, SMBJ30A, SMBJ30CA, SMBJ33A, SMBJ33CA, SMBJ36A, SMBJ36CA, SMBJ40A, SMBJ40CA, SMBJ43A, SMBJ43CA, SMBJ48A, SMBJ48CA, SMBJ58A, SMBJ58CA, SMBJ64A, SMBJ64CA, SMBJ70A, SMBJ70CA, SMBJ85A, SMBJ85CA, SMBJ100A, SMBJ100CA, SMBJ130A, SMBJ130CA, SMBJ154A, SMBJ154CA, SMBJ170A, SMBJ170CA, SMBJ188A, SMBJ188CA • • • • • • • • UL94, V0 J-STD-020 MSL level 1 J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 solderable matte tin plated leads JESD-201 class 2 whisker test IPC7531 footprint JEDEC registered package outline IEC 61000-4-4 level 4: – 4 kV IEC 61000-4-2, C = 150 pF - R = 330 Ω exceeds level 4: – 30 kV (air discharge) – 30 kV (contact discharge) Description The SMBJ series are designed to protect sensitive equipment against electrostatic discharges according to IEC 61000-4-2 and MIL STD 883, method 3015, and electrical overstress according to IEC 61000-4-4 and 5. This device is more generally used against surges below 600 W (10/1000 μs). The Planar technology makes it suitable for high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. The SMBJ series are packaged in SMB. DS1283 - Rev 12 - April 2021 For further information contact your local STMicroelectronics sales office. www.st.com SMBJ Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit Contact discharge 30 kV Air discharge 30 10/1000 µs, Tj initial = Tamb 600 W IEC 61000-4-2 (C = 150 pF, R = 330 Ω) VPP Peak pulse voltage PPP Peak pulse power dissipation Tstg Storage temperature range -65 to +150 °C Tj Operating junction temperature range -55 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C Figure 1. Electrical characteristics - parameter definitions Figure 2. Pulse definition for electrical characteristics DS1283 - Rev 12 page 2/13 SMBJ Characteristics Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified) IRM max at VRM Type 25 °C 85 °C µA VBR at IBR (1) Min. V Typ. V 10 / 1000 µs (2)(3) VCL IPP (4) Max. 8 / 20µs RD (2)(3) VCL Max. Max. IPP(4) RD αT Max. Max. mA V A Ω V A Ω 10-4/°C SMBJ5.0A/CA 20 50 5.0 6.40 6.74 10 9.2 68 0.031 14.4 275 0.027 5.7 SMBJ6.0A/CA 20 50 6.0 6.70 7.05 10 10.3 61 0.048 14.8 270 0.027 5.9 SMBJ6.5A/CA 20 50 6.5 7.20 7.58 10 11.2 56 0.058 15.2 266 0.027 6.1 SMBJ8.5A/CA 20 50 8.5 9.40 9.90 1 14.4 41.7 0.096 19.5 205 0.044 7.3 SMBJ10A/CA 0.2 1 10 11.1 11.7 1 17 37 0.127 21.7 184 0.051 7.8 SMBJ12A/CA 0.2 1 12 13.3 14.0 1 19.9 31 0.168 25.3 157 0.068 8.3 SMBJ13A/CA 0.2 1 13 14.4 15.2 1 21.5 29 0.191 27.2 147 0.076 8.4 SMBJ15A/CA 0.2 1 15 16.7 17.6 1 24.4 25.1 0.236 32.5 123 0.114 8.8 SMBJ16A/CA 0.2 1 16 17.8 18.7 1 26 23.1 0.276 34.4 116 0.127 8.8 SMBJ18A/CA 0.2 1 18 20.0 21.1 1 29.2 21.5 0.328 39.3 102 0.168 9.2 SMBJ20A/CA 0.2 1 20 22.2 23.4 1 32.4 19.4 0.404 42.8 93 0.196 9.4 SMBJ22A/CA 0.2 1 22 24.4 25.7 1 35.5 17.7 0.481 48.3 83 0.257 9.6 SMBJ24A/CA 0.2 1 24 26.7 28.1 1 38.9 16 0.587 50 80 0.256 9.6 SMBJ26A/CA 0.2 1 26 28.9 30.4 1 42.1 14.9 0.683 53.5 75 0.288 9.7 SMBJ28A/CA 0.2 1 28 31.1 32.7 1 45.4 13.8 0.802 59 68 0.363 9.8 SMBJ30A/CA 0.2 1 30 33.3 35.1 1 48.4 13 0.888 64.3 62 0.443 9.9 SMBJ33A/CA 0.2 1 33 36.7 38.6 1 53.3 11.8 1.08 69.7 57 0.512 10.0 SMBJ36A/CA 0.2 1 36 40.0 42.1 1 58.1 10.3 1.35 76 52 0.611 10.0 SMBJ40A/CA 0.2 1 40 44.4 46.7 1 64.5 9.7 1.59 84 48 0.728 10.1 SMBJ48A/CA 0.2 1 48 53.3 56.1 1 77.4 8.1 2.28 100 40 1.03 10.3 SMBJ58A/CA 0.2 1 58 64.4 67.8 