STB95N4F3, STD95N4F3
STP95N4F3
N-channel 40 V, 5.0 mΩ, 80 A STripFET™ III
Power MOSFET in D²PAK, DPAK, TO-220
Features
Order codes
VDSS
RDS(on)
max.
Pw
ID
TAB
TAB
STB95N4F3
STD95N4F3
40 V
STP95N4F3
< 5.8 m Ω
80 A
TAB
110 W
< 6.2 mΩ
3
1
■
Standard threshold drive
■
100% avalanche tested
D²PAK
3
3
1
1
DPAK
2
TO-220
Applications
■
Switching applications
– Automotive
Figure 1.
Internal schematic diagram
Description
$4!"OR
These devices are N-channel enhancement mode
Power MOSFETs produced using
STMicroelectronics’ STripFET™ III technology,
which is specifically designed to minimize onresistance and gate charge to provide superior
switching performance.
'
3
!-V
Table 1.
Device summary
Order codes
Marking
Package
STB95N4F3
95N4F3
D²PAK
STD95N4F3
95N4F3
DPAK
STP95N4F3
95N4F3
TO-220
Packaging
Tape and reel
December 2011
Doc ID 13288 Rev 4
Tube
1/20
www.st.com
20
Contents
STB95N4F3, STD95N4F3, STP95N4F3
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................. 6
3
Test circuits
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5
Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2/20
.............................................. 8
Doc ID 13288 Rev 4
STB95N4F3, STD95N4F3, STP95N4F3
1
Electrical ratings
Electrical ratings
Table 2.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source voltage
40
V
VGS
Gate-source voltage
± 20
V
Drain current (continuous) at TC = 25 °C
80
A
Drain current (continuous) at TC = 100 °C
65
A
Drain current (pulsed)
320
A
Total dissipation at TC = 25 °C
110
W
Derating factor
0.73
W/°C
8
V/ns
Single pulse avalanche energy
400
mJ
Operating junction temperature
Storage temperature
-55 to 175
°C
ID
(1)
ID
IDM
(2)
PTOT
dv/dt (3)
EAS
(4)
Tj
Tstg
Peak diode recovery voltage slope
1. Current limited by package.
2. Pulse width limited by safe operating area.
3. ISD ≤ 80 A, di/dt ≤ 400A/µs, VDS ≤ V(BR)DSS, Tj ≤ Tjmax.
4. Starting Tj = 25 °C, ID = 40 A, VDD = 30 V.
Table 3.
Thermal resistance
Value
Symbol
Parameter
Unit
D²PAK
Rthj-case
Rthj-a
Thermal resistance junction-case max
Maximum lead temperature for soldering purpose
TO-220
1.36
Thermal resistance junction-ambient max
Rthj-pcb (1) Thermal resistance junction-ambient max
Tl
DPAK
°C/W
62.5
30
50
°C/W
°C/W
300
°C
1. When mounted on 1inch² FR-4 2Oz Cu board.
Doc ID 13288 Rev 4
3/20
Electrical characteristics
2
STB95N4F3, STD95N4F3, STP95N4F3
Electrical characteristics
(TCASE=25 °C unless otherwise specified)
Table 4.
Symbol
Parameter
Test conditions
Min. Typ. Max. Unit
Drain-source breakdown
voltage
ID = 250 µA, VGS= 0
IDSS
Zero gate voltage drain
current (VGS = 0)
VDS = 40 V,
VDS = 40 V,Tc = 125 °C
10
100
µA
µA
IGSS
Gate body leakage current
(VDS = 0)
VGS = ±20 V
±200
nA
VGS(th)
Gate threshold voltage
VDS= VGS, ID = 250 µA
4
V
Static drain-source on
resistance
VGS= 10 V, ID= 40 A
5.0
5.8
mΩ
RDS(on)
VGS= 10 V, ID= 40 A for TO-220
5.4
6.2
mΩ
V(BR)DSS
Table 5.
4/20
Static
40
V
2
Dynamic
Symbol
Parameter
Test conditions
Ciss
Coss
Crss
Input capacitance
Output capacitance
Reverse transfer capacitance
VDS =25 V, f=1 MHz, VGS=0
-
2200
580
40
Qg
Qgs
Qgd
Total gate charge
Gate-source charge
Gate-drain charge
VDD=20 V, ID = 80 A
VGS =10 V
(see Figure 14)
-
40
11
8
Doc ID 13288 Rev 4
Min. Typ. Max. Unit
pF
pF
pF
54
nC
nC
nC
STB95N4F3, STD95N4F3, STP95N4F3
Table 6.
Symbol
Electrical characteristics
Switching on/off (inductive load)
Parameter
Test conditions
Min.
Typ.
Max.
