ST2051
Enhanced power switch
Not recommended for new design
Features
■
90 mΩ high-side MOSFET switch
■
500 mA continuous current per channel
■
Thermal and short-circuit protection with
overcurrent logic output
■
Operating range from 2.7 to 5.5 V
■
CMOS- and TTL-compatible enable inputs
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SO-8
■
2.5 ms typical rise time
■
Undervoltage lock out
■
10 μA maximum standby supply current
■
Ambient temperature range, 0 °C to 85 °C
■
2 kV ESD protection
■
Fault-blanking
Table 1.
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Device summary
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ST2051BDR(1)
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Order code
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Package
Packaging
SO-8
Tape and reel
1. Not recommended for new design (refer to STMPS2151MTR). Contact ST sales office for availability.
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November 2010
Doc ID 12593 Rev 3
This is information on a product still in production but not recommended for new designs.
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www.st.com
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Description
1
ST2051
Description
The ST2051 power distribution switch is intended for applications where heavy capacitive
loads and short-circuits are likely to be encountered. These devices incorporate 90 mΩ
N-channel MOSFET high-side power switches for power-distribution. The switch is
controlled by a logic enable input. Gate drive is provided by an internal charge pump
designed to control the power-switch rise times and fall times to minimize current surges
during switching. The charge pump requires no external components and allows operation
from supplies as low as 2.7 V.
When the output load exceeds the current-limit threshold or a short is present, the device
limits the output current to a safe level by switching into a constant-current mode, pulling the
overcurrent logic output low. When continuous heavy overloads and short-circuits increase
the power dissipation in the switch, causing the junction temperature to rise, a thermal
protection circuit shuts off the switch to prevent damage. Recovery from a thermal shutdown
is automatic once the device has cooled sufficiently. Internal circuitry ensures the switch
remains off until valid input voltage is present.
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Doc ID 12593 Rev 3
ST2051
2
Schematic diagram and pin connections
Schematic diagram and pin connections
Figure 1.
Schematic diagram
6).
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#URRENT
SENSE
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4HERMAL
SENSE
&AULT
BLANKINGREPORTING
DRIVERCONTROLUNIT
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#HARGE
PUMP
Figure 2.
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Pin connections (top view)
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Table 2.
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Pin functions
Pin
Name
Type
Description
1
GND
-
Ground
2
IN1
-
VCC input, 2.7-5.5 V
3
IN2
-
VCC input, 2.7-5.5 V
4
EN
I
Enable (active hi)
5
OC
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Open drain output for fault indication
6
OUT3
-
Output
7
OUT2
-
Output
8
OUT1
-
Output
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Functional descriptions
ST2051
3
Functional descriptions
3.1
Fault-blanking
ST devices feature a 10 ms fault-blanking. Fault-blanking allows current-limit faults,
including momentary short-circuit faults that occur when hot-swapping a capacitive load,
and also ensures that no fault is issued during power-up. When a load transient causes the
device to enter current limit, an internal counter starts. If the load fault persists beyond the
10 ms fault-blanking timeout, the FAULT output asserts low. Load-transient faults less than
10 ms (typical) will not cause a FAULT output assertion. Only current-limit faults are blanked.
Die overtemperature faults and input voltage drops below the undervoltage lock out (UVLO)
threshold will cause an immediate fault output.
3.2
Overcurrent/overtemperature protection
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In overcurrent or short-circuit condition, the switch limits the current at 500 mA.
If temperature of die goes above limit value, the switch turns OFF.
3.3
Undervoltage lock out (UVLO)
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When input voltage drops below critical value, the power switch turns OFF to prevent
improper operation due to low voltage.
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ST2051
4
Maximum rating
Maximum rating
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only, and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics™ SURE
program and other relevant quality documents.
Table 3.
Absolute maximum ratings
Symbol
Parameter
VI
Input voltage range
VO
Output voltage range
VIENX
ESD
Table 4.
V
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EN Input voltage range
-0.3-6.0
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Internally limited
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Junction operating temperature
TSTG
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ESD protection level
TJ
Unit
-0.3-6.0
Continuous output current
IO
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Storage temperature
2
kV
-40 to 125
°C
-55 to 150
°C
Recommended operating conditions
Symbol
-O
Parameter
(s)
VI
Input voltage
VO
Output voltage
IO
Continuous output current
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Value
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Min
Typ
Max
Unit
2.7
5.0
5.5
V
0
5.0
5.5
V
0
-
500
mA
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Electrical characteristics
5
ST2051
Electrical characteristics
Table 5.
