SPBT2532C2.AT2
Bluetooth® V2.1 + EDR module class 2 embedding SPP and AT
commands
Datasheet − production data
Features
■
Bluetooth® radio
– Fully embedded Bluetooth v2.1 + EDR with
profiles
– Class 2 module
– Complete RF ready module
■
ST micro Cortex-M3 microprocessor up to
72 MHz
■
Memory
– 256 kb Flash memory
– 48 kb RAM memory
■
Data rate
– 1.5 Mbps maximum data rate
■
Serial interface
– UART up to 2.0 Mbps
■
General I/O
– 4 general purpose I/Os
■
User interface
– AT2 command set (abSerial)
– Firmware upgrade over UART
■
CE and Bluetooth qualified
■
EPL (end product listing) fulfilled
■
Single voltage supply: 3.3 V typical
■
Micro-sized form factor: 10.5 x 13.5 x 2.5 mm
■
Operating temperature range: -40 °C to 85 °C
July 2012
This is information on a product in full production.
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www.st.com
27
Contents
SPBT2532C2.AT2
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4
Software architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5
4.1
Lower layer stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2
Upper layer stack: Amp'ed UP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.3
AT command set: abSerial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.4
Bluetooth firmware implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Hardware specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3
High speed CPU mode current consumption . . . . . . . . . . . . . . . . . . . . . . 11
5.4
Standard CPU mode current consumption . . . . . . . . . . . . . . . . . . . . . . . . 11
5.5
I/O operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.6
Selected RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.7
Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.8
Pin placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.9
Layout drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6
Hardware block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7
Hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8
2/27
7.1
Module reflow installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.2
GPIO interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3
UART interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8.1
Antenna choice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8.2
Antenna coupling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
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Contents
8.3
Example of trace calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8.4
Reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
8.4.1
External reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
8.4.2
Internal reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
9
Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
10
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
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List of tables
SPBT2532C2.AT2
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
4/27
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
High speed CPU mode current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Standard CPU mode current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
I/O operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Selected RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
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SPBT2532C2.AT2
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
FW architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Pin placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Ground plane diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Layout drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
SPBT2532C2.AT2 module block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Connection to host device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Typical RS232 circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Example of antenna integration on the STEVAL-SPBT2ATV3. . . . . . . . . . . . . . . . . . . . . . 20
Antenna printed on PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
SMD antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
SMA connector for external antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Parameters for trace matching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
External reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Internal reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
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Description
1
SPBT2532C2.AT2
Description
The SPBT2532C2.AT2 is an easy to use Bluetooth module, compliant with Bluetooth v2.1 +
EDR.
The module is the smallest form factor available which provides a complete RF platform.
The SPBT2532C2.AT2 enables electronic devices with wireless connectivity, not requiring
any RF experience or expertise for integration into the final product. The SPBT2532C2.AT2
module, being a certified solution, optimizes the time to market of the final application.
The module is designed for maximum performance in the minimum possible size including
fast speed UART and 4 general purpose I/O lines, several serial interface options, and up to
1.5 Mbps data throughput.
The SPBT2532C2.AT2 is a surface mount PCB module that provides fully embedded,
ready-to-use Bluetooth wireless technology. The reprogrammable Flash memory contains
embedded firmware for serial cable replacement using the Bluetooth SPP profile.
Embedded Bluetooth AT2 command firmware is a friendly interface, which realizes a simple
control for cable replacement, enabling communication with most Bluetooth enabled
devices, provided that the devices support the SPP profile. The SPBT2532C2.AT2,
supporting iAP profile, provides communication with Android™, smartphones, and Apple®
iOS Bluetooth enabled devices.
An Apple authentication IC is required to exchange data with an Apple device or access an
Apple device application. The AT2 FW includes the Bluetooth SPP profile capable of
recognizing the Apple authentication chip.
Customers using the Apple authentication IC must register as developers to become an
Apple certified MFI member. License fees may apply, for additional information visit:
http://developer.apple.com/programs/which-program/index.html.
