STAC2932FW

STAC2932F RF power transistor HF/VHF/UHF RF power N-channel MOSFETs Features ■ Gold metallization ■ Excellent thermal stability ■ Common source push-pull configuration ■ POUT = 300 W min. with 20 dB gain @ 175 MHz ■ In compliance with the 2002/95/EC European directive ■ ST air cavity packaging technology - STAC™ package STAC244F Air cavity Description The STAC2932F is a gold metallized N-channel MOS field-effect RF power transistor, intended for use in 50 V DC large signal applications up to 250 MHz. Figure 1. Pin connection 1 1 The STAC2932F benefits from the latest generation of efficient, patent-pending package technology, otherwise known as STAC™. 2 2 Table 1. 3 1. Drain 3. Source 2. Gate (Bottom side) Device summary Order code Marking Base qty. Package Packaging STAC2932FW STAC2932F(1) 20 STAC244F Tray 1. For more details please refer to Chapter 7: Marking, packing and shipping specifications. January 2012 Doc ID 17120 Rev 3 1/14 www.st.com 14 Contents STAC2932F Contents 1 2 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7 Marking, packing and shipping specifications . . . . . . . . . . . . . . . . . . . 12 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2/14 Doc ID 17120 Rev 3 STAC2932F Electrical data 1 Electrical data 1.1 Maximum ratings Table 2. Absolute maximum ratings (TCASE = 25 °C) Symbol V(BR)DSS(1) VDGR VGS ID PDISS TJ TSTG Parameter Value Unit Drain source voltage 125 V Drain-gate voltage (RGS = 1 MΩ) 125 V Gate-source voltage ±20 V Drain current 40 A Power dissipation 625 W Max. operating junction temperature 200 °C -65 to +150 °C Value Unit 0.28 °C/W Storage temperature 1. TJ = 150 °C 1.2 Thermal data Table 3. Symbol RthJC Thermal data Parameter Junction - case thermal resistance Doc ID 17120 Rev 3 3/14 Electrical characteristics 2 STAC2932F Electrical characteristics (TCASE = 25 oC) 2.1 Static Table 4. Static (per side) Symbol Test conditions Min. 125 Unit VGS = 0 V IDS = 100 mA IDSS VGS = 0 V VDS = 50 V 50 μA IGSS VGS = 20 V VDS = 0 V 250 nA VGS(Q) VDS = 10 V ID = 250 mA 4.0 V VDS(ON) VGS = 10 V ID = 10 A 3.0 V GFS VDS = 10 V ID = 5 A COSS 1.5 VGS = 0 V VDS = 50 V V 2.5 5 f = 1 MHz CRSS S 468 pF 206 pF 16 pF Dynamic Table 5. Symbol 4/14 Max. V(BR)DSS CISS 2.2 Typ. Dynamic Test conditions Min. Typ. Max. Unit POUT VDD = 50 V, IDQ = 2 x 250 mA, PIN = 4 W, f = 175 MHz 300 390 W hD VDD = 50 V, IDQ = 2 x 250 mA, PIN = 4 W, f = 175 MHz 55 68 % Doc ID 17120 Rev 3 STAC2932F 3 Note: Impedance Impedance Figure 2. Current conventions Table 6. Impedance data Freq. (MHz) ZIN (Ω) ZDL(Ω) 175 MHz 2.0 - j2.0 3.5 + j5.2 Measured gate to gate and drain to drain, respectively. Doc ID 17120 Rev 3 5/14 Typical performance STAC2932F 4 Typical performance Figure 3. Capacitances vs drain supply voltage Figure 4. !-V  ".W   0IN7  0IN7  #OSS  #RSS  #ISS 0OUT7 #APACITANCESP& Output power vs drain supply voltage    0IN7          )UHT 0+] ,GT [P$ 7FDVH  &          6DD6 6DD6 Figure 5. Output power vs gate voltage Figure 6. !-V  6DD6 6DD6   0OUT7 0OUT7 4CASEƒ#      )UHT 0+] ,GT [P$ 7FDVH   & 0IN7  )UHT 0+] ,GT [P$ 7FDVH  &     6/14 !-V  4CASEƒ#   Output power vs input power  4CASE ƒ#      6GS6                )NPUTPOWER7 Doc ID 17120 Rev 3 STAC2932F Figure 7. Typical performance Output power vs input power and case temperature Figure 8. !