ST25RU3980-BQFT

AS3980 UHF RFID Single Chip Reader EPC Class1 Gen2 General Description The AS3980 is an UHF RFID reader IC enabling battery-powered, small form-factor handheld and embedded UHF reader systems for a single tag environment of EPC Class1 Gen2 compliant UHF RFID tags. The device directly supports ISO 18000-6C/ EPC Class1 Gen2 transponders in a single-tag environment. The AS3980 operates at very low power, which means that this advanced RFID reader IC is suitable for use in portable and battery-powered equipment such as mobile phones. AS3980 requires only an external simple 8-bit μC to create a complete RFID reader system. AS3980 is highly integrated and implements the RFID functions on chip thus eliminating a need for a complex RFID co-processor. Packaged in a 7 x 7 mm QFN outline, the IC benefits from fabrication process technology unique to ams to deliver very high sensitivity and providing high immunity to the effects of antenna reflections and self-jamming. This is critical in mobile and embedded applications, in which antenna design is often compromised by cost or size constraints. High sensitivity enables end-product designs to achieve their required read range while using a simpler and cheaper antenna, thus reducing system bill-of-materials cost. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of AS3980, UHF RFID Single Chip Reader EPC Class1 Gen2 are listed below: Figure 1: Added Value of Using AS3980 Benefit Optimized for battery operation ISO 18000-6C implemented in HW. Feature • Supply voltage range 3.0V to 3.6V • Limited operation possible down to 2.7V • Peripheral I/O supply range: 1.65V to 5.5V Low coding effort and MCU requirements • Basic protocol support for ISO 18000-6C (EPC Class1 Gen2) • Reception mode M8 on 40kHz link frequency High PSRR • Integrated supply regulators Flexible modulation method • ASK or PR-ASK modulation Small package footprint – saving PCB area • 48-pin QFN (7x7x0.9 mm) package ams Short Datasheet [v1-00] 2015-Jul-03 Page 1 Document Feedback AS3980 − General Description Benefit Feature Avoidance of communication holes • Automatic I/Q selection Tag movement detection support • Phase bit for tag tracking with 8-bit linear RSSI Wide temperature range • -40ºC to 85ºC Applications The AS3980 device is well suited for: • Embedded consumer/industrial applications with cost constraints such as beverage dispensing. • Hand-Held readers. • Mobile UHF RFID readers. • Battery-Powered stationary readers. • FMCG and brand protection • Product authentication Block Diagram The functional blocks of this device for reference are shown below: Figure 2: AS3980 Block Diagram AS3980 Analog Front-End IQ Mixer Gain Amplifiers RX Filter Digitizer I MIXS_IN IRQ Q EN RSSI RFOPX PA 0 dBm Balu n I Q Shaping RFONX OSCI TCXO 20 MHz Oscillato r& Timing System Page 2 Document Feedback SPI SCLK MOSI MISO NCS Protocol & Logic VCO / PLL TX Framing OSCO +3.3 V Supply Regulators and References MCU Interface Serial Conversion and CRC Parity Check RX Decoder Bit Framing DUAL 24 Byte FIFO Registers ams Short Datasheet [v1-00] 2015-Jul-03 AS3980 − Pin Assignment The AS3980 pin assignments are described below. Pin Assignment Figure 3: Pin Diagram COMN_A COMP_A VDD_LF LF_CEXT VDD_A VOSC AGD CD1 CD2 ADC VDD_IO SCLK 48 47 46 45 44 43 42 41 40 39 38 37 AS3980 Pin Assignment: This figure shows the pin assignment and location viewed from top. COMP_B 1 36 CLSYS COMN_B 2 35 MOSI VDD_LFI 3 34 MISO NC 4 33 NCS MIXS_IN 5 32 IRQ NC 6 31 EN VDD_TXPAB 7 30 OSCO CBV 8 29 OSCI CBIB 9 28 VDD_D VDD_MIX 10 27 OAD VEXT 11 26 OAD2 VDD_B 12 25 VSN AS3980 15 16 17 18 19 20 21 22 23 VSN NC NC VSN VSN NC NC VSN RFONX 24 14 RFOPX 13 VDD_RF VEXT_RF 49 (exposed pad) Figure 4: Pin Description