Certified MFI developers developing electronic accessories that connect to the iPod®,
iPhone®, and iPad® gain access to technical documentation, hardware components,
technical support and certification logos.
Customized firmware for peripheral device interaction, power optimization, security, and
other proprietary features may be supported and can be ordered pre-loaded and configured.
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SPBT2532C2.AT2
2
RoHS compliance
RoHS compliance
ST modules are RoHS compliant and comply with ECOPACK® norms.
3
Applications
■
Serial cable replacement
■
M2M industrial control
■
Service diagnostic
■
Data acquisition equipment
■
Machine control
■
Sensor monitoring
■
Security system
■
Mobile health.
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Software architecture
SPBT2532C2.AT2
4
Software architecture
4.1
Lower layer stack
4.2
4.3
●
Bluetooth v2.1 + EDR
●
Device power modes: active, sleep and deep sleep
●
Wake-on Bluetooth feature optimized power consumption of host CPU
●
Authentication and encryption
●
Encryption key length from 8 bits to 128 bits
●
Persistent Flash memory for BD address and user parameter storage
●
All ACL (asynchronous connection less) packet types
●
Point-to-point supported
●
Master/slave switch supported during connection and post connection
●
Dedicated inquiry access code for improved inquiry scan performance
●
Dynamic packet selection channel quality driven data rate to optimize link performance
●
Dynamic power control
●
802.11b co-existence AFH.
Upper layer stack: Amp'ed UP
●
SPP, IAP, SDAP and GAP protocols
●
RFComm, SDP, and L2CAP supported
●
Multipoint with simultaneous slaves.
AT command set: abSerial
The complete command list including the iAP commands is reported in the UM1547 user
manual.
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SPBT2532C2.AT2
4.4
Software architecture
Bluetooth firmware implementation
Figure 1.
FW architecture
abSerial AT Command Set
and/or custom application
Application
layer API
iAP
Upper layer stack + BT
profiles:Amp’edUP
HCI over UART
Lower layer BT stack
Bluetooth controller
AM14808v1
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Hardware specifications
5
SPBT2532C2.AT2
Hardware specifications
General conditions (VIN = 3.3 V and 25 °C).
5.1
Recommended operating conditions
Table 1.
Recommended operating conditions
Rating
Min.
Typ.
Max.
Unit
Operating temperature range(1)
-40
-
85
°C
Supply voltage VIN
2.8
3.3
3.6
V
Signal pin voltage
-
3.0
-
V
RF frequency
2400
-
2483.5
MHz
1. @ CPU 8MHz, @ CPU 32MHZ - 16 MHz max. operating temperature is 55 °C.
5.2
Absolute maximum ratings
Table 2.
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Absolute maximum ratings
Rating
Min.
Typ.
Max.
Unit
Storage temperature range
-55
-
+105
°C
Supply voltage, VIN
-0.3
+ 5.0
V
I/O pin voltage, VIO
-0.3
+ 5.5
V
RF input power
-
-5
dBm
Input voltage on non-5 V tolerant pin
0.3
+4.0
V
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SPBT2532C2.AT2
5.3
Hardware specifications
High speed CPU mode current consumption
●
High speed CPU mode
–
CPU 32 MHz, maximum operating temperature 55 °C
–
UART supports up to 921 Kbps
–
Data throughput up to 1.5 Mbps
–
Shallow sleep enabled.
Table 3.
5.4
High speed CPU mode current consumption
Modes (typical power consumption)
Avg.
Unit
ACL data 115 K baud UART at max. throughput (master)
41
mA
ACL data 115 K baud UART at max. throughput (slave)
41
mA
Connection, no data traffic, master
28.9
mA
Connection, no data traffic, slave
34.5
mA
Standby, without deep sleep
28
mA
Standby, with deep sleep
3.1
mA
Bluetooth power down / CPU standby
25
µA
Mode (typical power consumption)
Avg.
