STB41N40DM6AG
Datasheet
Automotive-grade N-channel 400 V, 0.050 Ω typ., 41 A, MDmesh™ DM6
Power MOSFET in a D²PAK package
Features
TAB
2
Order code
VDS
RDS(on) max.
ID
STB41N40DM6AG
400 V
0.065 Ω
41 A
3
1
D²PAK
D(2, TAB)
•
•
•
AEC-Q101 qualified
Fast-recovery body diode
Lower RDS(on) per area vs previous generation
•
•
•
•
Low gate charge, input capacitance and resistance
100% avalanche tested
Extremely high dv/dt ruggedness
Zener-protected
Applications
G(1)
•
Switching applications
Description
S(3)
NG1D2TS3Z
Product status link
STB41N40DM6AG
This high-voltage N-channel Power MOSFET is part of the MDmesh™ DM6 fastrecovery diode series. Compared with the previous MDmesh fast generation, DM6
combines very low recovery charge (Qrr), recovery time (trr) and excellent
improvement in RDS(on) per area with one of the most effective switching behaviors
available in the market for the most demanding high-efficiency bridge topologies and
ZVS phase-shift converters.
Product summary
Order code
STB41N40DM6AG
Marking
41N40DM6
Package
D2PAK
Packing
Tape and reel
DS12571 - Rev 1 - May 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
STB41N40DM6AG
Electrical ratings
1
Electrical ratings
Table 1. Absolute maximum ratings
Symbol
Value
Unit
Gate-source voltage
±25
V
Drain current (continuous) at TC = 25 °C
41
A
Drain current (continuous) at TC = 100 °C
26
A
IDM(1)
Drain current (pulsed)
150
A
PTOT
Total dissipation at TC = 25 °C
250
W
dv/dt(2)
Peak diode recovery voltage slope
50
dv/dt(3)
MOSFET dv/dt ruggedness
100
VGS
ID
TJ
Parameter
Operating junction temperature range
Tstg
Storage temperature range
V/ns
-55 to 150
°C
Value
Unit
1. Pulse width limited by safe operating area
2. ISD ≤ 41 A, di/dt ≤ 800 A/μs, VDS peak < V(BR)DSS, VDD = 320 V
3. VDS ≤ 320 V
Table 2. Thermal data
Symbol
Rthj-case
(1)
Rthj-pcb
Parameter
Thermal resistance junction-case
0.5
Thermal resistance junction-pcb
30
°C/W
1. When mounted on an 1-inch² FR-4, 2 Oz copper board.
Table 3. Avalanche characteristics
Symbol
IAR
EAS
DS12571 - Rev 1
Parameter
Avalanche current, repetitive or not repetitive
(pulse width limited by Tjmax)
Single pulse avalanche energy
(starting Tj = 25°C, ID = IAR, VDD = 100 V)
Value
Unit
6
A
760
mJ
page 2/14
STB41N40DM6AG
Electrical characteristics
2
Electrical characteristics
TC = 25 °C unless otherwise specified
Table 4. On-/off-states
Symbol
V(BR)DSS
Parameter
Test conditions
Drain-source breakdown voltage
VGS= 0 V, ID = 1 mA
Min.
Typ.
400
Zero gate voltage drain current
1
µA
100
µA
±1
µA
4
5
V
0.050
0.065
Ω
Min.
Typ.
Max.
Unit
-
2310
-
pF
-
151
-
pF
-
10
-
pF
VGS = 0 V, VDS = 400 V,
TC = 125 °C(1)
IGSS
Gate body leakage current
VDS = 0 V, VGS = ±25 V
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250 µA
RDS(on)
Static drain-source on-resistance
VGS = 10 V, ID = 20.5 A
Unit
V
VGS = 0 V, VDS = 400 V
IDSS
Max.
3
1. Defined by design, not subject to production test.
Table 5. Dynamic
Symbol
Parameter
Test conditions
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer capacitance
Coss eq.(1)
Equivalent output capacitance
VDS = 0 to 320 V, VGS = 0 V
-
450
-
pF
RG
Intrinsic gate resistance
f = 1 MHz open drain
-
1.3
-
Ω
Qg
Total gate charge
VDD = 320 V, ID = 41 A,
-
53
-
nC
Qgs
Gate-source charge
VGS = 0 to 10 V
-
12
-
nC
Qgd
Gate-drain charge
(see Figure 14. Test circuit for gate
charge behavior)
-
29
-
nC
VDS = 100 V, f = 1 MHz, VGS = 0 V
1. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0
to 80% VDSS.
