SMTPA320

SMP50 / SMTPA / TPA Trisil™ for telecom equipment protection Features ■ ■ ■ ■ ■ ■ Bidirectional crowbar protection Voltage range from 62 V to 320 V Low capacitance from 12 pF to 20 pF @ 50 V Low leakage current : IR = 2 µA max Holding current: IH = 150 mA min Repetitive peak pulse current : IPP = 50 A (10/1000 µs) SMB SMA (JEDEC DO-214AC) (JEDEC DO-214AA) SMTPA SMP50 Main applications Telecommunication equipment such as: ■ ■ Analog and digital line cards (xDSL, T1/E1, ISDN, ...) Terminals (phone, fax, modem, ...) and central office equipment DO-15 TPA Description These Trisil series have been designed to protect telecommunication equipment against lightning and transient induced by AC power lines. They are available in SMA, SMB and DO-15 packages. Order codes Part Number SMP50-xxx TPAxxx SMTPAxxx See Ordering Information on page 9 Marking Benefits Trisils are not subject to ageing and provide a fail safe mode in short circuit for a better protection. They are used to help equipment to meet various standards such as UL1950, IEC950 / CSA C22.2, UL1459 and FCC part 68. Trisils have UL94 V0 approved resin. SMA and SMB packages are JEDEC registered (DO-214AC and DO-214AA). Trisils are UL497B approved (file: E136224). TM: TRISIL is a trademark of STMicroelectronics Schematic Diagram June 2007 Rev 3 1/11 www.st.com 11 Characteristics SMP50 / SMTPA / TPA 1 Characteristics Table 1. Compliant with the following standards Peak Surge Voltage (V) 2500 1000 5000 1500 6000 1500 8000 15000 4000 2000 4000 2000 4000 4000 1500 800 1000 Waveform Voltage 2/10 µs 10/1000 µs 2/10 µs 2/10 µs 10/700 µs 1/60 ns 10/700 µs 1.2/50 µs 10/700 µs 1.2/50 µs 10/160 µs 10/560 µs 9/720 µs Required peak current (A) 500 100 500 100 150 37.5 Current waveform 2/10 µs 10/1000 µs 2/10 µs 2/10 µs 5/310 µs Minimum serial resistor to meet standard (Ω) 20 10 40 0 53 0 0 0 21.5 0 0 0 21.5 0 12.5 6.5 0 Standard GR-1089 Core First level GR-1089 Core Second level GR-1089 Core Intra-building ITU-T-K20/K21 ITU-T-K20 (IEC61000-4-2) VDE0433 VDE0878 IEC61000-4-5 FCC Part 68, lightning surge type A FCC Part 68, lightning surge type B ESD contact discharge ESD air discharge 100 50 100 50 100 100 200 100 25 5/310 µs 1/20 µs 5/310 µs 8/20 µs 10/160 µs 10/560 µs 5/320 µs Table 2. Symbol Absolute ratings (Tamb = 25° C) Parameter 10/1000 µs 8/20 µs 10/560 µs 5/310 µs 10/160 µs 1/20 µs 2/10 µs 8/20 µs t = 0.2 s t=1s t=2s t = 15 mn t = 16.6 ms t = 20 ms Value 50 150 55 65 75 100 100 2.5 16 11.5 10 3.5 6.2 6.5 -55 to 150 150 260 Unit IPP Repetitive peak pulse current (see Figure 1) A IFS ITSM Fail-safe mode : maximum current(1) Non repetitive surge peak on-state current (sinusoidal) I2t value for fusing Storage temperature range Maximum junction temperature Maximum lead temperature for soldering during 10 s. kA A I2t Tstg Tj TL 1. A2s °C °C in fail safe mode, the device acts as a short circuit 2/11 SMP50 / SMTPA / TPA Table 3. Symbol Characteristics Thermal resistances Value Parameter DO-15 SMA 120 30 SMB 100 20 °C/W °C/W Unit Rth(j-a) Rth(j-l) Junction to ambient (with recommended footprint or with Llead = 10 mm for DO-15) Junction to leads (Llead = 10 mm for DO-15) 100 60 Table 4. Symbol VRM VBR VBO IRM IPP IBO IH VR IR C Electrical characteristics - definitions (Tamb = 25°C) Parameter Stand-off voltage