STB13NM60N,
STD13NM60N
N-channel 600 V, 0.28 Ω typ., 11 A MDmesh™ II
Power MOSFETs in D²PAK and DPAK packages
Datasheet — production data
Features
Order code VDS (@Tjmax)
STB13NM60N
TAB
650 V
TAB
ID
0.36 Ω
11 A
STD13NM60N
• 100% avalanche tested
3
3
1
1
• Low input capacitance and gate charge
DPAK
D²PAK
RDS(on) max
• Low gate input resistance
Applications
• Switching applications
Figure 1. Internal schematic diagram
Description
'RU7$%
These devices are N-channel Power MOSFETs
developed using the second generation of
MDmesh™ technology. This revolutionary Power
MOSFET associates a vertical structure to the
company’s strip layout to yield one of the world’s
lowest on-resistance and gate charge. It is
therefore suitable for the most demanding high
efficiency converters.
*
6
6&
Table 1. Device summary
Order code
Marking
Packages
STB13NM60N
D²PAK
13NM60N
STD13NM60N
June 2015
This is information on a product in full production.
Packaging
Tape and reel
DPAK
DocID024095 Rev 3
1/24
www.st.com
Contents
STB13NM60N, STD13NM60N
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
.............................. 6
3
Test circuits
.............................................. 9
4
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1
D2PAK package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.2
DPAK package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5
Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
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DocID024095 Rev 3
STB13NM60N, STD13NM60N
1
Electrical ratings
Electrical ratings
Table 2. Absolute maximum ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source voltage
600
V
VGS
Gate-source voltage
± 25
V
ID
Drain current (continuous) at TC = 25 °C
11
A
ID
Drain current (continuous) at TC = 100 °C
6.93
A
Drain current (pulsed)
44
A
Total dissipation at TC = 25 °C
90
W
Peak diode recovery voltage slope
15
V/ns
- 55 to 150
°C
150
°C
IDM
(1)
PTOT
dv/dt
(2)
Tstg
Tj
Storage temperature
Max. operating junction temperature
1. Pulse width limited by safe operating area
2. ISD ≤ 11 A, di/dt ≤ 400 A/µs, VDS peak ≤ V(BR)DSS, VDD = 80% V(BR)DSS.
Table 3. Thermal data
Value
Symbol
Parameter
Unit
D²PAK
Rthj-case
Thermal resistance junction-case max
Rthj-pcb
Thermal resistance junction-pcb max
DPAK
1.39
30
°C/W
50
°C/W
Table 4. Avalanche characteristics
Symbol
Parameter
Value
Unit
IAS
Avalanche current, repetitive or not-repetitive
(pulse width limited by Tj max)
3.5
A
EAS
Single pulse avalanche energy
(starting TJ=25 °C, ID=IAS, VDD=50 V)
200
mJ
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24
Electrical characteristics
2
STB13NM60N, STD13NM60N
Electrical characteristics
(TCASE = 25 °C unless otherwise specified)
Table 5. On/off states
Symbol
V(BR)DSS
Parameter
Test conditions
Drain-source
breakdown voltage
VGS = 0, ID = 1 mA
Min.
Typ.
Max.
Unit
600
V
VGS = 0, VDS = 600 V
1
µA
VGS = 0, VDS = 600 V,
TC=125 °C
100
µA
Gate-body leakage
current
VDS = 0, VGS = ± 25 V
± 0.1
µA
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250 µA
3
4
V
RDS(on)
Static drain-source
on-resistance
VGS = 10 V, ID = 5.5 A
0.28
0.36
Ω
Min.
Typ.
Max. Unit
-
790
-
pF
-
60
-
pF
-
3.6
-
pF
VGS = 0, VDS = 0 to 480 V
-
135
-
pF
-
27
-
nC
-
4
-
nC
-
14
-
nC
-
4.7
-
Ω
IDSS
Zero gate voltage
drain current
IGSS
2
Table 6. Dynamic
Symbol
Parameter
Test conditions
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer
capacitance
Coss eq. (1)
Equivalent output
capacitance
Qg
Total gate charge
Qgs
Gate-source charge
Qgd
Gate-drain charge
VDD = 480 V, ID = 11 A,
VGS = 10 V,
(see Figure 16)
RG
Gate input resistance
f=1 MHz open drain
VGS = 0, VDS = 50 V,
f = 1 MHz
1. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS
increases from 0 to 80% VDS
Table 7. Switching times
Symbol
td(on)
tr
td(off)
tf
4/24
Parameter
Test conditions
Turn-on delay time
Rise time
Turn-off delay time
VDD = 300 V, ID = 5.5 A
RG = 4.7 Ω VGS = 10 V
(see Figure 15)
Fall time
DocID024095 Rev 3
Min.
