STBP120
Overvoltage protection device with thermal shutdown
Features
■
Input overvoltage protection up to 28 V
■
Integrated high voltage N-channel MOSFET
switch
■
Low RDS(on) of 90 mΩ
■
Integrated charge pump
■
Thermal shutdown protection
■
Softstart feature to control the inrush current
■
Enable input (EN)
■
Fault indication output (FLT)
■
IN input ESD withstand voltage up to ±15 kV
(air discharge), up to ±8 kV (contact discharge)
in typical application circuit with 1µF input
capacitor (±2 kV HBM for standalone device)
■
■
Certain overvoltage options compliant with the
China Communications Standard YD/T 15912006 (overvoltage protection only)
Small, RoHS compliant 2.5 x 2 mm TDFN –
10-lead package.
September 2009
TDFN – 10-lead (2.5 x 2 mm)
Applications
■
Smart phones
■
Digital cameras
■
PDA and palmtop devices
■
MP3 players
■
Low-power handheld devices.
Doc ID15492 Rev 5
1/36
www.st.com
1
Contents
STBP120
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
4
2.1
Input (IN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2
Power output (OUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3
Fault indication output (FLT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.4
Enable input (EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.5
No Connect (NC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.6
Ground (GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1
Power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2
Normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.3
Undervoltage lockout (UVLO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.4
Overvoltage lockout (OVLO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.5
Thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1
Calculating the power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.2
Calculating the junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.3
PCB layout recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7
Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8
Typical application performance (STBP120DVDK6F) . . . . . . . . . . . . . 19
9
Typical thermal characteristics (STBP120DVDK6F) . . . . . . . . . . . . . . . 24
10
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2/36
Doc ID 15492 Rev 5
STBP120
Contents
11
Tape and reel specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
12
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
13
Package marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Doc ID 15492 Rev 5
3/36
List of tables
STBP120
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
4/36
Pin description and signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TDFN – 10-lead, 2.5 x 2.0 x 0.75 mm body, pitch 0.50 mm,
package mechanical data dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Carrier tape dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Further tape and reel information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reel dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Marking description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Doc ID 15492 Rev 5
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STBP120
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Typical application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Maximum MOSFET current at TA = 85 °C for various PCB thermal performance
and TJ = 125 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Overvoltage protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disable (EN = high). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
FLT behavior in disable (EN = high) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Startup delay, ton . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
FLT indication delay (OK), tstart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Output turn-off time, toff . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
FLT indication delay (FAULT), tstop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disable time, tdis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Startup to overvoltage and startup VO(FLT) delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Startup inrush current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Output short-circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Output short-circuit detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
ICC vs. temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
ICC(STDBY) vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
ICC(UVLO) at 2.9 V vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
VOVLO vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
VUVLO vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
VOL(FLT) at 1 mA vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
RDS(on) at 1 A vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
TDFN – 10-lead, 2.5 x 2.0 x 0.75 mm body, pitch 0.50 mm,
package mechanical drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Tape and reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Reel dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Tape trailer/leader. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Pin 1 orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
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Description
1
STBP120
Description
The STBP120 device provides overvoltage protection for input voltage up to +28 V. Its low
RDS(on) N-channel MOSFET switch protects the systems connected to the OUT pin against
failures of the DC power supplies in accordance with the China MII Communications
Standard YD/T 1591-2006.
In the event of an input overvoltage condition, the device immediately disconnects the DC
power supply by turning off an internal low R DS(on) N-channel MOSFET to prevent damage
to protected systems.
In addition, the device also monitors its own junction temperature and switches off the
internal MOSFET if the junction temperature exceeds the specified limit.
The device can be controlled by the microcontroller and can also provide status information
about fault conditions.
The STBP120 is offered in a small, RoHS-compliant TDFN – 10-lead (2.5 mm x 2 mm)
package.
Figure 1.
Logic diagram
IN
OUT
STBP120
EN
FLT
GND
AM00240
Figure 2.
