ST3DV520E
MUX/DEMUX for 4 differential channel LVDS and DDC
Features
■
Low RON: 4.0 Ω typical
■
VCC operating range: 3.0 to 3.6 V
■
Enhanced ESD protection: > 8 kV (contact) and
15 kV (HBM)
■
Channel on capacitance: 9.5 pF typical
■
Switching time speed: 9 ns
■
Near to zero propagation delay: 250 ps
■
Very low crosstalk: -45 dB at 250 MHz
■
Bit-to-bit skew: 200 ps
■
> 600 MHz -3 dB typical bandwidth (or data
frequency)
■
Support up to 4 differential LVDS channel
■
Support 2 channel for DDC
■
Independent SEL control for LVDS and DDC
channels
■
Package: QFN56
Applications
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Description
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■
Audio/video switching
■
High bandwidth physical layer signals routing
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The ST3DV520E is a 4 differential channel LVDS
multiplexer/demultiplexer low RON bidirectional
switch used to switch between multiple LVDS
sources. It is designed for very low crosstalk, low
bit-to-bit skew and low I/O capacitance, to
maintain high signal integrity.
The differential signal from the LVDS transceiver
is multiplexed into one of two selected outputs
while the unselected switch goes to Hi-Z status.
The device integrates 2 SPDT (single pole dual
throw) switches, for DDC channel.
SEL for LVDS and DDC channel is controlled
independently.
Table 1.
Device summary
Order code
Package
Packing
ST3DV520EQTR
QFN56
Tape and reel
December 2010
Doc ID 18318 Rev 1
1/19
www.st.com
19
Contents
ST3DV520E
Contents
1
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
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2/19
Doc ID 18318 Rev 1
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ST3DV520E
Pin description
'.$
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6$$
NC
'.$
#
$
'.$
6$$
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&
'.$
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'.$
SEL1
6$$
Pin connection (top through view)
DDC2
Figure 1.
DDC1
1
Pin description
'.$
6$$
DDC1_0
'.$
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SEL2
DDC2_0
'.$
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DDC1_1
Table 2.
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2, 3, 7, 8, 11, 12, 14, 15
Pr
48, 47, 43, 42, 37, 36, 32, 31
46, 45, 41, 40, 35, 34, 30, 29
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6$$
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'.$
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'.$
6$$
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Pin description
Pin
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'.$
6$$
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DDC2_1
'.$
Symbol
A, B, C, D, E, F, G, H
Name and function
8-bit bus
A0, B0, C0, D0, E0, F0, G0, H0 8-bit multiplexed to bus 0
A1, B1, C1, D1, E1, F1, G1, H1 8-bit multiplexed to bus 1
17
SEL1
LVDS channel selection
54
SEL2
DDC channel selection
19, 20
DDC1, DDC2
22, 23, 25, 26
DDC1_0, DDC2_0, DDC1_1,
DDC2_1
4, 10, 18, 27, 38, 50, 56
VDD
Supply voltage
1, 6, 9, 13, 16, 21, 24, 28, 33,
39, 44, 49, 53, 55
GND
Ground
5, 51, 52
NC
Doc ID 18318 Rev 1
DDC switch input
DDC switch output
No internal connection
3/19
Pin description
ST3DV520E
Figure 2.
Input equivalent circuit
A
A0
B
B0
A1
B1
C
C0
D
D0
C1
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D1
E
E0
F
F0
E1
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G0
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H0
G1
H1
SEL
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Pr
DDC1_0
DDC1
DDC2_0
DDC2
DDC2_1
SEL2
AM08682V1
Table 3.
LVDS switch function table
SEL1
Function
L
8-bit bus to 8-bit multiplexed bus 0
H
8-bit bus to 8-bit multiplexed bus 1
Table 4.
DDC switch function table
SEL2
4/19
DDC1_1
Function
L
DDC switch input connected to DDC switch output X_0
H
DDC switch input connected to DDC switch output X_1
Doc ID 18318 Rev 1
ST3DV520E
2
Maximum rating
Maximum rating
Stressing the device above the rating listed in the “absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 5.
Absolute maximum ratings
Symbol
Parameter
Value
Supply voltage to ground
-0.5 to 4.6
VIO
DC input output voltage
-0.5 to 4.6
VIC
DC control input voltage
IO
DC output
PD
Power dissipation
Tstg
Storage temperature
TL
Lead temperature (10 sec)
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Table 6.
Symbol
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Recommended operating
- conditions
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1. If VIO x IO does not exceed the maximum limit of PD.
2.1
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VCC
current(1)
Unit
V
-0.5 to 4.6
V
120
mA
0.5
W
-65 to 150
°C
300
°C
Recommended operating conditions
Value
Parameter
Unit
Min
Typ
Max
VCC
Supply voltage to ground
3
-
3.6
V
VIC
DC control input voltage (SEL1, 2)
0
-
VCC
V
VIO
DC input/output voltage
0
-
VCC
V
TA
Operating temperature
-40
-
85
°C
Doc ID 18318 Rev 1
5/19
Electrical characteristics
ST3DV520E
3
Electrical characteristics
Table 7.
