ST6G3238ETBR

ST6G3238E Dual supply level translator for SD / MiniSD / T-Flash with ±8 kV contact discharge ESD protection Features ■ High speed: tPD = 4.4 ns (typ.) at TA = 85 °C VCCB = 2.7 V; VCCA = 1.8 V ■ Low power dissipation: ICCA = ICCB = 5 µA (max.) at TA = 85 °C ■ Balanced propagation delays: TPLH ≈ TPHL ■ Power-down protection on inputs and outputs ■ 26 Ω series resistor on A side ■ EMI filter on B side ■ Integrated pull-up and pull-down resistor on B side ■ Operating voltage range: – VCCA (opr) = 1.4 V to VCCB – VCCB (opr) = 1.4 V to 3.6 V ■ Latch-up performance exceeds 500 mA (JESD17) ■ ESD protection for card side (B port, CD and WP pins) ±8 kV, IEC 61000-4-2 ESD or contact discharge: HBM > ±15 kV (MIL STD 883 method 3015) ) s ( ct u d o r P e ■ ESD protection for A-port: HBM > ±2 kV (MIL STD 883 method 3015) ■ RoHS compliant for µTFBGA25 package t e l o s b O ) s ( ct u d o TSSOP24 µTFBGA25 r P Descriptione t e l o s b -O The ST6G3238E is a dual supply low voltage CMOS level translator for SD / MiniSD / T-Flash fabricated with sub-micron silicon gate and fivelayer metal wiring C2MOS technology. Designed for use as an interface between a 3.3 V bus and a 2.5 V or 1.8 V bus in a mixed 3.3 V/1.8 V, 3.3 V/2.5 V and 2.5 V/1.8 V supply systems, it achieves high speed operation while maintaining the CMOS low power dissipation. The A port is designed to track VCCA. The B port is designed to track VCCB. This device is intended for two-way asynchronous communication between data buses and the direction of data transmission is determined by CMD-dir / DATA0-dir / DAT123-dir inputs. The B port interfaces with the 3 V bus, while the A port interfaces with the 2.5 V and 1.8 V bus. All inputs are equipped with circuits to protect against static discharge, giving them ±2 kV (on Aside except CD and WP pins) and ±15 kV (on B side, CD and WP pins) ESD immunity and transient excess voltage. See the section on integrated ESD protection and resistors for more information. Table 1. Device summary Order code Package Packaging ST6G3238ETTR TSSOP24 Tape and reel ST6G3238ETBR µTFBGA25 Tape and reel August 2008 Rev 4 1/19 www.st.com 19 Contents ST6G3238E Contents 1 Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Pin connection and function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Pin function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 I/O and test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 ) s ( ct u d o r P e t e l o ) (s t c u d o r P e t e l o s b O 2/19 s b O ST6G3238E Logic diagram 1 Logic diagram Figure 1. Block diagram VCCB R9 R10 R11 R12 B-SIDE A-SIDE CMD-dir R2 CMD CMD.h ) s ( ct DATA0-dir R3 DAT0.h DAT0 DAT123-dir u d o R4 DAT1 DAT1.h R5 DAT2.h R6 e t e ol DAT3.h CLK.h DAT2 DAT3 R1 VCCA R13 R14 WP CD ) (s CLK s b O R7 CLK-f GND t c u d o r GND Table 2. Pr P e V Integrated ESD protection and resistor on B side t e l o Resistors Value R1, R2, R3, R4, R5, R6 40 Ω Vbr min. 14 V @ 1 mA Tolerance ±20% Line capacitance < 20 pF R10, R11, R12 70 kΩ R9 15 