SPBTLE-RF0
Datasheet
Very low power network processor module for Bluetooth® Low Energy v4.1
Features
•
•
•
•
•
•
•
Product status link
SPBTLE-RF0
•
•
•
Bluetooth v4.1 compliant
Supports master and slave modes
–
–
Multiple roles supported simultaneously
Embedded Bluetooth low energy protocol stack
–
GAP, GATT, SM, L2CAP, LL, RFPHY
Bluetooth low energy profiles provided separately
Bluetooth radio performance:
–
Embedded ST BlueNRG-MS
–
Tx power: + 4 dBm
–
Rx sensitivity: - 88 dBm
–
Provides up to 92 dB link budget with excellent link reliability
Host interface
–
SPI, IRQ, and RESET
–
On-field stack upgrading available via SPI
AES security co-processor
Certifications:
–
CE qualified
–
FCC, IC modular approval certified
–
BT SIG qualified
On-board chip antenna
Operating supply voltage: from 1.7 to 3.6 V
Operating temperature range: -40 °C to 85 °C
Applications
•
•
•
•
•
•
•
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Watches
Fitness, wellness and sports
Consumer medical
Security/proximity
Remote control
Home and industrial automation
Assisted living
Mobile phone peripherals
PC peripherals
Description
The SPBTLE-RF0 is an easy to use Bluetooth® Low Energy network processor
module, compliant with Bluetooth v4.1. The SPBTLE-RF0 module supports multiple
roles simultaneously, and can act at the same time as Bluetooth Low Energy master
and slave device.
DS12080 - Rev 3 - January 2021
For further information contact your local STMicroelectronics sales office.
www.st.com
SPBTLE-RF0
The entire Bluetooth Low Energy stack and protocols are embedded into the
SPBTLE-RF0 module. The external host application processor, where the application
resides, is connected to the SPBTLE-RF0 module through a standard SPI interface.
The SPBTLE-RF0 module provides a complete RF platform in a tiny form factor.
Radio, antenna and high frequency oscillators are integrated to offer a certified
solution to optimize the time to market of the final applications.
The SPBTLE-RF0 can be powered directly with a pair of AAA batteries or any power
source from 1.7 to 3.6 V.
DS12080 - Rev 3
page 2/25
SPBTLE-RF0
General description
1
General description
The SPBTLE-RF0 is a Bluetooth Low Energy network processor module compliant with Bluetooth® v4.1.
The SPBTLE-RF0 module integrates the BlueNRG-MS BT radio controller with an on-board power-optimized
Bluetooth stack.
It supports:
•
Both master and slave roles
•
GAP: central, peripheral, observer or broadcaster roles
•
ATT/GATT: client and server
•
SM: privacy, authentication and authorization
•
L2CAP
The BlueNRG-MS radio embeds nonvolatile Flash memory which allows on-field stack upgrading.
In accordance with Bluetooth specification v4.1, the SPBTLE-RF0 module supports:
•
Multiple simultaneous roles
•
Simultaneous advertising and scanning
•
Acting as slave for up to two masters simultaneously
•
Privacy V1.1
•
Low duty cycle directed advertising
•
Connection parameter request procedure
•
LE Ping
•
32 bits UUIDs
•
L2CAP connection oriented channels
Both standard and proprietary Bluetooth low energy profiles, as well as a wide set of examples are available for
the SPBTLE-RF0 from the ST website.
The external host application processor where the application resides is interfaced with the SPBTLE-RF0 module
through an application controller interface protocol based on a standard SPI interface.
With the SPBTLE-RF0 module, developers can enable wireless connectivity in electronic devices without
requiring any RF experience or expertise for integration into the final product. The SPBTLE-RF0 module provides
a complete RF platform in a tiny form factor (13.5 x 11.5 x 2 mm) and, being a certified solution, optimizes the
time to market of the final applications.
The SPBTLE-RF0 module allows applications to meet the tight peak current requirements when using standard
coin cell batteries. SPBTLE-RF0 can be powered directly from a standard 3 V coin cell battery, a pair of AAA
batteries or any power source from 1.7 to 3.6 V.
ST may update the FW provided with the modules at any time. ST recommends that users regularly check for
documentation and the current FW version available at www.st.com/bluemodules.