DC electrical characteristics
Value
Symbol
Parameter
Test condition
Unit
Min
Typ
Max
VIH
Voltage input high (SEL1,
High level guaranteed
2)
2.4
-
-
VIL
Voltage input low
(SEL1, 2)
Low level guaranteed
-0.5
-
0.8
VIK
Clamp diode voltage
(SEL1, 2)
VCC = 3.6 V
IIN = -18 mA
-
-0.8
IIH
Input high current
(SEL1, 2)
VCC = 3.6 V
VIN = VCC
-
IIL
Input low current
(SEL1, 2)
VCC = 3.6 V
VIN = GND
Leakage current through
the switch common
IOFF(SW)(1) terminals (A to H)
(DDC1 to DDC2)
IOFF(SEL1)
RON
RFLAT
ΔRON
Pr
SEL1 pin leakage current
Switch ON resistance(2)
ON resistance flatness (2)
(3)
V
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V
-1.2
V
-
±5
µA
-
-
±5
µA
-
-
±1
µA
VCC = 0 V
SEL1, 2 = 0 to 3.6 V
-
-
±1
µA
VCC = 3.0 V
VIN = 1.5 to VCC
IIN = -40 mA
-
4.0
6.5
Ω
VCC = 3.0 V
VIN at 1.5 and VCC
IIN = -40 mA
-
0.5
-
Ω
-
0.4
1
Ω
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VCC = 3.6 V
A to H = VCC
DDC1 to DDC2 = VCC
A0 to H0 = 0 V
A1 to H1 = floating
DDCx_0 = 0 V
DDCx1 = floating
SEL1 = VCC, SEL2 = VCC
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-40 to 85 °C
ON resistance match
VCC = 3.0 V
between channel
V = 1.5 to VCC
ΔRON = RONMAX-RONMIN IN
IIN = -40 mA
(2)(4)
1. Refer to Figure 4: Test circuit for leakage current (IOFF) on page 9
2. Measured by voltage drop between channels at indicated current through the switch. ON resistance is determined by the
lower of the voltages.
3. Flatness is defined as the difference between the RONMAX and RONMIN of ON resistance over the specified range.
4.
ΔRON measured at same VCC, temperature and voltage level.
6/19
Doc ID 18318 Rev 1
ST3DV520E
Electrical characteristics
Table 8.
Capacitance (TA = 25 °C, f = 1 MHz)
Value
Symbol
Parameter
Test condition
Unit
Min
Typ
Max
SEL1, 2 pin input
capacitance(1)
DC = 0.25 V
AC = 0.5 VPP
f = 1 MHz
-
2
3
pF
COFF
Switch off
capacitance(2)
DC = 0.25 V
AC = 0.5 VPP
f = 1 MHz
-
4
5
pF
CON
Switch on
capacitance(3)
DC = 0.25 V
AC = 0.5 VPP
f = 1 MHz
-
9.5
11
)
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CIN
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1. Refer to Figure 5 on page 10
2. Refer to Figure 6 on page 10
3. Refer to Figure 7 on page 11
Table 9.
ICC
O
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Test condition
)
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Active mode power
supply current
-O
VCC = 3.6 V, VIN = VCC or
GND
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Value
-40 to 85 °C
Unit
Min
Typ
Max
-
150
500
c
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µA
Dynamic electrical characteristics (VCC = 3.3 V ±10%)
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Parameter
Table 10.
Symbol
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Power supply characteristics
Symbol
pF
Parameter
Value
Test condition
-40 to 85 °C
Unit
Min
Typ
Max
Xtalk
Crosstalk(1)
RL= 100 Ω
f = 250 MHz
-
-45
-
dB
OIRR
Off isolation(2)
RL= 100 Ω
f = 250 MHz
-
-37
-
dB
BW
-3 dB bandwidth(3)
RL= 100 Ω
0 < VIN ≤3.6 V
-
600
-
MHz
1. Refer to Figure 9 on page 12
2. Refer to Figure 10 on page 13
3. Refer to Figure 8 on page 11
Doc ID 18318 Rev 1
7/19
Electrical characteristics
Table 11.
ST3DV520E
Switching characteristics (TA = 25 °C, VCC = 3.3 V ±10%)
Value
Symbol
tPD
Parameter
Test condition
Propagation delay
Unit
Min
Typ
Max
-
0.25
-
ns
VCC = 3 to 3.6 V
tPZH,
tPZL
Line enable time,
SEL to x to x0 or x to VCC = 3 to 3.6 V
x1
0.5
6.5
15
ns
tPHZ,
tPLZ
Line disable time,
SEL to x to x0 or x to VCC = 3 to 3.6 V
x1
0.5
6.5
8.5
ns
tSK(O)
Output skew
between center port
to any other port
VCC = 3 to 3.6 V
-
0.1
0.2
tSK(P)
Skew between
opposite transition of
VCC = 3 to 3.6 V
the same output
(tPHL, tPLH)
-
Table 12.
