START499D

START499D NPN RF silicon transistor Features ■ High efficiency ■ Common emitter configuration ■ Broadband performances POUT = 29 dBm with 14 dB gain @ 900 MHz ■ Plastic package ■ Linear and non linear operation ■ Supplied in tape and reel ■ In compliance with the 2002/95/EC european directive u d o SOT-89 Figure 1. Description The START499D provide the market with a Si state-of-art RF process. Manufactured with ST 3rd generation bipolar process, it offers the highest power, gain and efficiency in SOT-89 for given breakdown voltage (BVCEo). START499D is suitable for a wide range of application up to 1 GHz. ) s ( ct r P e Pin connection t e l o bs Emitter O ) s ( t c u d o e t e ol Pr Base Emitter Collector s b O Table 1. Device summary Order code Marking Package Packaging START499D D499 SOT-89 Tape and reel June 2010 Doc ID 14496 Rev 4 1/18 www.st.com 18 Contents START499D Contents 1 2 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 ) s ( ct u d o 3 Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Test circuit, part list and photo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 r P e t e l o s b O 6.1 Thermal pad and via design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.2 Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 ) (s t c u 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 d o r P e t e l o s b O 2/18 Doc ID 14496 Rev 4 START499D Electrical data 1 Electrical data 1.1 Maximum ratings Table 2. Absolute maximum ratings (TCASE = +25 °C) Symbol Value Unit VCEO Collector - emitter voltage 4.5 V VEBO Emitter - base voltage 1.5 V Collectorcurrent 1.0 A Power dissipation 1.7 Max. operating junction temperature 150 IC PDISS TJ TSTG 1.2 Parameter r P e Thermal data Symbol ) (s t e l o s b O Parameter Junction - case thermal resistance RthJC uc -65 to +150 Thermal data Table 3. W od Storage temperature ) s ( t °C °C Value Unit 75 °C/W t c u d o r P e t e l o s b O Doc ID 14496 Rev 4 3/18 Electrical characteristics START499D 2 Electrical characteristics 2.1 Static Table 4. Static TCASE = +25 oC Symbol Min. Max. Unit VCB = 15 V 5 µA IEBO VEB = 1.2 V 250 µA BVCES IC = 200 µA VCE = 3 V 15 20 IC = 0.16 A ) s ( ct u d o r P e Dynamic Symbol Test conditions t e l o POUT GP V 150 Dynamic Table 5. s b O VCC = 3.6 V, ICQ = 30 mA, PIN = 15 dBm, f = 900 MHz hD Load VCC = 3.6 V, ICQ = 30 mA, POUT = 28 dBm, f = 900 MHz mismatch All phase angles )- s ( t c u d o r P e t e l o s b O 4/18 Typ. ICBO hFE 2.2 Test conditions Doc ID 14496 Rev 4 Min. Typ. 28 29 dBm 13 14 dB 55 65 % 3:1 Max. Unit VSWR START499D 3 Impedance Impedance Figure 2. Current conventions ZL C ZS B ) s ( ct E Table 6. u d o Frequency (MHz) ZBS (Ω) 800 16.58 - j4.04 820 15.81 - j3.81 16.28 - j5.11 840 bs 15.04 - j3.53 14.77 - j4.67 14.31 - j3.21 13.44 - j4.15 13.61 - j2.83 12.25 - j3.54 12.93 - j2.44 11.19 - j2.90 12.27 - j2.01 10.24 - j2.22 940 11.66 - j1.53 9.40 - j1.52 960 11.06 - j1.04 8.65 - j0.81 980 10.52 - j0.54 7.99 - j0.11 1000 9.98 + j0.02 7.38 + j0.62 t e l o O ) 860 t(s 880 900 c u d 920 ro P e let o s b r P e Impedance data ZCL(Ω) 17.95 - j5.49 O Doc ID 14496 Rev 4 5/18 Typical performance START499D 4 Typical performance Figure 3. DC output characterisitics Figure 4. BVEBO ) s ( ct START499D START499D u d o r P e Figure 5. t e l o BVCES ) (s s b O t c u d o r P e START499D t e l o s b O 6/18 Doc ID 14496 Rev 4 START499D Figure 6. Typical performance Gain vs frequency Figure 7. 