SPSGRF-915

SPSGRF Sub-GHz (868 or 915 MHz) low power programmable RF transceiver modules Datasheet - production data • Certification: – CE (SPSGRF-868) – FCC (SPSGRF-915) – IC (SPSGRF-915) Applications • AMR (automatic meter reading) • Home and building automation • WSN (wireless sensor network) • Industrial monitoring and control • Wireless fire and security alarm systems • Point-to-point wireless link Features • Programmable radio features – Based on Sub-1GHz SPIRIT1 transceiver and integrated Balun (BALF-SPI-01D3) – Modulation schemes: 2-FSK, GFSK, MSK, GMSK, OOk, ASK – Air data rate from 1 to 500 kbps – On-board antenna – Operating temperature range from -40 °C to 85 °C Description The SPSGRF-868 and SPSGRF-915 are easy-touse, low power sub-GHz modules based on the SPIRIT1 RF transceiver, operating respectively in the 868 MHz SRD and 915 MHz ISM bands. The modules provide a complete RF platform in a tiny form factor. • Host interface – SPI The SPSGRF series enables wireless connectivity in electronic devices, requiring no RF experience or expertise for integration into the final product. As an FCC, IC, and CE certified solution, the SPSGRF series optimizes the timeto-market of end applications. The SPSGRF-915 is an FCC certified module (FCC ID: S9NSPSGRF) and IC certified (IC 8976CSPSGRF), while the SPSGRF-868 is certified CE. • General I/O – Up to 32 programmable I/O functions on 4 GPIO programmable module pins The modules are designed for maximum performance in minimal space and include 4 programmable I/O pins and SPI serial interfaces. • RF features – Receiver sensitivity: -118 dBm – Programmable RF output power up to +11.6 dBm • Two typical carrier frequency versions: – SPSGRF-868 with 868 MHz tuned antenna – SPSGRF-915 with 915 MHz tuned antenna February 2022 This is information on a product in full production. DocID027664 Rev 8 1/24 www.st.com Contents SPSGRF Contents 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 SPSGRF module functional behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Hardware specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.3 Module current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.4 Module RF compliance limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.5 SPSGRF module RF typical performance . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.6 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 Hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.1 6 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.1 6.2 6.3 FCC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.1.1 Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.1.2 Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 IC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6.2.1 Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6.2.2 Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 CE certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7 Module traceability and marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 9 ECOPACK® 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2/24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 DocID027664 Rev 8 SPSGRF 1 Block diagram Block diagram Figure 1. SPSGRF block diagram DocID027664 Rev 8 3/24 24 SPSGRF module functional behavior 2 SPSGRF SPSGRF module functional behavior The SPIRIT1 device in the SPSGRF module is equipped with a built-in main controller which controls the switching between the two main operating modes: transmit (TX) and receive (RX). In shutdown condition, the SPSGRF module