kΩ R7 470 kΩ Tolerance ±30% s b O Table 3. Bi-directional Zener diodes Integrated pull-up resistors on WP and CD pins on A side Resistors Value R13 100 kΩ R14 100 kΩ Tolerance ±30% 3/19 Pin connection and function ST6G3238E 2 Pin connection and function Figure 2. Pin connection (top through view for µTFBGA25 and TSSOP24) 1 2 3 4 5 A B C DAT0-dir 1 24 VCCB VCCA 2 23 CD CMD-dir 3 22 CMD CMD.h 4 21 DAT0 DAT1 DAT0.h 5 20 D DAT1.h 6 19 E DAT2.h 7 18 DAT3.h 8 CLK-f 9 µTFBGA25 e t e ol 12 13 NC s b O NC DAT2 NC VCCA VCCB DAT3 CLK.h NC GND GND CLK D DAT0.h CMD.h CD CMD DAT0 E DAT1.h CLK-f DAT12 3-dir WP DAT1 B DAT3.h du o r P DAT123-dir GND DAT0. dir DAT2.h 15 14 CMDdir A WP 11 5 3 16 GND 4 2 so b O )- Pr CLK 10 s ( t c 1 e t e l 17 DAT3 CLK.h NC C u d o ) s ( ct DAT2 TSSOP24 µTFBGA25 2.1 4/19 Pin function ● CMD: Command is a bi-directional line. The host and card drivers operate in push-pull mode. ● DAT0-3: Data lines are bi-directional lines. The host and the card drivers operate in push-pull mode. ST6G3238E Pin connection and function ● CLK: Clock is a host-to-card signal. CLK operates in push-pull mode. ● Feedback (return) Clock is a feedback clock signal from the level shifter to host for controlling delays. ● CD: Card detect pulls HIGH state of input to VCCA. This pin is protected against ESD up to 8 kV contact. ● WP: Write protect pulls HIGH state of input to VCCA. This pin is protected against ESD up to 8 kV contact. Table 4. Pin description μTFBGA pin n° TSSOP pin n° Type Side Symbol A2 3 I A side CMD-dir D2 4 I/O A side CMD.h D4 22 I/O B side CMD A3 1 I A side r P e D1 5 I/O A side DAT0.h Data input / output D5 21 I/O B side DAT0 Data input / output E3 15 I A side DAT123-dir I/O A side DAT1.h Data input / output 7 I/O A side DAT2.h Data input / output 8 I/O A side DAT3.h Data input / output 20 I/O B side DAT1 Data input / output A5 19 I/O B side DAT2 Data input / output B5 18 I/O B side DAT3 Data input / output C1 10 I A side CLK.h Clock input C5 17 O B side CLK E2 9 O A side CLK-f D3 23 - A side CD Card detect E4 16 - A side WP Write protect B3 2 - A side VCCA Power supply B4 24 - B side VCCB Power supply C3, C4 11, 14 - - GND Ground (0 V) A4, B2, C2 12, 13 - - NC ct E1 6 du A1 ro B1 P e E5 let O o s b ) (s t e l o s b O DAT0-dir Name and function Command direction HIGH = A to B LOW = B to A ) s ( ct u d o A-side command B-side command Data direction HIGH = A to B (write) LOW = B to A (read) Data direction HIGH = A to B (write) LOW = B to A (read) Clock output Clock feedback No connect 5/19 Summary description ST6G3238E 3 Summary description Table 5. Truth table Function CMD-dir DAT0-dir DAT123-dir CMD.h CMD DAT0.h DAT0 DAT1.h DAT1 DAT2.h DAT2 DAT3.h DAT3 H X X INPUT OUTPUT X X X X B=A L X X OUTPUT INPUT X X X X A=B X H X X X INPUT OUTPUT X X X L X X X OUTPUT INPUT X X X H X X X X INPUT X X L X X X X OUTPUT c u d Note: e t e ol X = Don't care; Z = High impedance ) (s t c u d o r P e t e l o s b O 6/19 Output s b O o r P X ) s ( t B=A A=B OUTPUT B=A INPUT A=B ST6G3238E 4 Maximum