STD888T4

STD888T4 Medium Current, High Performance, Low Voltage PNP Transistor General features ■ Very low Collector to Emitter saturation voltage ■ D.C. Current gain, hFE >100 ■ 5A continuous collector current ■ Surface mounting DPAK(TO-252) power package in tape & reel packing ■ 3 In compliance with the 2002/93/EC European Directive 1 DPAK (TO-252) Description The device in manufactured in low voltage PNP Planar Technology by using a “Base Island” layout. The resulting transistor shows exceptional high gain performance coupled with very low saturation voltage. Internal schematic diagram Applications ■ Power management in portable equipment ■ Voltage regulation in bias supply circuits ■ Switching regulator in battery charger applications ■ Heavy load driver Order codes Part Number Marking Package Packing STD888T4 D888 DPAK Tape & reel April 2006 Rev 2 1/10 www.st.com 10 STD888T4 Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2/10 STD888T4 1 Electrical ratings Electrical ratings Table 1. Absolute maximum rating Symbol Parameter Value Unit VCBO Collector-base voltage (IE = 0) -45 V VCEO Collector-emitter voltage (IB = 0) -30 V VEBO Emitter-base voltage (IC = 0) -6 V Collector current -5 A ICM Collector peak current (tP < 5ms) -10 A Ptot Total dissipation at T c = 25°C 15 W Tstg Storage temperature -65 to 150 °C 150 °C Value Unit 8.33 °C/W IC TJ Table 2. Symbol Rthj-case Max. operating junction temperature Thermal data Parameter Thermal resistance junction-case __max 3/10 Electrical characteristics 2 STD888T4 Electrical characteristics (Tcase = 25°C unless otherwise specified) Table 3. Symbol Electrical characteristics Parameter ICBO Collector cut-off current (IE =0) IEBO Emitter cut-off current (IC =0) Collector-emitter V(BR)CEO (2) breakdown voltage (IB =0) Test Conditions Typ. VCB = -30V VCB = -30V; TC = 100°C VEB = -6V Max. Unit -10 100 µA µA -10 µA IC = -10mA -30 V V(BR)CBO Collector-base breakdown voltage (IE =0) IC = -100µA -45 V V(BR)EBO Emitter-base breakdown voltage (IC =0) IE = -100µA -6 V VCE(sat) (2) VBE(sat) (2) hFE (2) Collector-emitter saturation voltage Base-emitter saturation voltage DC current gain IC = -0.5A IB = -5mA -0.15 V IC = -2A IB = -50mA -0.35 V IC = -5A IB = -250mA -0.7 V IC = -6A IB = -250mA -0.7 V IC = -8A IB = -400mA -1 V IC = -10A IB = -500mA -1.2 V IC = -2A IB = -50mA IC = -6A IB = -250mA IC = -10mA V CE = -1V 120 200 IC = -500mA V CE = -1V 100 200 IC = -5A V CE = -1V 70 100 IC = -5A V CE = -1V TC = 100°C td tr ts tf Resistive load Delay time Rise time Storage time Fall time -1.1 -1.2 V CE = -1V 55 IC = -10A V CE = -1V 35 IC = -3A V CC = -20V IB1 = -IB2 = -60mA (see figure 7) V V 300 100 IC = -8A Note (2) Pulsed duration = 300 µs, duty cycle ≤1.5% 4/10 Min. 180 220 ns 160 210 ns 250 300 ns 80 100 ns STD888T4 2.1 Electrical characteristics Electrical characteristics (curves) Figure 1. DC current gain Figure 2. DC current gain Figure 3. Collector-emitter saturation voltage Figure 4. Base-emitter saturation voltage Figure 5. Switching time resistive load Figure 6. Switching time resistive load 5/10 Electrical characteristics 2.2 Test circuits Figure 7. Resistive load switching test circuit 1) Fast electronic switch 2) Non-inductive resistor 6/10 STD888T4 STD888T4 3 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 7/10 Package mechanical data STD888T4 TO-252 (DPAK) MECHANICAL DATA mm DIM. MIN. TYP. inch MAX. MIN. TYP. MAX. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.213 C 0.45 0.60 0.018 0.024 C2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.252 0.260 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 L2 0.8 0.398 0.031 L4 0.60 1.00 0.024 0.039 V2 0o 8o 0o 0o P032P_B 8/10 STD888T4 4 Revision history Revision history Table 4. Revision history Date Revision Changes 24-Mar-2004 1 Initial release. 03-Apr-2006 2 New template. 9/10 STD888T4 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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