ST6G3237TBR

ST6G3237 Dual supply level translator for SD/ MINISD / T-FLASH Features ■ High speed: – tPD = 4.4ns (Max.) at TA = 85°C – VCCB = 3.0V – VCCA = 2.3V ■ Low power dissipation: – ICCA = ICCB = 5µA (Max.) at TA = 85°C µTFBGA25 ■ Balanced propagation delays: – TPLH ≈ TPHL ■ Power down protections on inputs and outputs ■ 26Ω series resistor on A-Side ■ Operating voltage range: – VCCA (OPR) = 1.4V to VCCB – VCCB (OPR) = 1.4V to 3.6V ■ Latch-up performance exceeds 500mA (JESD17) ■ ESD performance: – HBM > 2kV (MIL STD 883 method 3015); ■ ROHS compliant for µTFBGA25 package u d o r P e t e l o s b O c u d Description ) s t( The ST6G3237 is a dual supply low voltage CMOS Level Translator for SD/MiniSD/T-Flash fabricated with sub-micron silicon gate and fivelayer metal wiring C2MOS technology. Designed for use as an interface between a 3.3V bus and a 2.5V or 1.8V bus in a mixed 3.3V/1.8V, 3.3V/2.5V and 2.5V/1.8V supply systems, it achieves high speed operation while maintaining the CMOS low power dissipation. e t le ) s ( ct TSSOP20 o r P o s b O - The A port is designed to track VCCA. The B port is designed to track VCCB. This IC is intended for two-way asynchronous communication between data buses and the direction of data transmission is determined by CMD-dir/DATA0-dir/DAT123-dir inputs. The B-port interfaces with the 3V bus, the A-port with the 2.5V and 1.8V bus. All inputs are equipped with protection circuits against static discharge, giving them ±2kV ESD immunity and transient excess voltage. Order codes Part number Package Packaging ST6G3237TTR TSSOP20 Tape and reel ST6G3237TBR µTFBGA25 Tape and reel January 2007 Rev 1 1/17 www.st.com 17 Contents ST6G3237 Contents 1 Logic diagram and truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.1 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.2 AC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.3 Output slew rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.4 Capacitance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 c u d ) s t( o r P 5 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 e t le ) s ( ct u d o r P e t e l o s b O 2/17 o s b O - ST6G3237 1 Logic diagram and truth table Logic diagram and truth table Figure 1. Logic diagram c u d e t le Table 1. ) s ( ct s b O t e l o o r P o s b O - Truth table u d o r P e CMDdir ) s t( DAT0- DAT12 dir 3-dir CMD.h Function CMD Output DAT0.h DAT0 DAT1.h DAT1 DAT2.h DAT2 DAT3.h DAT3 H X X I O X X X X B=A L X X O I X X X X A=B X H X X X I O X X B=A X L X X X O I X X A=B X X H X X X X I O B=A X X L X X X X O I A=B 3/17 Pin settings ST6G3237 2 Pin settings 2.1 Pin connections Figure 2. Pin connections (top through view) c u d e t le ) s ( ct u d o r P e t e l o s b O 4/17 o s b O - o r P ) s t( ST6G3237 2.2 Pin settings Pin descriptions Table 2. Pin descriptions Pin Nº Pin Nº µTFBGA25 TSSOP20 A2 Type Side Symbol 12 I A-side CMD-dir D2 9 I/O A-side CMD.h A-side Command D4 13 I/O B-Side CMD B-side Command Command direction