SMTYXXA

SMTYxxA Low forward voltage TVS: Transky™ Main applications ■ Power rail ESD transient over-voltages and reverse voltages protection for 5 and 12 V supplied IC’s A Description The Transky is designed specifically for miniaturized electronic devices and equipment subject to ESD transient over-voltages. The Transky combines the performance of a Transil™ or TVS (Transient Voltage Suppressor) and low forward voltage Schottky diode in a monolithic structure. It offers both an overshoot protection in the 6.4 V or 13.2 V clamping ranges and a negative spike protection in the -0.48 V clamping range compared to the -1 V with the standard Transil family on the 5 or 12 V power line. Its 600 W power capability offers high transient capability with SMA package. K SMA (JEDEC DO-214AC) K Features ■ ■ ■ ■ ■ Integration of a Transil with a Schottky diode JEDEC registred SMA package outline Low clamping factor VCL/VBR Fast response time RoHS compliant A Order code Part number SMTY5.0A SMTY12A Marking Y5.0 Y12 Benefits ■ ■ ■ Optimized PCB area: up to 62% space saving versus discrete solution High peak pulse power: up to 600 W Stand-off voltage: 5 V for SMTY5.0A 12 V for SMTY12A Low forward voltage: 0.48 V @ 1 A Very low leakage current: 10 µA @ 5 V for SMTY5.0A 20 µA @12 V for SMTY12A Complies with following standard IEC 61000-4-2 Level 4 Air discharge 15 kV Contact discharge 8 kV ■ ■ April 2006 Rev 1 1/7 www.st.com 7 Characteristics SMTYxxA 1 Characteristics Table 1. Symbol Vpp P PPP IFSM Tstg Tj d Ptot --------------dTj Absolute ratings (limiting value) Parameter IEC 61000-4-2 level 4 standard Power dissipation on infinite heatsink Peak pulse Power dissipation (1) Non repetitive surge peak forward current Storage temperature range Maximum operating junction temperature (2) Air discharge Contact discharge Tamb = 25° C Tj initial = Tamb tp=10 ms Tj initial = Tamb Value 15 8 4 600 40 -65 to +175 150 Unit kV W W A °C °C 1. 10/1000µs pulse waveform 2. 1 < -------------------------- thermal runaway condition for a Transky Rth ( j – a ) Table 2. Symbol Rth(j-a) Rth(j-l) Thermal resistance Parameter Junction to ambient on printed circuit Junction to lead Value 120 30 Unit °C/W °C/W Table 3. Symbol IRM VRM VBR IR VCL IPP VF Electrical characteristics Parameter Leakage current @ VRM Stand-off voltage Breakdown voltage VCL VBR VRM VF IRM IR V I IF Reverse leakage current Clamping voltage Peak pulse current Forward voltage drop IPP IRM max @ VRM µA SMTY5.0A SMTY12A 10 20 V 5 12 IRM max @ VCLmax @ IPP VBR min @ IR VRM @ 85° C 10/1000 µs mA 0.5 1.2 V 5 12 V 6.4 13.2 mA 10 1 V 9 18.5 A 43.5 31 VF max @ 1A (1) V 0.48 0.48 αT max 10-4/°C 10 10 1. Pulse test tp = 500 µs, δ < 2% 2/7 SMTYxxA Characteristics Figure 1. Pulse waveform (10/1000 µs) Figure 2. Peak pulse power versus exponential pulse duration (Tj initial = 25° C) Tj initial = 25 °C Ppp(kW) I Pulse waveform 10/1000 µs 1.E+01 1.E+00 tp(ms) tp = 10 µs 1000 µs 1.E-01 0.01 0.10 1.00 10.00 Figure 3. Relative variation of peak pulse power versus initial junction temperature Figure 4. Average power dissipation versus ambient temperature 110 100 90 % P(W) 4.5 4.0 3.5 Rth(j-a)=Rth(j-l) 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 175 Tj(°C) 1.0 0.5 Tamb(°C) 0.0 0 25 50 3.0 2.5 2.0 1.5 Rth(j-a)=120 °C/W (PCB FR4, recommended pad layout) 75 100 125 150 Figure 5. Variation of thermal impedance, Figure 6. junction to ambient, versus pulse duration (Epoxy, FR4, eCu = 35 µm) Thermal resistance, junction to ambient, versus copper surface under each lead (printed circuit board FR4, eCu = 35 µm) Zth(j-a) (°C/W) 1000.0 SCU=3 mm² Recommended pad layout Rth(j-a) (°C/W) 140 120 100 80 100.0 10.0 60 40 20 1.0 tp(s) 0.1 1.E-03 0 SCU(cm²) 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 3/7 Ordering information scheme SMTYxxA Figure 7. Forward voltage drop versus forward current (typical values) Figure 8. Reverse leakage current versus junction temperature (typical values) 10.00 IF (A) 1.E+04 IR(µA) 1.E+03 1.00 SMTY12A VR= 12 V T j =85 °C T j =25 °C 1.E+02 1.E+01 0.10 SMTY5.0A VR= 5 V 1.E+00 V F (V) 0.01 0.0 T j(°C) 1.E-01 1.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 25 50 75 100 125 150 Figure 9. IPP(A) SMTY5.0A Clamping voltage versus Figure 10. SMTY12A Clamping voltage versus peak pulse current (typical values) peak pulse current (typical values) 100.0 Tj initial =25 °C 8/20 µs 100.0 IPP(A) Tj initial =25 °C 8/20 µs 10.0 10/1000 µs 10.0 10/1000 µs 1.0 SMTY5.0A 1.0 SMTY12A VCL(V) 0.1 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 0.1 10 11 12 13 14 15 16 17 18 VCL(V) 19 20 2 Ordering information scheme SMTY xx A Transky Stand off voltage 5.0 = 5 V 12 = 12 V Package A = SMA package 4/7 SMTYxxA Package information 3 Table 4. Package information SMA (plastic) dimensions Dimensions Ref. Millimeters Min. A1 A2 b c E E1 D L 1.90 0.05 1.25 0.15 4.80 3.95 2.25 0.75 Max. 2.03 0.20 1.65 0.41 5.60 4.60 2.95 1.60 Min. 0.075 0.002 0.049 0.006 0.189 0.156 0.089 0.030 Inches Max. 0.080 0.008 0.065 0.016 0.220 0.181 0.116 0.063 Figure 11. Footprint dimensions (millimeter) Figure 12. Marking information scheme 5.49 Cathode bar (unidirectional devices only ) e3 1.67 xxx z y ww e3: ECOPACK ( Leadfree) XXX : Marking Z : Manufacturing location Y : Year WW : week 1.87 1.75 1.87 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information SMTYxxA 4 Ordering information Ordering type SMTY5.0A SMTY12A Marking Y5.0 Y12 Package SMA SMA Weight 0.068g 0.068g Base quantity Delivery mode 5000 5000 Tape and Reel Tape and Reel 5 Revision history Date 24-Apr-2006 Revision 1 Initial release. Changes 6/7 SMTYxxA Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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