Pinout(1)
NC
1
GND
2
FLT
3
IN
4
PAD1
10
EN
9
NC
8
NC
7
OUT
6
OUT
PAD2
IN
5
AM00239
1. Pin 1, PAD1 and PAD2 are No Connect (NC) and may be tied to IN or GND.
6/36
Doc ID 15492 Rev 5
STBP120
Pin descriptions
2
Pin descriptions
2.1
Input (IN)
Input voltage pin. This pin is connected to the DC power supply. External low ESR ceramic
capacitor of minimum value 1 µF must be connected between IN and GND. This capacitor is
for decoupling and also protects the IC against dangerous voltage spikes and ESD events.
This capacitor should be located as close to the IN pins as possible.
All IN pins (4, 5) must be hardwired to common supply.
2.2
Power output (OUT)
Output voltage pin. This pin is connected to the input through a low RDS(on) N-channel
MOSFET switch.
If no fault is detected and the STBP120 is not disabled (controlled by the EN input), this
switch is turned on and the output voltage follows the input voltage.
The output is disconnected from the input when the input voltage is under the UVLO
threshold or above the OVLO threshold, when the chip temperature is above the thermal
shutdown threshold or when the chip is disabled by the EN input.
There is a 50 ms delay, ton, between input voltage or junction temperature returns to
specified range and the power output is connected to the input (see Figure 6).
All OUT pins (6, 7) must be hardwired to common supply.
2.3
Fault indication output (FLT)
The fault indication output (active-low - open-drain) provides information on the STBP120
state to the application controller. When FLT is active (i.e. driven low), this indicates the
STBP120 is in the undervoltage or overvoltage condition or thermal shutdown mode is
active. When the input voltage and junction temperature is in specified range, the FLT output
is in high impedance (Hi-Z) state.
There is an additional 50 ms delay, tstart, between the power output is connected to the input
and the FLT output is deactivated (i.e. in Hi-Z state) (see Figure 6).
Since the FLT output is of open-drain type, it may be pulled up by an external resistor R P to
the controller supply voltage. If there is no need to use this output, it may be left
disconnected. The suitable RP resistor value is in range of 10 kΩ to 1 MΩ .
To improve safety and to prevent damage to application circuits in the event of extreme
voltage or current conditions, an optional protective resistor RFLT can be connected between
the FLT output and the controller input. The suitable RFLT resistor value is in range of 22 kΩ
to 100 kΩ.
The function of the FLT output is not affected by the EN input state (see Figure 9).
Doc ID 15492 Rev 5
7/36
Pin descriptions
2.4
STBP120
Enable input (EN)
This logical input (active-low) can be used to enable or disable the device. When EN input is
driven high, the STBP120 enters the standby mode and the power output is disconnected
from the input. When EN input is driven low and all operating conditions are within specified
limits, the power output is connected to the input.
Since the EN input has no internal pull-down resistor, its logical level must be defined by the
controller or by an external resistor. If there is no need to use this input, it should be
connected to the GND.
To improve safety and to prevent damage to application circuits in the event of extreme
voltage or current conditions, an optional protective resistor REN can be connected between
the EN input and the controller output. The suitable resistor value is in range of 22 kΩ to
100 kΩ .
The EN input level has no impact on the functionality of FLT output (see Figure 8 and
Figure 9).
2.5
No Connect (NC)
Pins 1, 8, 9 and exposed pads PAD1, PAD2 are No Connect. Pin 1 and exposed pads PAD1,
PAD2 may be tied to IN or GND if necessary.
2.6
Ground (GND)
Ground. All voltages are referenced to GND.
Table 1.
8/36
Pin description and signal names
Pin
Name
Type
Function
1, PAD1, PAD2
NC
—
No Connect. May be tied to IN or GND.
2
GND
Supply
Ground
3
FLT
Output
Fault indication output (open-drain)
4, 5
IN
Input / supply
Input voltage
6, 7
OUT
Output
Output voltage
8, 9
NC
—
No Connect
10
EN
Input
Enable input (no internal pull-down resistor)
Doc ID 15492 Rev 5
STBP120
Figure 3.