Breakdown voltage Breakover voltage Leakage current Peak pulse current Breakover current Holding current Continuous reverse voltage Leakage current at VR Capacitance 3/11 Characteristics Table 5. Electrical characteristics - values (Tamb = 25°C) Types IRM @ VRM max. µA SMP50-62 / TPA62 SMTPA62 SMP50-68 / TPA68 SMTPA68 SMP50-100 / TPA100 SMTPA100 SMP50-120 / TPA120 SMTPA120 SMP50-130 / TPA130 SMTPA130 SMP50-180 / TPA180 SMTPA180 SMP50-200 / TPA200 SMTPA200 SMP50-220 / TPA220 SMTPA220 SMP50-240 / TPA240 SMTPA240 SMP50-270 / TPA270 SMTPA270 SMP50-320 / SMTPA320 2. See functional test circuit 1(Figure 9.) 3. See test circuit 2(Figure 10.) 4. See functional holding current test circuit 3(Figure 11.) 5. VR = 50 V bias, VRMS = 1 V, F = 1 MHz 6. VR = 2 V bias, VRMS = 1 V, F = 1 MHz SMP50 / SMTPA / TPA IR @ VR(1) max. Dynamic VBO(2) max. Static VBO @ IBO(3) max. V 82 90 133 160 173 240 267 293 320 360 400 800 max. mA IH(4) min. mA C(5) typ. pF 20 20 16 16 14 C(6) typ. pF 40 40 35 30 30 25 25 25 25 25 25 V 56 61 90 108 117 µA V 62 68 100 120 130 V 85 93 135 160 173 235 262 285 300 350 400 2 162 180 198 216 243 290 5 180 200 220 240 270 320 150 14 12 12 12 12 12 1. IR measured at VR guarantee VBR min ≥ VR Figure 1. Pulse waveform (10/1000 µs) Repetitive peak pulse current tr = rise time (µs) tp = pulse duration time (µs) Figure 2. ITSM(A) 30 25 20 15 10 5 Non repetitive surge peak on-state current versus overload duration % I PP 100 F=50Hz 50 0 tr tp t t(s) 0 1E-2 1E-1 1E+0 1E+1 1E+2 1E+3 4/11 SMP50 / SMTPA / TPA Characteristics Figure 3. On-state voltage versus on-state current (typical values) Figure 4. Relative variation of holding current versus junction temperature IT(A) 50 2.0 1.8 IH[Tj] / IH[Tj=25°C] 20 Tj=25°C 1.6 1.4 10 1.2 1.0 5 0.8 0.6 2 0.4 VT(V) 1 0 1 2 3 4 5 6 7 8 9 10 0.2 0.0 -40 -20 0 20 Tj(°C) 40 60 80 100 120 Figure 5. Relative variation of breakover voltage versus junction temperature Figure 6. Relative variation of leakage current versus reverse voltage applied (typical values) VBO[Tj] / VBO[Tj=25°C] 1.10 2000 1000 IRM[Tj] / IRM[Tj=25°C] VR=VRM 1.05 100 1.00 270 V 10 0.95 62 V Tj(°C) 0.90 -40 -20 0 20 40 60 80 100 1 25 50 Tj(°C) 75 100 125 Figure 7. Figure 8. Variation of thermal impedance junction to ambient versus pulse duration (Printed circuit board FR4, SCu = 35 µm, recommended pad layout) 2.5 Relative variation of junction capacitance versus reverse voltage applied (typical values) Zth(j-a)(°C/W) 1E+2 C[VR] / C[VR=50V] Tj=25°C F=1MHz VRMS=1V 2.0 SMTPA / TPA 1E+1 1.5 SMP50 1.0 1E+0 0.5 tp(s) 1E-1 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 0.0 1 2 5 10 VR(V) 20 50 100 300 5/11 Characteristics Figure 9. Test circuit 1 for Dynamic IBO and VBO parameters 100 V / µs, di /dt < 10 A / µs, Ipp = 50 A SMP50 / SMTPA / TPA 2Ω 45 Ω 66 Ω 470 Ω 83 Ω 0.36 nF 46 µH U 10 µF KeyTek 'System 2' generator with PN246I module 1 kV / µs, di /dt < 10 A / µs, Ipp = 10 A 26 µH 250 Ω 12 Ω 47 Ω 46 µH U 60 µF KeyTek 'System 2' generator with PN246I module Figure 10. Test circuit 2 for IBO and VBO parameters K ton = 20ms R1 = 140Ω R2 = 240Ω 220V 50Hz Vout VBO measurement DUT 1/4 IBO measurement TEST PROCEDURE Pulse test duration (tp = 20ms): ● for Bidirectional devices = Switch K is closed ● for Unidirectional devices = Switch K is open VOUT selection: ● Device