1 93.6 6.7 3.34 121 33 1.51 10.4 SMBJ64A/CA 0.2 1 64 71.3 75 1 103 5.8 4.17 134 30 1.84 10.5 SMBJ70A/CA 0.2 1 70 77.8 81.9 1 113 5.5 4.91 146 27 2.22 10.5 SMBJ85A/CA 0.2 1 85 94 99 1 137 4.6 7.18 178 22.5 3.29 10.6 SMBJ100A/CA 0.2 1 100 111 117 1 162 3.8 10.3 212 19 4.69 10.7 SMBJ130A/CA 0.2 1 130 144 152 1 209 3 16.5 265 15 7.03 10.8 SMBJ154A/CA 0.2 1 154 171 180 1 246 2.4 23.8 317 12.6 10.2 10.8 SMBJ170A/CA 0.2 1 170 189 199 1 275 2.2 30.0 353 11.3 12.7 10.8 SMBJ188A/CA 0.2 1 188 209 220 1 328 2 48.5 388 10.3 15.2 10.8 1. To calculate VBR versus Tj : VBR at Tj = VBR at 25 °C x (1 + αT x (Tj - 25)) 2. To calculate VCL versus Tj : VCL at Tj = VCL at 25 °C x (1 + αT x (Tj - 25)) 3. To calculate VCL max versus IPPappli: VCLmax = VCL - RD x (IPP - IPPappli) where IPP appli is the surge current in the application 4. Surge capability given for both directions for unidirectional and bidirectional devices DS1283 - Rev 12 page 3/13 SMBJ Characteristics (curves) 1.1 Characteristics (curves) Figure 3. Maximum peak power dissipation versus initial junction temperature 100000 Ppp (W) 700 Figure 4. Maximum peak pulse power versus exponential pulse duration PPP(W) Tj initial = 25 °C 10/1000 µs 600 10000 500 400 1000 300 200 100 100 Tj (°C) 0 0 25 50 75 100 125 150 175 Figure 5. Maximum peak pulse current versus clamping voltage 10000 IPP(W) tp(ms) 10 0.001 0.01 0.1 1 10 Figure 6. Dynamic resistance versus pulse duration 1000 RD(Ω) 8/20 µs 100 10/1000 µs 1000 10 100 SMBJ188A/CA 1 SMBJ58A/CA 10 0.1 SMBJ26A/CA SMBJ188A/CA SMBJ85A/CA SMBJ40A/CA SMBJ24A/CA SMBJ12A/CA SMBJ5.0A/CA 1 0.01 SMBJ5.0A/CA VCL(V) 0.1 1 10 100 0.1 1 10 1000 Figure 7. Junction capacitance versus reverse applied voltage (unidirectional types) 10000 tp(ms) 0.001 0.01 C(pF) Figure 8. Junction capacitance versus applied voltage (bidirectional types) 10000 C(pF) f = 1 MHz Vosc = 30 mVRMS Tj = 25 °C f = 1 MHz Vosc = 30 mVRMS Tj = 25 °C 1000 SMBJ5.0A SMBJ5.0CA 1000 SMBJ12CA SMBJ12A SMBJ24CA 100 SMBJ24A SMBJ40CA SMBJ40A 100 SMBJ85CA 10 SMBJ188CA SMBJ85A SMBJ188A VR(V) 10 1 DS1283 - Rev 12 10 100 1000 VR(V) 1 1 10 100 1000 page 4/13 SMBJ Characteristics (curves) Figure 9. Leakage current versus junction temperature Figure 10. Peak forward voltage drop versus peak forward current IR (nA) 1000 IF (A) 100 VR=VRM single pulse 100 VRM < 10V 10 Tj = 125 °C 10 Tj = 25 °C VRM ≥ 10V 1 1 0 Tj (°C) 25 50 75 100 125 150 Figure 11. Thermal impedance junction to ambient versus pulse duration 1000 Zth(j-a) (°C/W) 0 VF (V) 0 1 1.5 2 2.5 3 Figure 12. Thermal resistance junction to ambient versus copper area under each lead Rth(j-a)(°C/W) 160 Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness 0.5 Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness 140 120 100 100 80 60 10 40 20 1 0.01 DS1283 - Rev 12 tp (s) 0.1 1 10 100 SCU(cm²) 1000 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 page 5/13 SMBJ Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB package information Figure 13. SMB package outline E1 D E A1 C A2 L b Table 3. SMB package mechanical data Dimensions Inches(1) Millimeters Ref. Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 1.95 2.20 0.0768 0.0867 c 0.15 0.40 0.0059 0.0157 D 3.30 3.95 0.1299 0.1556 E 5.10 5.60 0.2008 0.2205 E1 4.05 4.60 0.1594 0.1811 L 0.75 1.50 0.0295 0.0591 1. Values in inches are converted from mm DS1283 - Rev 12 page 6/13 SMBJ SMB package information Figure 14. SMB recommended footprint 1.62 0.064 2.60 (0.102) Figure 15. Marking layout 1.62 0.064 2.18 (0.086) 5.84 (0.230) millimeters (inches) Figure 16. Package orientation in reel Bidirectional Figure 17. Tape and reel orientation Unidirectional Taped according to EIA-481 Pocket dimensions are not on scale. Pocket shape may vary depending on package On bidirectional devices, marking and logo may not be always in the same direction. Figure 18. Reel dimensions (mm) DS1283 - Rev 12 Figure 19. Inner box dimensions (mm) page 7/13 SMBJ SMB package information Figure 20. Tape and reel outline Table 4. Tape and reel mechanical data Dimensions Millimeters Ref. DS1283 - Rev 12 Min. Typ. Max. ØD0 1.5 1.55 1.6 ØD1 1.5 F 5.4 5.5 5.6 K0 2.64 2.74 2.84 P0 3.9 4.0 4.1 P1 7.9 8.0 8.1 P2 1.9 2.0 2.1 W 11.7 12.0 12.3 page 8/13 SMBJ Reflow profile 2.2 Reflow profile Figure 21. ST ECOPACK recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS1283 - Rev 12 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. page 9/13 SMBJ Ordering information 3 Ordering information Figure 22. Ordering information scheme SM B J 85 CA - TR Surface mount Peak pulse power B= 600 W Transil in SMB Stand-off voltage 85 = 85 V Types CA = Bidirectional A = Unidirectional Delivery mode TR = Tape and reel Table 5. Ordering information DS1283 - Rev 12 Order code Marking Package Weight Base qty. Delivery mode SMBJxxxA / CA See Table 6. Marking. SMB 0.11 g 2500 Tape and reel page 10/13 SMBJ Ordering information Table 6. Marking Order code DS1283 - Rev 12 Marking Order code Marking SMBJ5.0A BUZ SMBJ5.0CA BBZ SMBJ6.0A BUA SMBJ6.0CA BBA SMBJ6.5A BUB SMBJ6.5CA BBB SMBJ8.5A BUC SMBJ8.5CA BBC SMBJ10A BUD SMBJ10CA BBD SMBJ12A BUE SMBJ12CA BBE SMBJ13A BUF SMBJ13CA BBF SMBJ15A BUG SMBJ15CA BBG SMBJ16A CUG SMBJ16CA CBG SMBJ18A BUH SMBJ18CA BBH SMBJ20A BUI SMBJ20CA BBI SMBJ22A BVA SMBJ22CA CBH SMBJ24A BUJ SMBJ24CA BBJ SMBJ26A BUK SMBJ26CA BBK SMBJ28A BUL SMBJ28CA BBL SMBJ30A BUM SMBJ30CA BBM SMBJ33A BUN SMBJ33CA BBN SMBJ36A CUN SMBJ36CA CBN SMBJ40A CUJ SMBJ40CA CBJ SMBJ48A BUW SMBJ48CA BBW SMBJ58A BUO SMBJ58CA BBO SMBJ64A BUP SMBJ64CA BBP SMBJ70A CUM SMBJ70CA CBM SMBJ85A BUQ SMBJ85CA BBQ SMBJ100A CUQ SMBJ100CA CBQ SMBJ130A BUS SMBJ130CA BBS SMBJ154A BUT SMBJ154CA BBT SMBJ170A BUU SMBJ170CA BBU SMBJ188A BUV SMBJ188CA BBV page 11/13 SMBJ Revision history Table 7. Document revision history DS1283 - Rev 12 Date Version Changes Oct-2001 4 Previous issue. 10-Feb-2005 5 Reformatted to current template. Added directional (uni and bi) indications to graphics. Added ECOPACK statement. 16-Nov-2006 6 Add part numbers SMBJ36A-TR and SMBJ36CA-TR in Table 3. 14-May-2009 7 17-Sep-2009 8 Document updated for low leakage current. 09-Jul-2010 9 Changed timescale in Figure 9. 20-Oct-2010 10 Updated Figure 13. 24-Jan-2018 11 Updated Table 3: "Electrical characteristics parameter values (Tamb = 25 °C, unless otherwise specified)". 26-Apr-2021 12 Reformatted to current standards. Updated ECOPACK statement. Added part number SMBJ43CA/A. Updated Table 6. Minor text changes. page 12/13 SMBJ IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2021 STMicroelectronics – All rights reserved DS1283 - Rev 12 page 13/13
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