Unit
ACL data 115 K baud UART at max. throughput (master)
25.8
mA
ACL data 115 K baud UART at max. throughput (slave)
25.8
mA
Connection, no data traffic, master
11.9
mA
Connection, no data traffic, slave
16.9
mA
Standby, without deep sleep
11.2
mA
Standby, with deep sleep
2.6
mA
Bluetooth power down / CPU standby
25
µA
Standard CPU mode current consumption
●
Standard CPU mode
–
CPU 8 MHz, maximum operating temperature 85 °C
–
UART supports up to 115 Kbps
–
Data throughput up to 200 Kbps
–
Shallow sleep enabled.
Table 4.
Standard CPU mode current consumption
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Hardware specifications
5.5
I/O operating characteristics
Table 5.
5.6
SPBT2532C2.AT2
I/O operating characteristics
Symbol
Parameter
Min.
Max.
Unit
Conditions
VIL
Low-level input voltage
-
0.9
V
VIN, 3.0 V
VIH
High-level input voltage
2.1
-
V
VIN, 3.0 V
VOL
Low-level output voltage
-
0.4
V
VIN, 3.0 V
VOH
High-level output voltage
2.2
-
V
VIN, 3.0 V
IOL
Low-level output current
-
4.0
mA
VOL = 0.4 V
IOH
High-level output current
-
4.0
mA
VOH = 2.2 V
RPU
Pull-up resistor
80
120
kΩ
Resistor turned on
RPD
Pull-down resistor
80
120
kΩ
Resistor turned on
Selected RF characteristics
Table 6.
Selected RF characteristics
Parameter
Conditions
Antenna load
Typ.
Unit
50
ohm
Radio receiver
Sensitivity level
BER < .001 with DH5
-85
dBm
Maximum usable level
BER < .001 with DH1
+8
dBm
Input VSWR
2.5:1
Radio transmitter
Maximum output power
12/27
50 Ω load
+2
dBm
Initial carrier frequency tolerance
± 30
kHz
20 dB bandwidth for modulated carrier
935
kHz
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SPBT2532C2.AT2
Hardware specifications
5.7
Pin assignment
Table 7.
Pin assignment
Name
Type
Pin#
Description
ALT function(1) (2)
5V
tolerant
Initial state
UART interface
RXD
I
13
Receive data
ADC 3
Y
TXD
O
14
Transmit data
ADC 2
Y
RTS
O
12
Request to send (active low)
ADC 0 I2C clock/aux
UART Rx
Y
CTS
I
11
Clear to send (active low)
ADC 1 I2C data/aux
UART Tx
Y
I
9
Boot 0
Vin
8
Vin
GND
5,7
GND
I
10
Reset input (active low for 5 ms)
RF
I/O
6
50 Ω Rx/Tx antenna port
Boot loader
Boot 0
Power and ground
Reset
RESETN
Antenna
ANT
GPIO - general purpose input/output
GPIO [1]
I/O
1
General purpose input/output
SPI MISO
Y
Input pull-down
GPIO [2]
I/O
2
General purpose input/output
SPI MOSI/I2S_SD
Y
Floating
GPIO [3]
I/O
3
General purpose input/output
SPI SCLK/ I2S_CK
Y
Input pull-down
GPIO [4]
I/O
4
General purpose input/output
SPI SS/I2S_WS
Y
Input pull-down
1. ADC pin functions are not 5 V tolerant when used as ALT pin function. Otherwise the I/O pins are all 5 V tolerant.
2. Please note that the usage of ALT function is dependant upon the firmware that is loaded into the module, and is beyond
the scope of this document. The AT command interface uses the main UART by default.
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Hardware specifications
5.8
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SPBT2532C2.AT2
Pin placement
Figure 2.
Pin placement
Figure 3.
Ground plane diagram
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SPBT2532C2.AT2
5.9
Hardware specifications
Layout drawing
Figure 4.
