SPBT2563C1
Bluetooth™ class 1 module
Preliminary Data
Features
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BluetoothTM specification compliant V2.0 Output power class 1 ( 20 dBm max) Transmission rate up to 721 Kbps in BR Point-to-point, point-to-multi-point (up to 7 slaves) and scatternet capability Asynchronous Connection Oriented (ACL) logical transport link Synchronous Connection Oriented link: 2 simultaneous SCO channels capability Pitch-Period Error Concealment (PPEC) improves speech quality in the vicinity of interference like e.g. WLAN Extended SCO (eSCO) links Packet types supported: – ACL: DM1, DM3, DM5, DH1, DH3, DH5 – SCO: HV1, HV3 and DV – eSCO: EV3, EV4, EV5
Order code
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SPBT2563C1
Description
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Adaptive Frequency Hopping (AFH): hopping kernel, channel assessment as master and as slave Efficient and flexible support for WLAN coexistence in collocated scenario Communication interfaces: – Fast UART up to 4 Mbit/s – SPI interface – PCM interface
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Memory organization: – On chip RAM, including provision for patches – On chip ROM, preloaded with FW up to HCI 3.3 V single supply voltage No external oscillator required Integrated voltage regulator with Inhibit function. Module size: 17 x 29 mm
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SPBT2563C1, class 1 radio module is highly integrated for easy implementation in embedded applications. Class 1 module enables wireless communication with other Bluetooth enabled devices up to 100 m away. The SPBT2563C1 integrates on a unique FR4 PCB support: BT 2.0 radio, 32.768 kHz and 26 MHz oscillators, Vreg as well as PA function. The antenna has not been included in order to grant a degree of freedom to the user in selecting the most suitable design and placement between external and integrated antenna that could be SMA aerial or a low cost antenna trace designed on PCB. The module is based on the ST Bluetooth Transceiver STLC2500C and can be interfaced by the host processor by means of a UART or SPI line (selectable by a pin) for HCI transport, and PCM for voice. SPBT2563C1 module implements an add-on feature perfectly fitting in systems equipped with host processor capable to manage upper and lower Bluetooth stack layers, including profiles. ST Bluetooth SPBT2563 series is specifically targeting all those applications requiring Bluetooth devices integrating up to HCI level. Conformance testing through Bluetooth qualification program enables a fast time to market after system integration, by ensuring a high degree of compliance and interoperability.
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This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
Contents
SPBT2563C1
Contents
1 Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 3.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 5 6 7 8
DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Bluetooth section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
8.1 8.2 8.3 Low-power improvements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Low power clock startup time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 PCB layout of the antenna output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
9 10
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
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SPBT2563C1
Certifications
1
Certifications
●
BQB qualified component, listed as STLC2563: BQB ID B012391
1.1
RoHS compliance
ST modules are RoHS complaint and being based on ST devices comply with ECOPACK® norms implemented by ST.
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Block diagram
SPBT2563C1
2
Block diagram
Figure 1. Block diagram
VCC Inhibit
Supply voltage regulator
PCM UART/ SPI UART/SPI SEL RESET
STLC2500C
PA
ANT SW
ANT
32.768 Xtal 32.768 kHz
26 Mhz oscillator
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SPBT2563C1
Maximum ratings
3
3.1
Maximum ratings
Absolute maximum ratings
Table 1.
Symbol VCC VIN TSTG H Tsold
Absolute maximum ratings
Values Parameter Min Module supply voltage Input voltage on any digital pin Storage temperature Humidity (Not condensing) Soldering temperature < 10s Max 4 Vss - 0.3 Vcc + 0.3 -40 0 +85 95 250 V V °C % °C Unit
3.2
Operating ranges
Operating ranges define the limits for functional operation and parametrics characteristics of the module. Functionality outside these limits is not implied Table 2.
Symbol VCC TSTG ITXBR IRX
Operating ranges
Parameter Module supply voltage Operating ambient temperature
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Total supply current in Tx BR Total supply current in Rx BR
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Conditions
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Values Unit Max 3.6 +70 46 33 1 V °C mA mA µA
-20°C < T < 70°C
Basic rate, DH1 173kbps (master/slave) Basic rate, DH1 173kbps (master/slave) Enable = L
Module disabled current.
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DC I/O specification
SPBT2563C1
4
DC I/O specification
(Vdd = 3.3V, T = 25°C, unless otherwise specified) Table 3.
