STD7N90K5
Datasheet
N-channel 900 V, 0.72 Ω typ., 7 A MDmesh™ K5 Power MOSFET in a DPAK
package
Features
TAB
2 3
1
DPAK
D(2, TAB)
Order code
VDS
RDS(on ) max.
ID
STD7N90K5
900 V
0.81 Ω
7A
•
Industry’s lowest RDS(on) x area
•
•
•
•
Industry’s best FoM (figure of merit)
Ultra-low gate charge
100% avalanche tested
Zener-protected
Applications
G(1)
•
Switching applications
Description
S(3)
AM01475V1
This very high voltage N-channel Power MOSFET is designed using MDmesh™ K5
technology based on an innovative proprietary vertical structure. The result is a
dramatic reduction in on-resistance and ultra-low gate charge for applications
requiring superior power density and high efficiency.
Product status
STD7N90K5
Product summary
Order code
STD7N90K5
Marking
7N90K5
Package
DPAK
Packing
Tape and reel
DS11870 - Rev 2 - February 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
STD7N90K5
Electrical ratings
1
Electrical ratings
Table 1. Absolute maximum ratings
Symbol
Parameter
VGS
Gate-source voltage
Value
Unit
± 30
V
ID
Drain current (continuous) at TC = 25 °C
7
A
ID
Drain current (continuous) at TC = 100 °C
4.4
A
ID (1)
Drain current (pulsed)
28
A
PTOT
Total dissipation at TC = 25 °C
90
W
dv/dt (2)
Peak diode recovery voltage slope
4.5
dv/dt (3)
MOSFET dv/dt ruggedness
50
Tj
Operating junction temperature range
Tstg
Storage temperature range
V/ns
- 55 to 150
°C
1. Pulse width limited by safe operating area
2. ISD ≤ 7 A, di/dt ≤ 100 A/μs; VDS peak < V(BR)DSS, VDD = 450 V
3. VDS ≤ 720 V
Table 2. Thermal data
Symbol
Rthj-case
Rthj-pcb
(1)
Parameter
Value
Unit
Thermal resistance junction-case
1.38
°C/W
Thermal resistance junction-pcb
50
°C/W
1. When mounted on 1 inch² FR-4 board, 2 oz Cu.
Table 3. Avalanche characteristics
Symbol
DS11870 - Rev 2
Parameter
Value
Unit
IAR
Avalanche current, repetitive or not repetitive (pulse width limited by Tjmax)
2.4
A
EAS
Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V)
230
mJ
page 2/16
STD7N90K5
Electrical characteristics
2
Electrical characteristics
TC = 25 °C unless otherwise specified
Table 4. On/off-state
Symbol
Parameter
Test conditions
Min.
V(BR)DSS
Drain-source breakdown
voltage
VGS = 0 V, ID = 1 mA
900
Typ.
IDSS
1
µA
50
µA
±10
µA
4
5
V
0.72
0.81
Ω
Min.
Typ.
Max.
Unit
-
425
-
pF
-
41
-
pF
-
1.2
-
pF
-
64
-
pF
VGS = 0 V, VDS = 900 V
TC = 125 °C (1)
IGSS
Gate body leakage current
VDS = 0 V, VGS = ±20 V
VGS(th)
Gate threshold voltage
VDD = VGS, ID = 100 µA
RDS(on)
Static drain-source onresistance
VGS = 10 V, ID = 3.5 A
Unit
V
VGS = 0 V, VDS = 900 V
Zero gate voltage drain
current
Max.
3
1. Defined by design, not subject to production test.
Table 5. Dynamic
Symbol
Parameter
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer capacitance
Co(tr) (1)
Equivalent capacitance time
related
Co(er) (2)
Equivalent capacitance
energy related
Rg
Intrinsic gate resistance
Qg
Total gate charge
Qgs
Gate-source charge
Qgd
Gate-drain charge
Test conditions
VDS = 100 V, f = 1 MHz, VGS = 0 V
VGS = 0 V, VDS = 0 to 720 V
24
f = 1 MHz , ID = 0 A
VDD = 720 V, ID = 7 A, VGS = 0 to 10
V; (see Figure 14. Test circuit for gate
charge behavior)
pF
-
6.7
-
Ω
-
12
-
nC
-
3.5
-
nC
-
6.5
-
nC
1. Co(tr) is a constant capacitance value that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS.
2. Co(er) is a constant capacitance value that gives the same stored energy as Coss while VDS is rising from 0 to 80% VDSS.
Table 6. Switching times
Symbol
td(on)
tr
td(off)
tf
DS11870 - Rev 2
Parameter
Test conditions
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Min.
Typ.
Max.