Pin descriptions
Block diagram
OUT
IN
Core
negative
protection
ESD
protection
SUPPLY
REGULATOR
CHARGE PUMP
MOSFET DRIVER
OSCILLATOR
OFF
VCC
VREF
VOLTAGE
REFERENCE
COUNTERS
Input overvoltage
FLT
MCU
INTERFACE
CONTROL LOGIC
Input undervoltage
EN
Temperature Thermal shutdown
detector
ESD
protection
ESD
protection
GND
AM00306
Figure 4.
Typical application circuit(1),(2)
AC
adapter
SYSTEM
CONNECTOR
OR
PERIPHERAL
SUPPLY CURRENT
DC-DC
CHARGING CURRENT
C1
1 µF
IN
OUT
STBP120
C2
1 µF
EN
CHARGER
IC
ENABLE
POWERED
PERIPHERALS
RFLT
FLT
EN
BATTERY
PACK
SUPPLY
CIRCUITS
RPU
CONTROLLER
REN
GND
APPLICATION
AM00314a
1. Optional resistors REN, RFLT prevent damage to the controller under extreme voltage or current conditions and are not
required. Low ESR ceramic capacitor C1 is necessary to ensure proper function of the STBP120. Capacitor C2 is not
necessary for STBP120 but may be required by the charger IC.
2. The STBP120 MOSFET switch topology allows the current to also flow in the reverse direction, from OUT to IN, which can
be useful for powering external peripherals from the system connector. The charger IC should not contain the reverse
diode to prevent the battery pack voltage from appearing on the system connector. If the reverse current (supply current) is
undesirable, it may be prevented by connecting a Schottky diode in series with the OUT pin. The voltage drop between IN
and charger is increased by the voltage drop across the diode.
Doc ID 15492 Rev 5
9/36
Operation
3
STBP120
Operation
The STBP120 provides overvoltage protection for positive input voltage up to 28 V using
a built-in low RDS(on) N-channel MOSFET switch.
3.1
Power-up
At power-up, with EN = low, the MOSFET switch is turned on after a 50 ms delay, ton, after
the input voltage exceeds the UVLO threshold to ensure the input voltage is stabilized. After
an additional 50 ms delay, tstart, the FLT indication output is deactivated (see Figure 6).
The FLT output state is valid for VIN input voltage 1.2 V or higher.
3.2
Normal operation
The device continuously monitors the input voltage and its own internal temperature so the
output voltage is kept within the specified range. Internal MOSFET switch is turned on and
the FLT output is not active.
The STBP120 enters normal operation state if the input voltage returns to the interval
between VUVLO and VOVLO - VHYS(OVLO) and the junction temperature falls below TOFF THYS(OFF). Internal MOSFET is turned on after the 50 ms delay ton to ensure that the
conditions have stabilized. Then, after an additional 50 ms delay, tstart, the FLT output is
deactivated (i.e. driven high). This behavior is equivalent to the startup shown on Figure 6.
Note:
The STBP120 MOSFET switch topology allows the current to also flow in the reverse
direction, i.e. from OUT to IN, which can be useful e.g. for powering external peripherals
from the system connector (see the supply current in Figure 4). At first, the current flows
through the MOSFET body diode. If the voltage that appears on the IN terminal is above the
UVLO threshold, the MOSFET is (after the 50 ms startup delay) turned on so the voltage
drop across STBP120 is significantly reduced. The charger IC should not contain the
reverse diode to prevent the battery pack voltage from appearing on the system connector.
If the reverse current is undesirable, it may be prevented by connecting a properly rated low
drop Schottky diode in series with the OUT pin. The voltage drop between IN and charger is
increased by the voltage drop across the diode.
Due to the MOSFET body diode, thermal shutdown protection is not functional for the
supply current.
3.3
Undervoltage lockout (UVLO)
To ensure proper operation under any conditions, the STBP120 has an undervoltage lockout
(UVLO) threshold. For rising input voltage, the output remains disconnected from input until
VIN voltage exceeds the VUVLO threshold (3.25 V typ). The FLT output is driven low as long
as VIN is below the UVLO threshold (assuming the input voltage is above 1.2 V). For falling
input voltage, the UVLO circuit has a 50 mV hysteresis, VHYS(UVLO), to improve noise
immunity under transient conditions.
