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D atas hee t
AS3992
UHF RFID Single Chip Reader EPC Class1 Gen2 Compatible
The AS3992 is pin to pin and firmware compatible with the previous
AS3990/91 IC's. It offers improved receive sensitivity to -86dB,
programmable Rx Dense Reader Mode (DRM) filters on chip and
pre-distortion. Fully scalable, the AS3992 is ideal for longer range
and higher power applications.
Filters dedicated to 250kHz and 320kHz M4 and M8 DRM
operation. Available RX modes:
- LF40kHz, 160kHz: FM0, M2, M4, M8
- LF 250kHz, 320kHz, 640kHz: M4, M8
ISO18000-6C (EPC Gen2) full protocol support
ISO18000-6A,B compatibility in direct mode
Programmable Dense Reader Mode filters on chip allowing a
true World Wide Shippable device
Improved receive sensitivity to -86dBm
On chip pre-distortion meaning improved external PA efficiency
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Offering DRM filtering on chip, combined with improved sensitivity
and pre-distortion allows the AS3992 to be the only true world wide
shippable IC. The reader configuration is achieved through setting
control registers allowing fine tuning of different reader parameters.
Supply voltage range 4.1V to 5.5V
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The AS3992 UHF Reader chip is an integrated analog front-end and
provides protocol handling for ISO180006c/b 900MHz RFID reader
systems. Equipped with multiple built-in programming options, the
device is suitable for a wide range of UHF RFID applications.
2 Key Features
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1 General Description
The AS3992 complies with EPC Class 1 Generation 2 protocol (ISO
18000-6C) and ISO 18000-6A/B (in direct mode).
Integrated low level transmission coding, Integrated low level
decoders
Parallel or serial interface can be selected for communication
between the host system (MCU) and the reader IC. When hardware
coders and decoders are used for transmission and reception, data
is transferred via 24 bytes FIFO register. In case of direct
transmission or reception, coders and decoders are bypassed and
the host system can service the analog front end in real time.
Integrated data framing, Integrated CRC checking
The transmitter generates 20dBm output power into 50Ω load and is
capable of ASK or PR-ASK modulation. The integrated supply
voltage regulators ensure supply rejection of the complete reader
system.
Can be powered by USB with no need for step conversion from
4.1V to 5.5V
The transmission system comprises low level data coding. Automatic
generation of FrameSync, Preamble, and CRC is supported.
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The receiver system allows AM and PM demodulation. The receiver
also comprises automatic gain control option (patent pending) and
selectable gain and signal bandwidth to cover a range of input link
frequency and bit rate options. The signal strength of AM and PM
modulation is measured and can be accessed in RSSI register. The
receiver output is selectable between digitized sub-carrier signal and
any of integrated sub-carrier decoders. Selected decoders deliver bit
stream and data clock as outputs.
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The receiver system also comprises framing system. This system
performs the CRC check and organizes the data in bytes. Framed
data is accessible to the host system through a 24 byte FIFO
register.
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To support external MCU and other circuitry a 3.3V regulated supply
and clock outputs are available. The regulated supply has 20mA
current capability.
The AS3992 is available in a 64-pin QFN (9mm x 9mm), ensuring
the smallest possible footprint.
Parallel 8-bit or serial 4-pin SPI interface to MCU using 24 bytes
FIFO
Voltage range for communication to MCU between 1.8V and
5.5V
Selectable clock output for MCU
Integrated supply voltage regulator (20mA), which can be used
to supply MCU and other external circuitry
Integrated supply voltage regulator for the RF output stage,
providing rejection to supply noise
Internal power amplifier (20dBm) for short range applications
Antenna driver using ASK or PR-ASK modulation
Adjustable ASK modulation index
AM & PM demodulation ensuring no “communication holes”
with automatic I/Q selection
Selectable reception gain, Reception automatic gain control
AD converter for measuring TX power using external RF power
detector
DA converter for controlling external power amplifier
Frequency hopping support
On-board VCO and PLL covering complete RFID frequency
range 840MHz to 960MHz
Oscillator using 20MHz crystal
Power down, standby and active mode available
3 Applications
The device is an ideal solution for UHF RFID reader systems and
hand-held UHF RFID readers.
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Revision 1.1
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AS3992
Datasheet - A p p l i c a t i o n s
2xC
VEXT
VEXT2
16 17
AS3992
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13 15
18
VDD_D
VDD_RF
19
VDD_B
54
AGD
VDD_A
38
Supply Regulators &
References
53 52
5
VDD_MIX
VDD_TXPAB
CD1
CD2
VDD_5LFI
3
31
30
ADC
58
DAC
4
7
MIX_INN
9
MIXS_IN
10
RFOUTN_1
27
RFOUTN_2
28
RFOUTP_1
20
RFOUTP_2
21
RFONX
32
RFOPX
33
EXT_IN
56
OSCI
37
DRM Filter
Oscillator
& Timing
System
VDDLF
61
VOSC
VDD_RFP
41
VDD_IO
IO0
42
IO1
43
44
IO2
IO3
45
IO4
46
IO5
47
IO6
48
IO7
51
Analog
Front-end
RSSI
EPC Gen 2 Protocol
Handling
GEN-2
Frame Gen
CRC
24 Byte
FIFO
60
65
EXP_PAD
50
CLK
39
EN
40
IRQ
49
CLSYS
Micro
controller
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8 11 12 14 22 23 24 25 26 29 35 55 57
VSS
VSS
VSN_MIX
CBIB
CBV5
VSN_1
VSN_2
VSN_3
VSN_4
VSN_5
VSN_D
VSN_RFP
VSN_A
VSN_CP
62
6
63
7xC
Digitizer
Digitizer
RF Out
59
34
Gain Filter
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OSCO
VCO
CP
36
IQ DownConversion
Mixer
MCU Interface
OAD_2
MIX_INP
Directional unit
1
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OAD
COMN_A
COMN_B
COMP_A
COMP_B
4xC
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Figure 1. AS3992 Block Diagram
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AS3992
Datasheet - C o n t e n t s
Contents
1
2 Key Features.............................................................................................................................................................................
1
3 Applications...............................................................................................................................................................................
1
4 Pin Assignments .......................................................................................................................................................................
5
4.1 Pin Descriptions....................................................................................................................................................................................
5
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1 General Description ..................................................................................................................................................................
5 Absolute Maximum Ratings ......................................................................................................................................................
8
6 Electrical Characteristics...........................................................................................................................................................
9
7 Detailed Description................................................................................................................................................................
11
7.1 Supply.................................................................................................................................................................................................
11
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7.1.1 Power Modes............................................................................................................................................................................. 12
7.2 Host Communication ..........................................................................................................................................................................
13
7.3 VCO and PLL .....................................................................................................................................................................................
13
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7.3.1 VCO and External RF Source.................................................................................................................................................... 13
7.3.2 PLL ............................................................................................................................................................................................ 13
7.4 Chip Status Control ............................................................................................................................................................................
14
7.5 Protocol Control..................................................................................................................................................................................
14
7.6 Option Registers Preset .....................................................................................................................................................................
14
7.7 Transmitter..........................................................................................................................................................................................
7.7.1
7.7.2
7.7.3
7.7.4
7.7.5
Normal Mode .............................................................................................................................................................................
Direct Mode ...............................................................................................................................................................................
Modulator...................................................................................................................................................................................
Amplifier.....................................................................................................................................................................................
TX Pre-Distortion .......................................................................................................................................................................
7.8 Receiver .............................................................................................................................................................................................
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7.8.1 Input Mixer .................................................................................................................................................................................
7.8.2 DRM RX Filter............................................................................................................................................................................
7.8.3 RX Filter Calibration...................................................................................................................................................................
7.8.4 Fast AC Coupling.......................................................................................................................................................................
7.8.5 RX Gain .....................................................................................................................................................................................
7.8.6 Received Signal Strength Indicator (RSSI)................................................................................................................................
7.8.7 Reflected RF Level Indicator .....................................................................................................................................................
7.8.8 Normal Mode .............................................................................................................................................................................
7.8.9 Direct Mode ...............................................................................................................................................................................
7.8.10 Normal Mode With Mixer DC Level Output and Enable RX Output Available .........................................................................
7.9 ADC / DAC .........................................................................................................................................................................................
14
14
16
16
17
17
17
17
18
19
19
19
20
20
20
21
21
22
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7.9.1 DA Converter ............................................................................................................................................................................. 22
7.9.2 AD Converter ............................................................................................................................................................................. 22
7.10 Reference Oscillator .........................................................................................................................................................................
23
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8 Application Information ...........................................................................................................................................................
22
8.1 Configuration Registers Address Space.............................................................................................................................................
23
8.2 Main Configuration Registers .............................................................................................................................................................
25
8.3 Control Registers - Low Level Configuration Registers......................................................................................................................
26
8.4 Status Registers .................................................................................................................................................................................
30
8.5 Test Registers.....................................................................................................................................................................................
33
8.6 PLL, Modulator, DAC, and ADC Registers .........................................................................................................................................
35
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AS3992
Datasheet - C o n t e n t s
8.7 RX Length Registers ..........................................................................................................................................................................
38
8.8 FIFO Control Registers.......................................................................................................................................................................
39
8.9 Direct Commands...............................................................................................................................................................................
40
41
41
41
41
41
41
41
41
42
42
42
42
42
42
42
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8.9.1 Idle (80)......................................................................................................................................................................................
8.9.2 Hop to Main Frequency (84) ......................................................................................................................................................
8.9.3 Hop to Auxiliary Frequency (85) ................................................................................................................................................
8.9.4 Trigger AD Conversion (87).......................................................................................................................................................
8.9.5 Trigger RX Filter Calibration (88)...............................................................................................................................................
8.9.6 Decrease RX Filter Calibration Data (89) ..................................................................................................................................
8.9.7 Increase RX Filter Calibration Data (8A) ...................................................................................................................................
8.9.8 Reset FIFO (8F).........................................................................................................................................................................
8.9.9 Transmission With CRC (90) .....................................................................................................................................................
8.9.10 Transmission With CRC Expecting Header Bit (91) ................................................................................................................
8.9.11 Transmission Without CRC (92) ..............................................................................................................................................
8.9.12 Delayed Transmission With CRC (93).....................................................................................................................................
8.9.13 Delayed Transmission Without CRC (94)................................................................................................................................
8.9.14 Block RX (96)...........................................................................................................................................................................
8.9.15 Enable RX (97) ........................................................................................................................................................................
8.10 EPC GEN2 Specific Commands ......................................................................................................................................................
8.10.1
8.10.2
8.10.3
8.10.4
8.10.5
8.10.6
8.10.7
8.10.8
Query (98)................................................................................................................................................................................
QueryRep (99) .........................................................................................................................................................................
QueryAdjustUp (9A).................................................................................................................................................................
QueryAdjustNic (9B) ................................................................................................................................................................
QueryAdjustDown (9C)............................................................................................................................................................
ACK (9D) .................................................................................................................................................................................
NAK (9E)..................................................................................................................................................................................
ReqRN (9F) .............................................................................................................................................................................
8.11 Reader Communication Interface .....................................................................................................................................................
42
42
42
42
43
43
43
43
43
43
8.12 Parallel Interface Communication.....................................................................................................................................................
45
8.13 Serial Interface Communication .......................................................................................................................................................
47
8.13.1 Timing Diagrams...................................................................................................................................................................... 48
8.13.2 Timing Parameters .................................................................................................................................................................. 49
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8.14 FIFO .................................................................................................................................................................................................
49
50
10 Ordering Information.............................................................................................................................................................
52
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9 Package Drawings and Markings ...........................................................................................................................................
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AS3992
Datasheet - P i n A s s i g n m e n t s
4 Pin Assignments
CLSYS
49
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VDD_IO
CLK
CD2
50
CD1
53
52
51
VSN_A
AGD
55
56
54
VSN_CP
EXT_IN
57
VDD_A
ADC
59
58
VOSC
VCO
62
60
CP
63
61
COMP_A
VDDLF
64
Figure 2. Pin Assignments (Top View)
1
48
IO7
COMP_B
2
47
IO6
COMN_B
3
46
IO5
DAC
4
45
IO4
VDD_5LFI
5
44
IO3
VSS
6
43
IO2
MIX_INP
VSS
7
8
42
IO1
41
IO0
MIX_INN
9
40
IRQ
MIXS_IN
10
39
EN
VSN_MIX
11
38
VDD_D
CBIB
12
37
OSCO
VDD_MIX
13
36
OSCI
CBV5
14
35
VSN_RFP
VDD_TXPAB
15
34
VDD_RFP
VEXT
16
33
RFOPX
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COMN_A
28
29
30
31
32
RFOUTN_2
VSN_D
OAD2
OAD
RFONX
26
27
VSN_5
25
RFOUTN_1
24
VSN_3
VSN_4
21
RFOUTP_2
22
20
23
19
VDD_B
RFOUTP_1
VSN_2
18
VSN_1
17
VEXT2
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VDD_RF
AS3992
4.1 Pin Descriptions
Pin Number
Pin Name
Pin Type
COMN_A
Bidirectional
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Table 1. Pin Descriptions
Description
Connect de-coupling capacitor to VDD_5LFI
COMP_B
Bidirectional
3
COMN_B
Bidirectional
4
DAC
Output
5
VDD_5LFI
Supply Input
Positive supply for LF input stage, connect to VDD_MIX
6
VSS
Supply Input
Substrate
7
MIX_INP
Input
8
VSS
Supply Input
9
MIX_INN
Input
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DAC output for external amplifier support, Output Resistance of DAC
pin is 1kΩ
Differential mixer positive input
Substrate
Differential mixer negative input
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AS3992
Datasheet - P i n A s s i g n m e n t s
Table 1. Pin Descriptions
Pin Number
Pin Name
Pin Type
10
MIXS_IN
Input
11
VSN_MIX
Supply Input
Mixer negative supply
12
CBIB
Bidirectional
Internal node de-coupling capacitor to GND
13
VDD_MIX
Supply Output
Mixer positive supply, internally regulated to 4.8V
14
CBV5
Bidirectional
Internal node de-coupling capacitor to VDD_MIX
15
VDD_TXPAB
Supply Input
Power Amplifier Bias positive supply. Connect to VDD_MIX
16
VEXT
Supply Input
Main positive supply input (5V to 5.5V)
17
VEXT2
Supply Input
PA positive supply regulator input (2.5V to 5.5V)
18
VDD_RF
Supply Output
PA positive supply regulator output, internally regulated to 2V-3.5V
19
VDD_B
Supply Output
PA buffer positive supply. Internally regulated to 3.4V
20
RFOUTP_1
Output
21
RFOUTP_2
Output
22
VSN_1
Supply Input
23
VSN_2
Supply Input
24
VSN_3
Supply Input
25
VSN_4
Supply Input
26
VSN_5
Supply Input
27
RFOUTN_1
Output
28
RFOUTN_2
Output
29
VSN_D
Supply Output
30
OAD2
Bidirectional
Analog or digital received signal output and MCU support mode sense
input
31
OAD
Bidirectional
Analog or digital received signal output
32
RFONX
Output
Low power linear negative RF output (~0dBm)
33
RFOPX
Output
Low power linear positive RF output (~0dBm)
34
VDD_RFP
Supply Output
35
VSN_RFP
Supply Input
36
OSCI
Input
OSCO
Bidirectional
Crystal oscillator output or external 20MHz clock input
VDD_D
Supply Output
Digital part positive supply, internally regulated to 3.4V
EN
Input
40
IRQ
Output
41
IO0
Bidirectional
42
IO1
Bidirectional
43
IO2
Bidirectional
I/O pin for parallel communication
EnableRX input in case of direct mode
44
IO3
Bidirectional
I/O pin for parallel communication
Modulation input in case of direct mode
45
IO4
Bidirectional
I/O pin for parallel communication
Slave select in case of serial communication (SPI)
38
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Single ended mixer input
PA positive RF output
RFOUT1 and RFOUT2 must be tied together
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Description
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PA negative supply
PA negative RF output or used in single ended mode.