Typ.
Max. Unit
-
3
-
ns
-
8
-
ns
-
30
-
ns
-
10
-
ns
STB13NM60N, STD13NM60N
Electrical characteristics
Table 8. Source drain diode
Symbol
Parameter
Test conditions
Min
Typ. Max. Unit
Source-drain current
-
11
A
ISDM
(1)
Source-drain current (pulsed)
-
44
A
VSD
(2)
Forward on voltage
ISD = 11 A, VGS = 0
-
1.5
V
trr
Reverse recovery time
-
230
ns
Qrr
Reverse recovery charge
-
2
µC
IRRM
Reverse recovery current
ISD = 11 A, di/dt = 100 A/µs
VDD = 100 V
(see Figure 17)
-
18
A
-
290
ns
-
2.5
µC
-
17
A
ISD
trr
Reverse recovery time
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
ISD = 11 A, di/dt = 100 A/µs
VDD = 100 V, Tj = 150 °C
(see Figure 17)
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%
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24
Electrical characteristics
2.1
STB13NM60N, STD13NM60N
Electrical characteristics (curves)
Figure 2. Safe operating area for D²PAK
Figure 3. Thermal impedance for D²PAK
AM03258v1
ai
s
ID
(A)
Op
Lim erat
ite ion
d b in
y m this
ax ar
R e
DS
(o
n)
10
1
0.1
0.1
10µs
100µs
Tj=150°C
Tc=25°C
1ms
Sinlge
pulse
10ms
10
1
100
VDS(V)
Figure 4. Safe operating area for DPAK
Figure 5. Thermal impedance for DPAK
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,'
$
LV
V
6
RQ
2S
/LP HUD
LWH WLRQ
G LQ
E\ WK
P LV
D[ DU
5 HD
'
V
7M &
7F &
PV
6LQJOH
SXOVH
PV
9'69
Figure 6. Output characteristics
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9*6 9
6/24
Figure 7. Transfer characteristics
9
9
9'6 9
9
$0Y
,'
$
9'69
DocID024095 Rev 3
9*69
STB13NM60N, STD13NM60N
Electrical characteristics
Figure 8. Normalized V(BR)DSS vs temperature
AM09028v1
V(BR)DSS
(norm)
ID=1mA
1.10
Figure 9. Static drain-source on-resistance
AM03302v1
RDS(on)
(Ω)
0.30
1.08
1.06
VGS=10V
0.28
1.04
1.02
0.26
1.00
0.24
0.98
0.96
0.22
0.94
0.92
-50 -25
0
25
75 100
50
Figure 10. Gate charge vs gate-source voltage
AM03305v1
VGS
(V)
VDS(V)
VDD=480V
12
4
2
6
10
8
ID(A)
Figure 11. Capacitance variations
$0Y
&
S)
500
ID=11A
VDS
0.2
0
TJ(°C)
10
&LVV
400
8
300
6
&RVV
200
4
100
2
0
0
20
10
30
0
Qg(nC)
Figure 12. Normalized gate threshold voltage vs
temperature
AM03306v1
VGS(th)
(norm)
1.10
&UVV
9'69
Figure 13. Normalized on-resistance vs
temperature
AM03307v1
RDS(on)
(norm)
2.1
ID=250µA
ID=5.5A
VGS=10V
1.9
1.7
1.00
1.5
1.3
0.90
1.1
0.9
0.80
0.7
0.70
-50 -25
0
25
50
75 100
TJ(°C)
0.5
-50 -25
DocID024095 Rev 3
0
25
50
75 100
TJ(°C)
7/24
24
Electrical characteristics
STB13NM60N, STD13NM60N
Figure 14. Source-drain diode forward
characteristics
AM09290v1
VSD
(V)
TJ=-50°C
TJ=25°C
1.2
1.0
TJ=150°C
0.8
0.6
0.4
0
8/24
2
4
6
8
10 ISD(A)
DocID024095 Rev 3
STB13NM60N, STD13NM60N
3
Test circuits
Test circuits
Figure 15. Switching times test circuit for
resistive load
Figure 16. Gate charge test circuit
VDD
12V
47kΩ
1kΩ
100nF
3.3
μF
2200
RL
μF
IG=CONST
VDD
VGS
100Ω
Vi=20V=VGMAX
VD
RG
2200
μF
D.U.T.