Unit
VDD= 450 V, ID = 3.5 A, RG = 4.7 Ω,
-
13.2
-
ns
VGS = 10 V; (see Figure 13. Test
circuit for resistive load switching
times and Figure 18. Switching time
waveform)
-
14.2
-
ns
-
31.6
-
ns
-
14.7
-
ns
page 3/16
STD7N90K5
Electrical characteristics
Table 7. Source-drain diode
Symbol
ISD
ISDM (1)
(2)
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Source-drain current
-
7
A
Source-drain current (pulsed)
-
28
A
1.5
V
Forward on voltage
ISD = 7 A, VGS = 0 V
-
trr
Reverse recovery time
ISD = 7 A, di/dt = 100 A/µs,VDD = 60 V
-
352
ns
Qrr
Reverse recovery charge
-
3.63
µC
IRRM
Reverse recovery current
(see Figure 15. Test circuit for
inductive load switching and diode
recovery times)
-
20.6
A
-
525
ns
-
4.94
µC
-
18.8
A
VSD
trr
Reverse recovery time
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
ISD = 7 A, di/dt = 100 A/µs VDD = 60
V, Tj = 150 °C
(see Figure 15. Test circuit for
inductive load switching and diode
recovery times)
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Table 8. Gate-source Zener diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
V(BR)GSO
Gate-source breakdown
voltage
IGS= ± 1mA, ID= 0 A
±30
-
-
V
The built-in back-to-back Zener diodes are specifically designed to enhance the ESD performance of the device.
The Zener voltage facilitates efficient and cost-effective device integrity protection, thus eliminating the need for
additional external componentry.
DS11870 - Rev 2
page 4/16
STD7N90K5
Electrical characteristics (curves)
2.1
Electrical characteristics (curves)
Figure 1. Safe operating area
ID
(A)
10 1
Figure 2. Thermal impedance
GADG121020161023SOA
Operation in this
area is limited
by R DS(on)
GC20460
K
tp= 10 µs
tp= 100µs
10 0
100
tp= 1 ms
tp= 10 ms
10-1
10 -1
single pulse
T j ≤150 °C
T c = 25 °C
10 -2
10 -1
10 0
10 1
10 2
10 3
V DS (V)
10-2
10-5
Figure 3. Output characteristics
ID
(A)
10-4
10-3
10-2
10-1
tp (s)
Figure 4. Transfer characteristics
ID
(A)
GIPG051020161339OCH
GIPG051020161340TCH
V DS =20 V
VGS = 11 V
15
15
VGS = 10 V
10
10
VGS = 9 V
VGS = 8 V
5
5
VGS = 7 V
VGS = 6 V
0
0
4
8
12
16
V DS (V)
Figure 5. Gate charge vs gate-source voltage
VGS
(V)
GIPG051020161340QVG VDS
(V)
VDS
14
500
8
400
4
300
Qgd
Qgs
DS11870 - Rev 2
8
9
10
V GS (V)
Figure 6. Static drain-source on-resistance
GIPG051020161341RID
R DS(on)
[Ω]
V GS =10 V
0.8
0.7
200
2
0
0
7
600
10
6
6
700
VDD = 720 V
ID = 7 A
12
0
5
100
2
4
6
8
10
12
14
0
Qg (nC)
0.6
0
2
4
6
I D (A)
page 5/16
STD7N90K5
Electrical characteristics (curves)
Figure 7. Capacitance variations
C
(pF)
Figure 8. Normalized VGS(th) vs temperature
GIPG051020161342CVR
V GS(th)
(norm.)
GIPG051020161343VTH
I D = 100 µA
1.2
1000
100
C ISS
1
f =1 MHz
0.8
C OSS
0.6
10
C RSS
1
0.1
1
10
100
0.4
V DS (V)
Figure 9. Normalized on-resistance vs temperature
R DS(on)
(norm.)
GIPG051020161344RON
2.6
V GS = 10 V
0.2
-50
V (BR)DSS
(norm.)
1.8
1.04
1.4
1.00
1
0.96
0.6
0.92
50
100
T j (°C)
Figure 11. Maximum avalanche energy vs starting TJ
EAS
(mJ)
GADG061020160850EAS
100
T j (°C)
GIPG051020161345BDV
1.12
1.08
0
50
Figure 10. Normalized V(BR)DSS vs temperature
2.2
0.2
-50
0
I D = 1 mA
0.88
-50
0
50
100
T j (°C)
Figure 12. Source-drain diode forward characteristics
V SD
(V)
GADG071020160858SDF
1
Single pulse
ID =2.4 A,VDD =50 V
T j = -50 °C
0.9
200
0.8
0.7
100
T j = 25 °C
T j = 150 °C
0.6
0
-50
DS11870 - Rev 2
0
50
100
TJ (°C)
0.5
1
2
3
4
5
6
I SD (A)
page 6/16
STD7N90K5
Test circuits
3
Test circuits
Figure 13. Test circuit for resistive load switching times
Figure 14. Test circuit for gate charge behavior
VDD
RL
RL
2200
+ μF
3.3
μF
VDD
VD
+
pulse width
RG
VGS
IG= CONST
VGS
2.7 kΩ
2200
μF
D.U.T.