RFOUT1 and RFOUT2 must be tied together
Digital negative supply
RF path positive supply, internally regulated to 3.4V
RF path negative supply
Crystal oscillator input
Enable input
Interrupt output
I/O pin for parallel communication
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AS3992
Datasheet - P i n A s s i g n m e n t s
Table 1. Pin Descriptions
Pin Number
Pin Name
Pin Type
Description
46
IO5
Bidirectional
I/O pin for parallel communication
Sub-carrier output in case of direct mode
IO6
Bidirectional
48
IO7
Bidirectional
I/O pin for parallel communication.
MOSI in case of serial communication (SPI)
49
CLSYS
Output
50
CLK
Input
51
VDD_IO
Supply Input
52
CD2
Bidirectional
53
CD1
Bidirectional
54
AGD
Bidirectional
Analog reference voltage
55
VSN_A
Supply Input
Analog part negative supply
56
EXT_IN
Input
57
VSN_CP
Supply Input
58
ADC
Input
59
VDD_A
Supply Output
60
VCO
Input
61
VOSC
Bidirectional
62
CP
Output
63
VDDLF
Supply Input
Positive supply for LF processing, internally regulated to 3.4
64
COMP_A
Bidirectional
Internal node, connect de-coupling capacitor to VDD_5LFI
65
EXP_PAD
Supply Input
Exposed paddle, must be tied to GND
Clock output for MCU operation
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I/O pin for parallel communication.
MISO in case of serial communication (SPI)
Sub-carrier output in case of direct mode
Clock input for MCU communication (parallel and serial)
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Internal node de-coupling capacitor
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Positive supply for peripheral communication, connect to host positive
supply
RF input in case external VCO is used
Charge pump negative supply
ADC input for external power detector support
Analog part positive supply, internally regulated to 3.4V
VCO input
Internal node de-coupling capacitor
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Charge pump output
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AS3992
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 9 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
-0.3
6
V
All voltage values are with respect to substrate ground
terminal VSS
VEXT+0.3
V
For pins EN, I07..IO0, CLK, IRQ, CLSYS, VDDIO,
VDD_MIX, VDD_5LFI, VDD_TXPAB, CBV5, DAC,
OAD, OAD2
4.5
V
For other pins
-0.3
V
For other pins
±100
mA
According to JEDEC 78
kV
According to MIL 883 E method 3015
120
ºC
The maximum junction temperature for continuous
operation is limited by package constraints.
+150
ºC
Positive Voltage
Negative voltage
1
Electrostatic Discharge
ESD rating
2
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Latchup immunity , IO
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Supply voltage, VEXT, VEXT2
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Electrical Parameters
Other pins, HBM
2
RF pins, HBM
1
Temperature Ranges and Storage Conditions
Maximum junction temperature, TJ
Storage temperature range, Tstg
-55
Lead temperature 1.6 mm (1/16 inch) from case
for 10 seconds
260
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
Classification for non-hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn)
1. The AGD (Pin 54) is excluded from Latch-up immunity test at EN (Pin 39) high. AGD is a reference voltage pin and must be kept at the
reference voltage level for proper chip operation. AGD must be connected to an external stabilization capacitor.
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2. This integrated circuit can be damaged by ESD. We recommend that all integrated circuits are handled with appropriate precautions.
Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance
degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric
changes could cause the device not to meet the published specifications. RF integrated circuits are also more susceptible to damage
due to use of smaller protection devices on the RF pins, which are needed for low capacitive load on these pins.
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Revision 1.1
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AS3992
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
VEXT = 5.3V, typical values at 25ºC, unless otherwise noted.
Note: The difference between the external supply and the regulated voltage is higher than 250mV.
Table 3. Electrical Characteristics
Symbol
Parameter
Conditions
Typ
IVEXT
Supply current without PA driver current
VEXT Consumption
80
IVEXT2
Supply Current for internal PA
VEXT2 Consumption,
VDD_RF = 2.5V
140
ISTBY
Standby current
IPD
Supply current in power-down mode
VAGD
AGD voltage
1.5
VPOR
Power on reset voltage (POR)
1.4
VVDD
Regulated supply for internal circuitry and
for external MCU
3.2
3.4
3.6
V
VDD_RF
Regulated supply for internal PA
1.9
2
2.1
V
VVDD MIX1
Regulated supply for mixers,
bit vext_low=L
4.5
4.8
5.1
V
VVDD MIX2
Regulated supply for mixers,
bit vext_low=H
3.5
3.7
3.9
V
PPSSR
Rejection of external supply noise on the
supply regulators
26
dB
PRFAUX
Auxiliary output power
0
dBm
PRFOUT
Internal PA output power
20
dBm
RRFIN
RFIN input resistance
100
Ω
Nominal mixer setting, PER = 0.1%
-66
dBm
Increased mixer gain, PER = 0.1%
-76
dBm
Maximum LBT sensitivity
-86
dBm
10
dBm
21
dBm
3
All system disabled including supply
voltage regulators
mA
mA
mA
10
µA
1.6
1.7
V
2.0
2.5
V
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VSENS-NOM
Input sensitivity
VSENS-GAIN
VSENS-LBT
LBT sensitivity
The difference between the external
supply and the regulated voltage is
higher than 250mV
Units
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Min
Input 1dB compression point
IP3
Third order intercept point
PN200
VCO Phase noise @ 200 kHz
-118
dBc/Hz
PN400
VCO Phase noise @ 400 kHz
-125
dBc/Hz
18
µs
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1dBCP
Recovery time after modulation
Nominal mixer setting
Maximum LF selected
ch
Logic Input/Output
2
MHz
VLOW
Input logic low
0.2
VDD_IO
VHIGH
Input logic high
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Maximum CLK frequency
RIO
Output resistance IO0…IO7
RCL SYS
Output resistance CL SYS
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VDD_IO
0.8
low_io = H for VDD_IO < 2.7V
Revision 1.1
400
200
800
Ω
Ω
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AS3992
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
Table 4. Recommended Operating Conditions
Symbol
Parameter
Conditions
Positive Supply Voltage
VEXT
Bit vext_low = 1
Min
Typ
Max
Units
5.0
5.3
5.5
V
4.1
5.5
V
Operating virtual junction temperature range
-40
110
ºC
TAMB
Ambient temperature
-40
110
ºC
-
Rth junction to exposed die pad
19
º/W
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Datasheet - D e t a i l e d D e s c r i p t i o n
7 Detailed Description
The RFID reader IC comprises complete analog and digital functionality for reader operation including transmitter and receiver section with
complete EPC Gen2 or ISO18000-6C digital protocol support. To integrate as many components as possible, the device also comprises an onboard PLL section with integrated VCO, supply section, DAC and ADC section, and host interface section. In order to cover a wide range of
possibilities, there is also Configuration registers section that configures operation of all blocks.
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For operation, the device needs to be correctly supplied via. VEXT and VEXT2 pins and enabled via. EN pin (Refer Supply on page 11 for
connecting to supply and Power Modes on page 12 about operation of the EN pin). At power-up, the configuration registers are preset to a
default operation mode. The preset values are described in the Configuration Registers Address Space on page 23 below each register
description table. It is possible to access and change registers to choose other options.
The communication between the reader and the transponder follows the reader talk first method. After power-up and configuring IC, the host
system starts communication by turning on the RF field by setting option bit rf_on in the ‘Chip status control register’ (00) (see Table 13) and
transmitting the first protocol command (Select in EPC Gen2). Transmitting and receiving is possible in the following two modes:
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7.1 Supply
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1. Normal Data Mode: In this mode, the TX and RX data is transferred through the FIFO register and all protocol data processing is done
internally.
2. Direct Data Mode: In this mode, the data processing is done by the host system.
COMN_B
COMP_B
COMN_A
COMP_A
VDD_TXPAB
LDO
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VEXT
Mixer
On
receive
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CBV5
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VDD_MIX
Figure 3. Mixer Supply
VDD_5LFI
The effective supply system of the chip decreases the influence of the supply noise and interference and thus improves de-coupling between
different building blocks. A set of 3.4V regulators is used for supplying the reference block, AD and DA converters, low frequency receiver cells,
the RF part, and digital part. It is possible to use the digital part supply VDD_D for supplying the external MCU with a current consumption up to
20mA. The input pin for the regulators is VEXT. The output pins for regulators are VDD_A, VDD_LF, VDD_D, VDD_RFP and VDD_B. Each of
the pins require stabilizing capacitors to connected ground (2.2…10µF and 10…100nF) in parallel. Depending on quality of the capacitors,
100pF could be required.
An additional 4.8V regulator is used for the input RF mixers supply. The input of this regulator is VEXT, output is VDD_MIX pin. For correct
operation of the 4.8V regulator, the VEXT voltage needs to be between 5.3V and 5.5V. VDD_MIX needs de-coupling capacitors to VDD_MIX like
other VDD pins.
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In case lower VEXT supply voltage is used (down to 4.1V), the vext_low option bit needs to be set to optimize the chip performance to the lower
supply. The vext_low in the ‘TRcal high and misc register’ (05) bit decreases VDD_MIX voltage to 3.7V to maintain the regulators PSSR and the
ir bit in the ‘RX special setting 2’ (0A) adapts mixer’s internal operating point to lower supply. Adaptation to low supply is implemented in
differential mixer only. The consequence of the decreased supply is lower mixer’s input range.
VDD_5LFI and VDD_TXPAB pins are supply input pins and should be connected to VDD_MIX. The internal 20dBm power amplifier has an
internal regulator from 2…3.5V. The output voltage selection is done by reg2v1:0 option bits in the ‘Regulator and IO control register’ (0B) (see
Table 24).
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The input pin is VEXT2 and output is VDD_RF. For optimum noise rejection performance, the input voltage at VEXT2 pin needs to be at least
0.5V above the regulated supply output. Connecting VEXT2 directly to VEXT is possible only at the expense of increasing IC’s power dissipation
and decreasing the maximum operating temperature.
7.1.1
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A separate I/O supply pin (VDD_IO) is used to supply the internal level shifters for communication interface to the host system (MCU). VDD_IO
should be connected to MCU supply to ensure proper communication between the chip and MCU. In case the MCU is supplied by VDD_D from
the reader IC also VDD_IO should be connected to VDD_D.
Power Modes
The chip has five power modes.
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Power Down Mode. The power down mode is activated by EN pin low (EN=L). For correct operation, the OAD2 pin should not be connected.
Normal Mode. The normal mode is entered by setting EN=H. In this case all supply regulators, reference voltage and bias system, crystal
oscillator, RF oscillator and PLL are enabled. After the crystal oscillator stabilizes, the CLSYS clock becomes active (default frequency is 5MHz)
and the chip is ready to work with internal registers.
In case the crystal oscillator is used the time that the crystal stabilizes dependent on the crystal used. Typical time is 1.5-3ms. By reading the
register 0E, the firmware can check the crystal status: register 0E:x1 (osc_ok=1, pll_ok=0, rf_ok=0) shows that crystal oscillator is stable and that
device is ready to operate. In case the continuously running TCXO is used, only the OSCO pin DC level needs to be set before the internal clock
is ready. The same test with reg0E as above can be used.
The bias and reference voltages after EN=H stabilize in 12ms typically. Then the chip is ready to switch on the RF field and start data
transmission.
Standby Mode. The standby mode is entered from normal mode by option bit stby=H. In the standby mode the regulators, reference voltage
system, and crystal oscillator are operating in low power mode; but the PLL, transmitter output stages and receiver are switched off. All the
register settings are kept while switching between standby and normal mode.
The bias and reference voltages after stby=0 stabilize in 12ms typically. Then the chip is ready to switch on the RF field and start data
transmission.
MCU Support Mode. Power down with MCU support mode intends to support the MCU if the majority of the reader IC is in power down. This
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mode is enabled by connecting 10kΩ resistor between OAD2 pin and ground. During EN=L period, the VDD_D regulator is enabled in low power
mode and the CLSYS frequency is 60kHz typically.
Temporary Normal Mode. It is also possible to trigger temporary normal mode from power down mode (EN=L) by pulling shortly the OAD2
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pin low via 10kΩ or less. After the crystal oscillator is stable and the CLSYS clock output is active, the chip waits for approximately 200µs and
then changes back to the power down mode. Using this function, the superior system can wake up the reader IC and MCU that are both in the
power down mode. If the MCU during 200µs period finds out that the RFID system must react, it confirms the normal mode by setting EN high.
Power Mode
EN
OAD2
Std by
Power down
L
-
X
Power down
SYSCLK of 60kHz
L
10k to GND
X
Normal power
H
X
X
X
H
10k and falling edge
X
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Table 5. AS3992 Power Modes
Standby
Listen mode
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7.2 Host Communication
An 8-bit parallel interface (pins IO0 to IO7) with two control signals (CLK, IRQ) forms the main communication system. It can also be changed (by
hardwiring some of the 8 I/O pins) to a serial interface. The data handling is done by a 24 byte FIFO register used in both directions, transmission
and reception. For more details, refer Reader Communication Interface on page 43.
