SMBYT03
®
FAST RECOVERY RECTIFIER DIODES
FEATURES
VERY LOW REVERSE RECOVERY TIME
VERY LOW SWITCHING LOSSES
LOW NOISE TURN-OFF SWITCHING
SURFACE MOUNT DEVICE
)
s
(
ct
u
d
o
r
P
e
DESCRIPTION
Single high voltage rectifier ranging from 200V to
400 V suited for Switch Mode Power Supplies and
other power converters.
)
(s
ABSOLUTE MAXIMUM RATINGS
Symbol
IF(RMS)
t
c
u
RMS forward current
Parameter
od
Average forward current
IFSM
Non repetitive surge peak forward current
Tstg
Tj
Storage and junction temperature range
t
e
l
o
s
b
O
Symbol
VRRM
SMC
s
b
O
IF(AV)
r
P
e
t
e
l
o
Parameter
Repetitive peak reverse voltage
Value
Unit
10
A
Tl=55°C
δ = 0.5
3
A
tp=10ms
sinusoidal
60
A
- 40 to + 150
- 40 to + 150
°C
°C
Value
Unit
400
V
Value
Unit
20
°C/W
THERMAL RESISTANCE
Symbol
Rth (j-l)
Parameter
Junction-leads
October 1999 - Ed : 2C
1/5
SMBYT03
ELECTRICAL CHARACTERISTICS
STATIC CHARACTERISTICS
Symbol
VF
*
Test Conditions
Tj = 25°C
Min.
Typ.
IF = 3 A
1.05
Tj = 100°C
IR **
Tj = 25°C
VR = VRRM
0.2
Tj = 100°C
Max.
Unit
1.5
V
1.4
10
µA
0.6
mA
Pulse test : * tp = 380 µs, duty cycle < 2 %
** tp = 5 ms, duty cycle < 2 %
)
s
(
ct
RECOVERY CHARACTERISTICS
Symbol
Test Conditions
Tj = 25°C
trr
Min.
IF = 0.5A
IR = 1A
Irr = 0.25A
IF = 1A
VR = 30V
dIF/dt = -15A/µs
r
P
e
u
d
o
Typ.
t
e
l
o
Max.
Unit
25
ns
60
s
b
O
TURN-OFF SWITCHING CHARACTERISTICS (Without serie inductance)
Symbol
tIRM
IRM
)
(s
Test Conditions
VCC = 200V
Tj = 100°C
ct
IF = 3A
Lp ≤ 0.05µH
dIF/dt = -50A/µs
du
o
r
P
To evaluate the conduction losses use the following equation :
P = 1.1 x IF(AV) + 0.08 x IF2(RMS)
e
t
e
ol
Voltage (V)
200
300
400
Marking
C2
C3
C4
s
b
O
Laser marking
Logo indicates cathode
2/5
Min.
Typ.
Max.
Unit
35
50
ns
1.5
2
A
SMBYT03
Fig.1 : Low frequency power losses versus
average current.
P F(av)(W)
60
5.5
=0.1
5.0
4.5
Fig.2 : Peak current versus form factor.
=0.5
=0.2
IM(A)
=1
T
50
=0.05
I
4.0
40
3.5
M
=tp/T
tp
3.0
30
2.5
P=0.5W
T
2.0
20
)
s
(
ct
P=1.5W
1.5
1.0
P=2.5W
10
0.5
I F(av)(A)
=tp/T
tp
u
d
o
4.0
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Fig.3 : Non repetitive surge peak forward current
versus overload duration.
Fig.4 : Relative variation of thermal impedance
junction to lead versus pulse duration.
0.0
0.0
20
0.5
1.0
1.5
2.0
2.5
3.0
3.5
K
IM(A)
18
16
)-
t
=0.5
14
s
(
t
c
12
10
Tc=25 oC
8
u
d
o
Tc=40 o C
6
4
r
P
e
2
t(s)
t
e
l
o
0.01
0.1
=0.5
= 0.2
=0.1
T
Single pulse
Tc=55 oC
1
10
bs
3.0
s
b
O
0.1
Fig.5 : Voltage drop versus forward current.
(Maximum values)
O
t
e
l
o
Zth(j-c) (tp. )
1 K = Rth(j-c)
IM
0
0.001
r
P
e
=tp/T
tp(s)
0.01
0.001
0.01
0.1
tp
1
10
Fig.6 : Average current versus ambient
temperature. (duty cycle : 0.5)
VFM(V)
3.5
I F(av)(A)
Rth(j-a)=Rth(j-l)
2.7
=0.5
T
3.0
2.4 Tl=100 oC
2.1
2.5
1.8
2.0
1.5
1.2
1.5
0.9
1.0
=tp/T
tp
Rth(j-a)=65 o C/W
1cm 2 Cu
0.6
0.3
0.0
0.01
0.5
I FM(A)
0.1
1
Tamb( o C)
10
50
0.0
0
20
40
60
80
100
120
140
160
3/5
SMBYT03
Fig.7 : Recovery time versus dIF/dt.
Fig.8 : Peak forward voltage versus dIF/dt.
)
s
(
ct
Fig.9 : Peak reverse current versus dIF/dt.
u
d
o
r
P
e
Fig.10 : Recovery charge versus dIF/dt.
(typical values)
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
bs
Fig.11 : Dynamic parameters versus junction
temperature.
O
Fig.12 : Thermal resistance junction to ambient
versus copper surface under each lead.
100
Rth(j-a)
Printed circuit : epoxy (e=35um)
90
80
70
60
50
40
30
20
10
Scu(cm 2 )
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
4/5
SMBYT03
PACKAGE MECHANICAL DATA
SMC
DIMENSIONS
REF.
E1
Min.
1.90
0.05
2.90
0.15
7.75
6.60
4.40
5.55
0.75
A1
A2
b
c
E
E1
E2
D
L
D
E
A1
Millimeters
L
Min.
0.075
0.002
0.114
0.006
0.305
0.260
0.173
0.218
0.030
Max.
0.096
0.008
0.126
0.016
0.321
0.281
0.185
0.246
0.063
u
d
o
)
s
(
ct
r
P
e
A2
C
Max.
2.45
0.20
3.2
0.41
8.15
7.15
4.70
6.25
1.60
Inches
b
t
e
l
o
FOOTPRINT DIMENSIONS
SMC
)
(s
s
b
O
t 3.3
c
u
d
o
r
P
e
t
e
l
o 4.2
2.0
s
b
O
2.0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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5/5
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