20 Efficiency vs frequency 80 75 18 Pin=13dBm Pin=14dBm Pin=15dBm Pin=13dBm Pin=14dBm Pin=15dBm Efficiency [%] 70 Gain[dB] 16 14 65 ) s ( ct 60 Vcc = 3.6V Icq = 30mA 12 55 u d o Vcc = 3.6V Icq = 30mA 10 800 820 840 860 880 900 920 940 960 980 50 800 820 840 860 880 900 920 940 960 980 1000 1000 r P e Frequency [MHz] Frequency [MHz] Gain and efficiency vs frequency y q 17 100 16 90 t(s c u d Gain [dB] 14 12 e t e l 11 o s b 10 800 O )- 820 840 860 o r P 900 70 60 Frequency [MHz] -20 -30 -40 40 920 Vcc = 3.6V Icq = 30mA Pout = 28dBm 50 Vcc = 3.6V Icq = 30mA Pout = 28dBm 880 -10 80 Efficiency [%] 15 Harmonics vs frequency s b O 0 Gain Efficiency 13 t e l o Figure 9. y Harmonics [dBc] Figure 8. 940 960 980 30 1000 -50 H_2nd H_3rd -60 800 820 840 860 880 900 920 940 960 980 1000 Frequency [MHz] Doc ID 14496 Rev 4 7/18 Typical performance START499D Figure 10. Input return loss vs frequency Figure 11. Gain vs output power 0 20 -2 Vcc = 3.6V Icq = 30mA Pout = 28dBm -4 18 860MHz 910MHz 960MHz 16 IRL [dB] Gain [dB] -6 -8 ) s ( ct 12 -10 Vcc = 3.6V Icq = 30mA 10 -12 -14 800 14 820 840 860 880 900 920 940 960 980 8 1000 22 Frequency [MHz] 23 24 u d o Pr 25 26 27 28 29 30 Output Power [dBm] e t e ol Figure 12. Efficiency vs output power Figure 13. Gain vs output power 70 )- 65 50 45 ete 40 c u d 30 b O 16 o r P 15 14 l o s 35 Vcc = 3 V Icq = 30mA 17 Gain [dB] Efficiency [%] 55 18 t(s 860MHz 910MHz 960MHz 60 s b O Vcc = 3.6V Icq = 30mA 860MHz 910MHz 960MHz 13 25 8/18 22 23 24 25 26 27 Output Pow er [dBm] 28 29 30 12 21 22 23 24 25 Output Pow er [dBm] Doc ID 14496 Rev 4 26 27 28 START499D Typical performance Figure 14. Efficiency vs output power Figure 15. Gain vs output power 70 18 65 860MHz 910MHz 960MHz 60 910MHz 960MHz 55 16 50 Gain [dB] Efficiency [%] 860MHz 17 45 40 Vcc = 2 V Icq = 30mA 13 u d o 30 25 21 22 23 24 25 26 27 28 12 16 17 18 19 Output Pow er [dBm] e t e ol 70 ) (s 65 60 Efficiency [%] 21 22 23 24 s b O t c u 55 d o r 50 P e 45 t e l o 40 35 s b O 30 Pr 20 Output Pow er [dBm] Figure 16. Efficiency vs output power 860MHz 910MHz 960MHz ) s ( ct 14 Vcc = 3 V Icq = 30mA 35 15 Vcc = 2 V Icq = 30mA 25 16 17 18 19 20 21 22 23 24 Output Pow er [dBm] Doc ID 14496 Rev 4 9/18 Test circuit, part list and photo 5 START499D Test circuit, part list and photo Figure 17. Test circuit schematic 18 m A C1 1 FR4 Er = 4 .5 H = 2 0 mil C6 C7 V cc 3. 6 V C8 R3 B1 R2 BJT2 B C8 4 7 L2 C9 C1 0 ) s ( ct L3 C 12 R1 C5 u d o L1 TL 4 RF _ in T L1 T L2 r P e TL 5 TL 3 C1 BJT1 C2 S TA RT4 9 9D C4 TL 6 RF_ o ut C3 t e l o Table 7. Components part list Component ID Description C1,C3,C5,C9 Capacitor C2 Capacitor C4 Capacitor C6,C10,C11 Case size Manufacturer Part code 100 pF 1608 Murata GRM1885C1H101JA01 5.6 pF 1608 Murata GRM1885C1HR50CZ01 6.8 pF 1608 Murata GRM1885C1H6R8CZ01 Capacitor 1 nF 1608 Murata GRM1885C1H102JA01 C7 Capacitor 10 nF 1608 Murata GRM188R71H103KA01 C8 Capacitor 1 uF 1608 Murata GRM188R71H105KA01 L1 Inductor 11 nH 1608 Coilcraft 0603CS-11NXGB L2 Inductor 100 nH 1608 Coilcraft 0603CS-R10XGB