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The signal level for communication between the host system (MCU) is defined by the supply voltage connected to VDD_IO pin. Communication
is possible in wide range between 1.8V and 5.5V. In case the pull-up output resistance at VDD_IO below 2.7V is to high, it can be decreased by
setting option bit vdd_io_low in the ‘TRcal High and Misc register’ (05). In case the MCU is supplied from the reader IC, then both the MCU
supply and VDD_IO pin need to be connected to VDD_D.
CLSYS output level is defined by the VDD_IO voltage. It is also possible to configure CLSYS to open drain N-MOS output by setting the option
bit open_dr in the in the ‘TRcal high and misc register’ (05), (see Table 18). This function can be used to decrease amplitude and harmonic
content of the CLSYS signal and decrease the cross-talk effects that could corrupt operation of other parts of the circuit.
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7.3 VCO and PLL
The PLL section is composed of a voltage control oscillator (VCO), prescaler, main and reference divider, phase-frequency detector, charge
pump, and loop filter. All building blocks excluding the loop filter are completely integrated. Operating range is 840MHz to 960MHz.
VCO and External RF Source
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7.3.1
Instead of the internal PLL signal, an external RF source can be used. The external source needs to be connected to EXT_IN pin and option bit
eext_in in the ‘PLL A/B divider auxiliary register’ (17) (see Table 39) needs to be set high. The EXT_IN input optimum level is 0dBm with a DC
level between 0V and 2V.
It is also possible to use external VCO and internal PLL circuitry. In this case, the output of the external VCO (0dBm) needs to be connected to
EXT_IN, option bits eext_in and epresc in the ‘PLL A/B divider auxiliary register’ (17) both need to be set high. The charge pump output pin CP
needs to be connected to the external loop filter input and loop filter output to the external VCO input. This configuration is useful in case the
application demands better phase noise performance than the completely integrated oscillator offers.
The internal on-board VCO is completely integrated including the variable capacitor and inductor. The control input is pin VCO; input range is
between 0 and 3.3V. The option bits eosc in the ‘CLSYS, analog out and CP control’ (14) (Table 36) can be used for oscillator noise and
current consumption optimization. Option bit lev_vco in the ‘PLL A/B divider auxiliary register’ (17) (see Table 39) is used to optimize the internal
VCO output level to other RF circuitry demands. VCO and CP pin valid range is between 0.5V and 2.9V.
AS3992 has internal VCO set to a frequency range around 1800MHz, later internally divided by two for decreasing the VCO pulling effect. The
tuning curve of 1800MHz VCO is divided into 16 segments to decrease VCO gain and attain lowest possible phase noise.
Configuration of the 1800MHz VCO tuning range can be manual using option bits vco_r in the ‘CL_SYS, analog out and CP control’
register (14) or automatic using L-H transition on option bit auto in the same register. The device allows measurement of the VCO voltage using
option bit mvco and reading out the 4 bits result of the automatic segment selection procedure, both in the ‘AGL/VCO/F_CAL status’ register
(10).
PLL
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7.3.2
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The divide by 32/33 prescaler is controlled by the main divider. The main divider ratio is defined by the ‘PLL A/B divider main register’ (16). The
low ten bits in the three bytes deep register define A value and the next ten bits define B value. The A and B values define the main divider
division ratio to N=B*32+A*33. The reference clock is selectable by RefFreq bits in the ‘PLL R, A/B divider main register’ (16) (see Table
38). The available values are 500 kHz, 250 kHz, 200 kHz, 100 kHz, 50 kHz and 25 kHz.
Charge pump current is selectable between 150µA and 1200µA using option bits cp1:0 in the ‘CL_SYS, analog out and CP control register’ (14)
(see Table 36). The cp is used to change the polarity (direction) of the charge pump output.
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The frequency hopping is supported by direct commands ‘Hop to main frequency’ (84) and ‘Hop to auxiliary frequency’ (85). The hopping is
controlled by host system (MCU) using two configuration registers for two frequencies. Before enabling the RF field, the host system needs to
configure the PLL by writing the ‘CL_SYS, analog out and PLL register’ (09) and the ‘PLL R, A/B divider main’ (16) registers. Any time during
operating at the first selected frequency, the external system can configure the three bytes deep ‘PLL A/B divider auxiliary (17)’ register. Hopping
to the second frequency is triggered, if direct command ‘Hop to auxiliary frequency’ is sent. Hop to the third frequency is similar: the register ‘PLL
A/B divider main (16)’ can be written any time the external system has free resources and actual hop is triggered by direct command ‘Hop to
main frequency’.
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7.4 Chip Status Control
In the ‘Chip status control register’ (00) (see Table 13), main functionality of the chip is defined. By setting the rf_on bit in the ‘Chip control
register’ (00), the transmit and receive part are enabled. The initial RF field ramp-up is defined with the Tari1:0 option bits in the ‘Protocol control
register’ (01) (see Table 14). It is also possible to slow down the initial RF field ramp by option bits trfon1:0 in the ‘Modulator control register’ (15)
(see Table 37). The available values are 100µs, 200µs, and 400µs.
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The host system can check whether the field ramp-up is finished via the rf_ok bit in the ‘AGC and internal status register’ (0E) (see Table 27),
which is set high when ramp-up is finished. By setting the rf_on bit low, the field will ramp-down similarly to the ramp-up transient. It is also
possible to enable receiver operation by setting rec_on bit. The agc_on and agl_on bits enables the (Automatic Gain Control) AGC and
(Automatic Gain Leveling) AGL functionality, dac_on enables DA converter, bit direct enables the direct data mode, and stby bit moves chip to
the stand-by power mode.
7.5 Protocol Control
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In the ‘Protocol control register’ (01) (see Table 14), the main protocol parameters are selected (Tari value and RX coding for EPC Gen2
protocol). The Gen2 Protocol is configured by setting Prot bits to low. The dir_mode bit defines type of output signals in case the direct
mode is used. The rx_crc_n bit high defines reception in case the user does not want to check CRC internally. In this case, the CRC is not
checked but is just passed to the FIFO like other data bytes. In the EPC Gen2, this function is useful in case of truncated EPC reply where the
‘CRC’ transponder transmits is not valid CRC calculated over actual transmitted data.
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7.6 Option Registers Preset
After power up (EN low to high transition), the option registers are preset to values that allow default reader operation. Default transmission uses
Tari 25µs, PW length is 0.5Tari, TX one length is 2 Tari, and RTcal is 133µs. Default reception uses FM0 coding with long preamble, link
frequency 160kHz. Default operation is set to internal PLL with internal VCO, differential input mixers, low power output (RFOPX, RFONX), and
DSB-ASK transmit modulation.
7.7 Transmitter
Transmitter section comprises of protocol processing digital part, shaping, modulator and amplifier circuitry. The RF carrier is modulated with the
transmit data and amplified for transmission.
7.7.1
Normal Mode
In normal mode, all signal processing (protocol coding, adding preamble or frame-sync and CRC, signal shaping, and modulation) is done
internally.
The external system (MCU) triggers the transmission and loads the transmit data into the FIFO register. The transmission is started by sending
the transmit command followed by information on the number of bytes that should be transmitted and the data. The number of bytes needs to be
written in the ‘TX length’ registers and the data to the FIFO register. Both can be done by a single continuous write. The transmission actually
starts when the first data byte is written into the FIFO.
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The second possibility is to start transmission with one of the direct Gen2 commands (Query, QueryRep, QueryAdjust, ACK, NAK, ReqRN). In
this case, the transmission is started after receiving the command.
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In case the transmission data length is longer than the size of the FIFO, the host system (MCU) should initially fill the FIFO register with up to 24
bytes. The reader chip starts transmission and sends an interrupt request when only 3 bytes are left in the FIFO. When interrupt is received, the
host system needs to read the ‘IRQ status register’ (0C) (see Table 25). By reading this register, the host system is notified by the cause of the
interrupt and the same reading also clears the interrupt. In case the cause of the interrupt is low FIFO level and the host system did not put all
data to the FIFO, the remaining data needs to be sent to FIFO, again according to the available FIFO size. In case all transmission data was
already sent to the FIFO, the host system waits until the transmission runs out. At the end of the transmit operation, the external system is
notified by another interrupt request with a flag in the IRQ register that signals the end of transmission.
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The two ‘TX length’ registers support in-complete bytes transmission. The high two nibbles in register 1D and the nibble composed of bits B4 ~
B7 in ‘TX length byte 2’ (1E) register (see Table 46) store the number of complete bytes that should be transmitted. Bit B0 (in register 1E) is a flag
that signals the presence of additional bits that do not form a complete byte. The number of bits are stored in bits B1~B3 of the same register
(1E).
The protocol selection is done by the ‘Protocol control register’ (01) (see Table 14). As defined by selected protocol, the reader automatically
adds all the special signals like Preamble, Frame-Sync, and CRC bytes. The data is then coded to the modulation pulse level and sent to the
modulator. This means that the external system only has to load the FIFO with data and all the micro-coding is done automatically.
The EPC Gen 2 protocol allows some adjustment in transmission parameters. The reader IC supports three Tari values (25µs, 12.5µs, 6.25µs)
by changing Tari option bits in the ‘Protocol control register’ (01). PW length and length of the logical one in the transmission protocol can
be adjusted by TxPW and TxOne option bits in the ‘TX options’ (02) register. Session that should be used in direct commands is
defined in the S1and S0 bits in the same register. The back scatter link frequency is defined by TRcal in the Query command transmission. The
TRcal is defined by option bits TRcal in the ‘TRcal registers’ (04, 05).
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Table 6. Register Bits Settings
Protocol Setting
Register Bits
Individual Settings
TARI
Protocol
control
6.25µs (00)
PW length
control
TX option
0.27TARI (00) 0.35TARI(01)
0.44TARI(10)
0.5TARI(11)
Data1 Tx
TX option
1.5TARI(00)
1.66TARI(01)
1.83TARI(10)
2TARI(11)
Coding
Protocol
control
FMO(00)
M2(01)
M4(10)
M8(11)
Link frequency
RX option
40 kHz
(0000)
25µs
256 kHz
(1001)
320 kHz
(1100)
640 kHz
(1111)
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160 kHz
(0110)
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12.5µs (01)
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The software designer needs to take care that actual TRcal (reg. 04, 05) and RxLF (reg. 03) bits and DR bit in the transmission of the
Query command are matched. Precise description is in the EPC Gen2 or ISO18000-6C protocol description.
The Transmit section contains a timer. The timer is used to issue a command in a specified time window after a transponder’s response. The
timer’s time is defined in ‘TX reply in slot’ (06) register. The timer is enabled by using the command ‘Delayed transmission without CRC’ (92) or
‘Delayed transmission with CRC’ (93) and is actually started at the end of the reception.
Forward Link
Table 7. EPC_gen2 - Tari Combinations
TARI Settings
12.5µs
2.5
3
6.25µs
2.5
3
2.6667
2.2222
2.1333
1.7778
2.5
3
2.1333
1.7778
Zero and one length (RT CAL)
Division
Ratio
TR cal
(microseconds)
40
8
200.00
3.2
2.6667
64/3
133.33
2.1333
1.7778
64/3
83.33
1.3333
1.1111
64/3
66.67
256
320
640
64/3
33.33
8
200.00
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LF
(kHz)
160
160
8
50.00
256
8
31.25
2
1.6667
1.6
1.3333
2.1333
1.7778
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Backscatter Link
25µs
1.6
8
25.00
640
8
12.50
40
64/3
533.33
160
64/3
133.33
2.1333
1.7778
256
64/3
83.33
1.3333
1.1111
320
64/3
66.67
640
64/3
33.33
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1.3333
2.6667
2.2222
2.1333
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Datasheet - D e t a i l e d D e s c r i p t i o n
7.7.2
Direct Mode
Direct mode is applied if the user wants to use analog functions only and bypass the protocol handling supported in the reader IC.
Direct Mode Using Parallel Interface. The reader IC enters the direct mode when option bit ‘direct’ is set to high in the ‘Chip status control
register’ (00). As the direct mode starts immediately, all the register settings that help to configure the operation of the chip needs to be done
prior to entering the direct mode. The ‘write’ command for direct mode should not be terminated by stop condition since the stop condition
terminates the direct mode. This is necessary as direct mode uses four IO pins (IO2, IO3, IO5, IO6) and normal parallel or serial communication
is not possible in direct mode. To terminate the direct mode, the user needs to send the stop condition. After stop condition, normal
communication via. interface and access to the registers are possible.
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Direct Mode Using Serial Interface (SPI). To enter direct mode via SPI, bit direct should be set to high in the ‘Chip status control register’
For more information on transmit modulation input signal possibilities, refer to Modulator on page 16.
For more information on the receive output signal possibilities, refer to TX Pre-Distortion on page 17.
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(00) and stop condition (IO4 L-to-H transition) has to be sent. As the direct mode starts immediately, all the register settings that help to configure
the operation of the chip needs to be done prior to entering the direct mode. The direct mode persists till writing bit direct to low (IO4 H-to-L, SPI
write to reg00). Since the direct mode uses four IO pins (IO2, IO3, IO5, IO6), it is not possible to read registers during the direct mode (IO6 which
is MISO in SPI mode is used as direct mode data or subcarrier output). It is possible to write register 00 to terminate the direct mode. After direct
mode termination, normal communication via SPI interface and access to the registers are possible.
1.
2.
3.
4.
5.
6.
7.7.3
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The digital modulation input in direct mode is IO3. RF field is set to high level if IO3 is high, and to low level if IO3 is low. IO2 is used as RX
enable. For correct operation, follow the instructions given below:
Configuration registers should be defined, starting from reg01
Direct command Enable RX (97) should be sent
Bit direct should be written to reg00
IO2 should be low during data transmission via IO3
IO2 should be changed to high level just before the reception is expected
IO3 should be maintained high during reception
Modulator
For the modulation signal source, there are three possibilities:
Normal data mode – Internally coded and internally shaped.
Externally coded and internally shaped modulation enabled by entering direct mode. For more information on entering and terminating the
direct mode, refer to Direct Mode on page 16.