DS12080 - Rev 3
page 3/25
SPBTLE-RF0
Block schematic
2
Block schematic
Figure 1. HW block diagram
Battery or External Supply
SPBTLE-RF0
INTERNAL 2.45 GHz
RF antenna
SUPPLY FILTER
Bead Ferrite
LDO
Host Controller
interface
BLUETOOTH
BLUENRG-MS
RF
BALUN
+ Filter
32 MHz
internal
clock
I/0
Signals
(Optionals)
SPI LINE
I/0 & Interrupt
32.768 kHz
internal
Ring Oscillator
Crystal
32 MHz
clock
DS12080 - Rev 3
page 4/25
SPBTLE-RF0
Software development kit
3
Software development kit
The SPBTLE-RF0 module embeds the BlueNRG-MS application processor. Refer to the BlueNRG-MS web page
(http://www.st.com/en/wireless-connectivity/bluenrg-ms.html) to access:
BlueNRG-MS datasheet
•
•
development kit
•
application notes
•
user manuals
•
tools and software
•
design note and tips
For module firmware updates (BlueNRG-MS Bluetooth Stack), take into account the SPBTLE-RF0-specific
configuration (see the block diagram) to select the proper binary file from the BlueNRG-MS Development Kit
(STSW-BLUENRG-DK).
In particular the SPBTLE-RF0 module is configured with:
•
32 MHz crystal oscillator
•
32 KHz Ring Oscillator
•
Internal LDO ( SMPS Off)
From the prebuilt image files provided for the BlueNRG-MS Development Kit, only the files with “32MHz”,
“RO32K”, and “SMPS_OFF” in the file name are suitable for the SPBTLE-RF0.
For example only the ifr_3v1_003_mode02-32MHz-RO32K_SMPS_OFF.dat file is suitable for the SPBTLE-RF0.
When used with the BlueNRG-GUI, the IFR configuration settings should reflect those pictured below.
Figure 2. IFR configuration for SPBTLE-RF0
DS12080 - Rev 3
page 5/25
SPBTLE-RF0
Software architecture
4
Software architecture
The SPBTLE-RF0 module has been designed to work with an external Host processor connected via SPI.
Figure 3. SPBTLE-RF0 application block diagram
DS12080 - Rev 3
page 6/25
SPBTLE-RF0
Hardware specifications
5
Hardware specifications
General conditions (VIN = 3.3 V and 25 °C)
Table 1. Absolute maximum ratings
Rating
Min.
Storage temperature
range
Typ.
Max.
Unit
- 40
+ 85
°C
Supply voltage, VIN
- 0.3
+ 3.9
V
I/O pin voltage (VIO
five-volt tolerant pin)
- 0.3
+ 3.9
V
RF saturation input
power
8
dBm
Table 2. Recommended operating conditions
5.1
Rating
Min.
Operating temperature
range
- 40
Supply voltage, VIN
1.7
Signals and I/O pin
voltage (according
supply voltage)
RF frequency
Typ.
Max.
Unit
+ 85
°C
3.6
V
1.7
3.6
V
2402
2480
MHz
1.8
Current consumption
Measurement conditions: VIN = 3.0 V, TX output power = +4 dBm, temperature = 25 °C, FW version = 7.1e
Table 3. Current consumption
Symbol
Parameter
IDD
Supply current
Test conditions
Shutdown /
STANDBY
Peripheral in
advertising (Adv Int
=
Typ.
Peak
Unit
1.98
1.98
µA
1.36
20.5
0.68
20.5
20 ms)
Peripheral in
advertising (Adv Int
=
40 ms)
Peripheral in
advertising (Adv Int
=
mA
0.34
20.5
0.20
20.5
80 ms)
Peripheral in
connection (Conn
Int =
DS12080 - Rev 3
page 7/25
SPBTLE-RF0
Current consumption
Symbol
Parameter
Test conditions
Typ.
Peak
14.49
14.49
Unit
40 ms)
Central in scan
mode (Scan Int =
1250 ms, scan
window = 1250 ms)
Central in scan
mode (Scan Int =
1250 ms, scan
window = 625 ms)
Central in
connection
mA
7.24
14.49
0.186
20.5
To increase the SPBTLE-RF0 module power efficiency, it is suggested to use 1.7 V power supply.