Electrical characteristics (TJ = 25 °C, VI = 5.0 V)
Symbol
Parameter
Test conditions
Static drain-source
RDS(on)
on-state resistance
tr
tf
Max
VI = 3.3 V;
-40 < TJ < 125 °C
100
145
VI = 5.0 V;
-40 < TJ < 125 °C
90
135
VI = 3.3 V;
TJ = 25 °C
90
130
VI = 5.0 V;
TJ = 25 °C
80
VI = 2.7 V,
RL = 10 Ω,
CL = 1 μF
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Unit
mΩ
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VI = 5.5 V,
RL = 10 Ω,
CL = 1 μF
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Output fall time(1)
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Typ
VI = 5.5 V,
RL = 10 Ω,
CL = 1 μF
Output rise time(1)
Min
VI = 2.7 V,
RL = 10 Ω,
CL = 1 μF
2.5
ms
3
ms
0.3
ms
0.2
ms
TON
Turn-ON time(1)
RL = 10 Ω,
CL = 100 μF
20
ms
TOFF
Turn-OFF time(1)
RL = 10 Ω,
CL = 100 μF
40
ms
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1. Not tested in production, specified by design
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Table 6.
Symbol
IOS
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Current limit characteristics
(VI = 5.5 V, IO = rated current, TJ = 25 °C, unless otherwise specified)
Parameter
Short-circuit output
current
Test conditions
VI = 5 V, OUT connected to
GND, device enabled into
short-circuit
Doc ID 12593 Rev 3
Min
Typ
Max
Unit
0.7
1.0
1.3
A
ST2051
Electrical characteristics
Table 7.
Supply current characteristics
(VI = 5.5 V, IO = rated current, TJ = 25 °C, unless otherwise specified)
Symbol
Parameter
Test conditions
Min
Typ
Max
Unit
1.0
5.0
μA
10
μA
90
μA
No load; -40 < TJ < 125 °C
100
μA
Output grounded, switch is OFF
10
μA
Output leakage current Output grounded, switch is OFF;
-40 < TJ < 125 °C
20
μA
No load
IOFF
Switch turned OFF
ION
Switch turned ON
No load; -40 < TJ < 125 °C
No load
Ileakage
Table 8.
Parameter
Thermal shutdown threshold
T2
Recovery from thermal shutdown
VUVLO
Hyst
Table 10.
OC
blanking
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Min
Typ
Max
Pr
Unit
135
°C
125
°C
10
°C
UVLO characteristics
(VI = 5.5 V, IO = rated current, TJ = 25 °C, unless otherwise specified)
Parameter
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(s
Test conditions
Undervoltage lockout threshold
Min
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Typ
2.0
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Hysteresis
Max
Unit
2.5
V
100
mV
OC pin characteristics
(VI = 5.5 V, IO = rated current, TJ = 25 °C, unless otherwise specified)
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Symbol
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Hysteresis
Symbol
let
Test conditions
T1
Table 9.
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Thermal characteristics
(VI = 5.5 V, IO = rated current, TJ = 25 °C, unless otherwise specified)
Symbol
Hyst
70
Parameter
Test conditions
OCx assertion and de-assertion(1)
Min
Typ
Max
Unit
4
8
15
ms
VO
Output low voltage
0.4
V
IOFF
OFF current
1.0
μA
1. Not tested in production, specified by design.
Table 11.
EN pin characteristics
(VI = 5.5 V, IO = rated current, TJ = 25 °C, unless otherwise specified)
Symbol
Parameter
VIH
High level input voltage
VIL
Low level input voltage
II
Input current
Test conditions
VI = 2.7 to 5.5 V
Min
Typ
Max
2.0
Unit
V
VI = 4.5 to 5.5 V
0.8
V
VI = 2.7 to 4.5 V
0.4
V
0.5
μA
VIENX = 0 or VI
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-0.5
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Package mechanical data
6
ST2051
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 3.
SO-8 package outline
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Doc ID 12593 Rev 3
ST2051
Revision history
Table 12.
SO-8 mechanical data
Millimeters
inches
Symbol
Min
Typ
Max
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
A2
1.10
1.65
0.043
0.065
B
0.33
0.51
0.013
0.020
C
0.19
0.25
0.007
0.010
D
4.80
5.00
0.189
E
3.80
4.00
0.15
0.157
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0.050
H
5.80
6.20
0.228
h
0.25
0.50
0.010
L
0.40
1.27
Table 13.
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0.10
0.244
0.020
0.050
0.004
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Document revision history
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Date
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8° (max.)
Revision history
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0.197
1.27
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Revision
Changes
02-Aug-2006
1
Initial release.
26-Feb-2008
2
Document restructured and converted to new ST template,
watermark removed.
3
Document reformatted, added “Not Recommended for New
Design” and Note 1 below Table 1, corrected typo in Features,
Description, Section 3, Section 4, Table 3, Table 5 to Table 11,
updated ECOPACK® text inSection 6.
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Typ
1.35
k
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Min
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7
Max
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ST2051
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Please Read Carefully:
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Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
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All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
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UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
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UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
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GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
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Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
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ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
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