Externally coded and externally shaped modulation is enabled by setting option bit e_amod in the ‘Modulator control register’ (15) and
entering direct mode. For more information on entering and terminating the direct mode, refer to Direct Mode on page 16. In this case, ADC
and DAC pins are differential modulator input. The DC level should be 2.2V, amplitude 600mVp. It is also possible to use CD1 and CD2 pins
as high and low reference for the external modulation shape circuitry.
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The internal modulator is capable of DSB-ASK and PR-ASK modulation. Modulation shape is controlled with a double D/A converter. The first
one defines the upper (un-modulated) signal level while the second one generates the modulation transient. The level defined by the first
converter is filtered by capacitors on CD1 and CD2 pins to decrease the noise level. The two levels are used as a reference for the shaping
circuitry that transforms the digital modulation signal to shaped analog modulation signal. Sinusoidal and linear shapes are available. The output
of the shaping circuit is interpolated and connected to the modulator input.
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The output level and modulation shape properties are controlled by the ‘Modulator control register’ (15). The level of the output signal is adjusted
by option bits tx_lev. Modulation depth for ASK is adjusted by mod_dep bits. Valid values for DSB-ASK are 01 to 3F. PR-ASK
modulation is selected by pr-ask bit high. In case of PR-ASK, the mod_dep bits are used to adjust the delimiter/first zero timing. Linear
modulation shape is selected by lin_mod bit. The rate of the modulation transient is automatically adjusted to selected Tari and can be adjusted
by ask_rate bits. For smoother transition of the modulation signal, an additional low pass filter can be used. The Filter will be enabled by
e_lpf bit. The adjustment step is 1.6%, 3F gives 100% ASK modulation depth.
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PR-ASK modulation is selected by pr-ask bit high. In case of PR-ASK the mod_dep bits are used to adjust the delimiter/first zero timing in
a range 9.6µs to 15.9µs. Linear modulation shape is selected by lin_mod bit. The rate of the modulation transient is automatically adjusted to
selected Tari and can be adjusted by ask_rate bits. For smoother transition of the modulation signal, additional low pas filter can be used
by e_lpf bit.
In ASK modulation it is possible to adjust delimiter length by setting option bit ook_ask in the ‘Modulator control register’ (15). In this case,
ook_ask defines 100% ask modulation and the mod_dep bits are used for delimiter length setting similar to the PR-ASK mode.
Bits aux_mod and main_mod define whether the modulation signal will be connected to the auxiliary low power output or to the main PA output.
In case one of the outputs are enabled by the etxp bits and appropriate aux_mod or main_mod bit is low, the output is enabled but not
modulated.
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7.7.4
Amplifier
The following two outputs are available:
Low power high linear output (~0dBm) can be used for driving an external amplifier. This output uses RFOPX and RFONX pins and it has
nominal output impedance of 50Ω. It needs an external RF choke and de-coupling capacitor for operation. It is also possible to use differential output for driving balanced loads. The output is enabled by etx bits in the ‘Regulator an IO control’ (0B) register (see Table 24).
With the help of these bits, it is also possible to adjust current capability of the output.
7.7.5
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Higher output power output (~20dBm) can be used for antenna driving in case of short range applications. Internal higher power amplifier
is enabled by etx bits in the ‘Regulator an IO control’ (0B) register (see Table 24). For operation it needs external RF choke and correct impedance matching for operation in 50Ω system. It is also possible to use differential output by setting etx. Bias current in the PA
stage can be increased by a factor of two or four using option bits ai2x and ai4x in registers 16 and 17. The differential outputs are
RFOUT_1 and RFOUT_2. Single ended output is RFOUT_1. UHF - power amplifiers (PAs) are generally sensitive to parasitics (layout,
placement, routing, PCB material etc) and load conditions. We recommend to carefully investigate the specific system implementation on
inherent parasitic and load variations to avoid instabilities over production.
TX Pre-Distortion
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Transmission signal is modulated with the cosine shaped representation of the digital modulation signal. It is possible to tune the initial shape by
writing the correction data in the register 13 and setting option bit use_corr in register 15. Register 13 is 252 bytes deep register accessible in
continuous write mode. Bytes on positions 1 to 251 are used for pre-distortion. Byte on position 0 is not used for pre-distortion. The value on
position 1 should be set to 0 and the value on position 251 should be set to 250 for smooth continuous transition. The values between positions
1 and 251 form the pre-distortion curve. In case the ramp with values 0-250 is written, the initial cosine shape is maintained.
The pre-distortion data can be written and read during use_corr=0 period.
7.8 Receiver
Receiver section comprises two input mixers followed by gain and filtering stages. The two receiving signals are fed to decision circuitry, bit
decoder and framer where preamble is removed and CRC is checked. The clean framed data is accessible to the host system (MCU) via. 24
byte FIFO.
7.8.1
Input Mixer
The two input mixer pairs are driven with 90º shifted LO signals and form IQ demodulator circuit. Using IQ architecture, the amplitude modulated
input signals are demodulated in the in-phase channel (I) while the phase modulated input signals are demodulated in the quadrature phase (Q)
channel. Mixed input modulation is demodulated in both receiving channels. This configuration allows reliable operation regardless the
transponders. Modulation presents amplitude or phase modulation at receiver’s input and suppresses communication holes that are caused by
modulation alternation.
One can use differential input mixer or single ended input mixer. The differential input is formed by pins MIX_INP and MIX_INN. Input should be
AC coupled. By default, differential mixers input is chosen. If the inputs are not used, then they should be unconnected.
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The mixer with single ended mixers input is selected by s_mix bit in the ‘Rx special setting register’ (0A). The single ended mixers input is the
MIXS_IN pin. Input should be AC coupled. If the input is not used, then it should be unconnected.
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To optimize the receiver’s noise level and dynamic input range, the mixers have adjustable input range. Depending on expected level of the
reflected power the one can adapt mixer performance by internal attenuator or increasing mixer gain. Depending on the reflectivity of the
environment or antenna, the receiver’s input RF voltage can increase to a level that corrupts mixer operation. In such a case, the input range can
be widened by internal input attenuator by setting option bit ir. This is valid for both differential and single ended input mixer.
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In case of low reflected power, the host system can increase the differential input mixer’s conversion gain and improve the overall sensitivity of
the receiver by setting option bit ir. The drawback of this setting is decreased mixer’s input dynamic range. The single ended input mixer
does not support the gain increase feature. The ir bits are in the ‘RX special setting’ (0A) register.
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In case lower supply voltage is used (low_vext=1, refer to Supply on page 11), the low_vext option bit adapts mixer’s operation point to
decreased supply. The consequence of low supply voltage is up to 1dB decreased performance in terms of sensitivity and input dynamic range.
The ir bits are in the ‘RX special setting2 register’ (0A) (see Table 23).
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7.8.2
DRM RX Filter
The analog filtering is composed of four filter stages:
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4 -order elliptic low-pass with notch characteristic to suppress neighboring channel (500kHz or 600kHz). The filter can be set to have -1dB
point at 360kHz and 280kHz for ETSI and FCC channel spacing in DRM operation. It allows one non-DRM setting: 800kHz upper frequency
for 640kHz LF.
nd
2 -order high-pass Chebyshev filter with adjustable -1dB from 72kHz to 200kHz. The filter can also be switched off (only gain stage) for
lower LF frequencies.
nd
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2 -order low-pass Chebyshev filter with -1dB frequencies at 360kHz and 280kHz for European and US channel spacing in DRM operation.
It allows three non-DRM settings:
- 800kHz upper frequency for 640kHz LF,
- 180kHz upper frequency for 160kHz LF and,
- 72kHz upper frequency for 40kHz LF.
nd
st
2 -order high-pass Chebyshev filter with adjustable -1dB from 72kHz to 200kHz. The filter can also be reconfigured to 1 -order with -3dB
frequency at 5.5kHz or 12kHz for lower LF and FM0 coding.
Filter setting is done via option bits setting in ‘RX Filter register’ 09. Available bit combinations are:
Filter Setting
reg09:00
reg09:07
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640kHz LF– (reg09:00…reg09:07)
-3dB high-pass frequency
-3dB low-pass frequency
Atten. at 40kHz
Atten. at 1.2MHz
220kHz
770kHz
-55dB
-35dB
80kHz
770kHz
-18dB
-35dB
320kHz LF – DRM ETSI range filter (reg09:20…reg09:27)
Filter Setting
-3dB high-pass
frequency
-3dB low-pass
frequency
Atten. at 40kHz
Atten. at 600kHz
Atten. at 1.2MHz
reg09:20
200kHz
380kHz
-50dB
-40dB
-54dB
75kHz
380kHz
-18dB
-40dB
-54dB
reg09:27
250kHz LF – DRM FCC range filter (reg09:30…reg09:37)
Filter Setting
-3dB high-pass
frequency
-3dB low-pass
frequency
Atten. at 40kHz
Atten. at 600kHz
Atten. at 1.2MHz
reg09:30
200kHz
320kHz
-50dB
-45dB
-55dB
75kHz
320kHz
-18dB
-45dB
-55dB
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reg09:37
160kHz – (reg09:3B…reg09:3F)
-3dB high-pass
frequency
-3dB low-pass
frequency
Atten. at 40kHz
Atten. at 600kHz
Atten. at 1.2MHz
reg09:3B
110kHz
245kHz
NA
-52dB
-56dB
56kHz
255kHz
NA
-52dB
-56dB
Filter Setting
-3dB high-pass
frequency
-3dB low-pass
frequency
Atten. at 40kHz
Atten. at 600kHz
Atten. at 1.2MHz
reg09:FF
7kHz
80kHz
NA
-60dB
-55dB
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Filter Setting
reg09:3F
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40kHz LF – (reg09:FF)
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Datasheet - D e t a i l e d D e s c r i p t i o n
Following filter settings for different link frequency and RX coding are proposed:
DRM modes:
Link frequency and RX coding
Proposed reg09 setting
320kHz, M4, M8
24
250kHz, M4, M8
34
40kHz, FM0, M2, M4, M8
FF
160kHz, FM0
BF
160kHz, M2, M4, M8
3F
640kHz, M4, M8
04
RX Filter Calibration
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Proposed reg09 setting
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7.8.3
Link frequency and RX coding
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Other supported modes:
The calibration procedure implemented in the chip helps to compensate the resistor and capacitor process and temperature variations.
Calibration procedure is triggered by ‘Trigger RX filter calibration’ (88) direct command. Calibration is finished in 5ms maximum. Calibration
should be triggered prior to first reception after power down and from time to time, especially in cases wherein significant temperature changes
are expected.
The result of calibration is seen in the ‘AGL/VCO/F_CAL/PilotFreq status register’ (10) in case option bits r10page in ‘Test setting’ register
(12) are set to 2. Typical calibration result values are 88.
The calibrated values can be changed automatically by using ‘Decrease RX filter calibration data’ (89) and ‘Increase RX filter calibration data’
(8A) direct command, together with f_cal_hp_cgh option bit in ‘Test setting’ register (12).
Note: hp_cal affects the high pass part of the filter characteristic and lp_cal affects the low pass part of the filter characteristic,
both in 4% steps.
7.8.4
Fast AC Coupling
The internal (patent pending) feedback AC coupling system prior to start of transmit modulation stores the DC operating points, and after data
transmission progressively adjusts the high pass time constant to allow very fast settling time prior to beginning of reception. Such a system is
needed to accommodate the short TX to RX time used at the highest bit rates in the EPC Gen 2 protocol.
It is possible to additionally speed up the first AC coupling time constant by setting option bit lf4_ac_su in the ‘Test register’ (12).
7.8.5
RX Gain
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Gain in the receiving chain can be adjusted to optimize the signal to noise and interference ratio. There are three ways of adjusting: manual
adjustment, AGC, and AGL.
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Manual Adjustment is gain adjustable by setting option bits gain in the ‘RX special setting 2 register’ (0A) (see Table 23) and ‘TRcal
high and misc register’ (05) (see Table 18). The low three bits decrease digitizer hysteresis by 3dB (7 steps), the high two bits change the
amplifier gain by 3dB (3 steps). Gain direction (increase or decrease) is defined by gd.
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AGC is automatic gain control. It can be enabled by option bit agc_on in the ‘Chip status control’ register (00) (see Table 13). AGC comprises of a system that decreases gain during the first periods of the incoming preamble. Gain is decreased equally for both channels to a
level that results the stronger signal is just in the range. In this case, the ratio between I and Q channel amplitude is maintained. The
resulted status of the AGC can be seen in the ‘AGC and internal status’ register (0E) (see Table 27).
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AGL is another possibility for adjusting the gain. AGL bit needs to be set high at the moment when there is no actual transponder response
at receiver input. It automatically decreases gain for each channel to the level that is just below the noise and interference level. The gain of
the two channels is independent. The resulted status of the AGL for both channels can be seen in the ‘AGL status ‘register (10) (see Table
29).
Difference between the AGC and AGL functionality is that AGC is done each time at beginning of the receive telegram; while AGL is done only at
the moment when agl_on bit is set high, stored, and is valid till the agl_on bit is set low.
The two receiving signals are digitized and evaluated. The decision circuit selects the in-phase signal or quadrature signal for further processing,
whichever presents the better received signal. Which of the signals is chosen can be seen in the in_select bit in the ‘AGC and internal status’
register (0E). Bit is valid from preamble end till start of the next transmission.
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7.8.6
Received Signal Strength Indicator (RSSI)
The receiver section includes a double RSSI meter. The RSSI meters are connected to the outputs of both receiver chains to measure in real
time the peak to peak demodulated voltage of each receiving channel during the reception of each transponder response (from the end of RX
wait timer till the end of reception). The peak value of each RSSI meter is stored and presented in the ‘RSSI levels’ (0F) register (see Table 28).
The RSSI register is valid till start of next transmission.
7.8.7
Reflected RF Level Indicator
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The receiver also comprises the input RF level indicator. It is used for diagnostic of circuitry or environment difficulties.
The reflection of poor antenna, reflection of reflective antenna’s environment, or directional device leakage (circulator) can cause that input
mixers are overdriven with the transmitting signal.