Unit
td(on)
tr
Turn-on delay time
Rise time
VDD=20 V, ID= 40 A,
RG=4.7 Ω, VGS=10 V
(see Figure 16)
-
15
50
-
ns
ns
td(off)
tf
Turn-off delay time
Fall time
VDD=20 V, ID= 40 A,
RG=4.7 Ω, VGS=10 V
(see Figure 16)
-
40
15
-
ns
ns
Min.
Typ.
Max.
Unit
-
80
320
A
A
-
1.5
V
Table 7.
Symbol
ISD
ISDM
(1)
VSD (2)
trr
Qrr
IRRM
Source drain diode
Parameter
Test conditions
Source-drain current
Source-drain current (pulsed)
Forward on voltage
ISD=80 A, VGS=0
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD=80 A,
di/dt = 100 A/µs,
VDD= 30 V, Tj=150 °C
(see Figure 15)
-
45
60
2.8
ns
nC
A
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Doc ID 13288 Rev 4
5/20
Electrical characteristics
STB95N4F3, STD95N4F3, STP95N4F3
2.1
Electrical characteristics (curves)
Figure 2.
Safe operating area
Figure 3.
Thermal impedance
Figure 4.
Output characteristics
Figure 5.
Transfer characteristics
Figure 6.
Static drain-source on resistance
Figure 7.
Normalized BVDSS vs temperature
HV29000
RDS(on)
(mΩ)
6.5
ID=40A
VGS=10V
6.0
5.5
TO-220
DPAK, D²PAK
5.0
4.5
0
6/20
20
40
60
80
ID(A)
Doc ID 13288 Rev 4
STB95N4F3, STD95N4F3, STP95N4F3
Figure 8.
Electrical characteristics
Gate charge vs gate-source voltage Figure 9.
Figure 10. Normalized gate threshold voltage
vs temperature
Capacitance variations
Figure 11. Normalized on resistance vs
temperature
Figure 12. Source-drain diode forward
characteristics
Doc ID 13288 Rev 4
7/20
Test circuits
3
STB95N4F3, STD95N4F3, STP95N4F3
Test circuits
Figure 13. Switching times test circuit for
resistive load
Figure 14. Gate charge test circuit
VDD
12V
47kΩ
1kΩ
100nF
3.3
μF
2200
RL
μF
VGS
IG=CONST
VDD
100Ω
Vi=20V=VGMAX
VD
RG
2200
μF
D.U.T.
D.U.T.
VG
2.7kΩ
PW
47kΩ
1kΩ
PW
AM01468v1
AM01469v1
Figure 15. Test circuit for inductive load
Figure 16. Unclamped inductive load test
switching and diode recovery times
circuit
A
A
D.U.T.
FAST
DIODE
B
B
L
A
D
G
VD
L=100μH
S
3.3
μF
B
25 Ω
1000
μF
D
VDD
2200
μF
3.3
μF
VDD
ID
G
RG
S
Vi
D.U.T.
Pw
AM01470v1
Figure 17. Unclamped inductive waveform
AM01471v1
Figure 18. Switching time waveform
ton
V(BR)DSS
tdon
VD
toff
tr
tdoff
tf
90%
90%
IDM
10%
ID
VDD
10%
0
VDD
VDS
90%
VGS
AM01472v1
8/20
0
Doc ID 13288 Rev 4
10%
AM01473v1
STB95N4F3, STD95N4F3, STP95N4F3
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com. ECOPACK
is an ST trademark.
Doc ID 13288 Rev 4
9/20
Package mechanical data
Table 8.
STB95N4F3, STD95N4F3, STP95N4F3
D²PAK (TO-263) mechanical data
mm
Dim.
Min.
Typ.
A
4.40
4.60
A1
0.03
0.23
b
0.70
0.93
b2
1.14
1.70
c
0.45
0.60
c2
1.23
1.36
D
8.95
9.35
D1
7.50
E
10
E1
8.50
10.40
e
2.54
e1
4.88
5.28
H
15
15.85
J1
2.49
2.69
L
2.29
2.79
L1
1.27
1.40
L2
1.30
1.75
R
V2
10/20
Max.
0.4
0°
8°
Doc ID 13288 Rev 4
STB95N4F3, STD95N4F3, STP95N4F3
Package mechanical data
Figure 19. D²PAK (TO-263) drawing
0079457_S
Figure 20. D²PAK footprint(a)
16.90
12.20
5.08
1.60
3.50
9.75
Footprint
a. All dimension are in millimeters
Doc ID 13288 Rev 4
11/20
Package mechanical data
Table 9.
STB95N4F3, STD95N4F3, STP95N4F3
DPAK (TO-252) mechanical data
mm
Dim.
Min.
Typ.
