SPMB250-A1
MOTIONBEE™ family acceleration sensor
Features
■
Ready-to-use IEEE 802.15.4 compliant
wireless acceleration sensor
■
Integrated three axis MEMS-based linear
accelerometer
■
Antenna on board
■
No external components required excluding
power supplier
■
Possibility to be programmed via SIF connector
with EMZNET ZigBee® protocol stack and
custom applications
■
Board fixing with screws or pads for SMD
soldering
■
Reset and commissioning push buttons
externally available
■
Power connector and power switch externally
available
■
Two LEDs externally available for connection
check and debugging
■
Board dimensions: 49 x 27 x 5 mm
■
CE / FCC compliant
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Description
SPMB250-A1 board is a ready-to-use wireless
acceleration sensor based on an IEEE 802.15.4
compliant radio. It is designed to enable
development of applications for remote motion
monitoring in wireless sensor networks systems.
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The board is based on the ZigBee® module
SPZB250 which performs both the RF radio and
controlling functions and the three axis linear
accelerometer sensor LIS3LV02DL.
November 2009
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The ZigBee® module contains the SN250 SoC
integrating a fully compliant 802.15.4 radio
together with a microcontroller that can be used to
elaborate sensor data and networking
functionalities. SN250 can be programmed to run
the EMZNET ZigBee® protocol stack from Ember
Corporation. The module is programmable thanks
to the SIF connector available on the SPZB250
module.
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The LIS3LV02DL three axis accelerometer is a
low power low voltage linear accelerometer with
digital output that can operate in the user
selectable range +/-2 g or +/-6 g and with
programmable data rate.
The controller inside SPZB250 module handles
all the networking functions and it can be used to
implement custom procedures to elaborate and
send data collected by the acceleration sensor.
The board is ready-to-use, requiring only an
external power supplier to connect to the
integrated standard two pole connector. A switch
is present in series to the supply connection to
power on / off the board.
Doc ID 15179 Rev 2
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www.st.com
18
Contents
SPMB250-A1
Contents
1
RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Connections - pad out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4.2
Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
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Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.1
6
DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
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Board description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
7
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6.1
Power supply connector (J1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6.2
ON / OFF switch (SW2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6.3
SIF connector (J2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6.4
Pad description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6.5
LED indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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Board layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
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4.1
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
10
Radiation pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
11
Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
12
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
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Doc ID 15179 Rev 2
SPMB250-A1
1
RoHS compliance
RoHS compliance
ST modules are RoHS compliant and being based on ST devices comply with ECOPACK®
norms implemented by ST.
2
Connections - pad out
Figure 1.
Connections
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Block diagram
3
SPMB250-A1
Block diagram
Figure 2.
Block diagram
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48
-
-
3FTFU
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41;#DPOUSPMMFS 3'
Doc ID 15179 Rev 2
SPMB250-A1
Maximum ratings
4
Maximum ratings
4.1
Absolute maximum ratings
Table 1.
Absolute maximum ratings
Values
Symbol
Parameter
Unit
Min
VCC
Board supply voltage
TOPmax
TSTG
4.2
Max
7
V
°C
Operating ambient temperature
-40
+85
Storage temperature
-40
+85
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Operating ranges
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Operating ranges define the limits for functional operation and parametric characteristics of
the module.
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Functionality outside these limits is not implied
Table 2.
Operating ranges
Symbol
)
(s
VCC
Module supply voltage
TSTG
Operating ambient
temperature
IOP
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Parameter
Operation current (1)
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Min
-40 °C < T < 85 °C
3.6
6
V
-40
+85
°C
Values
Conditions
Unit
Typ
Max
Vin = 4 V stand by
16
μA
Vin = 4 V TX mode
37
mA
Vin = 4 V RX mode
36
mA
Vin = 4 V CPU only
9
mA
1. Values indicated in the table are referred to the single states (Standby TX,RX,…); the overall current
depends on the working strategy used by the application
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Electrical characteristics
SPMB250-A1
5
Electrical characteristics
5.1
DC I/O specification
Table 3.
DC input / output specification
Values
Symbol
Parameter
Conditions
Unit
Min
Low level input voltage
SW1 (Reset) and SW3
Vin = 4 V
0.6
VOL
Low level output voltage
P8 (L1) and P10 (L2)
Vin = 4 V
0.2
VOH
High level output voltage
P8 (L1) and P10 (L2)
Vin = 4 V
RFin
RX sens
Receiver sensitivity
TXpout
Nominal output power
FS
Acceleration sensor
Measurement Range
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Acceleration sensor
Resolution
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@PER 1 %
Output frequency range
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Input frequency range
Acceleration sensor
Sensitivity
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2405
2405
V
3.3
V
4
mA
2480
MHz
-92
@ 2402 – 2480 MHz
V
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Vin = 4 V
RFout
Dres
dBm
2480
MHz
0
dBm
±1.7
±2.0
g
±5.3
±6.0
g
1.0
mg
Full-scale = ±2 g
Output data rate = 40 Hz
Full-scale = ±2 g
12 bit representation
920
1024
1126
LSb/g
Full-scale = ±6 g
12 bit representation
306
340
374
LSB/g
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Max
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Typ
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SPMB250-A1
Board description
6
Board description
6.1
Power supply connector (J1)
When used directly connected to the system to be monitored in terms of vibration /
acceleration the only connection needed is the one related to the power source.