HIGH = A to B LOW = B to A Data Direction HIGH = A to B (write) LOW = B to A (read) A3 11 I A-Side DAT0-dir D1 8 I/O A-Side DAT0.h Data Input / Output D5 14 I/O B-Side DAT0 Data Input / Output E3 10 I A-Side DAT123-dir E1 2 I/O A-Side DAT1.h A1 3 I/O A-Side DAT2.h B1 4 I/O A-Side DAT3.h Data Input / Output E5 19 I/O B-Side DAT1 Data Input / Output A5 18 I/O DAT2 Data Input / Output B5 17 I/O C1 5 C5 16 E2 du so e t le c u d ) s t( Data Direction HIGH = A to B (write) LOW = B to A (read) o r P Data Input / Output Data Input / Output B-Side DAT3 Data Input / Output I b O A-Side CLK.h Clock Input O B-Side CLK O A-Side CLK-f Clock Feedback 7 - A-Side VCCA Power supply B4 15 - B-Side VCCB Power supply C3, C4 1, 20 - - GND Ground (0V) A4, B2, C2, D3, E4 - - - NC No connect 6 o r P e B3 t e l o s b O Name and function ct (s) B-Side Clock Output ● CMD, Command is a bidirectional line. The host and card drivers are operating in push-pull. ● DAT0-3, Data lines are bi-directional lines. Host and card drivers are operating in push-pull mode. ● CLK, Clock is a host to card signal. CLK operates in push-pull mode. ● Feedback (return) Clock is feedback clock signal from level shifter to host for controlling delays. 5/17 Electrical ratings 3 ST6G3237 Electrical ratings Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 3. Absolute maximum ratings Symbol Parameter Supply voltage -0.5 to 4.6 V VCCB Supply voltage -0.5 to 4.6 V DC input voltage -0.5 to 4.6 V VI/OA DC I/O voltage (output disabled) -0.5 to 4.6 VI/OB DC I/O voltage (output disabled) -0.5 to 4.6 VI/OA DC output voltage -0.5 to VCCA + 0.5 VI/OB DC output voltage -0.5 to VCCB + 0.5 IIK DC input diode current IOK DC output diode current IOA DC output current IOB DC output current ICCA ICCB PD TSTG TL ro P e let V V V mA -50 mA ±50 mA ±50 mA DC VCC or ground current ±100 mA DC VCC or ground current ±100 mA Power dissipation 400 mW -65 to +150 °C 260 °C Value Unit c u d (t s) o s b O - Storage temperature Lead temperature (10 sec) Recommended operating conditions Symbol Parameter VCCA Supply Voltage 1.4 to VCCB V VCCB Supply Voltage 1.4 to 3.6 V Input Voltage (CMD-dir/DAT0-dir/DAT123-dir) 0 to VCCA V VI/OA I/O Voltage 0 to VCCA V VI/OB I/O Voltage 0 to VCCB V -40 to +85 °C 0 to 10 ns/V VI Top dt/dv Operating Temperature Input Rise and Fall Time 1. VIN from 0.8V to 2.0V at VCC = 3.0V 6/17 c u d ) s t( V -20 o r P e Table 4. s b O Unit VCCA VI t e l o Value (1) ST6G3237 Electrical characteristics 4 Electrical characteristics 4.1 DC electrical characteristics Table 5. DC specifications Test Conditions Symbol Value Parameter TA = 25°C -40 to 85°C Unit Vcc (V) Min 1.4 – 1.95 VIH High Level (A port) Input Voltage 1.95 – 2.7 VCCA to 3.6 2.7 – 3.6 Typ Max 0.65VCCA 0.65VCCA 1.7 1.7 2.0 2.0 1.4 – 1.95 VIL Low Level (A port) Input Voltage 1.95 – 2.7 VCCA to 3.6 2.7 – 3.6 VIH High Level (B port) Input Voltage Max V 0.35VCCA 0.35VCCA 0.7 0.7 uc 1.4 to VCCB 0.8 d o r 0.65VCCB 0.65VCCB 1.95 – 2.7 1.7 1.7 2.7 – 3.6 