rating Maximum rating Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 6. Absolute maximum ratings Symbol Parameter -0.5 to 4.6 VCCB Supply voltage -0.5 to 4.6 DC input voltage -0.5 to 4.6 VI/OA DC I/O voltage (output disabled) -0.5 to 4.6 V VI/OB DC I/O voltage (output disabled) -0.5 to 4.6 V VI/OA DC output voltage -0.5 to VCCA + 0.5 V VI/OB DC output voltage -0.5 to VCCB + 0.5 V -20 mA u d o e t e ol s b O Pr V V V IIK DC input diode current IOK DC output diode current -50 mA IOA DC output current ±50 mA DC output current ±50 mA DC VCC or ground current ±100 mA DC VCC or ground current ±100 mA Power dissipation 400 mW -65 to +150 °C 260 °C ) (s t c u ICCA ICCB od Pr PD O ) s ( ct Supply voltage IOB bs Unit VCCA VI e t e ol Value Tstg TL Table 7. Storage temperature Lead temperature (10 sec.) Recommended operating conditions Symbol Parameter Value Unit VCCA Supply voltage 1.4 to VCCB V VCCB Supply voltage 1.4 to 3.6 V Input voltage (CMD-dir/DAT0-dir/DAT123-dir) 0 to VCCA V VI/OA VI I/O voltage 0 to VCCA V VI/OB I/O voltage 0 to VCCB V -40 to +85 °C 0 to 10 ns/V Top dt/dv Operating temperature Input rise and fall time (1) 1. VIN from 0.8 V to 2.0 V at VCC = 3.0 V 7/19 DC and AC parameters ST6G3238E 5 DC and AC parameters Table 8. DC specification Test conditions Symbol Parameter VCCA (V) Value TA = 25 °C VCCB (V) Min. 1.4-1.95 VIH High level input (A port) voltage VCCA to 1.95-2.7 3.6 2.7-3.6 Max. 0.65VCCA 1.7 1.7 2.0 2.0 0.35VCCA VCCA to 3.6 1.95-2.7 1.4 to VCCB 0.8 1.4-1.95 0.65VCCB 1.95-2.7 1.7 2.7-3.6 2.0 1.4-1.95 VIL Low level input (B port) voltage 1.4 to VCCB 1.95-2.7 )- 2.7-3.6 1.4-3.6 t e l o VOL Low level output (A port) voltage bs O VOH High level output (B port) voltage 8/19 ) s ( ct du o r P 0.7 1.7 V 2.0 0.35VCCB 0.35VCCB 0.7 0.7 0.8 0.8 IOH = -100µA VCCA-0.1 VCCA-0.1 1.20 1.20 1.65 IOH = -2 mA 1.40 1.40 2.3 2.3 IOH = -4 mA 1.90 1.90 3 3 IOH = -8 mA 2.45 2.45 1.4-3.6 1.4-3.6 IOL = 100µA 0.10 0.10 1.4 1.4 IOL = 1 mA 0.20 0.20 1.65 1.65 IOL = 2 mA 0.25 0.25 2.3 2.3 IOL = 4 mA 0.40 0.40 3 3 IOL = 8 mA 0.55 0.55 1.4-3.6 1.4-3.6 IOH = -100µA VCCA-0.2 VCCA-0.2 1.4 1.4 IOH = -1 mA 1.05 1.05 1.65 1.65 IOH = -4 mA 1.20 1.20 2.3 2.3 IOH = -6 mA 1.75 1.75 3 3 IOH = -8 mA 2.30 2.30 du 1.65 1.4 V 0.8 IOH = -1 mA ro P e V s ( t c 1.4 VOH High level output (A port) voltage 1.4-3.6 s b O Max. 0.65VCCB ete ol Unit 0.35VCCA 0.7 2.7-3.6 VIH High level input (B port) voltage Min. 0.65VCCA 1.4-1.95 VIL Low level input (A port) voltage -40 to 85 °C V V V V ST6G3238E Table 8. DC and AC parameters DC specification (continued) Test conditions Symbol Parameter VOL Low level output (B port) voltage Input leakage current for A side IIA VCCA (V) VCCB (V) 1.4-3.6 1.4-3.6 1.4 Value TA = 25 °C Min. Max. Input leakage current for B side 0.20 1.4 IOL = 1 mA 0.35 0.35 1.65 1.65 IOL = 4 mA 0.45 0.45 2.3 2.3 IOL = 6 mA 0.55 0.55 3 3 IOL = 8 mA 0.70 0.70 1.8 2.9 VIA=VCC or GND DIR=HIGH VCD=VWP=V 1.8 2.9 1.65 3.6 VCLK.h=VCCA VCMD= VCCB VDAT0,DAT1,D AT2=VCCB VDAT3=GND DIR=LOW VCD=VWP=V ±5 µA ±0.5 ±5 µA ) (s ICCA d o r P e ICCB s b O t e l o IWP ICD Quiescent supply current for B side t c u 1.8 1.8 2.5 2.6 0.5 5 µA 0.5 5 µA e t e ol s b O VIA=VCCA or GND VCD=VWP=V V ) s ( ct du ±0.5 Unit Max. 0.20 CCA Quiescent supply current for A side Min. IOL = 100 µA CCA IIB -40 to 85 °C o r P CCA 3.6 3.6 DIR=HIGH 1.65 3.6 1.8 2.5 1.8 3.6 3.6 3.6 VCLK.h=VCCA or GND VIB=OPEN DIR=LOW VCD=VWP=V CCA WP pin input leakage current CD pin input leakage current 1.8 1.8 3.0 VIA=VCCA or GND DIR=HIGH VWP=GND 36 µA 3.0 VIA=VCCA or GND DIR=HIGH VCD=GND 36 µA 9/19 DC and AC parameters ST6G3238E AC electrical characteristics (f = 1 MHz, 50% duty cycle, CL = 30 pF, RL = 500 Ω) Table 9. Test condition TA = -40 to 85 °C Symbol VCCA = 1.8 ± 0.15V Parameter VCCB=2.5 ± 0.2V VCCA=1.8 ± 0.15V VCCA=2.5 ± 0.2V VCCB=2.7 ± 0.3V Unit VCCB=2.7 ± 0.3V Min. Max. Min. Max. Min. Max. tPLH tPHL Propagation delay time An to Bn 1.0 7.2 1.0 6.6 1.0 6.1 tPLH tPHL Propagation delay time Bn to An 1.0 8.1 1.0 7.5 1.0 5.0 ns tOSLH tOSHL Output to output skew time (1)(2) 0.5 0.5 0.5 ns tCDLH tCDHL Clock and data skew time 0.5 0.5 0.5 ns Clock fmax Data From A to B 52 52 52 From B to A 52 52 52 From A to B 52 52 From B to A 52 52 ) s ( ct MHz u d o 52 r P e Mbps 52 1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two outputs of the same device switching in the same direction, either HIGH or LOW (tOSLH = | tPLHm = tPLHn |, tOSHL = | tPHLm – tPHLn |) t e l o 2. Parameter guaranteed by design. Output slew rate (f = 1 MHz, 50% duty cycle, CL=15 pF, RL=500 Ω) Table 10. Symbol Parameter c u d tr Rise time tf Fall time Table 11. -O From ) s ( t o r P bs Test condition TA = -40 to 85 °C VCCA = 1.8V ± 0.15V To Unit VCCB = 3V ± 0.3V Min. Max. 10% 90% 3 ns 90% 10% 3 ns Capacitance characteristics e t e l Symbol Parameter Test condition VCCB (V) VCCA (V) Value TA = 25 °C Unit -40 to 85 °C o s b Input capacitance open open 9 pF CI/OA Input/output capacitance for A-side 3.3 2.5 17 pF CI/OB Input/output capacitance for B-side 3.3 2.5 33 pF CPD(1) Power dissipation capacitance 3.3 2.5 3.3 1.8 O CINB Min. f = 10 MHz Typ. Max. Min. 29 29 Max. pF 1. CPD is defined as the value of the IC's internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to Test Circuit). Average current can be obtained by the following equation. ICC(opr) - CPD x VCC x fIN + ICC/16 (per circuit) Note: 10/19 VIA = Input I/Os including CLK.h, CMD.h, DAT0.h, DAT1.h, DAT2.h, DAT3.h VIB = Input I/Os including CMD, DAT0, DAT1, DAT2, DAT3 ST6G3238E I/O and test circuit 6 I/O and test circuit Figure 3. Input and output equivalent circuit ) s ( ct u d o Figure 4. r P e t e l o Test circuit ) (s s b O t c u d o r P e t e l o s b O Table 12. Test values Test tPLH, tPHL tPZL, tPLZ (VCC = 3.0 to 3.6 V) Switch Open 6V tPZL, tPLZ (VCC = 2.3 to 2.7 V or VCC = 1.6 to 1.95 V) 2 VCC tPZH, tPHZ GND 11/19 Waveforms ST6G3238E 7 Waveforms Figure 5. Waveform - propagation delay (f = 1 MHz, 50% duty cycle) ) s ( ct u d o r P e t e l o Table 13. r P e Note: 1.65 to 1.95 V VCC VCC VCC 1.5 