SMM4F12A-TR

SMM4FxxA Datasheet 400 W TVS in STmite Flat Features • • • • • • Peak pulse power: 400 W (10/1000 μs) and 2.5 kW (8/20 μs) Flat and thin package: 0.85 mm Stand-off voltage range from 5 V to 33 V Unidirectional type Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C Operating Tj max: 175 °C • High power capability at Tj max.: up to 160 W (10/1000 µs) • Lead finishing: matte tin plating Complies with the following standards • • • • • • • Product status link SMM4F SMM4F5.0A, SMM4F6.0A, SMM4F6.5A, SMM4F8.5A, SMM4F10A, SMM4F12A, SMM4F13A, SMM4F15A, SMM4F18A, SMM4F20A, SMM4F24A, SMM4F26A, SMM4F28A, SMM4F33A UL94, V0 J-STD-020 MSL level 1 J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 JESD-201 class 2 whisker test IPC7531 footprint and JEDEC registered package outline IEC 61000-4-2, C = 150 pF - R = 330 Ω exceeds level 4: – 30 kV (contact discharge) – 30 kV (air discharge) IEC 61000-4-4 – 4 kV Description The SMM4F TVS series are designed to protect sensitive circuits against transient surges. The planar technology makes it compatible with high-end circuits where low leakage current and high junction temperature are required to provide long term reliability and stability. DS5630 - Rev 6 - April 2020 For further information contact your local STMicroelectronics sales office. www.st.com SMM4FxxA Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit Contact discharge 30 kV Air discharge 30 10/1000 µs, Tj initial = Tamb 400 W IEC 61000-4-2 (C = 150 pF, R = 330 Ω) VPP Peak pulse voltage PPP Peak pulse power dissipation Tstg Storage temperature range -65 to +175 °C Tj Operating junction temperature range -55 to +175 °C TL Maximum lead temperature for soldering during 10 s 260 °C Figure 1. Electrical characteristics - parameter definitions Figure 2. Pulse definition for electrical characteristics DS5630 - Rev 6 page 2/13 SMM4FxxA Characteristics Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified) Type 25 °C 85 °C µA 10 / 1000 µs VBR at IBR(1) IRM max at VRM Min. V Typ. VCL Max. V (2)(3) (4) IPP Max. mA 8 / 20 µs RD (2)(3) VCL Max. Max. (4) IPP αT RD Max. Max. V A Ω V A Ω 10-4/°C SMM4F5.0A 10 50 5.0 6.46 6.80 7.14 10 9.2 43.5 0.047 13.4 179 0.035 5.7 SMM4F6.0A 10 50 6.0 6.65 7.00 7.35 10 10.3 38.8 0.076 13.7 175 0.036 5.9 SMM4F6.5A 10 50 6.5 7.13 7.50 7.88 10 11.2 35.7 0.093 14.5 166 0.040 6.1 SMM4F8.5A 10 50 8.5 9.5 10.0 10.5 1 14.4 27.7 0.141 19.5 140 0.064 7.3 SMM4F10A 0.2 1 10 11.4 12.0 12.6 1 17.0 23.5 0.188 21.7 127 0.072 7.8 SMM4F12A 0.2 1 12 13.3 14.0 14.7 1 19.9 20.1 0.259 25.3 112 0.095 8.3 SMM4F13A 0.2 1 13 14.3 15.0 15.8 1 21.5 18.6 0.306 27.2 106 0.108 8.4 SMM4F15A 0.2 1 15 17.1 18.0 18.9 1 24.4 16.4 0.335 32.5 90 0.151 8.8 SMM4F18A 0.2 1 18 20.9 22.0 23.1 1 29.2 14.0 0.436 39.3 76 0.213 9.2 SMM4F20A 0.2 1 20 22.8 24.0 25.2 1 32.4 12.0 0.600 42.8 70 0.250 9.4 SMM4F24A 0.2 1 24 26.6 28.0 29.4 1 38.9 9.5 1.00 50 61 0.338 9.6 SMM4F26A 0.2 1 26 28.5 30.0 31.5 1 42.1 9.0 1.18 53.5 58 0.380 9.7 SMM4F28A 0.2 1 28 31.4 33.0 34.7 1 45.4 8.0 1.34 59 53 0.458 9.8 SMM4F33A 0.2 1 33 37.1 39.0 41.0 1 53.3 7.0 1.76 69.7 45 0.638 10 1. To calculate VBR versus Tj: VBR at TJ = VBR at 25 °C x (1 + αT x (Tj - 25)) 2. To calculate VCL versus Tj: VCL at TJ = VCL at 25 °C x (1 + αT x (Tj - 25)) 3. To calculate VCLmax versus IPPappli: VCLmax = VBR max + RD x IPPappli 4. Surge capability given for both directions DS5630 - Rev 6 page 3/13 SMM4FxxA Characteristics (curves) 1.1 Characteristics (curves) Figure 3. Maximum peak power dissipation versus initial junction temperature Figure 4. Maximum peak pulse power versus exponential pulse duration P PP (W) 500 P PP (W) Tj initial = 25 °C 10/1000 µs 10000 V ≤ 6.5 V RM V > 6.5 V 400 RM 300 1000 200 100 0 Tj (°C) 0 25 50 75 100 125 150 175 200 Figure 5. Maximum clamping voltage versus peak pulse current I PP (A) 1000 tp (ms) 100 0.001 0.01 0.1 1 10 Figure 6. Dynamic resistance versus pulse duration RD (Ω) 100 8/20 µs 10/1000 µs 10 100 SMM4F33A 1 10 0.1 SMM4F33A 1 SMM4F24A