A
2.20
2.40
A1
0.90
1.10
A2
0.03
0.23
b
0.64
0.90
b4
5.20
5.40
c
0.45
0.60
c2
0.48
0.60
D
6.00
6.20
D1
E
5.10
6.40
6.60
E1
4.70
e
2.28
e1
4.40
4.60
H
9.35
10.10
L
1
1.50
L1
2.80
L2
0.80
L4
0.60
1
R
V2
12/20
Max.
0.20
0°
8°
Doc ID 13288 Rev 4
STB95N4F3, STD95N4F3, STP95N4F3
Package mechanical data
Figure 21. DPAK (TO-252) drawing
0068772_H
Figure 22. DPAK footprint(b)
6.7
1.8
3
1.6
2.3
6.7
2.3
1.6
AM08850v1
b. All dimension are in millimeters
Doc ID 13288 Rev 4
13/20
Package mechanical data
Table 10.
STB95N4F3, STD95N4F3, STP95N4F3
TO-220 type A mechanical data
mm
Dim.
Min.
Typ.
A
4.40
4.60
b
0.61
0.88
b1
1.14
1.70
c
0.48
0.70
D
15.25
15.75
D1
14/20
Max.
1.27
E
10
10.40
e
2.40
2.70
e1
4.95
5.15
F
1.23
1.32
H1
6.20
6.60
J1
2.40
2.72
L
13
14
L1
3.50
3.93
L20
16.40
L30
28.90
∅P
3.75
3.85
Q
2.65
2.95
Doc ID 13288 Rev 4
STB95N4F3, STD95N4F3, STP95N4F3
Package mechanical data
Figure 23. TO-220 type A drawing
0015988_typeA_Rev_S
Doc ID 13288 Rev 4
15/20
Packaging mechanical data
5
STB95N4F3, STD95N4F3, STP95N4F3
Packaging mechanical data
Table 11.
D²PAK (TO-263) tape and reel mechanical data
Tape
Reel
mm
mm
Dim.
16/20
Dim.
Min.
Max.
A0
10.5
10.7
A
B0
15.7
15.9
B
1.5
D
1.5
1.6
C
12.8
D1
1.59
1.61
D
20.2
E
1.65
1.85
G
24.4
F
11.4
11.6
N
100
K0
4.8
5.0
T
P0
3.9
4.1
P1
11.9
12.1
Base qty
1000
P2
1.9
2.1
Bulk qty
1000
R
50
T
0.25
0.35
W
23.7
24.3
Doc ID 13288 Rev 4
Min.
Max.
330
13.2
26.4
30.4
STB95N4F3, STD95N4F3, STP95N4F3
Table 12.
Packaging mechanical data
DPAK (TO-252) tape and reel mechanical data
Tape
Reel
mm
mm
Dim.
Dim.
Min.
Max.
A0
6.8
7
A
B0
10.4
10.6
B
1.5
12.1
C
12.8
1.6
D
20.2
G
16.4
50
B1
Min.
Max.
330
13.2
D
1.5
D1
1.5
E
1.65
1.85
N
F
7.4
7.6
T
K0
2.55
2.75
P0
3.9
4.1
Base qty.
2500
P1
7.9
8.1
Bulk qty.
2500
P2
1.9
2.1
R
40
T
0.25
0.35
W
15.7
16.3
Doc ID 13288 Rev 4
18.4
22.4
17/20
Packaging mechanical data
STB95N4F3, STD95N4F3, STP95N4F3
Figure 24. Tape
10 pitches cumulative
tolerance on tape +/- 0.2 mm
T
P0
Top cover
tape
P2
D
E
F
W
K0
B0
A0
P1
D1
User direction of feed
R
Bending radius
User direction of feed
AM08852v2
Figure 25. Reel
T
REEL DIMENSIONS
40mm min.
Access hole
At sl ot location
B
D
C
N
A
Full radius
Tape slot
in core for
tape start 25 mm min.
width
G measured at hub
AM08851v2
18/20
Doc ID 13288 Rev 4
STB95N4F3, STD95N4F3, STP95N4F3
6
Revision history
Revision history
Table 13.
Dcument revision history
Date
Revision
22-Feb-2007
1
First release
15-May-2007
2
Changes on applications
10-Sep-2009
3
Removed package, mechanical data: IPAK
13-Dec-2011
4
Changes
New package and mechanical data have been added:
– Table 8: D²PAK (TO-263) mechanical data,
Figure 19: D²PAK (TO-263) drawing, Figure 20: D²PAK footprint
Section 5: Packaging mechanical data has been updated:
– Table 11: D²PAK (TO-263) tape and reel mechanical data,
Figure 24: Tape, Figure 25: Reel.
Minor text changes.
Doc ID 13288 Rev 4
19/20
STB95N4F3, STD95N4F3, STP95N4F3
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2011 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
20/20
Doc ID 13288 Rev 4