Normal Mode
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7.8.8
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Overloading of the input mixers by reflected transmitting carrier can be notified by the host system (MCU) by measuring the RF input level via
internal AD converter. The reflected carrier that is seen on the two mixers input is down converted to zero frequency. The two DC levels on the
mixers outputs are proportional to the input RF level and dependant on the input phase and can be used for measuring the level of the reflected
carrier. They can be connected to the on-board ADC converter by setting option bits msel in the ‘Test setting and measurement selection
register’ (11). The appropriate settings for connecting two mixers’ DC levels to AD converter are 001 and 002. Conversion is started by direct
command ‘Trigger ADC conversion’ (87). Result in register 19 is valid 20µs after triggering.
In the normal mode, the digitized output after decision circuit is connected to the input of the digital portion of the receiver. This input signal is the
sub-carrier coded signal, which is a digital representation of modulation signal on the RF carrier.
The digital part of the receiver consists of two sections, which partly overlap. The first section comprises the bit decoders for the various
protocols. The bit decoders convert the sub-carrier coded signal to a bit stream and the data’s clock according to the protocol defined by option
bits Rx-cod in the ‘Protocol control’ (01) register (see Table 14) and Rx_LF option bits in the ‘RX options’ (03) register. Preamble is
truncated. The decoder logic is designed for maximum error tolerance. This enables the decoders to successfully decode even partly corrupted
sub-carrier signals due to noise or interference. The receiver also supports transfer of incomplete bytes. The number of valid bits in the last
received byte is reported by Bb bits in the ‘TX length byte 2’ (1E) register (see Table 46).
The second section comprises the framing logic for the protocols supported by the bit decoder section. In the framing section, the serial bit
stream data is formatted in bytes. The preamble, FrameSync, and CRC bytes are checked and removed. The result is ‘clean’ data, which is sent
to the 24-byte FIFO register where it can be read out by the host system (MCU).
In the EPC Gen2 protocol, the decoder supports long RX preamble (TRext=1) for FM0, and all Miller coded signals and short RX preamble
(Trext=0) for Miller4 and Miller8 coded signals. In the EPC Gen2 protocol, the timing between transponders response and the subsequent
reader’s command is quite short. To relieve the host system (MCU) of reading RN16 (or handle) out of the FIFO and then writing it back into the
FIFO, there is a special register for storing last received RN16 during the Query, QueryRep, QueryAdjust or RegRN commands. The last stored
RN16 is automatically used in ACK command.
The start of the receive operation (successfully received preamble) sets the flags in the ‘IRQ and status’ register. The end of the receive
operation is signalled to the host system (MCU) by sending an interrupt request (pin IRQ). If the receive data packet is longer than 8 bytes, an
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interrupt is sent to the MCU when the 18 byte is received to signal that the data should be removed from the FIFO.
In case an error in data format or in CRC is detected, the external system is made aware of the error by an interrupt request pulse. The nature of
the interrupt request pulse is available in the ‘IRQ and status register’ (0C) (see Table 25).
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The receive part comprises two timers.
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The RX wait time timer setting is controlled by the value in the ‘RX wait time’ (08) (see Table 21). This timer defines the time after the end
of transmit operation in which the receive decoders are not active (held in reset state). This prevents any incorrect detection that could be
caused as a result of transients that are caused by transmit operation or transients that are caused by noise or interference. The value of
the ‘RX wait time register’ defines this time with increments of 6.4µs. This register is preset at every write to the ‘Protocol control’ register
(01) according to the minimum tag response time defined by default register definition.
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The RX no response timer setting is controlled by the ‘RX no response wait time’ (07) (see Table 20). This timer measures the time from
the start of slot in the anti-collision sequence until the start of tag response. If there is no tag response in the defined time, an interrupt
request is sent and a flag is set in ‘IRQ status control’ register. This enables the external controller to be aware of empty slots. The wait time
is stored in the register with increments of 25.6µs. This register is automatically preset for every new protocol selection.
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‘RX length register’ (1A, 1B) defines the number of bits that the receiver should receive. The number of bits is taken into account only in case the
value is different than 0 00, otherwise receiver stops on pause at the end of reception. Since in noisy environment, the end of transponders
transmission is not precisely defined using the RX length registers improves the probability for successful receiving. For direct commands 98 to
9C, the RX length is internally set to 16 to receive RN16. For direct command 9F, the RX length is internally set to 32 to receive RN16 and CRC.
For other commands when the host system knows the expected RX length, it is recommended to write it in the RX length register. The only case
when RX length is not known in advance is reception of the PC+EPC.
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AS3992 handles the issue mentioned above by using special RX mode. The idea is that reader chip generates an additional interrupt after two
bytes (PC part of the PC+EPC field) are received. MCU reads out the two bytes that define the length of the on going telegram and writes it in the
RX length register.
To use IRQ after the two received bytes, the fifo_dir_irq2 bit in the reg1A should be set and non-zero length (typical PC+EPC length) should be
written in the 1B register before start of reception. The fifo_dir_irq2 performs the following changes in the behavior of the logic:
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All received bytes are directly transferred to FIFO.
Normally the receiving data is pipelined, causing that the two CRC bytes are not seen in the FIFO. If dir_fifo=1, then all bytes including CRC
are seen in the FIFO.
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Additional interrupt is generated after two bytes are received. In the IRQ status register, the ‘header/2byte’ (B3) bit is set. If the reception is
still in progress, IRQ status value is 48.
At this moment, the MCU needs to read out the first two bytes (PC part of the PC+EPC field) and set RX length accordingly. The
fifo_dir_irq2 bit should be maintained high.
At the end of reception, another IRQ is generated. Additional IRQ status bit ‘Irq_err3 – preamble/end’ (B1) is set. IRQ status is 42 if the intermediate 2nd_byte interrupt was read out and cleared, or 4A if the reception was over before the intermediate interrupt was read out and
cleared.
7.8.9
Direct Mode
The direct mode is applied in case the user wants to use analog functions only and bypass the protocol handling supported in the reader IC.
(Refer to Transmitter on page 14 for information on entering direct mode.)
Regarding receiving tag data in direct data mode, there are three possibilities depending on setting of option bits:
Internally decoded bit stream and bit clock according to the protocol defined by option bits Rx-cod in the ‘Protocol control’ (01) register
and Rx_LF option bits in the ‘RX options’ (03) register is enabled by low level of option bit dir_mode in the ‘Protocol control’ (01) register. Outputs are IO5 and IO6.
Digitized sub-carrier signals of both receiving channels are enabled by high level of option bit dir_mode in the ‘Protocol control’ (01) register.
Outputs are IO5 and IO6.
Analog sub-carrier signals of both receiving channels are enabled by high level of option bit e_anasupc in the ‘CLSYS, analog out, and CP
control’ (14) register. Outputs are OAD and OAD2.
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In case MCU support mode is used, the OAD2 resistor to ground (the one that is needed for entering this mode) can be removed during
reception not to load the analog OAD2 output. Resistor is necessary only during EN=L, EN L-to-H transition and EN H-to-L transition. It is not
necessary during reception.
7.8.10 Normal Mode With Mixer DC Level Output and Enable RX Output Available
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One of the possibilities for achieving low reflected TX power is active tuning of the antenna or the directivity device. For correct tuning, the data
on the amplitude and phase of the incoming reflected power is available in the output DC level of the two mixers. The two voltages are available
on the OAD and OAD2 inputs. For correct operation, the tuning circuitry needs to know when receiver is enabled and the two mixer output DC
levels are correct. This signal is available on ADC in case ‘Test setting’ low register (12l) is set to 1A, or on DAC pin in case ‘Test setting’ low
register (12l) is set to 1B. Tuning can be done on CW and also during telegram reception. In the first case, the receiver is enabled by ‘Enable RX’
direct command. In the second case, the receiver is automatically enabled after data transmission.
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7.9 ADC / DAC
ADC
MCU
Power
detector
Interface
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Figure 4. ADC / DAC Section
AS3992
7.9.1
DA Converter
DA converter intends to support the TX power control function in cases that the external PA supports this function (typically named ramp input or
gain control input). The output level is stored in the DAC control register (18) (see Table 40) and the output pin is DAC. Output range is 0V to two
times AGD voltage (3.2V). Input code 00 gives output level equal to AGD. The 7 LSB gives absolute output level and the MSB Bit is the sign. DA
converter is enabled by dac_on bit in the ‘Chip status control’ register (00). Output resistance on DAC pin is 1kΩ typically. For applications that
require current, a voltage follower needs to be included.
7.9.2
AD Converter
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AD converter intends to support the external power detector placed before or after the circulator to measure actual output power. The analog
voltage from the power detector is connected to the ADC pin. AD conversion is triggered by the ‘Trigger AD conversion’ (87) command, and the
resulted value is available in the ‘ADC readout register’ (19) (see Table 41). AD converter can also be used for measuring the mixers DC output
levels. The source for the conversion is selected by msel bits in the ‘Test setting 1 and measurement selection’ register (11) (see Table 33).
Input range is 0V to two times AGD voltage (3.2V). Input level equal to AGD gives output code 00. The 7 LSB bits give absolute output level, the
MSB bit is a sign, H means positive, L means negative value. Result is valid 20µs after triggering. AD converter can be used to measure VEXT
voltage, and according to the result, the MCU can decide to use adaptation to low supply voltage (low_vext=1 and ir=1 option bits) or inform
the superior system that supply needs to be fixed or just disable transmission. The value in ‘ADC readout register’ (19) is calculated accordingly
to the equation:
ADCreg = [(VEXT-1.6)*0.8-1.6] / 0.0126
(EQ 1)
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Where:
ADCreg is the value, sign should be considered as above
VEXT is in volts
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7.10 Reference Oscillator
Reference frequency of 20MHz is needed for the chip. It is possible to use quartz crystal or external reference source (TCXO). In case the crystal
is used it should be connected between OSCI and OSCO pin with appropriate load capacitors between each oscillating pin and ground. Load
capacitance 15-20pF is proposed. Maximum series resistance in resonance is 30Ω. In case external reference source is used, it should be
connected to OSCO pin. The signal should be sinusoidal shape, 1Vpp, DC level 1.6V or AC coupled.
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8 Application Information
Figure 5. Application Example
LAN
Interface
device
microcontroller
8 I/O IRQ
CLK
CLSYS
VCC
Tx
Optional
PA
Rx
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UHF Reader AS3992
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Display
Optional VCO
8.1 Configuration Registers Address Space
At power up, the configuration registers are preset to a value that allows default operation. The preset values are given after each register
description table.
Table 8. Main Control Registers
Adr (hex)
00
01
Register
Length
Chip status control
R/W
1
Protocol control
R/W
1
Adr (hex)
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Table 9. Protocol Sub-setting Registers
Register
Length
TX options Gen2
R/W
1
RX options Gen2
R/W
1
04
TRcal L register Gen2
R/W
1
05
TRcal H and misc
R/W
1
06
TX reply in slot
R/W
1
07
RX no response wait
R/W
1
08
RX wait time
R/W
1
09
RX filter
R/W
1
0A
RX special setting2
R/W
1
0B
Regulator and IO control
R/W
1
13
TX pre-distortion (deep register)
R/W
14
CL_SYS, analog out, and CP
R/W
3
15
Modulator control (3 bytes deep)
R/W
3
02
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Table 9. Protocol Sub-setting Registers
Adr (hex)
Register
Length
PLL main (3 bytes deep)
R/W
3
17
PLL auxiliary (3 bytes deep)
R/W
3
18
DAC register
R/W
1
19
ADC register
R
1
Table 10. Status Registers
Register
Length
0C
IRQ and status
0D
Interrupt mask register
0E
AGC and internal status register
R
0F
RSSI levels
R
10
AGL / VCO / F_CAL / PilotFreq status register
R
Adr (hex)
11
12
Table 12. FIFO Registers
Adr (hex)
1A
1B
1C
1D
1E
1
1
1
1
Register
Length
Measurement selection
R/W
1
Test setting
R/W
1
Register
Length
RX length
R/W
1
RX length
R/W
1
FIFO status
R
1
TX length byte1
R/W
1
TX length byte2
R for RX
W for TX
1
FIFO I/O register
R/W
1
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1F
R/W
1
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Table 11. Test Registers
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Adr (hex)
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.2 Main Configuration Registers
Chip Status Control (00) – Controls of the operation mode
Table 13. Chip Status Control (00)
1
Signal Name
Comments
B7
stby
Stand-by power mode
0: normal mode
1: stby power mode
B6
direct
Direct data mode
External modulation control for transmission and IQ or
bit stream output for reception
B5
dac_on
DA converter enable
0: DAC off
1: DAC on
B3
agl_on
AGL mode enable
0: AGL off
1: AGL on
B2
agc_on
AGC select
0: AGC off
1: AGC on
rec_on
Receiver enable
Receiver is enabled
TX and RX enable
TX RF field and receiver are enabled
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Bit
B1
B0
rf_on
1. Reset to 00 at EN=L or POR=H
Protocol Control (01) – Controls the RFID protocol selection, operation of Tari10 bits is defined with Prot10 bits.
Table 14. Protocol Control (01)
1
Bit
Signal Name
B7
rx_crc_n
Receiving without CRC
0: RX CRC (generate interrupt)
1: No RX CRC (interrupt and no CRC truncation)
dir_mode
Direct mode type
0: Output is bit stream and clock from the selected
decoder
1: Output is sub-carrier data.
Protocol selection
00: EPC Gen2 / ISO18000-6C: Tari 6.26/12.5/25us,
FM0, M2, M4, M8
01:
10: ISO18000-6A/B:, A/B FM0 decoder in direct mode
B6
B5
Prot1
Prot0
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B4
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B1
RX_cod0
B0
RX decoding select (Gen2)
Tari (Gen2)
00: Tari=6.25µs (Gen2, ISO-C)
01: Tari=12.5µs (Gen2, ISO-C)
10: Tari=25µs (Gen2, ISO-C)
Tari1
Tari0
Comments
00: FM0
01: Miller 2
10: Miller 4
11: Miller 8
RX_cod1
ni
B3
B2
Function
Te
1. Preset to 06 (Gen2, Miller2, Tari=25µs) at EN=L or POR=H
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.3 Control Registers - Low Level Configuration Registers
TX Options (02) – Gen2
1
B7
TxPw1
B6
TxPw0
B5
TxOne1
B4
TxOne0
B3
Tx-CRC
B2
Force_TRcal
B1
S1
B0
Function
Comments
PW length control
00: 0.27Tari
01: 0.35Tari
10: 0.44Tari
11: 0.50Tari
TX one length control
00: 1.50Tari
01: 1.66Tari
10: 1.83Tari
11: 2.00Tari
TX CRC type
0: CRC-16
1: CRC-5
al
id
Signal Name
TRcal period in normal transmission
Normally TRcal is automatically transmitted when
Query (98) direct command is issued, according to
EPC Gen2 and ISO18000-6C.