ESD performance
Symbol
Test condition
Contact discharge(1)
IEC61000-4-2
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ESD
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Human body model
(MIL-STD-883)
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Doc ID 18318 Rev 1
0.2
ns
ns
Value
Unit
Min
Typ
Max
-
±8
-
kV
-
±15
-
kV
1. Refer to Figure 3: Diagram for suggested VDD decoupling on page 9.
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ST3DV520E
Electrical characteristics
GND
VDD
GND
56 55
VDD
53
GND
GND
VDD
Diagram for suggested VDD decoupling
GND
Figure 3.
50 49
44
1
4
6
39
GND
VDD
GND
C=2uF or
4.7uF
9
38
DUT
10
13
33
GND
18
24
GND
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27 28
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GND
GND
21
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VDD
16
VDD
VDD
GND
GND
GND
O
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Note: 100nF Capacitors must be used as local bypass capacitors between the adjacent VDD and GND pairs (total 7)
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1. Applicable for system level ESD test
Figure 4.
Test circuit for leakage current (IOFF)
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Doc ID 18318 Rev 1
9/19
Electrical characteristics
Figure 5.
ST3DV520E
Test circuit for SEL pin input capacitance (CIN)
1, 2
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Figure 6.
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Test circuit for switch off capacitance (COFF)
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Doc ID 18318 Rev 1
1
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ST3DV520E
Electrical characteristics
Figure 7.
Test circuit for switch on capacitance (CON)
1
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Figure 8.
Test circuit for bandwidth measurement (BW)
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A
A0
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(See Note 1)
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1. CL includes proble and jig capacitance.
Doc ID 18318 Rev 1
11/19
Electrical characteristics
ST3DV520E
Frequency response is measured at the output of the ON channel. For example, when
VSEL1 = 0 and A is the input, the output is measured at A0. All unused analog I/O ports are
left open.
HP8753ES setup:
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBm
Figure 9.
)
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Test circuit for crosstalk measurement (xtalk)
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A
A0
B
B0
A1
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B1
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C
D0
D
C1
SEL1
D1
AM08683V1
1. CL includes proble and jig capacitance.
2. A 50 Ω termination resistor is needed to match the loading of the network analyzer.
12/19
Doc ID 18318 Rev 1
ST3DV520E
Electrical characteristics
Crosstalk is measured at the output of the non-adjacent ON channel. For example, when
VSEL1 = 0, and B is the input, the output is measured at D. All unused analog input ports are
connected to GND and output ports are left open.
HP8753ES setup:
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
)
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P1 = 0 dBm
Figure 10. Test circuit for off isolation measurement (OIRR)
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A
B
A0
B0
A1
B1
1
Off isolation is measured at the output of the OFF channel. For example, when VSEL1=0,
and B is the input, the output is measured at B1. All unused analog input ports are
connected to GND and output ports are left open.
HP8753ES setup:
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBm
Doc ID 18318 Rev 1
13/19
Package mechanical data
4
ST3DV520E
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11. Package outline for QFN56 (11 x 5 mm) pitch 0.5 mm
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7576329-A
14/19
Doc ID 18318 Rev 1
ST3DV520E
Package mechanical data
Table 13.
Mechanical data for QFN56 (11 x 5 mm) pitch 0.5 mm
Millimeters
Symbol
Min
Typ
Max
A
0.70
0.75
0.80
A1
–
–
0.05
A3
–
0.20
–
b
0.20
0.25
0.30
D
10.90
11.00
11.10
D2
8.30
8.40
8.50
D3
–
9.50
E
4.90
5.00
E2
2.30
2.40
E3
–
3.50
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–
L
0.30
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uc
–
Pr
od
5.10
2.50
–
0.50
–
0.40
0.50
Figure 12. Footprint recommendation for QFN56 (11 x 5 mm) pitch 0.5 mm
)
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Doc ID 18318 Rev 1
15/19
Package mechanical data
ST3DV520E
Figure 13. Carrier tape information for QFN56 (11 x 5 mm) pitch 0.5 mm
)
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Doc ID 18318 Rev 1
7875978_K
ST3DV520E
Package mechanical data
Figure 14. Reel information for QFN56 (11 x 5 mm) pitch 0.5 mm
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Doc ID 18318 Rev 1
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Revision history
5
ST3DV520E
Revision history
Table 14.
Document revision history
Date
Revision
08-Dec-2010
1
Changes
Initial release.
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Doc ID 18318 Rev 1
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Please Read Carefully:
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Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
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Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
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Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
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Doc ID 18318 Rev 1
19/19