D.U.T.
VG
2.7kΩ
PW
47kΩ
1kΩ
PW
AM01468v1
Figure 17. Test circuit for inductive load
switching and diode recovery times
A
A
AM01469v1
Figure 18. Unclamped inductive load test circuit
L
A
D
G
D.U.T.
FAST
DIODE
B
B
VD
L=100μH
S
3.3
μF
B
25 Ω
1000
μF
D
VDD
2200
μF
3.3
μF
VDD
ID
G
RG
S
Vi
D.U.T.
Pw
AM01470v1
AM01471v1
Figure 19. Unclamped inductive waveform
Figure 20. Switching time waveform
ton
V(BR)DSS
tdon
VD
toff
tr
tdoff
tf
90%
90%
IDM
10%
ID
VDD
10%
0
VDD
VDS
90%
VGS
AM01472v1
0
DocID024095 Rev 3
10%
AM01473v1
9/24
24
Package information
4
STB13NM60N, STD13NM60N
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
4.1
D2PAK package information
Figure 21. D²PAK (TO-263) type A package outline
B$BUHY
10/24
DocID024095 Rev 3
STB13NM60N, STD13NM60N
Package information
Table 9. D²PAK (TO-263) type A package mechanical data
mm
Dim.
Min.
Typ.
Max.
A
4.40
4.60
A1
0.03
0.23
b
0.70
0.93
b2
1.14
1.70
c
0.45
0.60
c2
1.23
1.36
D
8.95
9.35
D1
7.50
7.75
8.00
D2
1.10
1.30
1.50
E
10
E1
8.50
8.70
8.90
E2
6.85
7.05
7.25
10.40
e
2.54
e1
4.88
5.28
H
15
15.85
J1
2.49
2.69
L
2.29
2.79
L1
1.27
1.40
L2
1.30
1.75
R
V2
0.4
0°
8°
DocID024095 Rev 3
11/24
24
Package information
STB13NM60N, STD13NM60N
Figure 22. D²PAK (TO-263) type B package outline
B%BUHY
12/24
DocID024095 Rev 3
STB13NM60N, STD13NM60N
Package information
Table 10. D²PAK (TO-263) type B package mechanical data
mm
Dim.
Min.
Typ.
Max.
A
4.36
4.60
A1
0
0.25
b
0.70
0.93
b2
1.14
1.70
c
0.38
0.694
c1
0.38
0.534
c2
1.19
1.36
D
8.6
9.35
D1
6.9
E
10
E1
8.1
10.55
e
2.54
H
15
15.85
L
1.9
2.79
L1
1.65
L2
1.78
L3
L4
0.25
4.78
5.28
DocID024095 Rev 3
13/24
24
Package information
STB13NM60N, STD13NM60N
Figure 23. D²PAK footprint(a)
)RRWSULQW
a. All dimension are in millimeters
14/24
DocID024095 Rev 3
STB13NM60N, STD13NM60N
4.2
Package information
DPAK package information
Figure 24. DPAK (TO-252) type A2 package outline
BW\SH$BUHY
DocID024095 Rev 3
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24
Package information
STB13NM60N, STD13NM60N
Table 11. DPAK (TO-252) type A2 package mechanical data
mm
Dim.
Min.
Typ.
A
2.20
2.40
A1
0.90
1.10
A2
0.03
0.23
b
0.64
0.90
b4
5.20
5.40
c
0.45
0.60
c2
0.48
0.60
D
6.00
6.20
D1
4.95
E
6.40
E1
5.10
5.20
5.30
e
2.16
2.28
2.40
e1
4.40
4.60
H
9.35
10.10
L
1.00
1.50
L1
2.60
2.80
3.00
L2
0.65
0.80
0.95
L4
0.60
5.10
V2
5.25
6.60
1.00
R
16/24
Max.