can be switched on/off with the external SDN pin; all other functions/registers/commands are available through the SPI interface and GPIOs. No internal supply is generated (in order to minimize battery leakage), and therefore all stored data and configurations are lost. The GPIO and SPI ports of the module during shutdown are in HiZ. From the SHUTDOWN state, the SPSGRF module can be switched on from the SDN pin and goes into a READY state, which is the default, where the reference signal from XO is available. From the READY state, the SPSGRF module can be moved to a LOCK state to generate the high precision LO signal and/or TX or RX modes. Switching from RX to TX and viceversa can occur only by passing through the LOCK state. This operation is normally managed by radio control with a single user command (TX or RX). At the end of the events above, the SPSGRF module can return to its default state (READY) and can then be put into a sleep condition (SLEEP state), characterized by very low power consumption. If no timeout is required, the SPSGRF module can be moved from READY to STANDBY state, which has the lowest possible current consumption while retaining FIFO, status and configuration registers. To manage the transitions towards and between these operating modes, the controller works as a state machine, the state switching of which is driven by SPI commands. Figure 2. Module functional state transitions diagram 4/24 DocID027664 Rev 8 SPSGRF Hardware specifications 3 Hardware specifications 3.1 Absolute maximum ratings General conditions (VIN= 3.3 V and 25 °C) Table 1. Absolute maximum ratings Rating Min. Typ. Unit Storage temperature range -40 +85 °C Supply voltage, VIN -0.3 3.9 V I/O pin voltage -0.3 3.9 V RF saturation input power 3.2 Max. +10 dBm Recommended operating conditions Table 2. Recommended operating conditions Rating 3.3 Min. Typ. Max. Unit +85 °C 3.6 V Operating temperature range -40 Supply voltage, VIN 1.8 Signals & I/O pin voltage (according supply voltage) 1.8 3.6 V RF frequency bandwidth (SPSGRF-868) 863 870 MHz RF frequency bandwidth (SPSGRF-915) 902 928 MHz 3.3 Module current consumption Table 3. SPSGRF-868 module Symbol IDD Parameter Supply current Test conditions Typ. Unit Operating mode Tx, +11.6 dBm, 2-FSK, 868 MHz 22 mA Operating mode Tx, - 7 dBm, 2-FSK, 868 MHz 9 mA Operating mode Rx, 868MHz 10 mA Command mode 0.6 mA Shutdown high level -VDD (with other I/O in High impedance) 0.1 µA DocID027664 Rev 8 5/24 24 Hardware specifications SPSGRF Table 4. SPSGRF-915 module Symbol IDD 3.4 Parameter Supply current Test conditions Typ. Unit Operating mode Tx, +11.6 dBm, 2-FSK, 915 MHz 22 mA Operating mode Tx, - 7 dBm, 2-FSK, 915 MHz 9 mA Operating mode Rx, 915 MHz 10 mA Command mode 0.6 mA Shutdown high level -VDD (with other I/O in high impedance) 0.1 µA Module RF compliance limits The RF compliance limits are those tested for FCC, IC and CE certification using the dedicated dongle (PC92A.V01). These limits are enforced by the dongle firmware. Care must be taken with custom application firmware to ensure these limits are not exceeded, voiding the FCC, IC and CE certification. Table 5. RF compliance limits table Modulation 2-FSK GFSK MSK OOK ASK Standards FCC Part 15.207 (1) FCC Part 15.247 (1) IC RSS-210 ETSI EN 301 489-3 V2.1.1 ETSI EN 301 489-1 V2.2.3 ETSI EN 300 220-2 V3.2.1 FCC Part 15.207 (1) FCC Part 15.247 (1) IC RSS-210 ETSI EN 301 489-3 V2.1.1 ETSI EN 301 489-1 V2.2.3 ETSI EN 300 220-2 V3.2.1 Parameter Max. Unit Data rate 500 kbps Output power +11.6 dBm Data rate 250 kbps Output power +6 dBm 1. FCC and IC standards are applicable only to the SPSGRF-915 module. 