-V  %FFICIENCY 0OUT7  )UHT 0+] 9GG 9 ,GT [P$  $0Y    Efficiency vs output power and case temperature  4CASE ƒ#  4CASEƒ#  4CASEƒ#    )UHT 0+] 9GG 9 ,GT [P$  4CASE ƒ# 4CASEƒ# 4CASEƒ#                  )NPUTPOWER7 Doc ID 17120 Rev 3              /UTPUTPOWER7 7/14 Test circuit STAC2932F 5 Test circuit Figure 9. 175 MHz schematic (production test circuit) $ # # $ $ % # # # # # % % $ «52#%' &+/'05+10«6#$.' &+/ +0 // # $     %   # % 64#05/+55+10«.+0'«&+/'05+105 ($ % ($ 4 ($ %14' 6 6 % ($ .+ % 6GF 6 % % % % % % % % % 6 % % ($ 8II 4 ($ % 4 4 % % % 016'5 «&+/'05+105«#6«%1/210'06«5;/$1.5«#4'«4'('4'0%'«(14«%1/210'06«2.#%'/'06«5''«5*''6« «)#2«$'69''0«)4170&« «64#05/+55+10«.+0'5«+5«=?«««««««««««««6;2 Table 7. 175 MHz part list Component Description C1, C2, C14, C15, C24, C25 1200 pF ATC 700B chip capacitor C5 75 pF ATC 100B chip capacitor C6 ST406 variable capacitor C9, C10 47 pF ATC 100B chip capacitor C11, C12, C13 43 pF ATC 100B chip capacitor C16, C18 470 pF ATC 100B chip capacitor C17, C19, C20, C21 10,000 pF ATC 200B chip capacitor C22, C23 .1 μF 200 V chip capacitor C28 10 μF 100 V electrolytic capacitor C29 .8 - 8 pF variable capacitor R1, R2, R5, R6 430 Ω, 1/2 W chip resistor 8/14 % %14' % % $ ($ 4 %14' % 4 %14' 8II 8 Doc ID 17120 Rev 3 $ % STAC2932F Table 7. Test circuit 175 MHz part list (continued) Component Description R3, R4 270 Ω 1/2 W axial lead resistor B1 RG-316 50 Ω 11.8" thru ferrite toroid B2 RG-142 50 Ω 11.8" T1 4:1, RG-316 25 Ω, 5.9", 2 turns thru ferrite core T2 1:4, 25 Ω semi-rigid cable, OD .141", 5.9" L1 λ/4 inductor, RG-142 50 Ω, 11.8", 3 turns thru ferrite toroid FB1,FB5 Ferrite toroid FB2, FB6 Multi-aperture core FB3, FB4 Surface mount ferrite bead PCB Rogers ultralam 2000, Er 2.55, .060" Figure 10. Circuit layout Doc ID 17120 Rev 3 9/14 Package mechanical data 6 STAC2932F Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 8. STAC244F package dimensions mm. Inch Dim. 10/14 Min Max Min Max A 5.10 5.59 200 220 A1 4.32 4.83 170 190 B 4.32 5.33 170 210 C 9.65 9.91 380 390 D 19.61 20.02 772 788 E 20.45 20.70 805 815 F 0.08 1.15 .003 .006 G 0.89 1.14 .035 .045 H 1.45 1.70 .057 .067 I 3.18 4.32 .125 .170 J 9.27 9.53 .365 .375 Doc ID 17120 Rev 3 STAC2932F Package mechanical data Figure 11. Package dimensions !-V Doc ID 17120 Rev 3 11/14 Marking, packing and shipping specifications 7 STAC2932F Marking, packing and shipping specifications Table 9. Packing and shipping specifications Order code Packaging Pcs per tray Dry pack humidity Lot code STAC2932FW Tray 20 < 10 % Not mixed Figure 12. Marking layout Table 10. 12/14 Marking specifications Symbol Description W Wafer process code CZ Assembly plant xxx Last 3 digit of diffusion lot VY Diffusion plant MAR Country of origin CZ Test and finishing plant y Assembly year yy Assembly week Doc ID 17120 Rev 3 STAC2932F 8 Revision history Revision history Table 11. Document revision history Date Revision Changes 12-Feb-2010 1 First release. 29-Jun-2010 2 Updated features and description on cover page. 12-Jan-2012 3 Inserted Section 7: Marking, packing and shipping specifications. Minor text changes. Doc ID 17120 Rev 3 13/14 STAC2932F Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 14/14 Doc ID 17120 Rev 3