D.U.T.
100 Ω
VG
47 kΩ
pulse width
1 kΩ
AM01469v10
AM01468v1
Figure 15. Test circuit for inductive load switching and
diode recovery times
Figure 16. Unclamped inductive load test circuit
L
D
G
A
D.U.T.
S
25 Ω
A
A
100 µH
fast
diode
B
B
B
VD
3.3
µF
D
G
+
RG
1000
+ µF
2200
+ µF
3.3
µF
VDD
ID
VDD
D.U.T.
S
D.U.T.
Vi
_
pulse width
AM01471v1
AM01470v1
Figure 17. Unclamped inductive waveform
Figure 18. Switching time waveform
V(BR)DSS
VD
ton
td(on)
IDM
toff
td(off)
tr
90%
90%
10%
ID
VDD
tf
VDD
10%
0
VGS
AM01472v1
0
VDS
90%
10%
AM01473v1
DS11870 - Rev 2
page 7/16
STD7N90K5
Package information
4
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
DS11870 - Rev 2
page 8/16
STD7N90K5
DPAK (TO-252) type A2 package information
4.1
DPAK (TO-252) type A2 package information
Figure 19. DPAK (TO-252) type A2 package outline
0068772_type-A2_rev24
DS11870 - Rev 2
page 9/16
STD7N90K5
DPAK (TO-252) type A2 package information
Table 9. DPAK (TO-252) type A2 mechanical data
Dim.
mm
Min.
Max.
A
2.20
2.40
A1
0.90
1.10
A2
0.03
0.23
b
0.64
0.90
b4
5.20
5.40
c
0.45
0.60
c2
0.48
0.60
D
6.00
6.20
D1
4.95
E
6.40
E1
5.10
5.20
5.30
e
2.16
2.28
2.40
e1
4.40
4.60
H
9.35
10.10
L
1.00
1.50
L1
2.60
2.80
3.00
L2
0.65
0.80
0.95
L4
0.60
R
V2
DS11870 - Rev 2
Typ.
5.10
5.25
6.60
1.00
0.20
0°
8°
page 10/16
STD7N90K5
DPAK (TO-252) type A2 package information
Figure 20. DPAK (TO-252) recommended footprint (dimensions are in mm)
FP_0068772_24
DS11870 - Rev 2
page 11/16
STD7N90K5
DPAK (TO-252) packing information
4.2
DPAK (TO-252) packing information
Figure 21. DPAK (TO-252) tape outline
10 pitches cumulative
tolerance on tape +/- 0.2 mm
T
P0
Top cover
tape
P2
D
E
F
B1
K0
For machine ref. only
including draft and
radii concentric around B0
W
B0
A0
P1
D1
User direction of feed
R
Bending radius
User direction of feed
AM08852v1
DS11870 - Rev 2
page 12/16
STD7N90K5
DPAK (TO-252) packing information
Figure 22. DPAK (TO-252) reel outline
T
40mm min.
access hole
at slot location
B
D
C
N
A
G measured
at hub
Tape slot
in core for
tape start
2.5mm min.width
Full radius
AM06038v1
Table 10. DPAK (TO-252) tape and reel mechanical data
Tape
Dim.
mm
mm
Dim.
Min.
Max.
A0
6.8
7
A
B0
10.4
10.6
B
1.5
12.1
C
12.8
1.6
D
20.2
G
16.4
50
B1
DS11870 - Rev 2
Reel
Min.
Max.
330
13.2
D
1.5
D1
1.5
E
1.65
1.85
N
F
7.4
7.6
T
K0
2.55
2.75
P0
3.9
4.1
Base qty.
2500
P1
7.9
8.1
Bulk qty.
2500
P2
1.9
2.1
R
40
T
0.25
0.35
W
15.7
16.3
18.4
22.4
page 13/16
STD7N90K5
Revision history
Table 11. Document revision history
Date
Revision
14-Oct-2016
1
Changes
First release.
Removed maturity status indication from cover page.
20-Feb-2018
2
The document status is production data.
Updated Table 5. Dynamic and Figure 5. Gate charge vs gate-source voltage.
Minor text changes.
DS11870 - Rev 2
page 14/16
STD7N90K5
Contents
Contents
1
Electrical ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1
Electrical characteristics (curves). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
4
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1
DPAK (TO-252) type A2 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2
DPAK (TO-252) packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
DS11870 - Rev 2
page 15/16
STD7N90K5
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved
DS11870 - Rev 2
page 16/16
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