Layout drawing
1 GPI0 01
TXD 14
2 GPI0 02
RXD 13
3 GPI0 03
RTS 12
4 GPI0 04
CTS 11
RESET 10
5 GND
6 ANT
BOOT 9
7 GND
VIN 8
pad size: 0.76x1.07
10.5x13.5x2.5 mm (height tolerance +/- 0.1 mm)
All dimensions are in millimeters.
Drawing is not in scale.
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AM14832v1
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Hardware block diagram
6
SPBT2532C2.AT2
Hardware block diagram
Figure 5.
SPBT2532C2.AT2 module block diagram
Battery or Supply
ARM Cortex MCU
STM32
Regulator
256K Flash
BP
Filter
Host Controller
Interface
STLC2500DB
UART
GPIO
48K RAM
UART
I2S/
PCM
Clock
LPO
AM14807v1
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SPBT2532C2.AT2
7
Hardware design
Hardware design
The SPBT2532C2.AT2 module with AT2 command embedded FW supports UAR and GPIO
hardware interfaces. Note that the usage of these interfaces is dependent upon the firmware
that is loaded into the module, and is beyond the scope of this document. The AT2
command interface uses the main UART by default.
Note:
7.1
1
All unused pins should be left floating; do not ground.
2
All GND pins must be well grounded.
3
The area around the module should be free of any ground planes, power planes, trace
routings, or metal, for 6 mm from the antenna in all directions.
4
Traces should not be routed underneath the module.
Module reflow installation
The SPB2532C2.AT2 is a surface mount Bluetooth module supplied on a 14-pin, 6-layer
PCB. The final assembly recommended reflow profiles are indicated here below.
The soldering phase must be executed with care: in order to avoid undesired melting
phenomenon, particular attention must be paid to the setup of the peak temperature.
The following are some suggestions for the temperature profile based on IPC/JEDEC JSTD-020C, July 2004 recommendations.
Table 8.
Soldering
Profile feature
Average ramp-up rate (TSMAX to TP)
PB-free assembly
3 °C/sec max.
Preheat:
– Temperature min. (TS min.)
– Temperature max. (TS max.)
– Time (ts min. to ts max.)(ts)
150 °C
200 °C
60-100 sec
Time maintained above:
– Temperature TL
– Temperature TL
217 °C
60-70 sec
Peak temperature (TP)
240 + 0 °C
Time within 5 °C of actual peak temperature (TP)
10-20 sec
Ramp-down rate
6 °C/sec
Time from 25 °C to peak temperature
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8 minutes max.
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Hardware design
SPBT2532C2.AT2
Figure 6.
Soldering profile
!-V
7.2
GPIO interface
All GPIOs are capable of sinking and sourcing 4 mA of I/O current. GPIO [1] is internally
pulled down with 100 kΩ (nominal) resistors.
7.3
UART interface
The UART is compatible with the 16550 industry standard. Four signals are provided with
the UART interface. The TXD and RXD pins are used for data while the CTS and RTS pins
are used for flow control.
Figure 7.
Connection to host device
"LUETOOTH
-ODULE
(OST
!-V
18/27
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SPBT2532C2.AT2
Figure 8.
Hardware design
Typical RS232 circuit
!-V
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Application information
8
SPBT2532C2.AT2
Application information
Here below there are some suggestions to better implement the module in the final
application.
●
Avoid that traces with switching signals are routed on the motherboard below the
module. The best condition would be to have a ground plane underneath the module
●
Connect the supply voltage ground of the module with the other grounds present on the
motherboard in a star ground configuration.
Keep the RF ground separate from the module supply voltage ground; the two grounds are
already connected inside the module in one point, a possible implementation can be seen in
Figure 9.
Figure 9.
8.1
Example of antenna integration on the STEVAL-SPBT2ATV3
Antenna choice
The RF output pin must be connected to an antenna which may be:
●
Antenna directly printed on the PCB (Figure 10)
●
Integrated SMD antenna, including but not limited to the following examples
(Figure 11):
–
Johanson Technology 2450T18A100S
–
Antenova 30-30-A5839-01
–
Murata ANCV12G44SAA127
–
Pulse W3008
–
Yageo CAN4311153002451K.