V VCC/2 VCC/2 VX VOL+0.3 V VOL+0.15 V VOL+0.15 V VY VOL-0.3 V VOL-0.15 V VOL-0.15 V VM CL = 15 pF for output slew rate measurement RL = R1 = 500Ω or equivalent RT = ZOUT of pulse generator (typically 50Ω) 12/19 VCC 2.3 to 2.7 V let o s b od 3.0 to 3.6 V VIH O t c u Waveform symbol value Symbol ) (s s b O ST6G3238E 8 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 14. µTFBGA25 mechanical data Dimension (mm) Dimension (inch) ) s ( ct Dim Ref A Min. Typ. Max Min. Typ. 1.0 1.10 1.16 0.039 0.043 A1 u d o 0.25 A2 0.78 b 0.25 D 2.90 0.86 0.031 0.30 0.35 0.010 3.0 3.10 0.114 D1 so 2.0 E 2.90 3.0 E1 2.0 e 0.50 SE 0.25 b O 3.10 s ( t c )- e t e l 0.114 Pr Max 0.046 0.010 0.034 0.012 0.014 0.118 0.122 0.079 0.118 0.122 0.079 0.020 0.010 u d o r P e t e l o s b O 13/19 Package mechanical data Figure 6. ST6G3238E Package dimensions ) s ( ct u d o r P e t e l o Table 15. ) (s s b O t c u µTFBGA25 tape and reel information od Dimension (mm) Dim Ref Pr Min. e t e ol Typ. A bs O Max Min. Typ. 330 13.2 Max 12.992 C 12.8 D 20.2 0.795 N 60 2.362 T 14/19 Dimension (inch) 0.504 0.519 14.4 0.567 Ao 3.3 0.130 Bo 3.3 0.130 Ko 1.60 0.063 Po 3.9 4.1 0.153 0.161 P 7.9 8.1 0.311 0.319 ST6G3238E Figure 7. Package mechanical data Reel dimension ) s ( ct u d o r P e t e l o ) (s s b O t c u Table 16. P e TSSOP24 mechanical data t e l o Dim Ref s b O d o r Min. Dimension (mm) Typ. A A1 Dimension (inch) Max Min. Typ. 1.10 0.05 A2 Max 0.043 0.15 0.002 0.90 0.006 0.035 b 0.19 0.30 0.007 0.012 C 0.09 0.20 0.004 0.008 D 7.70 790 0.303 31.102 E 4.3 4.50 0.169 e 0.65 0.177 0.026 H 6.25 6.50 0.246 0.256 L 0.50 0.70 0.020 0.028 K 0º 8º 0º 8º 15/19 Package mechanical data Figure 8. ST6G3238E Package dimensions ) s ( ct u d o r P e t e l o s b O ) (s t c u d o r t e l o P e Table 17. s b O TSSOP24 tape and reel information Dimension (mm) Dimension (inch) Dim Ref Min. A Max Min. 330 C 12.8 D 20.2 N 60 T 16/19 Typ. 13.2 Typ. Max 12.992 0.504 0.519 0.795 2.362 22.4 0.882 Ao 6.8 7 0.268 0.276 Bo 8.2 8.4 0.323 0.331 Ko 1.7 1.9 0.067 0.075 Po 3.9 4.1 0.153 0.161 P 11.9 12.1 0.468 0.476 ST6G3238E Figure 9. Package mechanical data Reel dimension ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 17/19 Revision history 9 ST6G3238E Revision history Table 18. Document revision history Date Revision 10-Feb-2006 1 First Release 23-Feb-2006 2 New Template 16-Aug-2006 3 Values updated in Table 8: DC specification on page 8 4 Changed title of Table 1 to Device summary, and modified column titles. Changed the CL value to 15 pF and modified rise and fall time from/to percentages in Table 10 on page 10. Modified the CL value and text in the Note: on page 12. Changed title of Table 18 to Document revision history. Minor text changes throughout the document. 04-Aug-2008 Changes ) s ( ct u d o r P e t e l o ) (s t c u d o r P e t e l o s b O 18/19 s b O ST6G3238E ) s ( ct Please Read Carefully: u d o Information in this document is provided solely in connection with ST products. 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