L3 Inductor 5.4 nH 2012 Coilcraft 0906-5JLB B1 Ferrite bead Panasonic EXCELDRC35C R1 Resister 30 ohm 1608 R3 Resister 180 ohm 1608 R2 Potentiometer 10 KΩ s b O t c u od e t e ol 10/18 ) (s Value s b O Pr 1608 chip resister (0.063 W, ±5 %) Bourns electronics TL1 Transmission line L=11.9 mm W=0.9 mm TL2 Transmission line L=5.0 mm W=0.9 mm TL3 Transmission line L=5.2 mm W=0.9 mm Doc ID 14496 Rev 4 3214W-1-103E START499D Table 7. Test circuit, part list and photo Components part list (continued) Component ID Description Value Case size TL4 Transmission line L=3.5 mm W=0.9 mm TL5 Transmission line L=2.8 mm W=0.9 mm TL6 Transmission line L=12.2 mm W=0.9 mm Manufacturer Part code BJT2 BJT STMicroelectronics BC847 BJT1 BJT STMicroelectronics START499D Board FR4 Er=4.5 THk=0.020" 1OZ Cu both sides ) s ( ct Figure 18. Photo u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O Doc ID 14496 Rev 4 11/18 Package mechanical data 6 START499D Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 12/18 Doc ID 14496 Rev 4 START499D Package mechanical data Table 8. SOT-89 mechanical data Dim. mm. Min Typ Inch Max Min Typ Max A 1.4 1.6 55.1 63.0 B 0.44 0.56 17.3 22.0 B1 0.36 0.48 14.2 18.9 C 0.35 0.44 13.8 17.3 C1 0.35 0.44 13.8 17.3 D 4.4 4.6 173.2 181.1 D1 1.62 1.83 63.8 E 2.40 2.6 94.5 e 1.42 1.57 55.9 e1 2.92 3.07 115.0 H 3.94 4.25 155.1 L 0.89 1.2 e t e l 35.0 ) s ( ct 72.0 Pr u d o 102.4 61.8 120.9 167.3 47.2 o s b Figure 19. Package dimensions O ) s ( t c u d o r P e t e l o s b O Doc ID 14496 Rev 4 13/18 Package mechanical data 6.1 START499D Thermal pad and via design Thernal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device. The via pattern is based on thru-hole vias with 0.203 mm to 0.330 mm finished hole size on a 0.5 mm to 1.2 mm grid pattern with 0.025 plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. Figure 20. Pad layout details ) s ( ct u d o r P e t e l o ) (s t c u s b O SOT-89 d o r P e t e l o s b O 14/18 Doc ID 14496 Rev 4 START499D 6.2 Package mechanical data Soldering profile Figure 21 shows the recommeded solder for devices that have Pb-free terminal plating and where a Pb-free solder is used. Figure 21. Recommended solder profile ) s ( ct u d o r P e t e l o s b O Figure 22 shows the recommeded solder for devices with Pb-free terminal plating used with leaded solder, or for devices with leaded terminal plating used with a leaded solder. ) (s Figure 22. Recommended solder profile for leaded devices t c u d o r P e t e l o s b O Doc ID 14496 Rev 4 15/18 Package mechanical data START499D Figure 23. Reel information ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 16/18 Doc ID 14496 Rev 4 START499D 7 Revision history Revision history Table 9. Document revision history Date Revision Changes 03-Mar-2008 1 Initial release. 15-Jul-2008 2 Updated Table 1 on page 1. 17-Jul-2008 3 Values update on Table 4 on page 4. 29-Jun-2010 4 Updated Table 8 on page 13. ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O Doc ID 14496 Rev 4 17/18 START499D ) s ( ct Please Read Carefully: u d o Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. r P e All ST products are sold pursuant to ST’s terms and conditions of sale. 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