with VBO > 200V ➔ VOUT = 250 VRMS, R1 = 140Ω ● Device with VBO ≥ 200V ➔ VOUT = 480 VRMS, R2 = 240Ω Figure 11. Test circuit 3 for dynamic IH parameters R Surge generator VBAT = - 48 V D.U.T This is a GO-NOGO test which allows to confirm the holding current (IH) level in a functional test circuit. TEST PROCEDURE 1/ Adjust the current level at the IH value by short circuiting the AK of the D.U.T. 2/ Fire the D.U.T. with a surge current ➔ IPP = 10A, 10/1000µs. 3/ The D.U.T. will come back off-state within 50ms maximum. 6/11 SMP50 / SMTPA / TPA Ordering information scheme 2 Ordering information scheme SMP Series SMP = Trisil surface mount in SMA SMTP = Trisil surface mount in SMB TP = Trisil in DO-15 Repetitive Peak Pulse Current A or 50 = 50 A Voltage 62 = 62 V 50 - xxx 3 Package information ● Epoxy meets UL94, V0 SMA dimensions Dimensions Ref. E1 Table 6. Millimeters Min. Max. 2.45 0.20 1.65 0.40 2.90 5.35 4.60 1.50 Inches Min. 0.075 0.002 0.049 0.006 0.089 0.189 0.156 0.030 Max. 0.094 0.008 0.065 0.016 0.114 0.211 0.181 0.059 D A1 A2 b 1.90 0.05 1.25 0.15 2.25 4.80 3.95 0.75 E c A1 D E b C L A2 E1 L Figure 12. Footprint, dimensions in mm (inches) 1.4 (0.055) 2.63 (0.103) 1.4 (0.055) 1.64 (0.064) 5.43 (0.214) 7/11 Package information Table 7. SMB dimensions SMP50 / SMTPA / TPA Dimensions Ref. E1 Millimeters Min. Max. 2.45 0.20 2.20 0.40 5.60 4.60 3.95 1.50 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.059 D A1 A2 b 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 E c A1 E E1 b C L A2 D L Figure 13. Footprint, dimensions in mm (inches) 1.62 2.60 (0.064) (0.102) 1.62 (0.064) 2.18 (0.086) 5.84 (0.300) Table 8. DO-15 dimensions Dimensions C A C Ref. Millimeters Min. Max. 6.75 3.53 31 0.88 Inches Min. 0.238 0.116 1.024 0.028 Max. 0.266 0.139 1.220 0.035 A D B 6.05 2.95 26 0.71 B C D In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/11 SMP50 / SMTPA / TPA Ordering Information 4 Ordering Information Part Number SMP50-62 SMP50-68 SMP50-100 SMP50-120 SMP50-130 SMP50-180 SMP50-200 SMP50-220 SMP50-240 SMP50-270 SMP50-320 SMTPA62 SMTPA68 SMTPA100 SMTPA120 SMTPA130 SMTPA180 SMTPA200 SMTPA220 SMTPA240 SMTPA270 SMTPA320 TPA62 TPA62RL TPA68 TPA68RL TPA100 TPA100RL TPA120 TPA130 TPA130RL TPA180 TPA180RL TPA200 TPA200RL TPA220 TPA220RL TPA240 TPA240RL TPA270 TPA270RL Marking V06 V07 V10 V12 V13 V18 V20 V22 V24 V27 V32 U01 U05 U13 U17 U19 U25 U27 U31 U35 U39 U47 TPA62 TPA68 TPA100 TPA120 TPA130 TPA180 TPA200 TPA220 TPA240 TPA270 DO-15 0.40 g 1000 6000 1000 6000 1000 6000 1000 1000 6000 1000 6000 1000 6000 1000 6000 1000 6000 1000 6000 Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel SMB 0.11 g 2500 Tape & reel SMA 0.068 g 5000 Tape & reel Package Weight Base qty Delivery mode 9/11 Revision History SMP50 / SMTPA / TPA 5 Revision History Date 16-Nov-2004 Revision 1 Description of Changes SMP50, SMTPA and TPA datasheets merge. Reformatted to current standards. Updated IPP value in Table 2 . Added part numbers SMP50-320 and SMTPA320. Updated dimensions and footprint for SMA and footprint for SMB. Corrected typographical error in part number. Added dimensions in inches to footprint illustrations. 30-Mar-2007 2 12-Jun-2007 3 10/11 SMP50 / SMTPA / TPA Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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