STDD15-05WFILM

STDD15 series ® LOW CAPACITANCE DETECTION DIODE MAIN PRODUCT CHARACTERISTICS IF(AV) 10 mA VRRM 15 V Tj (max) 150 °C VF (max) 0.51 V ) s ( ct e t e ol Low diode capacitance Device designed for RF application Low profile package Available in 3 configurations Very low parasitic inductor & resistor ■ ■ ■ ■ s b O SOT323-6L STDD15-xxS SCHEMATIC DIAGRAM )- DESCRIPTION The STDD15 is a dual diode series for the detection of a RF signal and the compensation of the voltage drift with the temperature. The SOT323 package makes the device ideal in application where the space saving is critical like mobile phones. The low junction capacitance will reduce the disturbance on the RF signal 1 t(s c u d e t e ol Pr SOT323-3L STDD15-xxW FEATURES AND BENEFITS ■ u d o 3 Series configuration STDD15-04W 2 o r P bs 1 4 2 5 3 6 Parallel configuration STDD15-07S 1 3 O Common cathode configuration STDD15-05W 2 ABSOLUTE RATINGS (limiting values) Symbol VRRM IF Parameter Value Unit Repetitive peak reverse voltage 15 V Continuous forward current 10 mA 2 A - 65 + 150 °C 150 °C IFSM Surge non repetitive forward current Tstg Storage temperature range Tj tp = 10ms Maximum operating junction temperature August 2002 - Ed: 3A 1/6 STDD15 series THERMAL PARAMETERS Symbol Rth (j-a)* Parameter Junction to ambient Value Unit 500 °C/W *: Mounted with minimum recommended pad size, PC board FR4. STATIC ELECTRICAL CHARACTERISTICS Symbol IR* Parameter Tests conditions Reverse leakage current Tj = 25°C Min. Typ. VR = 1V Tj = 125°C Tj = 25°C 6 VR = 15V Forward voltage drop Tj = 25°C ete Tj = 125°C bs Tj = 125°C Symbol Parameter s ( t c u d o C Diode capacitance RF Forward resistance Ls let o s b O 2/7 r P e Series inductance µA ) s ( ct 30 10 100 350 380 230 260 500 570 450 510 µA mV O ) * Pulse test: tp ≤ 250µs, Delta ≤ 2% ELECTRICAL CHARACTERISTICS Pr ol IF = 10 mA 0.035 u d o IF = 1 mA Tj = 25°C Unit 0.23 Tj = 125°C V F* Max. Tests conditions VR = 0 V F = 1MHz IF = 5 mA F = 100MHz Min. Typ. Max. Unit 1.0 pF 15 Ω 1.5 nH STDD15 series Fig. 1: Forward voltage drop versus forward current (typical values). Fig. 2: Reverse leakage current versus reverse voltage applied (typical values). IFM(mA) IR(µA) 1.E+02 1.E+02 Tj=125°C 1.E+01 1.E+01 Tj=85°C 1.E+00 Tj=125°C 1.E-01 1.E+00 Tj=25°C Tj=85°C Tj=-40°C VFM(V) VR(V) 1.E-03 1.E-01 0.0 0.2 0.4 0.6 0.8 1.0 0.0 1.2 Fig. 3: Differential forward resistance versus forward current (typical values). 100 ) s ( ct 1.E-02 Tj=25°C 2.5 0.8 s ( t c 1 1.0 10.0 e t e ol 12.5 15.0 r P e F=1MHz Vosc=30mVRMS Tj=25°C 0.7 0.6 0.5 0.4 0.3 du o r P IF(mA) u d o s b O 0.9 )- 10.0 t e l o C(pF) 1.0 10 7.5 Fig. 4: Junction capacitance versus reverse voltage applied (typical values). RF(Ω) F=10kHz Tj=25°C 5.0 0.2 0.1 VR(V) 0.0 100.0 Fig. 5: Variation of thermal impedance junction to ambient versus pulse duration (printed circuit board, epoxy FR4). s b O 0.0 2.5 5.0 7.5 10.0 12.5 15.0 Fig. 6: Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board, epoxy FR4).. Zth(j-a)(°C/W) Rth(j-a) 600 1000.0 550 500 450 100.0 400 350 tp(s) S(mm²) 300 10.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 0 5 10 15 20 25 30 35 40 45 50 3/6 STDD15 series Electrical Model (PSPICE) Parameter Value Unit Is 2.66 e-8 A N 1.04 M 0.772 Vj 0.65 V Eg 0.69 eV Xti 2 Rs 15 W Cjo 0.85 e-12 F Bv 20 V Ibv 10 e-3 A ) s ( ct u d o r P e PACKAGE MECHANICAL DATA SOT323-3L bs REF. A A1 ) s ( ct D e t e ol s b O Pr H E θ c e FOOTPRINT (in millimeters) 0.95 0.50 2.9 1 0.8 4/6 -O u d o b L t e l o DIMENSIONS Millimeters Min. Typ. Max. Inches Min. Typ. Max. A 0.8 1.1 0.031 0.043 A1 0.0 0.1 0.0 0.004 b 0.25 0.4 0.010 0.016 c 0.1 0.26 0.004 0.010 D 1.8 2.0 2.2 E 1.15 1.25 1.35 0.045 0.049 0.053 e 0.071 0.079 0.086 0.65 0.026 H 1.8 2.1 2.4 0.071 0.083 0.094 L 0.1 0.2 0.3 0.004 0.008 0.012 θ 0 30° 0 30° STDD15 series PACKAGE MECHANICAL DATA SOT323-6L DIMENSIONS A REF. A2 Millimeters A1 D e e L E HE Min. Max. Min. Max. A 0.8 1.1 0.031 0.043 A1 0 0.1 0 0.004 A2 0.8 1 0.031 0.039 b 0.15 0.3 0.006 0.012 c 0.1 0.18 0.004 0.007 D 1.8 2.2 0.071 0.086 E 1.15 1.35 0.045 0.053 e 1.8 e t e l Q1 c b L 0.1 o s b 0.1 2.4 ) s ( ct u d o Pr 0.65 Typ. HE Q1 Inches 0.025 Typ. 0.071 0.094 0.4 0.004 0.016 0.45 0.004 0.018 O ) FOOTPRINT (in millimeters) 0.3mm s ( t c 1mm u d o e t e l o s b Pr 2.9mm 1mm 0.35mm O Note: The device fulfills the MSL level 1 after leadfree soldering profile. Ordering code Marking Package Weight Base qty Delivery mode STDD15-04W 24 SOT323-3L 0.006 g 3000 Tape & reel STDD15-05W 25 SOT323-3L 0.006 g 3000 Tape & reel STDD15-07S D25 SOT323-6L 0.006 g 3000 Tape & reel 5/6 STDD15 series ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2002 STMicroelectronics - Printed in Italy - All rights reserved. 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