10/36
Doc ID 15492 Rev 5
STBP120
3.4
Operation
Overvoltage lockout (OVLO)
If the input voltage VIN rises above the threshold level VOVLO, the MOSFET switch is
immediately turned off (see Figure 7). At the same time, the fault indication output FLT is
activated (i.e. driven low). This device is equipped with hysteresis, VHYS(OVLO), to improve
noise immunity under transient conditions.
For available OVLO thresholds and hystereses, please see the Table 5.
3.5
Thermal shutdown
If the STBP120 internal junction temperature exceeds the TOFF threshold, internal MOSFET
switch is turned off and the fault indication output FLT is driven low.
To improve thermal stability, this circuit has a 20 °C hysteresis, THYS(OFF).
Doc ID 15492 Rev 5
11/36
Application information
STBP120
4
Application information
4.1
Calculating the power dissipation
The maximum power dissipation of the STBP120 internal power MOSFET can be calculated
using following formula:
PD = I2 x RDS(on)(max),
Where I is current flowing through the MOSFET and RDS(on)(max) is maximum value of
MOSFET resistance.
Example:
Rload = 5 Ω, VIN = 5 V, R DS(on)(max) = 150 mΩ
I = VIN / (RDS(on)(max) + R load) = 5 / (5 + 0.150) = 0.97 A
PD = 0.972 x 0.15 = 0.14 W
The power dissipation of reverse diode (in powering peripherals mode) can be estimated as
PD = (VOUT - VIN) x I ≈ 0.7 x I.
4.2
Calculating the junction temperature
The maximum junction temperature for given power dissipation, ambient temperature and
thermal resistance junction - to - ambient can be calculated as
TJ = TA + 1.15 x PD x RthJA = TA + 1.15 x I2 x RDS(on)(max) x RthJA,
where TJ is junction temperature, TA is given ambient temperature, 1.15 is a derating factor
and RthJA is thermal resistance junction - to - ambient, depending on shape, dimension and
design of PCB. Two examples of PCB with appropriate thermal resistance are listed in
Table 3. The junction temperature may not exceed 125 °C (see Table 4), due to TOFF
(thermal shutdown threshold temperature).
Maximum allowed MOSFET current for ambient temperature TA = 85 °C and various RthJA
values are listed in Figure 5.
Example: For conditions listed in previous example, well designed PCB (RthJA = 82 °C/W)
and TA = 85 °C, the maximum junction temperature is
85 + 1.15 x 0.14 x 82 = 98.2 °C.
4.3
12/36
PCB layout recommendations
●
This device is intended as a protection device to the application from overvoltage.
It must be ensured that the clearances between PCB tracks satisfy the high voltage
design rules.
●
Input capacitor, C1, should be located as close as possible to the STBP120 device.
It should be a Low-ESR ceramic capacitor. Also the protective resistors RFLT, REN
(if used) should be located close to the STBP120.
●
For good thermal performance, it is recommended to connect the STBP120 exposed
thermal pads with the PCB ground plane. In most designs, this requires thermal vias
between the copper pads on PCB and the ground plane.
Doc ID 15492 Rev 5
STBP120
5
Maximum rating
Maximum rating
Stressing the device above the rating listed in the “absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 2.
Absolute maximum ratings
Symbol
Value
Unit
–55 to 150
C
260
C
Operating junction temperature range
–40 to 150
C
TA
Operating ambient temperature range
–40 to 85
C
VIN
Input voltage (pins IN)
–0.3 to 30
V
VIO(OUT)
Input / output voltage (pins OUT)
–0.3 to 12
V
VIO
Input / output voltage (other pins)
–0.3 to 7
V
2000
mA
15
mA
±15 (air),
±8 (contact)
kV
Human body model (HBM), Model = 2(4)
2000
V
Machine model (MM), Model = B(5)
200
V
TSTG
TSLD(1)
(2)
TJ
Parameter
Storage temperature (VIN off)
Lead solder temperature for 10 seconds
IIN,
Input / output current through MOSFET (pins IN, OUT)
IOUT(MOSFET)
I(FLT)
Output current (pin FLT)
ESD withstand voltage (IEC 61000-4-2, pins IN only)(3)
VESD
1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
2. Maximum junction temperature is internally limited by the thermal shutdown circuit (not valid for reverse
current, see Chapter 3.2).