The external antenna connected by means of an SMA connector (Figure 12).
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SPBT2532C2.AT2
Application information
Figure 10. Antenna printed on PCB
Note:
This is an antenna design indication. Since antenna dimension depends on PCB material,
thickness, ε r constant and design, among other parameters, to dimension it correctly,
please refer to antenna calculator literature.
Figure 11. SMD antenna
Figure 12. SMA connector for external antenna
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Application information
8.2
SPBT2532C2.AT2
Antenna coupling
Despite the type of antenna chosen, the connection between the RF out pin and the
antenna must be realized to get the maximum power transfer.
As a general rule, the characteristic impedance (Z0) of the connection must be fixed at the
value of 50 Ω. The connection trace must be matched to respect such a condition.
50 Ω¸ matching depends on various factors and elements that must be taken into
consideration:
8.3
●
Type of material, i.e. FR4 or others
●
The electrical characteristics of the material, among them the electric constant, ε r, at
2.4 GHz
●
PCB and traces mechanical dimensions:
–
PCB thickness
–
Reference ground thickness
–
Trace width
–
Trace thickness.
Example of trace calculation
Example of strip line calculation:
●
To get a strip line of 50 Ω, using a 1 mm thick FR4 board, with an ε r = 4.3 at 2.4 GHz,
with Cu thickness of 41 µm, the strip line width must be 1.9 mm (micro strip type
calculation).
Tools for calculating the characteristic impedance, based on the physical and mechanical
characteristics of the PCB, can be easily found online.
Figure 13. Parameters for trace matching
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8.4
Application information
Reset circuit
Two types of system reset circuits are detailed below.
8.4.1
External reset circuit
Figure 14. External reset circuit
2%3%4
!-V
Note:
RPU ranges from 30 kΩ to 50 kΩ internally.
8.4.2
Internal reset circuit
Figure 15. Internal reset circuit
2%3%4
!-V
Note:
1
RPU ranges from 30 kΩ to 50 kΩ internally.
2
RRST should be from 1 kΩ to 10 kΩ.
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Regulatory compliance
9
SPBT2532C2.AT2
Regulatory compliance
●
●
BQB
–
BQB qualified design, QD ID: B016360
–
Product type: End Product
–
TGP version: Core 2.1/2.1 + EDR TCRL-2009-1
–
Core spec version: 2.1/2.1 + EDR
–
Product descriptions: Bluetooth module
CE
–
CE Expert opinion: 307-ARAJ00079
–
Measurements have been performed in accordance with (report available on
request):
–
EN 300 328 V 1.7.1 (2006-10) (a)
–
EN 301 489-17 V 2.1.1 (2009) (b)
–
EN60950-1:2006 +A11:2009+A1:2010
(c)
CE certified:
a. EN 300 328 V 1.7.1 (2006-10): “electromagnetic compatibility and radio spectrum matters (ERM); wideband
transmission systems; data transmission equipment operating in the 2.4 GHZ ISM band and using wideband
modulation techniques; harmonized EN covering essential requirements under article 3.2 of the R&TTE
directive”.
b. EN 301 489-17 V 2.1.1 (2009): “electromagnetic compatibility and radio spectrum matters (ERM);
electromagnetic compatibility (EMC) standard for radio equipment and services; part 17: specific condition for
2.4 GHz wideband transmission systems and 5 GHz high performance RLAN equipment”.
c. EN60950-1:2006 +A11:2009+A1:2010: “Information technology equipment - safety”.
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10
Ordering information
Ordering information
Table 9.
Ordering information
Order code
Description
SPBT2532C2.AT2
Class 2 OEM Bluetooth antenna module
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Revision history
11
SPBT2532C2.AT2
Revision history
Table 10.
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Document revision history
Date
Revision
18-Jul-2012
1
Changes
First release.
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