Pin Number Pin Name Pin Type Description 48-Pin QFN 1 COMP_B Analog I/O Internal node, connect de-coupling capacitor to VDD_LFI 2 COMN_B Analog I/O Internal node, connect de-coupling capacitor to VDD_LFI 3 VDD_LFI Supply pad Positive supply for LF input stage, connect to VDD_MIX 4 NC 5 MIXS_IN 6 NC 7 VDD_TXPAB Supply pad Bias positive supply. Connect to VDD_MIX 8 CBV Analog I/O Internal node, connect de-coupling capacitor to VDD_MIX 9 CBIB Analog I/O Internal node, connect de-coupling capacitor to ground 10 VDD_MIX Analog I/O Mixer positive supply, internally regulated ams Short Datasheet [v1-00] 2015-Jul-03 Not connected Analog input Single ended mixer input Not connected Page 3 Document Feedback AS3980 − Pin Assignment Pin Number Pin Name Pin Type Description 48-Pin QFN 11 VEXT Supply pad Main positive supply input, input to regulators 12 VDD_B Analog I/O Buffer positive supply, internally regulated 13 VDD_RF Analog I/O RF positive supply, internally regulated 14 VEXT_RF Supply pad RF positive supply regulator input 15 VSN Supply pad Negative supply 16 NC Not connected 17 NC Not connected 18 VSN Supply pad Negative supply 19 VSN Supply pad Negative supply 20 NC Not connected 21 NC Not connected 22 VSN 23 Supply pad Negative supply RFONX Analog output Low power linear negative RF output (~0dBm) 24 RFOPX Analog output Low power linear positive RF output (~0dBm) 25 VSN Supply pad Negative supply 26 OAD2 Analog I/O Analog or digital received signal output 27 OAD Analog I/O Analog or digital received signal output 28 VDD_D Analog I/O Positive supply for logic, internally regulated 29 OSCI Analog input Crystal oscillator input or short to ground in case external TCXO is used 30 OSCO Analog I/O Crystal oscillator output or external 20MHz clock input 31 EN Digital input Enable input 32 IRQ Digital output Interrupt request output 33 NCS Digital input Serial Peripheral Interface Enable (active low) 34 MISO Digital output / tri-state Serial Peripheral Interface DATA output 35 MOSI Digital input Serial Peripheral Interface DATA input 36 CLSYS Digital output Clock Output for MCU 37 SCLK Digital input Serial Peripheral Interface Clock Page 4 Document Feedback ams Short Datasheet [v1-00] 2015-Jul-03 AS3980 − Pin Assignment Pin Number Pin Name Pin Type Description 48-Pin QFN Supply pad Positive supply for peripheral communication, connect to host positive supply ADC Analog input ADC input for external power detector support 40 CD2 Analog I/O Internal node de-coupling capacitor 41 CD1 Analog I/O Internal node de-coupling capacitor 42 AGD Analog I/O Analog reference voltage 43 VOSC Analog I/O Internal node de-coupling capacitor 44 VDD_A Analog I/O Analog part positive supply, internally regulated 45 LF_CEXT Analog output PLL Loop filter 46 VDD_LF Analog I/O Positive supply for LF processing, internally regulated 47 COMP_A Analog I/O Internal node, connect de-coupling capacitor to VDD_LFI 48 COMN_A Analog I/O Internal node, connect de-coupling capacitor to VDD_LFI 49 Exposed Pad Supply pad Exposed pad of the package 38 VDD_IO 39 ams Short Datasheet [v1-00] 2015-Jul-03 Page 5 Document Feedback AS3980 − Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Electrical Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings Figure 5: Absolute Maximum Ratings Symbol Parameter Min Max Units Comments Electrical Parameters VDD_IO Supply voltage VDD_IO -0.3 6.0 V Supply voltage VEXT -0.3 4 V VEXT_RF Supply voltage VEXT_RF -0.3 4.5 V VINH Input pin voltage host interface -0.3 VDD_IO + 0.5 V VINO Input pin voltage, other pins -0.3 VEXT + 0.5 V VEXT I_scr Input current (latch-up immunity) -100 100 mA Valid for inputs EN, IRQ, MOSI, SCLK, NCS Norm: JEDEC 78, AGD excluded from Latch-up immunity test