In case Force_TRcal=1 the TRcal period is
transmitted also in normal data transmission (direct
commands 90, 91)
Session bits
Used for Gen 2 direct commands
am
lc s
on A
te G
nt
st
il
Bit
lv
Table 15. TX Options (02)
S0
1. Preset at POR=H or EN=L
Gen2: F0 (TxPW=0.5 Tari, TxOne=2 Tari)
RX Options (03) - Gen 2
Table 16. RX Options (03)
1
Bit
Signal Name
B7
Rx_LF3
Rx_LF2
B5
Rx_LF1
B4
ni
pil_meas_sh
ch
B2
Link frequency selection
Shorter pilot measurement
Shorten pilot measurement interval to 1/2, 1/4, 1/8.
Available intervals are 80, 40, 20, 10, 5 LF periods.
RX preamble length
0: Short preamble
1: Long preamble
Short preamble is supported for Miller 4 and Miller 8
coding.
don’t care
Set to 0
Rx_LF0
B3
B1
TRext
Te
B0
Comments
0000: 40kHz
0110: 160kHz
1001: 256kHz
1100: 320kHz
1111: 640kHz
ca
B6
Function
1. Preset at POR=H or EN=L
Gen2: 60 (160kHz)
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
TRcal Low Register (04) – Gen2
1
Signal Name
B7
TRcal7
B6
TRcal6
B5
TRcal5
B4
TRcal4
B3
TRcal3
B2
TRcal2
B1
TRcal1
B0
TRcal0
Function
Comments
Gen2: 17.2µs…225µs
al
id
Bit
TRcal range 0.1µs…409µs (1…4096 steps)
step size 0.1µs worst case relative resolution (0.1µs/
17.2µs=0.6%)
am
lc s
on A
te G
nt
st
il
1. Preset at POR=H or EN=L
Gen2: 35 (1333 steps: 133.3µs, DR=64/3(bit DR=1) => LF=160µs)
lv
Table 17. TRcal Low Register (04)
TRcal High and Miscellaneous Register (05) – Gen 2
Table 18. TRcal High and Miscellaneous Register (05)
1
Bit
Signal Name
B7
gain
RX gain direction
0: Decrease
1: Increase gain by option bits gain in reg0A
vext_low
Decrease VDD_MIX
0: 4.8V
1: 3.7V, also differential mixer adaptation to low
supply
Supports low peripheral
communication voltage
When high decreases output resistance of logic
outputs. Should be set high when VDD_IO voltage is
below 2.7V.
Open drain N-MOS outputs
Valid for CLSYS, OAD, OAD2 pins
B6
B5
vdd_io_low
B4
open_dr
B3
Function
Comments
TRcal11
B2
TRcal10
(see Table 17 on page 27)
TRcal9
ca
B1
B0
TRcal8
Te
ch
ni
1. Preset at POR=H or EN=L
Gen2: 05
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Delayed Transmission Wait Time (06)
Bit
Signal Name
B7
Txdel7
B6
Txdel6
B5
Txdel5
B4
Txdel4
B3
Txdel3
B2
Txdel2
B1
Txdel1
B0
Txdel0
1
Function
Delayed transmission wait time
Comments
TX reply range 6.4µs to 1632µs (1…255), Start at end of
RX.
00: Delayed transmission is disabled.
al
id
Table 19. Delayed Transmission Wait Time (06)
lv
Gen2: T2=4.68µs…500µs after end of RX,
Select T4>31.2…150µs after end of TX
am
lc s
on A
te G
nt
st
il
1. Preset at POR=H or EN=L
Gen2: 00
RX No Response Wait Time (07) – Defines the time when ‘No Response’ interrupt is sent.
Table 20. RX No Response Wait Time (07)
1
Bit
Signal Name
B7
NoResp7
B6
Function
Defines the time when ‘no response’ interrupt is sent. It
starts from the end of TX.
NoResp6
B5
NoResp5
B4
NoResp4
B3
NoResp3
B2
No response wait time
RX no response wait range is 25.6µs to 6528µs (1…255),
Step size 25.6µs
Interrupt is sent in case the time runs out before 6-10
periods of link frequency is detected.
NoResp2
B1
Comments
NoResp1
B0
Gen2: T1max=23.6µs…262µs
NoResp0
ca
1. Preset at POR=H or EN=L
Gen2: 07 (179.2µs > 54.25µs…84.5µs + 10 periods – LF:160kHz)
RX Wait Time (08) – Defines the time after TX when the RX input is disregarded.
Bit
Signal Name
ch
B7
1
ni
Table 21. RX Wait Time (08)
Rxw7
B6
Rxw6
B5
Rxw5
B4
Rxw4
B3
Rxw3
B2
Rxw2
B1
Rxw1
B0
Rxw0
Te
Function
Comments
Defines the time during which the RX input is ignored. It
starts from the end of TX.
RX wait time
RX wait range is 6.4µs to 1632µs (1…255),
Step size 6.4µs,
00: receiver enabled immediately after TX.
ISO 1800-6C(Gen2)
Gen2: T1min=11.28µs…262us,
ISO 1800 - 6A: 150…1150µs
ISO 1800 - 6B: 85…460µs
1. Preset at POR=H or EN=L
Gen2: 07(44.8µs < 54.25µs…84.5µs – LF:160kHz)
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RX Filter (09)
1
Bit
Signal Name
B7
byp160
Bypass for 160kHz LF
B6
byp40
Bypass for 40kHz LF
B5
lp3
B4
lp2
B3
lp1
B2
hp3
B1
hp2
B0
hp1
RX Special Setting2 (0A)
Table 23. RX Special Setting2 (0A)
Signal Name
B7
gain
lv
High pass setting
Function
Comments
RX gain setting
Gain change, 3 steps by 3dB, Increase/decrease
defined by gain option bit in reg05
Digitizer hysteresis setting
Hysteresis increase, 7 steps by 3dB
s_mix
Mixer input selection
0: differential input mixer
1: single ended input mixer
ir
Differential mixer gain increase
10dB gain increase
ir
Mixer input attenuation
8dB attenuation using differential mixer,
5dB attenuation using single ended input mixer
gain
B5
see DRM RX Filter on page 18
1
Bit
B6
Low pass setting
Comments
am
lc s
on A
te G
nt
st
il
1. Preset at POR=H or EN=L
Gen 2:41
Function
al
id
Table 22. RX Filter (09)
gain
B4
gain
B3
gain
B2
B1
ca
B0
Te
ch
ni
1. Preset to 01 (Max gain, mixer range) at POR=H or EN=L
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Regulator and I/O Control (0B)
Table 24. Regulator and I/O Control (0B)
1
Bit
Signal Name
B7
reg
B6
reg2v
etx
B3
etx
etx
PA2 enable
0: RFOUT1 only
1: differential RFOUT1 and RFOUT2
Enable for main PA and current for
main PA pre-driver
00: disabled
01:7mA
10: 14mA
11: 22mA
00: disabled
01:7mA
10: 14mA
11: 22mA
am
lc s
on A
te G
nt
st
il
B1
00: 2V
01: 2.5V
10: 3V
11: 3.5V
al
id
B4
Internal power amplifier regulator
setting
lv
reg2v
etx
Comments
for VDD_RF current source
B5
B2
Function
B0
Enable for low power output and
current for auxiliary driver low power
output
etx
1. Preset to 02 (Medium driver current) at POR=H or EN=L
8.4 Status Registers
IRQ and status register (0C) displays the cause of IRQ and TX / RX status.
Table 25. IRQ and Status Register (0C)
1
Bit
Signal Name
B7
Irq_tx
IRQ set due to end of TX
Signals the TX is in progress. Interrupt when TX is
finished.
Irg_srx
IRQ set due to RX start
Signals the RX was received and RX is in progress.
Interrupt when RX is finished.
Irq_fifo
Signals the FIFO is 3/4910MHz)
DAC Control Register (18)
Bit
Signal Name
Function
Comments
dac
ch
B7
1
ni
Table 40. DAC Control Register (18)
dac
B5
dac
B4
dac
B3
dac
B2
dac
B1
dac
B0
dac
Te
B6
DAC control value
1. Default: reset to 00 at POR=H and EN=L
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ADC Readout Register (19)
Table 41. ADC Readout Register (19)
B7
adc
B6
adc
B5
adc
B4
adc
B3
adc
B2
adc
B1
adc
B0
adc
Function
Comments
ADC readout
Via ADC the two mixers output DC levels can be
measured showing the reflectivity of the antenna or
the environment. Also DC level on ADC pin can be
measured. The later case can be used for checking
the RF output power via external power detector. The
measurement is selected using msel bits. The
measurement is triggered by the ‘Trigger ADC
conversion’ command (87). Result is valid 20µs after
triggering.
Table 42. RX Length 1 (1A)
1
Bit
am
lc s
on A
te G
nt
st
il
8.7 RX Length Registers
RX Length 1 (1A)
Signal Name
B7
al
id
Signal Name
lv
Bit
rx_crc_n2
Function
Receiving without CRC
Comments
Temporary receiving without CRC. Valid for a single
reception.
All bytes including CRC are transferred to FIFO,
B6
fifo_dir_irq2
B5
B4
B3
B2
B1
Direct FIFO and 2 byte IRQ
rxl
B0
nd
rxl
nd
irq_header is changed to irq_2 byte, irq_err3 is
changed to irq_RX_finished. For PC+EPC reception
RX length
RX Length 2 (1B)
ca
1. Default: reset to 00 at POR=H, EN=L, at the end of reception.
Bit
Signal Name
ch
B7
1
ni
Table 43. RX Length 2 (1B)
Comments
rxl
B6
rxl
B5
rxl
B4
rxl
B3
rxl
B2
rxl
B1
rxl
B0
rxl
Te
Function
RX length
1. Default: reset to 00 at POR=H, EN=L, at the end of reception.
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8.8 FIFO Control Registers
FIFO status – adr 1C hex number of received bytes and FIFO flags.
1
Table 44. FIFO Status- adr 1C hex
Signal Name
Function
Comments
B7
Fhil
High FIFO level
Indicates that 18 bytes are in FIFO already (for RX)
B6
Flol
Low FIFO level
Indicates that only 6 bytes are left in FIFO (for TX)
B5
Fove
FIFO overflow error
Several data is written to FIFO
B4
Fb4
FIFO bytes fb[4]
B3
Fb3
FIFO bytes fb[3]
B2
Fb2
FIFO bytes fb[2]
B1
Fb1
FIFO bytes fb[1]
B0
Fb0
FIFO bytes fb[0]
al
id
Bit
am
lc s
on A
te G
nt
st
il
lv
How many bytes loaded in FIFO were not read out yet
1. Default: reset to 00 at POR=H and EN=L
TX length byte1 – adr 1D hex high 2 nibbles of complete bytes, which will be transferred through FIFO.
1
Table 45. TX Length Byte1 - adr 1D hex
Bit
Signal Name
B7
Txl11
Number of complete byte– bn[11]
Txl10
Number of complete byte– bn[10]
Txl9
Number of complete byte– bn[9]
Txl8
Number of complete byte– bn[8]
Txl7
Number of complete byte– bn[7]
Txl6
Number of complete byte– bn[6]
Txl5
Number of complete byte– bn[5]
Txl4
Number of complete byte– bn[4]
B6
B5
B4
B3
B2
B1
B0
Function
Comments
High nibble of complete bytes to be transmitted or
received.
Middle nibble of complete bytes to be transmitted
or received.
Te
ch
ni
ca
1. Default: reset to 00 at POR=H and EN=L. It is also automatically reset at TX EOF
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TX Length Byte2 – adr 1E hex low nibbles of complete bytes, which will be transferred through FIFO and information if there is broken byte and
how many bits from it should be transferred.
1
Table 46. TX Length Byte2 - adr 1E hex
Function
B7
Txl3
Number of complete byte– bn[3]
B6
Txl2
Number of complete byte– bn[2]
B5
Txl1
Number of complete byte– bn[1]
B4
Txl0
Number of complete byte– bn[0]
B3
Bb2
Broken byte number of bits bb[2]
B2
Bb1
Broken byte number of bits bb[1]
B1
Bb0
Broken byte number of bits bb[0]
B0
Bbf
Broken byte flag
Comments
Low nibble of complete bytes to be transmitted
or received.
al
id
Signal Name
Number of bits in the last (broken) byte to be
transmitted or number of bits that is valid in the
last (broken) received byte. It is taken into
account only when broken byte flag is set.
lv
Bit
am
lc s
on A
te G
nt
st
il
1: indicates that last byte is not complete 8 bit
wide.
1. Default: reset to 00 at pro=H and EN=L
Note: For transmission, the register 1E is write only. The written value is used for the transmission but can not be read out by the micro controller. For reception bits B0 to B4 are read only. The value read out is the number of valid bits in the last received byte. Bits B0 to B4
are updated at the end of the last successful reception. In case the last received byte is not complete, the valid bits are on the LSB side.
FIFO I/O Register – adr 1F hex 24 bytes FIFO register filled and read in cyclical way.
8.9 Direct Commands
Table 47 lists out the direct commands that are supported in the UHF reader IC.
Table 47. Command Codes
Cmd (hex)
1
Command
Idle
84
Hop to main frequency
85
Hop to auxiliary frequency
87
Trigger AD conversion
88
Trigger RX filter calibration
89
Decrease RX filter calibration data
8A
Increase RX filter calibration data
Reset FIFO
Transmission with CRC
ch
90
ni
8F
ca
80
Comments
Transmission with CRC expecting header bit (Gen2 RX)
92
Transmission without CRC
93
Delayed transmission without CRC (not used in EPC Gen2)
94
Delayed transmission with CRC (not used in EPC Gen2)
96
Block RX
97
Enable RX
98
Query (=TX with TX CRC5, no RX CRC)
99
QueryRep (=TX no TX CRC, no RX CRC)
Te
91
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Table 47. Command Codes
Cmd (hex)
1
Command
Comments
QueryAdjustUp (=TX no TX CRC, no RX CRC)
9B
QueryAdjustNic (=TX no TX CRC, no RX CRC)
9C
QueryAdjustDown (=TX no TX CRC, no RX CRC)
9D
ACK (repeat) RN 16
9E
NAK
9F
ReqRN
al
id
9A
8.9.1
lv
1. Value in this column includes the command bit (MSB) high.
Idle (80)
Command
Hop to Main Frequency (84)
am
lc s
on A
te G
nt
st
il
8.9.2
This command forces the PLL to use frequency setting in ‘PLL A/B divider main register’ (see Table 38). This is also the default setting.