To have a standard and in the same time miniaturized connection a two pole connector has
been chosen (i.e. Molex 53261-0271 or equivalent)
Figure 3.
J1 connector
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6.2
ON / OFF switch (SW2)
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To power on / off the board a switch has been provided aboard.
Figure 4.
SW2 switch
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SW2
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Board description
6.3
SPMB250-A1
SIF connector (J2)
To allow the user to program the board, a SIF connector is available.
Signals available on this connector are:
Figure 5.
SIF - pin description
Vdd
GND
GND
SIF_LOADB
PTI_EN
Figure 6.
1
3
5
7
9
2
4
6
8
10
SIF_MISO
SIF_MOSI
SIF_CLK
RSTB
PTI_DATA
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SIF connector
J2
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Doc ID 15179 Rev 2
SPMB250-A1
6.4
Board description
Pad description
When used on a motherboard the boundary pads on the SPMB250-A1 can be used to get
the connections with the remaining part of the circuit present on the motherboard itself.
The meaning of the pads is listed in the following table:
Table 4.
Pad description
N.
Pin name
I/O
Description
P1
J1 – Vcc- (GND)
P2
J1 – Vcc +
P3
SW2-O
Power Power switch pole connected to the circuit
P4
SW2-I
Power Power switch pole connected to Vin +
P5
GND
Power
P6
SW1 (RESET /
RSTB)
I
P7
GND
Power
P8
GPIO8
I/O
Power GND input voltage supply
Power Positive input voltage supply
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Reset push button. Reset occurs when this pad is tied to
GND
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GPIO8 of SPZB250 module
P9
SW3
I
General purpose push button / commissioning push button.
It can used also as I/O pin
P10
L3 – GPIO13
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Led 3 general purpose (connected to SPZB250 GPIUO13) A
resistor is needed to limit the current
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6.5
LED indicators
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Two LED L2 (Led2) and L3 (Led3) are connected to the GPIO of SPZB250 module to be
used to monitor the module activity. Driving pin of L3 is also available as pad out (P10).
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Board layout
7
SPMB250-A1
Board layout
Figure 7.
Board layout
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SPMB250-A1
8
Soldering
Soldering
Soldering phase has to be carefully carried out: in order to avoid undesired melting
phenomenon, particular attention has to be paid on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on
IPC/JEDEC J-STD-020C, July 2004 recommendations.
Table 5.
Soldering
Profile feature
PB free assembly
Average ramp up rate (TSMAX to TP)
3 °C / sec max
Preheat
Temperature min (TS min)
Temperature max (TS max)
Time (tS min to tS max) (tS)
150 °C
200 °C
60 – 100 sec
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Time maintained above:
Temperature TL
Time tL
Peak temperature (Tp)
O
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Time from 25 °C to peak temperature
Figure 8.
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Time within 5 °C of actual peak temperature (tP)
Ramp down rate
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217 °C
40 – 70 sec
240 + 0 °C
10 – 20 sec
6 °C / sec
8 minutes max
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Soldering
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Recommendations
9
SPMB250-A1
Recommendations
●
●
An integrated antenna is present on the board:
–
Assembly the board in the application avoiding any shielding of the antenna
–
Avoid metallic parts close to the antenna
–
Do not use metallic case
Board fixing can be done with 4 screws:
–
In case of fixing on metallic base insert an insulator foil between the board and the
base in order to avoid any potential short circuit
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SPMB250-A1
10
Radiation pattern
Radiation pattern
SPMB250-A1 is based on the SPZB250 module which incorporates an RF section with an
integrated antenna (Murata ANCV12G44SAA127).
The antenna radiation pattern (as measured on the SPZB250 module) follows.
Figure 9.
Measurement direction
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Mechanical dimensions
11
SPMB250-A1
Mechanical dimensions
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com. ECOPACK
is an ST trademark.
Figure 10. Mechanical dimensions
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SPMB250-A1
Mechanical dimensions
Figure 11. Recommended land pattern
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Ordering information scheme
12
SPMB250-A1
Ordering information scheme
Table 6.
Ordering information scheme
SP
MB
250
-A
1
Subsystem product
MOTIONBEE™ family
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SN250 -based board
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Accelerometer sensor
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Version 1
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SPMB250-A1
13
Revision history
Revision history
Table 7.
Document revision history
Date
Revision
Changes
12-Feb-2009
1
Initial release
03-Nov-2009
2
Added Section 1 on page 3
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SPMB250-A1
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Please Read Carefully:
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Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
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All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
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UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
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UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
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DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
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Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
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ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2009 STMicroelectronics - All rights reserved
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