3. System-level value (see Figure 4, C1 ≥ 1 µF low ESR ceramic capacitor).
4. Human body model, 100 pF discharged through a 1.5kΩ resistor according the JESD22/A114
specification.
5. Machine model, 200 pF discharged through all pins according the JESD22/A115 specification.
Doc ID 15492 Rev 5
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Maximum rating
STBP120
.
Table 3.
Thermal data
Symbol
Parameter
RthJA
Thermal resistance (junction to ambient)
RthJC
Thermal resistance (junction to case)
Value
Unit
204(1)
82(2)
°C/W
43
°C/W
1. The package is mounted on a 2-layers (1S) JEDEC board as per JESD51-7 without thermal vias
underneath the exposed pads.
2. The package is mounted on a 4-layers (2S2P) JEDEC board as per JESD51-7 with 2 thermal vias (one
underneath each exposed pad) as per JESD-51-5. Thermal vias connected from exposed pad to 1'st
buried copper plane of PCB.
Figure 5.
Maximum MOSFET current at TA = 85 °C for various PCB thermal
performance and TJ = 125 °C
2.10
1.90
1.70
I (MOSFET) 1.50
[A]
1.30
1.10
0.90
0.70
50
100
150
200
250
300
350
Rth JA [˚C/W]
AM00428b
14/36
Doc ID 15492 Rev 5
STBP120
6
DC and AC parameters
DC and AC parameters
This section summarizes the operating measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristics tables that
follow are derived from tests performed under the measurement conditions summarized in
Table 4. Designers should check that the operating conditions in their circuit match the
operating conditions when relying on the quoted parameters.
Table 4.
Operating and AC measurement conditions
Parameter
Value
Unit
5
V
Ambient operating temperature (TA)
–40 to 85
°C
Junction operating temperature (TJ)
–40 to 125
°C
5
Ω
Input voltage (VIN)
Output load resistance (Rload)
Table 5.
DC and AC characteristics
Test condition(1)
Symbol
Description
VIN
Input voltage range
1.2
VUVLO
Input undervoltage
lockout threshold
3.1
VHYS(UVLO)
Undervoltage lockout
hysteresis
20
VOVLO
Overvoltage lockout
threshold
Min
Typ
Max Unit
28
V
3.25
3.4
V
50
100
mV
VIN rises up OVLO threshold, OVLO option A
5.25 5.375 5.50
VIN rises up OVLO threshold, OVLO option B
5.30
5.50
5.70
VIN rises up OVLO threshold, OVLO option C
5.71
5.90
6.10
VIN rises up OVLO threshold, OVLO option D
5.70
6.02
6.40
30
60
90
mV
V
VHYS(OVLO)
Input overvoltage
hysteresis
RDS(on)
IN to OUT resistance
EN = 0 V, VIN = 5 V, Rload connected to OUT
90
150
mΩ
ICC
Operating current
EN = 0 V, no load on OUT, VIN = 5 V
170
250
µA
ICC(STDBY)
Standby current
EN = 5 V, no load on OUT, VIN = 5 V
96
150
µA
ICC(UVLO)
UVLO operating current
VIN = 2.9 V
70
100
µA
VOL(FLT)
FLT output low level
voltage
1.2 V < VIN < VUVLO, ISINK(FLT) = 50 µA
20
400
mV
400
mV
IL(FLT)
FLT output leakage
current
VIL(EN)
EN low level input
voltage
VIH(EN)
EN high level input
voltage
IL(EN)
EN input leakage
current
VIN > VOVLO, ISINK(FLT) = 1 mA
V(FLT) = 5 V
5
nA
0.4
1.2
V(EN) = 0 V or 5 V
Doc ID 15492 Rev 5
V
V
5
nA
15/36
DC and AC parameters
Table 5.