2.0 P e let so 1.95 – 2.7 1.4 to VCCB 2.7 – 3.6 b O - 2.0 0.35VCCB 0.7 0.7 0.8 0.8 All A-port I/Os and control inputs are powered by VCCA ● All B-port I/Os are powered by VCCB V V 0.35VCCB ● ) s ( ct ) s t( 0.8 1.4 – 1.95 1.4 – 1.95 VIL Low Level (B port) Input Voltage Min V u d o r P e t e l o s b O 7/17 Electrical characteristics Table 6. ST6G3237 DC specifications Test conditions Symbol Parameter 1.4-3.6 1.4-3.6 IOH = -100µA 1.30 1.4 1.4 IOH = -1 mA 1.20 1.65 1.65 IOH = -2 mA 1.40 2.3 2.3 IOH = -4 mA 1.90 3 3 IOH = -8 mA 2.45 1.4-3.6 1.4-3.6 IOL = 100µA 0.10 1.4 1.4 IOL = 1 mA 0.20 1.65 1.65 IOL = 2 mA 0.25 2.3 2.3 IOL = 4 mA 0.40 3 3 IOL = 8 mA 0.55 1.4-3.6 1.4-3.6 IOH = -100µA 1.30 1.4 1.4 IOH = -2 mA 1.25 1.65 IOH = -4 mA 1.45 2.3 2.3 IOH = -8 mA 1.90 3 3 IOH = -24 mA 2.45 1.4-3.6 1.4-3.6 IOL = 100µA 1.4 1.4 IOL = 2 mA 1.65 1.65 IOL = 4 mA 2.3 2.3 IOL = 8 mA 3 3 IOL = 24 mA 2.7 3.6 0 ct VOL Low level (B port) output voltage Input leakage current Power OFF leakage current u d o 1.65 t e l o bs ICCB O IOZ 8/17 r P e Quiescent supply current Quiescent supply current Leakage current when I/O are in High-Z Min 1.65 VOH High level (B port) output voltage ICCA -40 to 85°C VCCB (V) VOL Low level (A port) output voltage IOFF TA = 25°C VCCA (V) VOH High level (A port) output voltage IIA, IIB Value 0 (s) e t le so b O - Typ Max Min Unit Max V V c u d ) s t( V o r P 0.10 0.15 V 0.20 0.30 0.55 VI = VCC or GND ±0.1 ±1 µA VIA = GND to 3.6 VIB = GND to 3.6 ±1.0 ±10 µA VIA = VCCA or GND VIB = VCCB or GND 0.5 5 µA VIA = VCCA or GND VIB = VCCB or GND 0.5 5 µA VIOA = VCCA or GND ±0.5 ±5 µA 3.6 1.80 2.9 2.5 3.6 3.0 3.0 1.65 3.6 1.80 2.9 2.5 3.6 3.0 3.0 3.6 3.6 ST6G3237 Electrical characteristics 4.2 AC electrical characteristics Table 7. AC electrical characteristics f = 1MHz, 50% duty cycle, CL = 30pF, RL = 500Ω Test condition TA = -40 to 85 °C VCCA=1.8 ± 0.15V VCCA=1.8 ± 0.15V VCCA=2.5 ± 0.2V Symbol Unit Parameter VCCB=2.5 ± 0.2V tPLH tPHL tPZL tPZH tPLZ tPHZ Min. Max. Min. Max. Min. Max. Propagation delay time A to B (CMD) 1.0 3.7 1.0 3.8 1.0 3.6 Propagation delay time B to A (CMD) 1.0 3.6 1.0 3.9 1.0 3.6 Propagation delay time A to B (CLK) 1.0 3.2 1.0 3.4 1.0 3.2 Propagation delay time B to A (CLK-f) 1.0 7.6 1.0 7.7 1.0 7.5 Propagation delay time An to Bn (DATn) 1.0 6.2 1.0 6.2 1.0 Propagation delay time Bn to An (DATn) 1.0 5.3 1.0 5.3 Output enable time from An to Bn 1.0 2.9 1.0 3.0 Output enable time from Bn to An 1.0 4.3 1.0 Output disable time from An to Bn 1.0 ns Output disable time from Bn to An ) s ( ct tOSLH tOSHL Output to output skew time (note 1,2) tCDLH tCDHL Clock and data skew time o r P e From A to B 1.0 2.9 4.5 1.0 4.2 8 1.0 7.8 ns ns 1.0 5.5 1.0 5.3 0.5 0.5 0.5 ns 0.5 0.5 0.5 ns 52 52 52 52 From A to B 52 52 52 From B to A 52 52 52 t e l o s b O 5.4 6.2 5.3 52 From B to A Data du 1.0 1.0 ) s t( 1.0 P e let o s b O 7.8 uc d o r 52 Clock fmax VCCB=3.0 ± 0.3V VCCB=3.0 ± 0.3V MHz Mbps 9/17 Electrical characteristics 4.3 ST6G3237 Output slew