8.9.3
Hop to Auxiliary Frequency (85)
This command forces the PLL to use frequency setting in ‘PLL A/B divider auxiliary register’ (see Table 39).
8.9.4
Trigger AD Conversion (87)
This command triggers the analog to digital conversion with the internal 8-bit AD converter. Conversion result is available in the ‘ADC readout
register’ (19) (see Table 41). The source for the AD conversion is defined with msel bits in the ‘Test setting 1 register’ (11) (see Table 33).
With this command it is possible to measure the both mixers output DC levels (msel=001 and 010) and DC value on the pin ADC
(msel=011). The first two possibilities are used for diagnostic purposes. Reflectivity of the antenna or antenna environment, or leakage of
the directional device causes reflection of the transmitted carrier towards receivers input. The mixers DC levels are defined with the amplitude
and phase of the incoming carrier. The ADC pin is direct input to the AD converter. The input can be used to connect the external power detector
for measuring the actual transmitted power. Other msel combinations are used for test purposes.
8.9.5
Trigger RX Filter Calibration (88)
The command triggers the RX filter calibration cycle. The calibration cycle is finished after t.b.d. Result is available in reg10.
8.9.6
Decrease RX Filter Calibration Data (89)
Increase RX Filter Calibration Data (8A)
ni
8.9.7
ca
After RX filter calibration (88), the host system (MCU) can decrease the automatically selected time constant by sending direct command 89 to
fine adjust the filters. The option bit f_cal_hp_chg in reg12 defines whether the calibration data change triggered by command 89 will affect the lp
or hp part of the filter. Sending one command 89 decreases calibration data for one step. There are 16 steps available, step size is 4%. Result is
available in reg10.
ch
After RX filter calibration (8A), the host system (MCU) can increase the automatically selected time constant by sending direct command 8A to
fine adjust the filters. The option bit f_cal_hp_chg in reg12 defines whether the calibration data change triggered by command 89 will affect the lp
or hp part of the filter. Sending one command 8A increases calibration data for one step. There are 16 steps available, step size is 4%. Result is
available in reg10.
Reset FIFO (8F)
Te
8.9.8
The reset command clears the FIFO pointers and all IRQ flags. It also clears the register storing the error (collision) location.
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8.9.9
Transmission With CRC (90)
The transmission commands are used to transmit data from the reader to the transponders. First the registers ‘Tx length’ (1D, 1E) need to be set
with the number of bytes for transmission, including data on broken bytes. Then transmission data can be loaded to FIFO register (1F).
Transmission starts when the third byte is written in the FIFO. Transmission of short messages (less than three bytes) is started when complete
data is in the FIFO. When the command is received the reader starts transmitting. CRC-16 is included in the transmitted sequence. In this mode
the micro controller has control on precise timing.
al
id
Optimal way to load transmission data is use of Continuous Write mode, starting from address 1D. Example 90 3D 00 30 AA BB CC operates as
follows: Transmit with CRC, write 00 to 1D and 30 to 1E (three bytes are going to be transmitted), and write AA, BB, CC to address 1F (FIFO,
data that will be transmitted). Continuous write command must be terminated by ‘Continuous stop condition’. Transmission starts when the data
is in the FIFO.
8.9.10 Transmission With CRC Expecting Header Bit (91)
8.9.11 Transmission Without CRC (92)
am
lc s
on A
te G
nt
st
il
This command functions similar to Transmission with CRC (90), but CRC is excluded.
lv
This command functions similar to Transmission with CRC (90), but also informs RX decoding logic that header bit is expected in the response
(Gen 2).
8.9.12 Delayed Transmission With CRC (93)
Delayed transmission is used in case the transmission needs to be started in a quite narrow time window after end of reception. The time
between end of reception and start of transmission is set in register ‘Delayed transmission wait time’ (06) (see Table 19). The register 06 needs
to be set prior to the reception after which the delayed transmit should be done. After sending the ‘Delayed transmission with CRC’ the TX length
bytes must be set and transmission data needs to be loaded in the FIFO. The reader transmitting is triggered by the TX timer.
Example: 93 3D 00 40 AA BB CC DD will transmit AA BB CC DD and CRC. Transmission will start after delayed defined in reg 06. The delay
time will start at the end of previous reception - despite the command is sent during the delay is already running out.
8.9.13 Delayed Transmission Without CRC (94)
This command functions similar to Delayed transmission with CRC, but CRC is excluded.
8.9.14 Block RX (96)
8.9.15 Enable RX (97)
ca
The block RF command puts the digital part of receiver (bit decoder and framer) in reset. The reset of the receiver is useful in case the system
operates in an extremely noisy environment, causing a constant switching of the sub-carrier input of the digital part of the receiver. The receiver
(if not in reset) would try to ‘catch’ a Preamble and in case the noise pattern matches the expected signal pattern, an interrupt is sent. A constant
flow of interrupt requests can be a problem for the external system (MCU), so the external system can stop this by putting the receive decoders
in reset mode. The reset mode can be terminated in two ways. One possibility is that the external system sends the ‘Enable RX’ command. The
reset mode is also automatically terminated at the end of TX operation. The receiver can stay in reset also after end of TX if the ‘RX wait time’
registers (address 08) is set. In this case, the receiver is enabled at the end of the wait time following the transmit operation.
This command clears the reset mode in the digital part of the receiver, if the reset mode was entered on the request by the ‘Block RX’ command.
ni
8.10 EPC GEN2 Specific Commands
ch
8.10.1 Query (98)
The Query command must be followed by 3F (continuous FIFO write) and two bytes of query data (00, DR, M, TRext, Sel, Session, Target, Q).
Since this gives 15 applicable bits the last LSB bit is disregarded. Transmitter issues preamble, command, TX data and CRC-5. The received
RN16 is stored in an internal register for further communication (ACK…). RN 16 is also achievable from the FIFO.
Te
8.10.2 QueryRep (99)
The QueryRep command issues the command followed by two session bits. The session bits are taken from ‘TX options’ (02) register. The
received RN16 is stored in an internal register for further communication (ACK). RN 16 is also achievable from the FIFO.
8.10.3 QueryAdjustUp (9A)
The QueryAdjustUp command issues the command QueryAdjust followed by two session bits and ‘up’ parameter (increase number of slots Q).
The session bits are taken from ‘TX options’ (02) register. The received RN16 is stored in an internal register for further communication (ACK…).
RN 16 is also achievable from the FIFO.
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8.10.4 QueryAdjustNic (9B)
The QueryAdjustNic command issues the command QueryAdjust followed by two session bits and ‘no change’ parameter. The session bits are
taken from ‘TX options’ (02) register. The received RN16 is stored in an internal register for further communication (ACK). RN 16 is also
achievable from the FIFO.
8.10.5 QueryAdjustDown (9C)
al
id
The QueryAdjustUp command issues the command QueryAdjust followed by two session bits and ‘down’ parameter (decrease number of slots
Q). The session bits are taken from ‘TX options’ (02) register. The received RN16 is stored in an internal register for further communication (ACK,
ReqRN). RN 16 is also achievable from the FIFO.
8.10.6 ACK (9D)
The ACK command issues the command followed by RN16 (or handle) that was stored in the internal register. The stored RN16 was acquired in
last successful Query command.
8.10.7 NAK (9E)
lv
The direct NAK command issues the NAK command to tags.
8.10.8 ReqRN (9F)
am
lc s
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The direct ReqRN command issues the ReqRN command to the tag. The last received RN is used as a parameter and the received new RN16
(handle) is stored in an internal register for further communication (ACK, ReqRN…). New RN 16 is also achievable from the FIFO.
8.11 Reader Communication Interface
The basic interface is a parallel 10-pin bus, which can be also configured and used as a serial peripheral interface (SPI) also. Both modes are
exclusive and one can not switch between them in a single application. The parallel mode is selected if all IO pins are low during low to high
transition of the EN pin (enable).
When the serial interface is selected in an application, the unused IO1 and IO0 pins should be hard wired according to Table 48. Upon power-up
(EN low to high transition), the reader looks for the status of these three pins and as given in Table 48, it enters parallel or serial mode.
The reader will always behave as the “slave” connected to the host system (MCU), which behaves as the “master” device. The host system
initiates all communications with the reader and is used for communication to the higher levels towards the host station, which can typically be a
personal computer. The reader has an IRQ pin to ask for host system attention.
Table 48. Pin Assignment in Parallel and Serial Interface Connection and in Case of Direct Mode
Pin
1
Parallel normal mode,
Direct mode
SPI with SS ,
Direct mode
CLK
SCLK from master
A/D[7]
MOSI (data in)
A/D[6],
Direct mode out (sub-carrier)
MISO (data out),
Direct mode out (sub-carrier)
A/D[5],
Direct mode out (sub-carrier)
Direct mode out (sub-carrier)
IO4
A/D[4]
SS – Slave Select
IO3
A/D[3]
Direct mode modulation input
Direct mode modulation input
IO2
A/D[2]
Direct mode enable RX input
Direct mode enable RX input
IO1
A/D[1]
Hard wire to VDD_IO
IO0
A/D[0]
Hard wire to ground
IRQ
IRQ interrupt
IRQ interrupt
IO7
IO6
3
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CLK
1. SS – Slave Select pin active low
2. MOSI – Master Output, Slave Input
3. MISO – Master Input, Slave Output
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AS3992
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Communication is initialized by a Start condition, which should be followed by an Address or Command word. The Address and Command words
are 8-bits long. Their format is shown in Table 49. Communication is closed by an appropriate stop condition. Three different communication
modes are available – Continuous address mode, non-continuous address mode, and command mode. Continuous address mode needs to be
closed by StopCont condition, while the other two modes need to be terminated by StopSgl condition.
Table 49. Address / Command Word Bit Distribution
Description
Bit Function
Address
Command
7
Command control bit
0=Address, 1=Command
0
1
6
Read/Write
1=Read, 0=Write
R/W
5
Continuous address mode
1=Cont., 0=Non-cont mode
Cont
4
Address/Command bit 4
Adr 4
3
Address/Command bit 3
Adr 3
2
Address/Command bit 2
Adr 2
Cmd 2
1
Address/Command bit 1
Adr 1
Cmd 1
0
Address/Command bit 0
Adr 0
Cmd 0
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Bit
Not used
Not used
Cmd 4
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Cmd 3
The MSB (Bit 7) determines if the word is to be used as a command or address. The last two columns in Table 49 show the function of the
separate bits in the event that either address or command is written. Data is expected once the address word is sent. In the event of continuous
address mode (Cont mode=1), the first data that follows the address is written (or read) to (from) the given address. For each additional data, the
address is incremented by one. This continuous mode can be used to write part of the control registers in a single stream without changing the
address: for instance, set-up of the pre-defined standard control registers from the MCU’s non-volatile memory to the reader. In the case of noncontinuous address, only one data word is expected after the address. The two address modes are used to write or read the configuration
registers or the FIFO. When writing or reading more than one byte the Continuous address mode should be used. The Command mode is used
to enter a command resulting in reader action (initialize transmission, frequency hop…). Examples of expected communication between MCU
and reader chip are shown below:
Continuous Address Mode
Start
Adrc x
Data (x)
Data (x+1)
Data (x+2)
Data (x+3)
Data (x+4)
…
Data (x+n)
StopCont
Non-continuous Address Mode (Single Address Mode)
Start
Adr x
Adr y
Data (y)
…
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Command Mode
Data (x)
Start
Cmd x
Cmd y
Adr z
Data (z)
…
StopSgl
StopSgl
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Where:
Start = start condition
Adr = address with Cont bit low
Adrc = address with the Cont bit high
Cmd = command byte
Data = data byte
StopSgl = stop condition for termination of the command or non-continuous address mode
StopCont = stop condition for termination of the continuous address mode
There are also combinations of different communication modes allowed in a single stream between the start and stop condition. Some examples
of combined communication are presented below:
Non-continuous Address Mode and Command Mode
Start
Adr x
Data (x)
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Adr y
Data (y)
…
Revision 1.1
Cmd z
Cmd w
StopSgl
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AS3992
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Command and Continuous Address Mode
Start
Cmd x
Cmd y
…
Adrc z
Data (z)
Data (z+1)
Data (z)
Data (z+1)
…
Data (z+n)
StopCont
Non-continuous, Command, and Continuous Address Mode
Adr x
Data (x)
…
Cmd y
…
Adrc z
…
Data (z+n)
…
StopSgl
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Start
Non-continuous address mode and Command mode can be continued by any mode including the Continuous address mode. The Continuous
address mode should be terminated by StopCont condition. Changing from Continuous address mode to the other two modes can be done only
by StopCont condition followed by start condition.
Majority of the registers in the reader IC are 8-bit long. They can be accessed by continuous or non-continuous address mode.
Adrc x
1. Least significant byte
2. Middle byte
3. Most significant byte
Data0 (x)
1
Data1 (x)
2
Data2 (x)
3
StopCont
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Start
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Registers 12, 14, 15, 16, and 17 are three bytes deep. They can be accessed by Continuous address mode only. The least significant byte is
accessed first. It is possible to access only deep register in a single communication stream, more of them, or combination of normal and deep
registers. Example is presented below:
Continuous access is possible for registers 00 to the end of the register 12. Register 13 is deep register and prevents continuous access over it
to register 14. Continuous access is again possible from register 14 to the end of FIFO (address 1F).
The 24 bytes deep FIFO register can be accessed by Continuous address mode only. It is allowed to use communication stream combined of
command mode and address mode. Example is combination needed for transmission composed of Reset FIFO, Transmit, write to 1D, 1E for
transmission length, and continuously to 1F for filling FIFO with transmission data.