for EN is high. AGD is a reference voltage pin and must be kept at the reference Electrostatic Discharge ESDHBM Electrostatic discharge for the RF pins 5, 23 and 24 ±1 Electrostatic discharge for other pins ±2 kV Norm: JESD22-A114E kV Continuous Power Dissipation PT Total power dissipation (all supplies and outputs) Page 6 Document Feedback 1.6 W ams Short Datasheet [v1-00] 2015-Jul-03 AS3980 − Absolute Maximum Ratings Symbol Parameter Min Max Units Comments Temperature Ranges and Storage Conditions TJ Maximum operating virtual junction temperature Tstrg Storage temperature Tbody Package Body Temperature RHNC Relative Humidity non-condensing MSL Moisture Sensitivity Level ams Short Datasheet [v1-00] 2015-Jul-03 -55 5 3 120 °C 125 °C 260 °C 85 % Norm: IPC/JEDEC J-STD-020. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices” Represents a max. floor life time of 168h Page 7 Document Feedback AS3980 − Electrical Characteristics Electrical Characteristics All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. V EXT = 3.3 V, V EXT_RF = 3.3 V, V DD_IO = 3.3 V, TA = 25 ºC unless otherwise noted. Figure 6: Electrical Characteristics Symbol Parameter IEXT Supply current without VDD_RF current ISTBY Supply current in standby mode IPD Supply current in power-down mode Conditions VEXT consumption Min Typ 65 (1) 75 mA 3 mA All system disabled including supply voltage regulators Max Units 1 10 μA 1.45 1.55 1.65 V 1 1.8 2.0 V VAGD AGD voltage VPOR Power on reset voltage (POR) VRD Regulator drop see note (2) 300 mV Rejection of external supply noise on the supply regulator see note (3) 26 dB RF output power VDD_B =3V 0 dBm 50 Ω PPSSR PRF RRFIN Single ended mixer input impedance VSENS_NOM Input sensitivity Nominal mixer setting, PER=0.1% -67 dBm VSENS_GAIN Input sensitivity Increased mixer gain, PER=0.1% -77 dBm VSENS_LBT LBT sensitivity Maximum LBT sensitivity -90 dBm Third order intercept point Nominal mixer setting (4) VEXT = 3V 17 dBm Input 1dB compression point Nominal mixer setting (4) VEXT = 3V 7 dBm Recovery time after modulation Maximum LF selected 18 μs IP3 1dBCP TREC Page 8 Document Feedback ams Short Datasheet [v1-00] 2015-Jul-03 AS3980 − Electrical Characteristics Symbol Parameter Conditions Min Typ Max Units CMOS Input (valid for all CMOS inputs) VIH High level input voltage see note (5) VIL Low level input voltage see note (6) lLEAK 0.8 * VDD_IO V Input leakage current 0.2 * VDD_IO V 1 μA CMOS Output (valid for all CMOS outputs) Note: On all outputs, it is recommended to use loads with the smallest required drive capability in order to prevent current/spikes problems. fSCLK RNMOS RPMOS SCLK frequency Output NMOS resistance on digital pins Output PMOS resistance on digital pins hs_output = 1(7), VDD_IO ≥ 3V, CLOAD = 50pF 5 MHz hs_output = 1, VDD_IO ≥ 1.65V, CLOAD = 50pF 3 MHz hs_output = 0, VDD_IO ≥ 3V, CLOAD = 50pF 2 MHz hs_output = 1 120 Ω hs_output = 1, VDD_IO > 3V 150 Ω hs_output = 1, VDD_IO > 1.65V 300 Ω Note(s) and/or Footnote(s): 1. Using ic_bia_m option bits, the consumption can be decreased up to 9%. The drawback of decreased power consumption can be higher noise, lower output power, and declining sensitivity. 2. After execution of direct command: Automatic Power Supply Level Setting (A2 h). 3. The difference between the external supply and the regulated voltage is higher than 300mV. 4. Register settings for nominal mixer settings: 0A:01 h, 0D:84h , 22:13h . 