rate Table 8. Output slew rate (f = 1MHz, 50% duty cycle, CL = 30pF, RL = 500Ω) VCCA = 1.8V ± 0.15V Symbol Parameter From VCCB = 3V ± 0.3V To Min. 4.4 Unit Max. tr Rise time 20% 80% 3 ns tf Fall time 80% 20% 3 ns Capacitance characteristics Table 9. Capacitance characteristics Test condition Symbol Value TA = 25 °C Parameter VCCB (V) VCCA (V) Min. CINB Input capacitance CI/O Input/Output capacitance CPD (1) Power dissipation capacitance Open Open 3.0 1.8 3.0 2.5 3.0 1.8 od 5 o s b O - r P e t le f=10MHz uc Typ. 6 ) s t( Unit Max. pF pF 29 pF 29 1. CPD is defined as the value of the IC's internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to Test Circuit). Average current can be obtained by the following equation. ICC(opr) - CPD x VCC x fIN + ICC/16 (per circuit) ) s ( ct u d o r P e t e l o s b O 10/17 ST6G3237 5 Test circuit Test circuit Figure 3. Test circuit Table 10. Test values Test c u d tPLH, tPHL Open ro tPZL, tPLZ (VCC = 3.0 to 3.6V) P e let tPZL, tPLZ (VCC = 2.3 to 2.7V or VCC = 1.6 to 1.95V) tPZH, tPHZ Table 11. o s b O - Waveform symbol value Symbol 3.0 to 3.6V VX o r P e ● ● t e l o ● GND VCC VCC VCC 1.5V VCC/2 VCC/2 VOL + 0.3V VOL + 0.15V VOL + 0.15V VOL - 0.3V VOL - 0.15V VOL - 0.15V (s) ct du 2VCC 1.65 to 1.95V VCC VM 6V 2.3 to 2.7V VIH VY ) s t( Switch CL = 30pF or equivalent (includes jig and probe capacitance) RL = R1 = 500Ω or equivalent RT = ZOUT of pulse generator (typically 50Ω) s b O 11/17 Test circuit ST6G3237 Figure 4. Waveform - propagation delay (f = 1MHz, 50% duty cycle) c u d e t le ) s ( ct u d o r P e t e l o s b O 12/17 o s b O - o r P ) s t( ST6G3237 6 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O 13/17 Package mechanical data Table 12. ST6G3237 µTFBGA25 Mechanical data mm. mils Dim. A Min. Typ. Max. Min. Typ. Max. 1.0 1.1 1.16 39.4 43.3 45.7 A1 0.25 A2 0.78 b 0.25 D 2.9 D1 9.8 0.86 30.7 3.0 3.1 114.2 118.1 122.0 3.0 3.1 114.2 118.1 122.0 2 E 2.9 3.0 78.8 3.1 114.2 2 78.8 e 0.5 19.7 SE 0.25 9.8 c u d Package dimensions e t le ) s ( ct u d o r P e s b O 14/17 118.1 E1 Figure 5. t e l o 33.9 o s b O - o r P 122.0 ) s t( ST6G3237 Package mechanical data Table 13. TSSOP20 Mechanical data mm. mils Dim. Min. Typ. Max. A Typ. Max. 1.2 A1 0.05 A2 0.8 b 0.047 0.15 0.002 0.004 0.006 1.05 0.031 0.039 0.041 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.0079 D 6.4 6.5 6.6 0.252 0.256 0.260 E 6.2 6.4 6.6 0.244 0.252 0.260 E1 4.3 4.4 4.48 0.169 0.173 0.176 1 e 0.65 BSC K 0° L 0.45 Figure 6. 0.0256 BSC 0.60 8° 0° 0.75 0.018 e t le A2 b A1 ) s ( ct u d o r P e so e b O - ) s t( 8° 0.024 c u d Package dimensions A t e l o Min. 0.030 o r P K L E c D E1 PIN 1 IDENTIFICATION s b O 1 0087225C 15/17 Revision history 7 ST6G3237 Revision history Table 14. Revision history Date Revision 18-Jan-2007 1 Changes First release c u d e t le ) s ( ct u d o r P e t e l o s b O 16/17 o s b O - o r P ) s t( ST6G3237 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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