STBP120
DC and AC characteristics (continued)
Description
Test condition(1)
Min
Typ
ton
Startup delay
Time measured from VIN > VUVLO
to VOUT = 0.3 V (see Figure 6)
30
50
70
ms
tstart
FLT indication delay
(OK)
Time measured from VOUT = 0.3 V
to V(FLT) = 1.2 V (see Figure 6)
30
50
70
ms
toff(2)
Output turn-off time
Time measured from VIN > VOVLO to VOUT ≤ 0.3 V.
VIN increasing from 5.0 V to 8.0 V at 3.0 V/µs,
Rload connected to OUT. (see Figure 7)
1.5
5
µs
tstop(2)
FLT indication delay
(FAULT)
Time measured from VIN > VOVLO to V(FLT) ≤ 0.4 V.
VIN increasing from 5.0 V to 8.0 V at 3.0 V/µs,
Rload connected to OUT. (see Figure 7)
1
tdis(2)
Disable time
Time measured from V(EN) ≥ 1.2 V
to VOUT < 0.3 V. Rload connected to OUT.
(see Figure 8)
1
Symbol
Max Unit
Timing parameters
µs
5
µs
Thermal shutdown
TOFF
Thermal shutdown
threshold temperature
THYS(OFF)
Thermal shutdown
hysteresis
130
1. Test conditions described in Table 4 (except where noted).
2. Guaranteed by design. Not tested in production.
16/36
Doc ID 15492 Rev 5
145
°C
20
°C
STBP120
7
Timing diagrams
Timing diagrams
Figure 6.
Startup(1)
OVLO
UVLO
VIN
ton
0.3 V
VOUT
1.2 V
tstart
V(FLT)
AM00335
1. EN input is low.
Figure 7.
Overvoltage protection(1)
OVLO
VIN
VOUT
UVLO
toff
0.3 V
tstop
0.4 V
V(FLT)
AM00336
1. EN input is low.
Doc ID 15492 Rev 5
17/36
Timing diagrams
Figure 8.
STBP120
Disable (EN = high)(1)
1.2 V
V(EN)
OVLO
VIN
UVLO
tdis
0.3 V
VOUT
AM00337
1. FLT output still indicates the VIN status.
Figure 9.
FLT behavior in disable (EN = high)
1.2 V
V(EN)
OVLO
UVLO
VIN
equiv. to ton + tstart
1.2 V
VFLT
AM00338
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Doc ID 15492 Rev 5
STBP120
8
Typical application performance (STBP120DVDK6F)
Typical application performance (STBP120DVDK6F)
Figure 10. Startup delay, ton
1. No load on the output. The “leakage” on the VOUT trace is a crosstalk caused mainly by the parasitic
capacitances of the MOSFET switch.
Figure 11. FLT indication delay (OK), tstart
Doc ID 15492 Rev 5
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Typical application performance (STBP120DVDK6F)
Figure 12. Output turn-off time, toff
1. 5 Ω load on the output.
Figure 13. FLT indication delay (FAULT), tstop
1. 5 Ω load on the output.
20/36
Doc ID 15492 Rev 5
STBP120
STBP120
Typical application performance (STBP120DVDK6F)
Figure 14. Disable time, tdis
1. No change in VO(FLT) status during disable.
2. 5 Ω load on the output.
Figure 15. Startup to overvoltage and startup VO(FLT) delay
1. 5 Ω load on the output.
Doc ID 15492 Rev 5
21/36
Typical application performance (STBP120DVDK6F)
STBP120
Figure 16. Startup inrush current
1. Output load 5 Ω in parallel with C = 100 µF, power supply cable inductance 1 µH, power supply cable
resistance 0.3 Ω.