6/24 DocID027664 Rev 8 SPSGRF 3.5 Hardware specifications SPSGRF module RF typical performance The RF performance of the SPSGRF-868 and SPSGRF-915 modules are dependent on many factors, related to the customer hardware application board where the module is connected and also to the customer application firmware. In order to provide some basic information to the customer integrating the module, it may be useful to provide the RF measurements taken in an anechoic chamber using a dongle containing a connected SPSGRF-868 or SPSGRF-915 module. Table 6. SPSGRF-868 or 915 modules radiated typical performance Symbol Tx RF power Parameter Test conditions Typ. Unit Operating mode Tx, +11.6 dBm, 2-FSK, 868,0-868,6 MHz +5.3 dBm Operating mode Tx, +11.6 dBm, 2-FSK, 902-928 MHz +2.2 dBm RF radiated power DocID027664 Rev 8 7/24 24 Hardware specifications SPSGRF Table 7. SPSGRF-868 or 915 module conducted typical performance before the RF antenna circuits (positive RF power signal values measured) Parameter Tx RF conducted power (before the antenna circuits) Test conditions(1) Tx, +11.6 dBm, 2-FSK, 868 MHz Tx, +11.6 dBm, 2-FSK, 915 MHz +11.6 +11.2 dBm Tx, +11 dBm, 2-FSK, 868 MHz Tx, +11 dBm, 2-FSK, 915 MHz +11.0 +10.8 dBm Tx, +10 dBm, 2-FSK, 868 MHz Tx, +10 dBm, 2-FSK, 915 MHz +10.0 +9.7 dBm Tx, +9 dBm, 2-FSK, 868 MHz Tx, +9 dBm, 2-FSK, 915 MHz +9.0 +8.5 dBm Tx, +8 dBm, 2-FSK, 868 MHz Tx, +8 dBm, 2-FSK, 915 MHz +8.0 +7.6 dBm Tx, +7 dBm, 2-FSK, 868 MHz Tx, +7 dBm, 2-FSK, 915 MHz +7.0 +7.2 dBm Tx, +6 dBm, 2-FSK, 868 MHz Tx, +6 dBm, 2-FSK, 915 MHz +6.0 +6.2 dBm Tx, +5 dBm, 2-FSK, 868 MHz Tx, +5 dBm, 2-FSK, 915 MHz +5.0 +5.4 dBm Tx, +4 dBm, 2-FSK, 868 MHz Tx, +4 dBm, 2-FSK, 915 MHz +4.0 +4.0 dBm Tx, +3 dBm, 2-FSK, 868 MHz Tx, +3 dBm, 2-FSK, 915 MHz +3.0 +3.1 dBm Tx, +2 dBm, 2-FSK, 868 MHz Tx, +2 dBm, 2-FSK, 915 MHz +2.0 +2.1 dBm Tx, +1 dBm, 2-FSK, 868 MHz Tx, +1 dBm, 2-FSK, 915 MHz +1.0 +1.2 dBm Tx, +0 dBm, 2-FSK, 868 MHz Tx, +0 dBm, 2-FSK, 915 MHz +0.0 +0.6 dBm 1. Operating mode 8/24 Measured Conducted conducted Unit programmable value value Typ. DocID027664 Rev 8 SPSGRF Hardware specifications Table 8. SPSGRF-868 or 915 module conducted typical performance before the RF antenna circuits (negative RF power signal values measured) Parameter Tx RF conducted power (before the antennas circuits) Test conditions(1) Measured Conducted conducted Unit programmable value value Typ. Tx, -1 dBm, 2-FSK, 868 MHz Tx, -1 dBm, 2-FSK, 915 MHz -1.0 -1.1 dBm Tx, -2 dBm, 2-FSK, 868 MHz Tx, -2 dBm, 2-FSK, 915 MHz -2.0 -2.3 dBm Tx, -3 dBm, 2-FSK, 868 MHz Tx, -3 dBm, 2-FSK, 915 MHz -3.0 -3.4 dBm Tx, -4 dBm, 2-FSK, 868 MHz Tx, -4 dBm, 2-FSK, 915 MHz -4.0 -4.9 dBm Tx, -5 dBm, 2-FSK, 868 MHz Tx, -5 dBm, 2-FSK, 915 MHz -5.0 -5.8 dBm Tx, -6 dBm, 2-FSK, 868 MHz Tx, -6 dBm, 2-FSK, 915 MHz -6.0 -6.9 dBm Tx, -7 dBm, 2-FSK, 868 MHz Tx, -7 dBm, 2-FSK, 915 MHz -7.0 -6.5 dBm Tx, -8 dBm, 2-FSK, 868 MHz Tx, -8 dBm, 2-FSK, 915 MHz -8.0 -7.3 dBm Tx, -9 dBm, 2-FSK, 868 MHz Tx, -9 dBm, 2-FSK, 915 MHz -9.0 -8.2 dBm Tx, -10 dBm, 2-FSK, 868 MHz Tx, -10 dBm, 2-FSK, 915 MHz -10.0 -9.7 dBm Tx, -15 dBm, 2-FSK, 868 MHz Tx, -15 dBm, 2-FSK, 915 MHz -15.0 -14.6 dBm Tx, -20 dBm, 2-FSK, 868 MHz Tx, -20 dBm, 2-FSK, 915 MHz -20.0 -19.2 dBm Tx, -25 dBm, 2-FSK, 868 MHz Tx, -25 dBm, 2-FSK, 915 MHz -25.0 -23.3 dBm Tx, -30 dBm, 2-FSK, 868 MHz Tx, -30 dBm, 2-FSK, 915 MHz -30.0 -26.2 dBm Tx, -35 dBm, 2-FSK, 868 MHz Tx, -35 dBm, 2-FSK, 915 MHz -35.0 -27.8 dBm 1. Operating mode DocID027664 