5. At supply voltage ≤1.8V, the minimum VIH is defined as 0.9*V DD_IO. 6. At supply voltage ≤1.8V, the maximum VIL is defined as 0.1*V DD_IO. 7. Option bit 7 of Miscellaneous Register 1. ams Short Datasheet [v1-00] 2015-Jul-03 Page 9 Document Feedback AS3980 − Typical Operating Characteristics Typical Operating Characteristics All in this specification defined tolerances for external components need to be assured over the whole operation condition range and also over lifetime. Figure 7: Typical Operating Characteristics Symbol Parameter Min Max Units VDD_IO Positive supply voltage VDD_IO 1.65 5.5 V VEXT Positive supply voltage VEXT 2.7 3.6 V VEXT_RF Positive supply voltage VEXTRF 2.7 4.3 V VSS Negative supply voltage 0 0 V -40 85 °C TAMB Ambient temperature Page 10 Document Feedback Comments For optimal power supply rejection and performance a supply voltage of at least 3.3 V is required. A supply voltage above 3.0V allows operation with reduced power supply rejection. Operation down to 2.7V is possible with reduced performance. Valid for all VSS and VSN pins ams Short Datasheet [v1-00] 2015-Jul-03 AS3980 − PCB Pad Layout PCB Pad Layout Figure 8: Recommended PCB Pad Layout 5.24 mm 0.75 mm 0.05mm 5.24 mm 0.3 0.5mm 3m m 0.3mm 0.07mm 0.55mm 3.25mm 3.35mm AS3980 PCB Pad Layout : This figure shows the recommended PCB land pattern of the AS3980 device. ams Short Datasheet [v1-00] 2015-Jul-03 Page 11 Document Feedback AS3980 − Soldering Information Soldering Information Stencil Design & Solder Paste Application 1. Stainless steel stencils are recommended for solder paste application. 2. A stencil thickness of 0.125 – 0.150 mm (5 – 6 mils) is recommended for screening. 3. For the PCB thermal pad, solder paste should be printed on the PCB by designing a stencil with an array of smaller openings that sum to 50% of the QFN thermal pad area as shown in Figure 9. 4. The aperture opening for the signal pads should be between 50-80% of the QFN pad area as shown in Figure 10. 5. Optionally, for better solder paste release, the aperture walls should be trapezoidal and the corners rounded. 6. The fine pitch of the IC leads requires accurate alignment of the stencil and the printed circuit board. The stencil and printed circuit assembly should be aligned to within + 1 mil prior to application of the solder paste. 7. No-clean flux is recommended since flux from underneath the thermal pad will be difficult to clean if water-soluble flux is used. Figure 9: Solder Paste Application on Paddle Solder Paste Paddle Pattern: Solder paste should be applied through an array of squares (or circles) which totals 50 % of the total area of the paddle. Page 12 Document Feedback ams Short Datasheet [v1-00] 2015-Jul-03 AS3980 − Soldering Information Figure 10: Solder Paste Application on Pads Minimum 50 % coverage 62 % coverage Maximum 80 % coverage Solder Paste on Pads: The aperture opening for the signal pads should be between 50-80% of the QFN pad area. Soldering Options & Package Placement 1. Hand soldering of these devices is not recommended even for prototypes. 2. Infrared or Convection mass reflow soldering is the preferred method of QFN attachment. 3. Manual placement and/or manual repositioning of QFN packages is not recommended. Solder Reflow Profile The PCB assembly should be instrumented and the reflow oven’s process parameters established to ensure the solder paste manufacturer’s reflow profile specification is met during the assembly process. See Figure 12. The maximum PCB temperature recommended by the supplier must not be exceeded. ams Short Datasheet [v1-00] 2015-Jul-03 Page 13 Document Feedback AS3980 − Soldering Information Figure 11: Solder Reflow Profile Profile Feature Average ramp-up rate (Tsmax to TP) Lead-free Assembly 3 °C/second max. Preheat • Temperature Min (Tsmin) 150 °C 200 °C 60 – 120 seconds • Temperature Max (Tsmax) • Time (tL) Time maintained above: • Temperature (TL) 217 °C 60 – 150 seconds • Time (tL) Peak/classification temperature (TP) 260 °C Time within 5 °C of actual