Figure 17. Output short-circuit
1. See also details on Figure 18.
2. Power supply cable inductance 1 µH, power supply cable resistance 0.3 Ω.
22/36
Doc ID 15492 Rev 5
STBP120
Typical application performance (STBP120DVDK6F)
Figure 18. Output short-circuit detail
1. Due to power supply cable impedance, during the output short-circuit the input voltage falls below the
VUVLO threshold, resulting in turning off the power MOSFET and preventing any damage to the
components.
2. Power supply cable inductance 1 µH, power supply cable resistance 0.3 Ω.
Doc ID 15492 Rev 5
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Typical thermal characteristics (STBP120DVDK6F)
9
STBP120
Typical thermal characteristics (STBP120DVDK6F)
Figure 19. ICC vs. temperature
180
170
160
150
140
ICC [µA]
130
120
110
100
90
80
–50
0
50
100
150
Temperature [˚C]
AM00415
Figure 20. ICC(STDBY) vs. temperature
120
110
100
90
ICC(STDBY)
[µA]
80
70
60
50
40
–50
0
50
100
150
Temperature [˚C]
AM00416
24/36
Doc ID 15492 Rev 5
STBP120
Typical thermal characteristics (STBP120DVDK6F)
Figure 21. ICC(UVLO) at 2.9 V vs. temperature
80.0
70.0
60.0
ICC(UVLO)
[µA]
50.0
40.0
30.0
20.0
–50
0
50
100
150
Temperature [˚C]
AM00417
Figure 22. VOVLO vs. temperature
6.3
6.2
6.1
VOVLO [V]
6
5.9
5.8
–50
0
50
100
150
Temperature [˚C]
AM00420
Doc ID 15492 Rev 5
25/36
Typical thermal characteristics (STBP120DVDK6F)
STBP120
Figure 23. VUVLO vs. temperature
3.4
3.35
3.3
VUVLO [V]
3.25
3.2
3.15
3.1
–50
0
50
100
150
Temperature [˚C]
AM00422
Figure 24. VOL(FLT) at 1 mA vs. temperature
0.1
0.09
0.08
VOL(FLT)
[V]
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
–50
0
50
100
150
Temperature [˚C]
AM00424
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Doc ID 15492 Rev 5
STBP120
Typical thermal characteristics (STBP120DVDK6F)
Figure 25. RDS(on) at 1 A vs. temperature
140.0
120.0
100.0
RDS(on)
[mΩ]
80.0
60.0
40.0
20.0
0.0
–50
0
50
100
150
Temperature [˚C]
AM00427
Doc ID 15492 Rev 5
27/36
Package mechanical data
10
STBP120
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 26. TDFN – 10-lead, 2.5 x 2.0 x 0.75 mm body, pitch 0.50 mm,
package mechanical drawing
D
A
B
INDE X AREA
E
0.10 C 2x
0.10 C 2x
TOP VIEW
0.10 C
A1
C
A
SEATING
PLANE
SIDE VIEW
0.08 C
D2 -2
LEADS COPLA NARITY
e
1
5
PI N#1 ID
K (x10)
0.350
INDEX AR EA
E2
0.195
0.195
L
(x10)
b (x 10)
0.10
10
0.02 5
D2- 1
C A B
BOTTOM VIEW
10L_ME
28/36
Doc ID 15492 Rev 5
STBP120
Package mechanical data
Table 6.
TDFN – 10-lead, 2.5 x 2.0 x 0.75 mm body, pitch 0.50 mm,
package mechanical data dimensions(1)
(mm)
(inches)
Symbol
Note
Min.
Nom.
Max.
Min.
Nom.
Max.
A
0.70
0.75
0.80
0.028
0.030
0.031
A1
0.00
0.02
0.05
0.000
0.001
0.002
b
0.18
0.25
0.30
0.007
0.010
0.012
D
BSC
2.50
0.098
D2-1
0.53
0.68
0.78
0.021
0.027
0.031
D2-2
0.93
1.08
1.18
0.037
0.043
0.046
E
BSC
E2
2.00
0.75
e
0.90
0.079
1.00
0.030
0.50
L
0.20
K
0.20
0.30
0.035
0.039
0.020
0.40
0.008
0.012
0.016
0.008
N
10
10
(2)
1. Controlling dimension: millimeters.
2. N is the total number of terminals.
Doc ID 15492 Rev 5
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Tape and reel specification
11
STBP120
Tape and reel specification
Figure 27. Tape and reel
P0
D
P2
T
E
A0
F
Top cover
tape
W
B0
Center lines
of cavity
K0
P1
User direction of feed
AM03073v2
Table 7.