0.20
0°
8°
DocID024095 Rev 3
STB13NM60N, STD13NM60N
Package information
Figure 25. DPAK (TO-252) type C2 outline
¡
BBW\SHB&
DocID024095 Rev 3
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24
Package information
STB13NM60N, STD13NM60N
Table 12. DPAK (TO-252) type C2 package mechanical data
mm
Dim.
Min.
Typ.
Max.
A
2.20
2.30
2.38
A1
0.90
1.01
1.10
A2
0.00
0.10
b
0.72
0.85
b4
5.13
c
0.47
0.60
c2
0.47
0.60
D
6.00
6.10
6.20
D1
5.25
-
-
E
6.50
6.60
6.70
E1
5.20
-
-
e
2.186
2.286
2.386
H
9.80
10.10
10.40
L
1.40
1.50
1.70
L1
L2
0.90
-
1.25
0.51 BSC
0.60
L6
18/24
5.46
2.90 REF
L3
L4
5.33
0.80
1.00
1.80 BSC
Θ1
5°
7°
9°
Θ2
5°
7°
9°
V2
0°
8°
DocID024095 Rev 3
STB13NM60N, STD13NM60N
Package information
Figure 26. DPAK (TO-252) footprint (b)
)3B4
b. All dimensions are in millimeters
DocID024095 Rev 3
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24
Packing information
5
STB13NM60N, STD13NM60N
Packing information
Figure 27. Tape
10 pitches cumulative
tolerance on tape +/- 0.2 mm
T
P0
Top cover
tape
P2
D
E
F
K0
W
B0
A0
P1
D1
User direction of feed
R
Bending radius
User direction of feed
AM08852v2
20/24
DocID024095 Rev 3
STB13NM60N, STD13NM60N
Packing information
Figure 28. Reel
T
REEL DIMENSIONS
40mm min.
Access hole
At sl ot location
B
D
C
N
A
Full radius
G measured at hub
Tape slot
in core for
tape start 25 mm min.
width
AM08851v2
Table 13. D²PAK (TO-263) tape and reel mechanical data
Tape
Reel
mm
mm
Dim.
Dim.
Min.
Max.
A0
10.5
10.7
A
B0
15.7
15.9
B
1.5
D
1.5
1.6
C
12.8
D1
1.59
1.61
D
20.2
E
1.65
1.85
G
24.4
F
11.4
11.6
N
100
K0
4.8
5.0
T
P0
3.9
4.1
P1
11.9
12.1
Base qty
1000
P2
1.9
2.1
Bulk qty
1000
R
50
T
0.25
0.35
W
23.7
24.3
DocID024095 Rev 3
Min.
Max.
330
13.2
26.4
30.4
21/24
24
Packing information
STB13NM60N, STD13NM60N
Table 14. DPAK (TO-252) tape and reel mechanical data
Tape
Reel
mm
mm
Dim.
Dim.
Min.
Max.
A0
6.8
7
A
B0
10.4
10.6
B
1.5
12.1
C
12.8
1.6
D
20.2
G
16.4
50
B1
22/24
Min.
Max.
330
13.2
D
1.5
D1
1.5
E
1.65
1.85
N
F
7.4
7.6
T
K0
2.55
2.75
P0
3.9
4.1
Base qty.
2500
P1
7.9
8.1
Bulk qty.
2500
P2
1.9
2.1
R
40
T
0.25
0.35
W
15.7
16.3
DocID024095 Rev 3
18.4
22.4
STB13NM60N, STD13NM60N
6
Revision history
Revision history
Table 15. Document revision history
Date
Revision
Changes
18-Dec-2012
1
First release
10-Jul-2014
2
– Updated: Section 3: Test circuits
– Updated: Section 4: Package information
– Minor text changes
19-Jun-2015
3
– Updated 4: Package information
– Minor text changes
DocID024095 Rev 3
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24
STB13NM60N, STD13NM60N
IMPORTANT NOTICE – PLEASE READ CAREFULLY
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acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2015 STMicroelectronics – All rights reserved
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