Table 6. Switching times
Symbol
td(on)
tr
td(off)
tf
DS12571 - Rev 1
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Turn-on delay time
VDD = 200 V, ID = 20.5 A,
-
18
-
ns
Rise time
RG = 4.7 Ω, VGS = 10 V
-
10.3
-
ns
Turn-off delay time
(see Figure 13. Test circuit for
resistive load switching times and
Figure 18. Switching time
waveform)
-
46
-
ns
-
9.4
-
ns
Fall time
page 3/14
STB41N40DM6AG
Electrical characteristics
Table 7. Source-drain diode
Symbol
ISD
ISDM(1)
(2)
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Source-drain current
-
41
A
Source-drain current (pulsed)
-
150
A
1.6
V
Forward on voltage
ISD = 41 A, VGS = 0 V
-
trr
Reverse recovery time
ISD = 41 A, di/dt = 100 A/µs,
-
103
ns
Qrr
Reverse recovery charge
VDD = 60 V
-
0.44
µC
Reverse recovery current
(see Figure 15. Test circuit for
inductive load switching and diode
recovery times)
-
8.5
A
trr
Reverse recovery time
ISD = 41 A, di/dt = 100 A/µs,
-
180
ns
Qrr
Reverse recovery charge
VDD = 60 V, Tj = 150 °C
-
1.5
µC
IRRM
Reverse recovery current
(see Figure 15. Test circuit for
inductive load switching and diode
recovery times)
-
17
A
Min.
Typ.
Max.
Unit
±30
-
-
V
VSD
IRRM
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Table 8. Gate-source Zener diode
Symbol
V(BR)GSO
Parameter
Gate-source breakdown voltage
Test conditions
IGS = ±1 mA, ID = 0 A
The built-in back-to-back Zener diodes are specifically designed to enhance the ESD performance of the device.
The Zener voltage facilitates efficient and cost-effective device integrity protection, thus eliminating the need for
additional external componentry.
DS12571 - Rev 1
page 4/14
STB41N40DM6AG
Electrical characteristics (curves)
2.1
Electrical characteristics (curves)
Figure 1. Safe operating area
ID
(A)
10 2
Figure 2. Thermal impedance
GADG020520181249SOA
Operation in this area
is limited by RDS(on)
tp =10 µs
10 1
tp =100 µs
Single pulse, TC = 25 °C,
TJ ≤ 150 °C, VGS = 10 V
10 0
tp =1 ms
tp =10 ms
10 -1
10 -1
10
10
0
10
1
VDS (V)
2
Figure 3. Output characteristics
ID
(A)
Figure 4. Transfer characteristics
ID
(A)
GADG020520181250OCH
VGS = 10 V
140
GADG020520181250TCH
140
VGS = 9 V
120
120
VGS = 8 V
100
VGS = 7 V
80
80
60
60
40
40
VGS = 6 V
20
0
0
20
VGS = 5 V
2
4
6
8
10
12
14
VDS (V)
Figure 5. Gate charge vs gate-source voltage
VGS
(V)
GADG020520181251QVG VDS
(V)
VDS
12
0
4
250
54
200
52
6
150
50
4
100
48
2
50
46
VDD = 320 V
ID = 41 A
8
DS12571 - Rev 1
10
20
30
40
6
7
RDS(on)
(mΩ)
56
10
5
8
9
VGS (V)
Figure 6. Static drain-source on-resistance
300
0
0
VDS = 16 V
100
GADG020520181252RID
VGS = 10 V
50
60
0
Qg (nC)
44
0
8
16
24
32
40
ID (A)
page 5/14
STB41N40DM6AG
Electrical characteristics (curves)
Figure 8. Normalized gate threshold voltage vs
temperature
Figure 7. Capacitance variations
C
(pF)
GADG020520181252CVR
VGS(th)
(norm.)
104
GADG020520181253VTH
1.1
CISS
103
102
COSS
101
CRSS
1
0.9
ID = 250 µA
0.8
0.7
100
10-1
100
101
102
VDS (V)
Figure 9. Normalized on-resistance vs temperature
RDS(on)
(norm.)
GADG020520181253RON
2.5
0.6
-75
25
75
125
Tj (°C)
Figure 10. Normalized VBR(DSS) vs temperature
V(BR)DSS
(norm.)