For each calculated value refer to the following screenshots:
Figure 4. Configuration of the “BlueNRG current consumption estimation tool”
Figure 5. Peripheral in advertising (Adv Int = 20 ms)
DS12080 - Rev 3
page 8/25
SPBTLE-RF0
Current consumption
Figure 6. Peripheral in advertising (Adv Int = 40 ms)
Figure 7. Peripheral in connection (Conn Int = 80 ms)
DS12080 - Rev 3
page 9/25
SPBTLE-RF0
Current consumption
Figure 8. Peripheral in connection (Conn Int = 40 ms)
Figure 9. Central in scan mode (Scan Int = 1250 ms, Scan Window = 1250 ms)
DS12080 - Rev 3
page 10/25
SPBTLE-RF0
Current consumption
Figure 10. Central in scan mode (Scan Int = 1250 ms, Scan Window = 625 ms)
Figure 11. Central in connection (Conn Int = 40 ms)
DS12080 - Rev 3
page 11/25
SPBTLE-RF0
Pin assignment
5.2
Pin assignment
Figure 12. Pin assignment
Table 4. Pin description
Name
Type
Pin n°
Description
V max. tolerant
SPI Interface
SPI_IRQ
O
4
SPI IRQ (SLAVE has
data for MASTER)
Vin
SPI_IRQSPI_CLK
I
7
SPI CLOCK (Max. 8
MHz)
Vin
SPI_MISO
O
8
SPI MISO (MASTER
in / SLAVE out)
Vin
SPI_MOSI
I
9
SPI MOSI (MASTER
out SLAVE in)
Vin
SPI_CS
I
10
SPI “Chip select” (SPI
slave select)
Vin
Vin
5
Vin
(1.7 V - 3.6 V max.)
GND
6
GND
I
11
Reset input (active low
< 0.35 Vin)
EXT_LPCLK
I
1
Not connected. Must
be left floating.
GPIO2
I/O
2
Not connected. Must
be left floating.
ANA TEST 0
I
3
Not connected. Must
be left floating.
Power and ground
Reset
BT_RESET
(1.7 V - 3.6 V max.)
Not connected
DS12080 - Rev 3
page 12/25
SPBTLE-RF0
Mechanical dimensions
5.3
Mechanical dimensions
Figure 13. SPBTLE-RF0 module mechanical dimensions
DS12080 - Rev 3
page 13/25
SPBTLE-RF0
Mechanical dimensions
Figure 14. Recommend land pattern top view
DS12080 - Rev 3
page 14/25
SPBTLE-RF0
Hardware design
6
Hardware design
SPBTLE-RF0 module supports SPI hardware interfaces.
Note:
•
•
•
•
•
6.1
All unused pins should be left floating; do not ground
All GND pins must be well grounded
The area around the module should be free of any ground planes, power planes, trace routings, or metal
for 6 mm from the module antenna position, in all directions.
Traces should not be routed underneath the module
Reset pin must be keep low until Vin is stable
Reflow soldering
The SPBTLE-RF0 is a high temperature strength surface mount Bluetooth® module supplied on an 11-pin, 4-layer
PCB. The recommended final assembly reflow profiles are indicated below.
The soldering phase must be executed with care: pay special attention to the set up of the peak temperature to
avoid undesired melting.
Below are some soldering profile recommendations.
Table 5. Soldering
Profile feature
Pb-free assembly
Average ramp up rate (TSMAX to Tp)
3 °C / s max.
Preheat
Temperature min (TS min.)
150 °C
Temperature max (TS max.)
200 °C
Time (tS min to tS max.) (tS))
60 - 100 s
Time maintained above
Temperature TL
217 °C
Time tL
60 - 70 s
Peak temperature (TP)
240 + 0 °C
Time within 5 °C of actual peak temperature (TP)
DS12080 - Rev 3
10 - 20 s
Ramp down rate
6 °C / sec
Time from 25 °C to peak temperature
8 minutes max
page 15/25
SPBTLE-RF0
Reflow soldering
Figure 15. Soldering profiles
DS12080 - Rev 3
page 16/25
SPBTLE-RF0
Regulatory compliance
7
Regulatory compliance
7.1
FCC certification
This module has been tested and found to comply with the FCC part 15 rules. These limits are designed to
provide reasonable protection against harmful interference in approved installations. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
This device may not cause harmful interference,
1.
and
2.
this device must accept any interference received, including interference that may cause undesired
operation.
Modifications or changes to this equipment not expressly approved by STMicroelectronics may render void the
user's authority to operate this equipment.