peak temperature (TP) 30 seconds Ramp-down rate 6 °C/second max. Time 25 °C to peak temperature 8 minutes max. JEDEC standard Lead-free reflow profile: According to J-STD-020D. Temperature [°C] Figure 12: Recommended Reflow Soldering Profile tP TP Ramp Up TL TL Critical Zone TL to TP Tsmax Ramp Down Tsmin TL 25 t 25°C to Peak Temperature Page 14 Document Feedback Time [s] ams Short Datasheet [v1-00] 2015-Jul-03 AS3980 − Package Drawings & Markings Package Drawings & Markings Figure 13: Package Drawings AS3980 YYWWXZZ @ Symbol Min Nom A 0.80 0.90 1.00 A1 0 0.02 0.05 A3 - 0.20 REF - L 0.48 0.53 0.58 L1 0 - 0.15 L2 0.35 0.40 0.45 b 0.18 0.25 0.30 D RoHS Green Max 7.00 BSC E 7.00 BSC e 0.50 BSC D2 5.04 5.14 5.24 E2 5.04 5.14 5.24 aaa - 0.15 - bbb - 0.10 - ccc - 0.10 - ddd - 0.05 - eee - 0.08 - fff - 0.10 - N 48 Note(s) and/or Footnote(s): 1. Dimensioning and tolerances conform to ASME Y14.5M-1994. 2. All dimensions are in millimeters. Angles are in degrees. 3. Dimension b applies to metallized terminal and is measured between 0.25mm and 0.30mm from terminal tip. Dimension L1 represents terminal full back from package edge up to 0.15mm is acceptable. 4. Co-planarity applies to the exposed heat slug as well as the terminal. 5. Radius on terminal is optional. 6. N is the total number of terminals. 7. This drawing is subject to change without notice. ams Short Datasheet [v1-00] 2015-Jul-03 Page 15 Document Feedback AS3980 − Package Drawings & Mark ings Figure 14: Packaging Code YYWWXZZ@ YY WW X ZZ @ Year Working week assembly / packaging Plant identifier Free choice / traceability code Sublot Identifier Packaging Code YYWWXZZ: This figure explains the laser marked date code on the package. Page 16 Document Feedback ams Short Datasheet [v1-00] 2015-Jul-03 AS3980 − Ordering & Contact Information Ordering & Contact Information Figure 15: Ordering Information Ordering Code AS3980-BQFM AS3980-BQFT Package Marking Delivery Form 48-pin QFN (7x7x0.9 mm) AS3980 Tape & Reel Delivery Quantity 50 500 Ordering Information: This figure shows ordering information for the AS3980 device. Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbaderstrasse 30 8141 Unterpremstaetten Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com ams Short Datasheet [v1-00] 2015-Jul-03 Page 17 Document Feedback AS3980 − RoHS Compliant & ams Green Statement RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Page 18 Document Feedback ams Short Datasheet [v1-00] 2015-Jul-03 AS3980 − Copyrights & Disclaimer Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services. ams Short Datasheet [v1-00] 2015-Jul-03 Page 19 Document Feedback AS3980 − Document Status Document Status Document Status Product Preview Preliminary Datasheet Datasheet Datasheet (discontinued) Page 20 Document Feedback Product Status Definition Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs ams Short Datasheet [v1-00] 2015-Jul-03 AS3980 − Revision Information Revision Information ams Short Datasheet [v1-00] 2015-Jul-03 The initial version of short datasheet was derived from version 2-01 of full datasheet. Page 21 Document Feedback AS3980 − Content Guide Content Guide Page 22 Document Feedback 1 1 2 2 General Description Key Benefits & Features Applications Block Diagram 3 6 8 10 11 Pin Assignment Absolute Maximum Ratings Electrical Characteristics Typical Operating Characteristics PCB Pad Layout 12 12 13 13 Soldering Information Stencil Design & Solder Paste Application Soldering Options & Package Placement Solder Reflow Profile 15 17 18 19 20 21 Package Drawings & Markings Ordering & Contact Information RoHS Compliant & ams Green Statement Copyrights & Disclaimer Document Status Revision Information ams Short Datasheet [v1-00] 2015-Jul-03