GADG020520181253BDV
1.1
2
1
1
0.95
0.5
0.9
-25
25
75
125
Tj (°C)
Figure 11. Source-drain diode forward characteristics
VSD
(V)
ID = 1 mA
1.05
VGS = 10 V
ID = 20 A
1.5
0
-75
-25
GADG020520181254SDF
TJ = -55 °C
0.85
-75
-25
25
75
125
Tj (°C)
Figure 12. Output capacitance stored energy
EOSS
(µJ)
GADG020520181254EOS
12
1
TJ = 25 °C
10
0.8
8
TJ = 150 °C
6
0.6
4
0.4
0.2
0
DS12571 - Rev 1
2
8
16
24
32
40
ISD (A)
0
0
80
160
240
320
400
VDS (V)
page 6/14
STB41N40DM6AG
Test circuits
3
Test circuits
Figure 13. Test circuit for resistive load switching times
Figure 14. Test circuit for gate charge behavior
VDD
12 V
2200
+ μF
3.3
μF
VDD
VD
VGS
1 kΩ
100 nF
RL
IG= CONST
VGS
RG
47 kΩ
+
pulse width
D.U.T.
2.7 kΩ
2200
μF
pulse width
D.U.T.
100 Ω
VG
47 kΩ
1 kΩ
AM01469v1
AM01468v1
Figure 15. Test circuit for inductive load switching and
diode recovery times
D
G
A
D.U.T.
S
25 Ω
A
L
A
B
B
3.3
µF
D
G
+
VD
100 µH
fast
diode
B
Figure 16. Unclamped inductive load test circuit
RG
1000
+ µF
2200
+ µF
VDD
3.3
µF
VDD
ID
D.U.T.
S
D.U.T.
Vi
_
pulse width
AM01471v1
AM01470v1
Figure 17. Unclamped inductive waveform
Figure 18. Switching time waveform
V(BR)DSS
ton
VD
td(on)
90%
IDM
tf
90%
10%
10%
0
ID
VDD
toff
td(off)
tr
VDD
VGS
0
VDS
90%
10%
AM01472v1
AM01473v1
DS12571 - Rev 1
page 7/14
STB41N40DM6AG
Package information
4
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
4.1
D²PAK (TO-263) type A2 package information
Figure 19. D²PAK (TO-263) type A2 package outline
0079457_A2_24
DS12571 - Rev 1
page 8/14
STB41N40DM6AG
D²PAK (TO-263) type A2 package information
Table 9. D²PAK (TO-263) type A2 package mechanical data
Dim.
mm
Min.
Typ.
Max.
A
4.40
4.60
A1
0.03
0.23
b
0.70
0.93
b2
1.14
1.70
c
0.45
0.60
c2
1.23
1.36
D
8.95
9.35
D1
7.50
7.75
8.00
D2
1.10
1.30
1.50
E
10.00
E1
8.70
8.90
9.10
E2
7.30
7.50
7.70
e
10.40
2.54
e1
4.88
5.28
H
15.00
15.85
J1
2.49
2.69
L
2.29
2.79
L1
1.27
1.40
L2
1.30
1.75
R
V2
0.40
0°
8°
Figure 20. D²PAK (TO-263) recommended footprint (dimensions are in mm)
Footprint
DS12571 - Rev 1
page 9/14
STB41N40DM6AG
D²PAK packing information
4.2
D²PAK packing information
Figure 21. D²PAK tape outline
DS12571 - Rev 1
page 10/14
STB41N40DM6AG
D²PAK packing information
Figure 22. D²PAK reel outline
T
40mm min.
access hole
at slot location
B
D
C
N
A
G measured
at hub
Tape slot
in core for
tape start
2.5mm min.width
Full radius
AM06038v1
Table 10. D²PAK tape and reel mechanical data
Tape
Dim.
DS12571 - Rev 1
Reel
mm
mm
Dim.
Min.
Max.
Min.
A0
10.5
10.7
A
B0
15.7
15.9
B
1.5
D
1.5
1.6
C
12.8
D1
1.59
1.61
D
20.2
E
1.65
1.85
G
24.4
F
11.4
11.6
N
100
K0
4.8
5.0
T
Max.
330
13.2
26.4
30.4
P0
3.9
4.1
P1
11.9
12.1
Base quantity
1000
P2
1.9
2.1
Bulk quantity
1000
R
50
T
0.25
0.35
W
23.7
24.3
page 11/14
STB41N40DM6AG
Revision history
Table 11. Document revision history
DS12571 - Rev 1
Date
Version
17-May-2018
1
Changes
Initial release. The document status is production data.
page 12/14
STB41N40DM6AG
Contents
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1
Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
4
Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
4.1
D²PAK (TO-263) type A2 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2
D²PAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
DS12571 - Rev 1
page 13/14
STB41N40DM6AG
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© 2018 STMicroelectronics – All rights reserved
DS12571 - Rev 1
page 14/14