Modular approval
FCC ID: S9NSPBTLERF
In accordance with FCC part 15, the SPBTLE-RF0 is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple transmitters must
comply with collocation and RF exposure requirements in accordance with FCC multi-transmitter product
procedures. Collocated transmitters operating in portable RF Exposure conditions (e.g. < 20 cm from persons
including but not limited to body worn and hand held devices) may require separate approval.
7.1.1
Labeling instructions
When integrating the SPBTLE-RF0 into the final product, the OEM must ensure that the FCC labeling
requirements are satisfied. A statement must be included on the exterior of the final product which indicates
the product includes a certified module. The label should state the following (or similar wording that conveys the
same meaning):
Contains FCC ID: S9NSPBTLERF
OR
This product contains FCC ID: S9NSPBTLERF
The OEM must include the following statements on the exterior of the final product unless the product is too small
(e.g. less than 4 x 4 inches):
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
•
this device may not cause harmful interference,
and
this device must accept any interference received, including any interference that may cause undesired
•
operation.
DS12080 - Rev 3
page 17/25
SPBTLE-RF0
IC certification
7.1.2
Product manual instructions
This section applies to OEM final products containing the SPBTLE-RF0 module, subject to FCC compliance.
The final product manual must contain the following statement (or a similar statement that conveys the same
meaning):
Warning:
Changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate the equipment. (Part. 15.21)
In the case where an OEM seeks Class B (residential) limits for the final product, the following statement must be
included in the final product manual:
Note:
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference
in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning the equipment
off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
•
Reorient or relocate the receiving antenna
•
Increase the separation between the equipment and receiver
•
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected
•
Consult the dealer or an experienced radio/TV technician for help
In the case where an OEM seeks the lesser category of a Class A digital device for the final product, the following
statement must be included in the final product manual:
Note:
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate
radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause
harmful interference in which case the user will be required to correct the interference at his expense.
For more information refer to Test Report No. AR16-0006125-01 performed in accordance with:
•
FCC Rules: Code of Federal Regulations (CFR) no. 47 Part 15 subpart C Section 15.247
7.2
IC certification
The SPBTLE-RF0 module has been tested and found compliant with the IC RSS-210 rules.
These limits are designed to provide reasonable protection against harmful interference in approved installations.
This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with RSS-210 of the IC rules. Operation is subject to the following two conditions:
•
this device may not cause harmful interference
and
•
this device must accept any interference received, including interference that may cause undesired
operation
Modifications or changes to this equipment not expressly approved by STMicroelectronics may render void the
user's authority to operate this equipment.
Modular approval
IC: 8976C-SPBTLERF
In accordance with IC RSS-210, the SPBTLE-RF0 is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple transmitters
must comply with colocation and RF exposure requirements in accordance with IC multi-transmitter product
procedures. Collocated transmitters operating in portable RF Exposure conditions (e.g. < 20 cm from persons
including but not limited to body worn and hand held devices) may require separate approval.
DS12080 - Rev 3
page 18/25
SPBTLE-RF0
IC certification
7.2.1
Labeling instructions
When integrating the SPBTLE-RF0 into the final product, the OEM must ensure that the IC labeling requirements
are satisfied. A statement must be included on the exterior of the final product which indicates that the product
includes a certified module. The label should state the following (or similar wording that conveys the same
meaning):
Contains IC: 8976C-SPBTLERF
OR
This product contains IC: 8976C-SPBTLERF
The OEM must include the following statements on the exterior of the final product unless the product is too small
(e.g. less than 4 x 4 inches):
This device complies with RSS-210 of the IC rules. Operation is subject to the following two conditions:
•
this device may not cause harmful interference
and
•
this device must accept any interference received, including any interference that may cause undesired
operation.
7.2.2
Product manual instructions
This section applies to OEM final products containing the SPBTLE-RF0 module, subject to IC compliance.
The final product manual must contain the following statement (or a similar statement that conveys the same
meaning):
Warning:
Changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate the equipment. (RSS-210)
In the case where an OEM seeks Class B (residential) limits for the final product, the following statement must be
included in the final product manual:
Note:
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to RSS-210 of the IC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy
and, if not installed and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
•
Reorient or relocate the receiving antenna
•
Increase the separation between the equipment and receiver
•
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected
•
Consult the dealer or an experienced radio/TV technician for help
In the case where an OEM seeks the lesser category of a Class A digital device for the final product, the following
statement must be included in the final product manual:
Note:
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant
to RSS-210 of the IC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses,
and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual,
may cause harmful interference to radio communications. Operation of this equipment in a residential area is
likely to cause harmful interference in which case the user will be required to correct the interference at his
expense.