Symbol VIL VIH VOL VOH LP_CKH LP_CKL INH_L INH_H Iinh
DC input / output specification
Values Parameter Low level input voltage High level input voltage Low level output voltage High level output voltage 32.768kHz out high level output voltage 32.768kHz out low level output voltage Inhibit signal low level Inhibit signal high level Inhibit input current Vinh = 3.3V 2 2.55 2.4 0.3 2.15 Conditions Min Typ Max 1.1 2.85 0.15 V V V V V Unit
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0.15 Vcc 55
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V V V
µA
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SPBT2563C1
Bluetooth section
5
Bluetooth section
TA = 25 °C, VCC = 3.3 V (parameters are given at antenna pin) Table 4.
Symbol Pout-BR RXsensBR RXmax Freq ÄF |∆f-p1| |∆f-p3| |∆f-p5| |∆f/50us| Hop
Bluetooth parameters
Values Parameter Output power Sensitivity Max useable input level Frequency range Initial CF tolerance CFD 1 slot packet CFD 3 slot packet CFD 5 slot packet CFD rate Hopping System clock 2402 -75 15 15 15 Conditions Min Basic rate Basic rate, clean Tx Typ +16.5 -82 10 2480 +75 25 40 Max 18 dBm dBm dBm MHz kHz kHz kHz kHz Unit
SYS_CK
System clock precision System clock stability
LP_CK
Low power clock
Low power clock accuracy Z Antenna port impedance
Note:
Details about Bluetooth features are available at www.st.com, out of the STLC2500C data sheet.
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25 °C
-20 °C to 70°C
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-10 -20 -200
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kHz/µs hops/ sec MHz
1600
+10 +20 32.768 +200 50
ppm ppm kHz ppm Ω
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Pin settings
SPBT2563C1
6
Pin settings
Table 5.
Pin N°
Pin description
Name I/O Description
Power / GND/enable 12 2 11 3 VCC GND GND Inhibit I Module inhibit pin , active low. To be connected to VCC for module enabling ; if left open or connected to GND the module is disabled DC power input 3.3 ± 0.3 V
UART / SPI Interface / Selection 8 5 7 6 17 TXD RXD CTS RTS UART / SPI O I I O I UART serial data output / SPI data out UART serial data input / SPI data in UART clear to send / SPI CK
UART request to send / SPI CSN
UART / SPI selection When connected to VCC UART is selected When connected to GND or left open , SPI is selected
PCM interface 15 14 13 16 PCMIN PCMOUT PCMSYNC PCMBCLK I O I I PCM data in
PCM data output (tri-state capability) PCM sync signal PCM bit clock
RF interface 1 G1 G2
ANT_GND ANT_GND
System control and clock interface
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I/O Antenna interface, 50 Ω impedance Antenna Ground Antenna Ground
RESET_N
Reset ( active low ) Wake-up signal to Bluetooth Wake-up signal to host Spare signal (pin G7 of STLC2500C)
BT_WAKEUP
10 18 19
HOST_WAKEUP
LP_CK_OUT
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LP clock out The 32.768 kHz low power clock is available at this pin
WLAN/BT coexistence 20 21 22 BT_PRIORITY WL_ACTIVE RF REQ1 O I O WLAN/BT coexistence function WLAN/BT coexistence function pin E6 of STLC2500C
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SPBT2563C1
Mechanical dimensions
7
Mechanical dimensions
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com Figure 2. Mechanical dimensions
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Application
SPBT2563C1
8
8.1
Application
Low-power improvements
In low power modes,due to the oscillators continuously runnig, the module current is roughly 2.5 mA ( measured at pin 12). This current consumption can be drastically improved by switching off the two oscillators during low power phases. This can be done by means of Inhibit function (pin 3) which act directly on the internal power supply regulator ; in this mode the module is no more powered and the current consumption becomes < 1 µA instead of 2.5mA.
8.2
Low power clock startup time
Due to 32.768 Khz oscillator stabilization , when the module is powered on or when enabled ( Inhibit from Low to High state) a waiting time of at least 500ms must be observed ( Reset signal could be kept Low for the waiting1 time or given after it).
8.3
PCB layout of the antenna output
The microstrip track connected to the antenna (pin 1) should respect a characteristic impedance of 50 Ω. It should be verified particularly if some variations in the final project: dielectric material, tolerances, layout changes. The RF ground island around the antenna is connected only to G1 and G2 pins of the module. This ground island is isolated from other grounds. The ground plane at lower PCB layer should also be isolated from other grounds. Vias every 5 millimeters should connect together RF ground islands of each layer. Figure 3. Layout of the RF track to antenna pin of SPBT2563C1
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4 3 2 G2 1 G1
Isolated RF GND connected to G1 and G2
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SPBT2563C1
Ordering information scheme
9
Ordering information scheme
Table 6. Ordering information scheme SPBT
Bluetooth modules
2563
C1
V 2.0 compliant
Class 1
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Revision history
SPBT2563C1
10
Revision history
Table 7.
Date 14-Nov-2007
Document revision history
Revision 1 First release Changes
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SPBT2563C1
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