SMM4F15A SMM4F5.0A 1 0.1 SMM4F24A SMM4F5.0A VCL (V) 10 100 Figure 7. Junction capacitance versus reverse applied voltage 10000 SMM4F15A 0.01 0.01 1 10 Figure 8. Leakage current versus junction temperature C (pF) 10000 f = 1 MHz Vosc = 30mVRMS Tj = 25 °C tp (ms) 0.1 I R (nA) VR=VRM VRM < 10V 1000 1000 SMM4F5.0A 100 SMM4F15A SMM4F33A 10 VRM ≥ 10V SMM4F24A 100 10 VR (V) 1 DS5630 - Rev 6 10 100 1 Tj (°C) 25 50 75 100 125 150 175 page 4/13 SMM4FxxA Characteristics (curves) Figure 9. Peak forward voltage drop versus peak forward current 100 Figure 10. Thermal impedance junction to ambient versus pulse duration I F (A) 1,000 Z th(j-a) (°C/W) single pulse 10 Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness 100 Tj=175 °C Tj=25 °C 10 1 VF (V) 0 0 0.5 1 1.5 2 2.5 3 tp (s) 1 0.01 3.5 0.1 1 10 100 1000 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead 200 Rth(j-a) (°C/W) Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness 150 100 50 0 DS5630 - Rev 6 SCu (cm²) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 page 5/13 SMM4FxxA Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 STmite Flat package information Figure 12. STmite Flat package outline Table 3. STmite Flat mechanical data Dimensions Ref. DS5630 - Rev 6 Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.80 0.85 0.95 0.031 0.033 0.038 b 0.40 0.55 0.65 0.015 0.022 0.026 b2 0.70 0.85 1.00 0.027 0.033 0.040 c 0.10 0.15 0.25 0.003 0.006 0.010 D 1.75 1.90 2.05 0.068 0.075 0.081 E 3.60 3.80 3.90 0.141 0.150 0.154 E1 2.80 2.95 3.10 0.110 0.116 0.123 L 0.50 0.55 0.80 0.019 0.022 0.032 L1 2.10 2.40 2.60 0.082 0.094 0.103 L2 0.45 0.60 0.75 0.017 0.024 0.030 L3 0.20 0.35 0.50 0.007 0.014 0.020 page 6/13 SMM4FxxA STmite Flat package information Figure 13. Footprint recommendations, dimensions in mm (inches) Cathode bar 1.8 (0.070) 0.8 (0.031) 0.85 (0.033) 0.75 (0.029) 2.04 (0.080) 0.55 (0.021) 0.7 (0.027) Figure 15. Package orientation in reel Figure 17. Reel dimensions (mm) DS5630 - Rev 6 Figure 14. Marking layout (refer to ordering information table for marking) Y WW MMMM MMMM : Marking Y : Year WW : week Figure 16. Tape and reel orientation Figure 18. Inner box dimensions (mm) page 7/13 SMM4FxxA STmite Flat package information Figure 19. Tape and reel outline Table 4. Tape and reel mechanical data Dimensions Ref. DS5630 - Rev 6 Millimeters Min. Typ. Max. P0 3.9 4 4.1 P1 3.9 4 4.1 P2 1.9 2 2.1 ØD0 1.5 1.55 1.6 ØD1 1.5 F 5.4 5.5 5.6 K0 1.0 1.1 1.2 W 11.7 12 12.3 page 8/13 SMM4FxxA STmite Flat package information Figure 20. ST ECOPACK recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 DS5630 - Rev 6 30 60 90 120 150 180 210 240 270 300 page 9/13 SMM4FxxA Ordering information 3 Ordering information Figure 21. Ordering information scheme SM M 4F xx A - TR Surface Mount Package M = STmite package Surge rating 4F = 400 W in flat package Stand off voltage 12 = 12 V Type A = Unidirectional Packaging TR = Tape and reel Table 5. Ordering information DS5630 - Rev 6 Order code Marking Package Weight Base qty. Delivery mode SMM4FxxA-TR See Table 6. Marking. STmite Flat 16 mg 12000 Tape and reel page 10/13 SMM4FxxA Ordering information Table 6. Marking DS5630 - Rev 6 Order code Marking SMM4F5.0A-TR 4UA SMM4F6.0A-TR 4UB SMM4F6.5A-TR 4UC SMM4F8.5A-TR 4UD SMM4F10A-TR 4UE SMM4F12A-TR 4UF SMM4F13A-TR 4UG SMM4F15A-TR 4UH SMM4F18A-TR 4UJ SMM4F20A-TR 4UK SMM4F24A-TR 4UM SMM4F26A-TR 4UN SMM4F28A-TR 4UO SMM4F33A-TR 4UQ page 11/13 SMM4FxxA Revision history Table 7. Document revision history DS5630 - Rev 6 Date Version Changes 29-Nov-2007 1 First issue. 19-Dec-2007 2 Updated IPP and RD parameters in columns 10 and 11 of Table 4. 19-Aug-2014 3 Updated package name. 19-Jan-2017 4 Updated cover page and Table 4. 03-Mar-2020 5 Updated document title, Section Description, Section 1 Characteristics and Section 1.1 Characteristics (curves). 15-Apr-2020 6 Updated Figure 5 and Figure 11. page 12/13 SMM4FxxA IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS5630 - Rev 6 page 13/13