Rev 8 9/24 24 Hardware specifications 3.6 SPSGRF Pin connections Figure 3. Pin connection diagram Table 9. Pin assignment Name Type Pin# Description Alt function V max. tolerance Initial state SPI interface SPI_CLK I 7 SPI CLOCK (Max. 8 MHz) Vin SPI_MISO O 8 SPI MISO (MASTER in / SLAVE out) Vin SPI_MOSI I 9 SPI MOSI (MASTER out SLAVE in) Vin SPI_CS 10 SPI “Chip Select” (SPI slave select) Vin I Power and ground Vin 5 Vin GND 6 GND (1.8V - 3.6V max.) Module shutdown SDN I 11 Shutdown input (active high) (1.8V - 3.6V max.) GPIO - general purpose input/output GPIO [0] I/O 4 Programmable input / output & analog temperature output (1.8V - Vin max.) Digital output. Low power GPIO [1] I/O 3 Programmable input / output (1.8V - Vin max.) Digital output. Low power GPIO [2] I/O 2 Programmable input / output (1.8V - Vin max.) Digital output. Low power GPIO [3] I/O 1 Programmable input / output (1.8V - Vin max.) Digital output. Low power 10/24 DocID027664 Rev 8 SPSGRF 4 Mechanical dimensions Mechanical dimensions Figure 4. Mechanical dimensions Figure 5. Recommended land pattern DocID027664 Rev 8 11/24 24 Hardware design 5 SPSGRF Hardware design The SPSGRF module supports SPI hardware interfaces. Note: - All unused pins should be left floating; do not ground. - All GND pins must be well grounded. - The area around the module should be free of any ground planes, power planes, trace routings, or metal for 6 mm from the module antenna position, in all directions. - Traces should not be routed underneath the module 5.1 Reflow soldering The SPSGRF is a surface mount sub-1 GHz transceiver module supplied on an 11 pin, 4layer PCB. The final assembly recommended reflow profiles are indicated below. The soldering phase must be executed with care. In order to avoid an undesired melting phenomenon, particular attention should be given to the setup of the peak temperature. Table 10 provides suggestions for the temperature profile based on IPC/JEDEC J-STD020C, July 2004 recommendations. Table 10. Soldering recommendations Profile feature PB-free assembly Average ramp up rate (TSMAX to Tp) 3°C/ sec max Preheat Temperature min (TS min) 150 °C Temperature max (TS max) 200 °C Time (tS min to tS max) (tS) 60-100 sec Time maintained above: 12/24 Temperature TL 217 °C Time tL 60-70 sec Peak temperature (TP) 240 + 0 °C Time within 5 °C of actual peak temperature (tP) 10-20 sec Ramp down rate 6 °C/sec Time from 25 °C to peak temperature 8 minutes max DocID027664 Rev 8 SPSGRF Hardware design Figure 6. Soldering profile DocID027664 Rev 8 13/24 24 Regulatory compliance SPSGRF 6 Regulatory compliance 6.1 FCC certification The SPSGRF-915 module has been tested and found compliant with the FCC part 15 rules. These limits are designed to provide reasonable protection against harmful interference in approved installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference may not occur in a particular installation. This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Modifications or changes to this equipment not expressly approved by STMicroelectronics may render void the user's authority to operate this equipment. Modular approval FCC ID: S9NSPSGRF In accordance with FCC part 15, the SPSGRF-915 is listed as a modular transmitter device. This module is evaluated for stand-alone use only. Finished products incorporating multiple transmitters must comply with collocation and RF exposure requirements in accordance with FCC multi-transmitter product procedures. Collocated transmitters operating in portable RF exposure conditions (e.g.