Start
ResetFIFO
Transmit
Write Cont. to 1D
8F
90
3D
Data (1D)
Data (1E)
Data FIFO (0)
TX length
Data FIFO (1)
…
StopCont
TX data
8.12 Parallel Interface Communication
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In parallel mode, the Start condition is triggered by rising edge of the IO7 pin while the CLK pin is high and IO6-IO0 are low. This is used to reset
the interface logic. Communication is terminated by StopSgl condition or StopCont condition. StopSgl condition is triggered by falling edge on
IO7 pin while CLK pin is high and IO6-IO0 are low. StopCont condition is triggered by successive rising and falling edge on IO7 pin while CLK
and IO6-IO0 are low. The ‘StopSgl’ condition is used to terminate the direct mode.
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Figure 6. Parallel Interface Communication with Single Stop Condition “StopSgl”
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Start condition
StopSgl
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CLK
IO7
a1[7]
d1[7]
a2[7]
d2[7]
IO[6:0]
a1[6:0]
d1[6:0]
a2[6:0]
d2[6:0]
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Revision 1.1
aN[7]
aN[6:0]
dN[7]
dN[6:0]
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AS3992
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Figure 7. Parallel Interface Communication with Continuous Stop Condition “StopCont”
Stop Cont
Start condition
continuous mode
IO7
d0[7]
d1[7]
d2[7]
d3[7]
dN[7]
a0[6:0]
d0[6:0]
d1[6:0]
d2[6:0]
d3[6:0]
dN[6:0]
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IO[6:0]
a0[7]
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CLK
Figure 8. Data Output Only when CLK is High
Stop Cont
continuous mode
Start condition
CLK
IO7
IO[6:0]
internal OE
d0[7]
d1[7]
d2[7]
d3[7]
dN[7]
a0[6:0]
d0[6:0]
d1[6:0]
d2[6:0]
d3[6:0]
dN[6:0]
valid Output data
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Output Data
a0[7]
Timing Requirements for Parallel Interface. While using parallel interface, there must always be a separation between CLK transitions
and IO0…IO7 transitions. Minimum time interval between transition on CLK and data lines is 100ns.
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Minimum CLK high time interval is 300ns in periods when IO0…IO7 pins are used as data outputs (see Figure 8) or 100ns in periods when
IO0…IO7 pins are used as inputs (address, command, or register write).
To decrease interferences between MCU communication and RF part of the chip, the output resistance of IO0…IO7 lines is 400Ω typical and
800Ω maximum. The firmware designer should be aware of the fact that in case higher capacitance are connected to these pins, then possibly
longer CLK high intervals are needed to allow settling of the output level.
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AS3992
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.13 Serial Interface Communication
In serial interface IO4 pin enables the communication, CLK pin is serial data clock, IO7 is serial data input, and IO6 is serial data output.
The interface is in reset as long the IO4 pin is high. Communication is started by falling edge on the IO4 pin. Data coming from the host system
is sampled on the falling of the CLK pin. When reading out the data from the UHF chip, the data is set on the rising edge of the CLK pin. Host
system (MCU) should sample the data on the falling edge on the CLK pin. Communication is terminated by rising edge on the IO4 pin. All words
are 8-bits long with the MSB transmitted first.
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Figure 9. Serial Interface Communication
Stop
condition
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Start
condition
IO7
x
b7
IO4
IO6
b6
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CLK
b5
b4
b3
b2
b1
b0
x
z7
z6
z5
z4
z3
z2
z1
z0
x
In this mode the serial interface is in reset while the IO4 signal is high. CLK pin is serial data clock, IO7 is serial data in, and IO6 is serial data
output. Communication is terminated when IO4 signal goes high again.
Timing Requirements for Serial Interface. Minimum time interval between IO4 falling edge and first CLK change is 100ns.
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Minimum CLK high time interval is 300ns in periods IO6 pin is used as data output (like register reading – data from UHF chip to MCU) or 100ns
in periods when IO7 pin is used as input (address, command, or register write – data from MCU to UHF chip). Minimum CLK low interval is
100ns.
To decrease interferences between MCU communication and RF part of the chip the output resistance of IO6 line is 400Ω typical and 800Ω
maximum. The firmware designer should be aware that in case of higher capacitance is connected to this pin possibly longer CLK high interval is
needed to allow settling of the output level.
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Minimum hold time (time in which IO6 output data is valid after the CLK fall edge) is 130ns.
Minimum time interval between bytes is 200ns.
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Minimum time interval between last CLK falling edge and IO4 rising edge is 200ns.
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Minimum IO4 high time interval is 200ns.
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AS3992
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.13.1 Timing Diagrams
Figure 10. Write Data
tCHD
tCH
tEH
tCL
CLK
tDIS
Figure 11. Read Data
ENABLE - IO4
DATAI
DATAI
tDOH
DATAO (D7N)
tDOD
DATAO (D00)
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MISO - IO6
tDOD
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MOSI - IO7
DATAI
tCL
tCH
CLK
DATAI
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DATAI
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MOSI - IO7
tDIH
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ENABLE - IO4
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AS3992
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.13.2 Timing Parameters
Table 50. Timing Parameters
Symbol
Parameter
Condition
Min
Typ
Max
Units
2
Mbps
General
tCH
Clock high time
250
tCL
Clock low time
250
tDIS
Data in setup time
20
tDIH
Data in hold time
10
tEH
Enable hold time
300
tDOH
Data out hold time
150
tDOD
Data out delay
Write timing
ns
ns
ns
ns
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Read timing
ns
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Bit rate
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BRSDI
8.14 FIFO
150
ns
ns
The FIFO is loaded in a cyclical manner. The FIFO and its pointers should be cleared by the Reset FIFO command (0F) prior each FIFO write for
transmission. Data coming from the MCU is stored in the FIFO at address 1F hex from location 0 to 23. When the bytes are loaded in the reader,
the input FIFO counter is counting the number of bytes loaded into the FIFO. When data is read from the FIFO, an output FIFO counter is
incremented and it follows the status of the bytes read.
The input and output counters are 12 bits each. They are used to control the data flow in and out of the FIFO. This control sends an interrupt
request if the number of bytes in the FIFO is less than 6 and if number of bytes increases to above 18 so that MCU can send new data or remove
the data as necessary. It additionally checks that the number of data bytes to be sent does not surpass the value defined in ‘TX length’ bytes. It
also signals the transmit logic when the last data to be sent was moved from FIFO to the transmit logic. The number of bytes in the FIFO is
available in the FIFO status register. This register also contains three status flags:
Fove bit is set in case of FIFO overflow
Flol bit is set in case of low FIFO level during transmission
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Fhil bit is set in case of high FIFO level during reception
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AS3992
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
9 Package Drawings and Markings
The device is available in a 64-pin QFN (9mm x 9mm) package.
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Figure 12. Drawings and Dimensions
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AS3992
YYWWXZZ
Min
0.80
0
0.35
0
0.18
5.90
5.90
-
Nom
0.90
0.02
0.20 REF
0.40
0.25
9.00 BSC
9.00 BSC
0.50 BSC
6.00
6.00
0.15
0.10
0.10
0.05
0.08
0.10
64
Max
1.00
0.05
0.45
0.15
0.30
6.10
6.10
-
- REF: Reference Dimension, usually without
tolerance, for information purposes only.
- BSC: Basic Dimension. Theoretically exact
value shown without tolerances.
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Notes:
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Symbol
A
A1
A3
L
L1
b
D
E
e
D2
E2
aaa
bbb
ccc
ddd
eee
fff
N
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1. Dimensions and Tolerancing conform to ASME Y14.5M-1994.
2. All dimensions are in millimeters. Angles are in degrees.
3. Dimension b applies to metalized terminal and is measured between 0.25mm and 0.30mm from terminal tip.
Dimension L1 represents terminal full back from package edge up to 0.15mm is acceptable.
4. Coplanarity applies to the exposed heat slug as well as the terminal.
5. Radius on terminal is optional.
6. N is the total number of terminals
Marking: YYWWXZZ.
YY
WW
X
ZZ
Year (i.e. 10 for 2010)
Manufacturing Week
Assembly plant identifier
Assembly traceability code
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AS3992
Datasheet - R e v i s i o n H i s t o r y
Revision History
Date
1.0
Dec 21, 2009
1.1
Nov 24, 2010
Owner
Description
Initial revision
tlu
Updated current consumption, Key Features, Package Drawings and
Markings, Ordering Information
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Note: Typos may not be explicitly mentioned under revision history.
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AS3992
Datasheet - O r d e r i n g I n f o r m a t i o n
10 Ordering Information
The devices are available as the standard products shown in Table 51.
Table 51. Ordering Information
1
Description
Delivery Form
Package
AS3992-BQFP
Internal DRM compatible VCO, pre-distortion
Tape and Reel in
dry pack
64-pin QFN (9mm x 9mm)
Note: All products are RoHS compliant and Pb-free.
Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect
Technical Support is availableat http://www.austriamicrosystems.com/Technical-Support
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For further information and requests, please contact us mailto: sales@austriamicrosystems.com
or find your local distributor at http://www.austriamicrosystems.com/distributor
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1. Dry Pack Sensitivity Level =3 according to IPC/JEDEC J-STD-033A for full reels.
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Ordering Code
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AS3992
Datasheet - C o p y r i g h t s
Copyrights
Copyright © 1997-2010, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered ®.
All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of
the copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.
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Disclaimer
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Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale.
austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding
the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at
any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for
current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range,
unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are
specifically not recommended without additional processing by austriamicrosystems AG for each application. For shipments of less than 100
parts the manufacturing flow might show deviations from the standard production flow, such as test flow or test location.
Contact Information
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Headquarters
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The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However, austriamicrosystems AG shall not
be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use,
interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of
austriamicrosystems AG rendering of technical or other services.
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austriamicrosystems AG
Tobelbaderstrasse 30
A-8141 Unterpremstaetten, Austria
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Tel: +43 (0) 3136 500 0
Fax: +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit:
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http://www.austriamicrosystems.com/contact
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AS3992 (V6) Errata Sheet
Known issues in the digital section:
No.
P1
Issue description
clsys=000b enables
60kHz on the CLSYS
output
Comment
As a consequence a
-62dBc TX spur at 60kHz
can be seen.
This problem can be
considered as noncritical.
By using the proposed
workaround, the spur
disappears.
Workaround
Set the bit open_dr in
register 0x05 to high.
No.
P2
Issue description
In case exactly two bytes
are received in the FIFO
and both bytes are read
out during reception, the
subsequent ReqRN
command is corrupted.
Comment
The data length
information is contained
in the first received byte –
therefore it is sufficient to
read only one byte.
Workaround
Read out only the first
FIFO byte which contains
the EPC length
information upon
receiving Irq_2nd_byte
The case happens when
2byte_irq is used.
Any other number of
bytes (1, 3, 4, …) can be
read out without any
problems.
No.
P5
Issue description
In case BlockRX is used
after receiving the RN16
the IRQstatus register
(0x0C) reports 0x00
instead of 0x4x.
(Select, NAK)
Comment
An alternative to the
Block RX command,
reg03:0A can be used as
well.
Workaround
Skip the direct command
BlockRX. In case the
issue still happen act as
in case of a collision.
No.
P6
Issue description
In case BlockRX is used
after receiving the RN16
the IRQstatus register
(0x0C) reports 0xC0
instead of 0x4x.
(Select, NAK)
Comment
An alternative to the
Block RX command,
reg03:0A can be used as
well.
Workaround
Skip the direct command
BlockRX. In case the
issue still happen act as
in case of a collision.
No.
P7
Issue description
After corrupted reception
of RN16 with IRQstatus
register (0x0C) = 0x40
the reception remains
enabled, TX is blocked
and consequently the TX
IRQ is missing.
Comment
There are two
possibilities to identify
this condition:
(1) Read IRQstatus just
after subsequent TX
command
(IRQstatus=0x80 is
expected)
(2) Watch dog timer
action when waiting
on the missing IRQ
pulse at the end of
transmission.
Workaround
EN H-L-H transition is
needed.
STRICTLY CONFIDENTIAL
1/3
20 Sept. 12
No.
P8
Issue description
After EPC reception the
IRQstatus register
contains 0X00.
Comment
This case does not
indicate that a collision
has happened. There is
no need to increase the
number of slots in the
subsequent inventory.
Workaround
Continue inventory round
as if a corrupted EPC
was received.
No.
P9
Issue description
After any reception the
IRQstatus register
contains 0x41.
Comment
Workaround
Continue inventory round
as if a corrupted
reception has happened
(collision on RN, error
EPC…)
No.
P10
Issue description
SPI: Direct command
Reset FIFO (0x8F)
should not be sent before
the direct command
ReqRN (0x9F).
Comment
Workaround
Send the direct command
Reset FIFO after the TX
IRQ, before the receiving
the HANDLE.
No.
G5d
Issue description
SPI: Reading the FIFO
register 0x1F should not
be done right after an IO4
H-L transition.
Comment
Workaround
Read the FIFO status
register in single byte
mode before reading the
contents of the FIFO
register.
Known issues in the analogue section:
No.
A4b
Issue description
MCU support current not
stable and higher than
expected (400uA1000uA).
Should be 400-500uA
typ.
Comment
Issue is less critical since
MCU current in operation
is typically much higher
than the unwanted
500uA.
Workaround
No.
H3
Issue description
The internal PA cannot
be used in majority of the
applications due to
insufficient linearity and
stability.
Comment
Use low power RF
output.
Workaround
STRICTLY CONFIDENTIAL
2/3
20 Sept. 12
Important Notes & Hints
No.
P3
Issue description
QueryRep and
QueryAdj need a Reset
FIFO (0x8F) direct
command for correct
operation.
Comment
Not critical in a normal
inventory round in case
an access operation
(read/write) is done in the
same round.
The issue decreases tag
inventory rate in case
only the EPCs are read
and no read or write
operation is planned.
Recommendation
Use Reset FIFO
command before
QueryRep and
QueryAdj.
No.
P3A
Issue description
Direct commands for
transmission (0x90, 0x91,
0x92) require a Reset
FIFO direct command for
correct operation.
Comment
Recommendation
Use Reset FIFO before
transmission commands.
No.
P4
Issue description
To meet a StopSgl
condition a IO7 transition
at CLK=H is needed.
IO6:0 should be stable
during StopSgl.
Comment
Previously also the stop
condition met by a
transition of all IO lines at
CLK=H was allowed.
Recommendation
Use correct StopSgl.
No.
G8
Issue description
A FIFO read operation
requires the continuous
read mode for correct
status of the pointers.
Comment
Recommendation
Read FIFO contents in
the continuous read
mode.
STRICTLY CONFIDENTIAL
3/3
20 Sept. 12