For more information refer to Test Report No. AR16-0006125-02 performed in accordance with:
•
INDUSTRY CANADA Spectrum Management and Telecommunications Radio Standards Specification
•
RSS-210:210 Licence-exempt Radiocommunication Devices (All Frequency Bands): Category I Equipment
•
RSS-247:2015Digital Transmission Systems (DTSs), Frequency Hopping Systems (FHSs) and LicenceExempt Local Area Network (LE-LAN) Devices
DS12080 - Rev 3
page 19/25
SPBTLE-RF0
CE certification
7.3
CE certification
The SPBTLE-RF0 module has been certified according to the following standards:
•
ETSI EN 300 328 V 2.1.1 (2016-11)(1)
•
ETSI EN 301 489-17 V3.1.1 (2017-02)(2)
•
ETSI EN 301 489-1 V2.1.1 (2017-02)(3)
•
•
EN 62368-1:2020/A11:2020(4)
EN 62311:2008
1. ETSI EN 300 328 V 2.1.1 (2016 11): “electromagnetic compatibility and radio spectrum Matters (ERM); Wideband
transmission systems; data transmission equipment operating in the 2.4 GHZ ISM band and using wideband modulation
techniques; harmonized EN covering essential requirements under article 3.2 of the R&TTE directive”.
2. ETSI EN 301 489-17 V 3.1.1 (2017 02): “electromagnetic compatibility and radio spectrum matters (ERM); electromagnetic
compatibility (EMC) standard for radio equipment and services; part 17: specific condition for 2.4 GHz wideband
transmission systems and 5 GHz high performance RLAN equipment”.
3. ETSI EN 301 489-1 V2.1.1 (2017 02): “electromagnetic compatibility and radio spectrum matters (ERM); electromagnetic
compatibility (EMC) standard for radio equipment and services; part 1: common technical requirements”.
4. EN 62368-1:2020/A11:2020: “Audio/video, information and communication technology equipment - Part 1: Safety
requirements”.
The module is provided by CE marking:
Figure 16. CE certified
The module has obtained the RED certificate: No. 0051-RED-0011
The certified module production firmware release is: 7.X
For additional information please refer to:
STMicroelectronics Via C. Olivetti 2, Agrate Brianza 20864 (ITALY)
7.4
Bluetooth certification
The module with embedded stack and profile has been qualified in accordance with the Bluetooth special interest
group (BT SIG) qualification rules:
•
Declaration ID: D028766
Qualified design ID: 71984
•
•
Product type: End Product
•
Core spec version: 4.1
•
Product description: Bluetooth Low Energy v4.1 module
DS12080 - Rev 3
page 20/25
SPBTLE-RF0
Ordering information
8
Ordering information
Table 6. Ordering information
DS12080 - Rev 3
Order code
Description
Packing
MOQ
SPBTLE-RF0TR
Bluetooth® V4.1 Low Energy module
Tape and reel
1000 pcs
page 21/25
SPBTLE-RF0
Package information
9
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
DS12080 - Rev 3
page 22/25
SPBTLE-RF0
Traceability
10
Traceability
Each module is univocally identified by serial number stored in a 2D data matrix laser marked on the bottom side
of the module itself.
The serial number has the following format:
Table 7. Traceability information
Letter
Meaning
WW
Week
YY
Year
D
Product ID family
FF
Production panel coordinate identification
NNN
Progressive serial number
Each module bulk is identified by a bulk ID.
BULK ID and module 2D data matrix are linked by a reciprocal traceability link.
The module 2D data matrix traces the lot number of any raw material used.
DS12080 - Rev 3
page 23/25
SPBTLE-RF0
Revision history
Table 8. Document revision history
Date
Version
Changes
10-May-2017
1
11-Jul-2017
2
Document status promoted from preliminary to production data.
Minor text changes.
05-Oct-2017
3
Updated Section 7.3 CE certification
13-Jan-2021
4
Updated Section 7.3 CE certification and Section 7.4 Bluetooth
certification.
Initial release.
Updated Ordering information.
DS12080 - Rev 3
page 24/25
SPBTLE-RF0
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© 2021 STMicroelectronics – All rights reserved
DS12080 - Rev 3
page 25/25