SPV1520N

SPV1520 20 V reverse voltage cool bypass switch Datasheet - preliminary data Applications   c u d Description o s b O ) Features      o r P The SPV1520 is a cool bypass switch with a very low forward voltage drop and ultra low reverse leakage current. The former drastically reduces the power dissipation in bypass mode and prolongs the lifetime of the device, by reducing maintenance costs and shutdown due to a device failure. The latter allows the device to work at very high temperature avoiding thermal runaway phenomenon. These are clearly key benefits for all those applications requiring low power consumption to increase the system lifetime and maximize the power transfer from harvesting source to the load. For all these reasons and the strong ESD robustness, the cool bypass switch is the significant evolution with respect to the traditional standard Schottky diode. e t le   ) s t( Photovoltaic panels Solar farm s ( t c Maximum forward current IF up to 16 A Maximum reverse recovery mode VR up to 20 V Very low forward voltage drop:  VF = 120 mV @ IF = 10 A, TAMB =125 °C Ultra low reverse leakage current:  IR = 100 μA @ VR = 20 V, TAMB =125 °C ESD HBM level (JESD22-A114) up to 8 kV Surge test level (IEC61000-4-5) up to 2 kV Junction temperature range TJ : -40 °C to 150 °C u d o r P e t e l o s b O Table 1: Device summary Order code Operating temperature range Package Packing SPV1520N -40 to 125 °C VFQFPN (6x5x0.75) 8L Tape and reel October 2015 DocID023610 Rev 2 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. 1/12 www.st.com Contents SPV1520 Contents 1 Electrical ratings ............................................................................. 3 2 Electrical characteristics ................................................................ 4 3 Recommended footprint on the application board ....................... 6 4 Package information ....................................................................... 7 5 4.1 VFQFPN (6x5x0.75) package information ........................................ 8 4.2 VFQFPN (6x5x0.75) packing information .......................................... 9 Revision history ............................................................................ 11 ) s t( c u d e t le o s b O ) s ( t c u d o r P e t e l o s b O 2/12 DocID023610 Rev 2 o r P SPV1520 1 Electrical ratings Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VR Max. DC reverse voltage 20 V IF Max. forward current 16 A TJ Junction temperature range -40 to 150 °C TSTG Storage temperature range -40 to 175 °C Thermal resistance, junction-to-case 4 °C/W Human body model 8 RTH(j-c) ESD ) s ( kV t c u d o r P e et l o s ) s t( b O - c u d e t le o r P o s b O DocID023610 Rev 2 3/12 Electrical characteristics 2 SPV1520 Electrical characteristics TAMB = 25 °C unless otherwise specified Table 3: Electrical characteristics Symbol Parameter Min. Typ. Max. TJ = 25 °C - 100 - TJ = 125 °C - 110 - TJ = 25 °C - 115 - TJ = 125 °C - 130 - TJ = 25 °C - 140 TJ = 125 °C - 160 TJ = 25 °C - TJ = 125 °C o r P Test conditions IF = 1 A VF Forward voltage drop IF = 10 A IF = 16 A IR Reverse leakage current VR = 20 V e t le - 100 Figure 1: Forward power dissipation vs. forward current o s b O ) s ( t c u d o r P e t e l o s b O 4/12 DocID023610 Rev 2 mV ) s t( c u d 10 Unit - μA SPV1520 Electrical characteristics Figure 2: Reverse current vs. reverse voltage ) s t( c u d e t le o r P o s b O ) Figure 3: Forward current vs. ambient temperature s ( t c u d o r P e t e l o s b O DocID023610 Rev 2 5/12 Recommended footprint on the application board 3 SPV1520 Recommended footprint on the application board The below figure shows the suggested footprint on the board, in order to improve heat dissipation. Figure 4: Recommended footprint 7.2 mm 1.8 mm 1.8 mm 3.6 mm ) s t( 0.9 mm 0.9 mm c u d ro 1.2 mm P e et l o s 6.6 mm ) (s Ob R0.3 t c u d o r let eP o s b 1.5 mm 0.9 mm O 6/12 DocID023610 Rev 2 1.2 mm 1.2 mm 0.9 mm SPV1520 4 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. ) s t( c u d e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O DocID023610 Rev 2 7/12 Package information 4.1 SPV1520 VFQFPN (6x5x0.75) package information Figure 5: VFQFPN (6x5x0.75) package outline ) s t( c u d e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O 8417098 C 8/12 DocID023610 Rev 2 SPV1520 Package information Table 4: VFQFPN (6x5x0.75) package mechanical data mm Dim. Min. Typ. Max. A 0.70 0.75 0.85 A1 0 0.02 0.05 D D2 5.00 4.11 E E2 2.35 2.50 2.60 1.27 1.10 L1 b 4.36 6.00 e L 4.26 1.20 0.30 0.40 uc 0.45 aaa 0.05 bbb 0.10 ) s t( 1.30 0.50 d o r P e et ccc 0.10 N 8 4.2 l o s VFQFPN (6x5x0.75) packing information b O ) s t( c u d o r P e et Figure 6: VFQFPN (6x5x0.75) tape outline l o s Ob DocID023610 Rev 2 9/12 Package information SPV1520 Figure 7: VFQFPN (6x5x0.75) carrier tape outline ) s t( Figure 8: VFQFPN (6x5x0.75) reel outline c u d e t le o s b O ) s ( t c u d o r P e t e l o s b O 10/12 DocID023610 Rev 2 o r P SPV1520 5 Revision history Revision history Table 5: Document revision history Date Revision 31-Aug-2012 1 First release. 2 Updated title, features, applications and description in cover page. Removed in the device summary table the SPV1520D and replaced with the SPV1520N. Updated the table of maximum ratings. Changed figure titled "Reverse current vs. reverse voltage" and updated the rest of figures relative to the section titled “Electrical characteristics”. Inserted a new section titled "Recommended footprint on the application board". Updated the package information section. 08-Oct-2015 Changes ) s t( c u d e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O DocID023610 Rev 2 11/12 SPV1520 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. ) s t( No license, express or implied, to any intellectual property right is granted by ST herein. c u d Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. o r P ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. e t le Information in this document supersedes and replaces information previously supplied in any prior versions of this document. o s b © 2015 STMicroelectronics – All rights reserved O ) s ( t c u d o r P e t e l o s b O 12/12 DocID023610 Rev 2