Tape
size
W
D
E
12
12.00 ± 0.30
1.50 +0.10 / –0.00
1.75 ± 0.10
Table 8.
30/36
Carrier tape dimensions
Po
P2
4.00 ± 0.10 2.00 ± 0.10
F
5.50 ± 0.05
Further tape and reel information
Package code
W
Ao
Bo
2 x 2.5mm TDFN 10 lead
12
2.30 ±
0.10
2.80 ±
0.10
Doc ID 15492 Rev 5
Ko
P1
T
1.10 ± 4.00 ± 0.30 ±
0.01
0.10
0.05
Bulk Qty.
Reel
Diameter
3000
13
STBP120
Tape and reel specification
Figure 28. Reel dimensions
T
40 mm min.
acces hole
at slot location
B
D
C
N
A
Full radius
Tape slot
in core for
tape start
25 mm min width
G measured
at hub
AM00443
Table 9.
Reel dimensions
Tape size
A max.
B min.
C
D min.
N min.
G
T max.
12 mm
330 (13 inch)
1.5
13 ± 0.2
20.2
60
12.4 + 2 / – 0
18.4
Doc ID 15492 Rev 5
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Tape and reel specification
STBP120
Figure 29. Tape trailer/leader
End
Top
cover
tape
Start
No components
Components
100 mm min.
T RA IL ER
No components
L EA D ER
160 mm min.
400 mm min.
Sealed with cover tape
User direction of feed
AM00444
Figure 30. Pin 1 orientation
Direction of feed
Note:
32/36
1
Drawings are not to scale.
2
All dimensions are in mm, unless otherwise noted.
Doc ID 15492 Rev 5
AM00442a
STBP120
12
Part numbering
Part numbering
Table 10.
Ordering information scheme
STBP120
D
V
DK
6
F
Device type
STBP120
Overvoltage threshold
A = 5.375 V
B = 5.50 V
C = 5.90 V
D = 6.02 V
Undervoltage threshold
V = 3.25 V
Package
DK = TDFN – 10-lead, 2.5 x 2 mm
Temperature range
6 = –40 °C to +85 °C
Shipping method
F = ECOPACK® package, tape and reel
Note:
Other overvoltage thresholds are offered. Minimum order quantities may apply.
Contact local sales office for availability.
Doc ID 15492 Rev 5
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Package marking information
13
STBP120
Package marking information
Table 11.
Marking description
Part number(1)
Overvoltage threshold (V)
Topside marking
STBP120AVxxxx
5.375
P12A
STBP120BVxxxx
5.50
P12B
STBP120CVxxxx
5.90
P12C
STBP120DVxxxx
6.02
P12D
1. Other overvoltage thresholds are offered. Minimum order quantities may apply.
Contact local sales office for availability.
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STBP120
14
Revision history
Revision history
Table 12.
Document revision history
Date
Revision
Changes
20-Mar-2009
1
Initial release.
07-Apr-2009
2
Updated Section 2, Section 3, Figure 5, ton and tstart in Table 5 and
shipping method in Table 10, added Section 8 and Section 9.
29-Apr- 2009
3
Updated the revision history table - removed the draft revisions.
01-Jun-2009
4
Updated Features, Section 4.3, Table 2, Figure 5, Table 5, Figure 10,
Figure 12, Figure 13, Figure 14, Figure 15, Figure 16, Figure 17,
Figure 18, removed Figure 22, Figure 23, Figure 25, Figure 27,
Figure 29, Figure 30, added Section 11: Tape and reel specification.
25-Sep-2009
5
Document reformatted, updated overvoltage threshold option C in
Table 5, Table 10 and Table 11.
Doc ID 15492 Rev 5
35/36
STBP120
Please Read Carefully:
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right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
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