STDLED524

STDLED524, STFILED524, STPLED524, STULED524 N-channel 525 V, 2.1 Ω typ., 4.0 A Power MOSFET in DPAK, I2PAKFP, TO-220 and IPAK packages Datasheet - production data Features TAB 3 1 Order codes DPAK VDS RDS(on) max. ) s ( t STDLED524 1 TAB 2 STFILED524 3 STPLED524 I²PAKFP 3 1 45 W 525 V STULED524 TAB 2 3 TO-220 2 1 IPAK ) (s t c u d o r G(1) s b O 4.0 A 45 W o r P • 100% avalanche tested e t e ol • Extremely high dv/dt capability • Improved diode reverse recovery characteristics s b O • Zener-protected Applications • LED lighting applications Description P e t e l o 20 W c u d < 2.6 Ω • Very low intrinsic capacitance Figure 1. Internal schematic diagram D(2,TAB) PTOT ID These Power MOSFETs boast extremely low onresistance and very good dv/dt capability, rendering them suitable for buck-boost and flyback topologies. S(3) AM01476v1 Table 1. Device summary Order codes Marking Package Packaging DPAK Tape and reel STDLED524 2 STFILED524 I PAKFP (TO-281) LED524 STPLED524 TO-220 STULED524 IPAK August 2013 This is information on a product in full production. DocID025164 Rev 1 Tube 1/22 www.st.com 22 Contents STDLED524,STFILED524,STPLED524,STULED524 Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 Test circuits .............................................. 9 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 2/22 DocID025164 Rev 1 STDLED524,STFILED524,STPLED524,STULED524 1 Electrical ratings Electrical ratings Table 2. Absolute maximum ratings Value Symbol Parameter DPAK, IPAK Unit I2PAKFP TO-220 VDS Drain-source voltage 525 V VGS Gate-source voltage ± 30 V (1) 4.0 2.9 ID Drain current (continuous) at TC = 25 °C 4.0 4.0 ID Drain current (continuous) at TC = 100 °C 2.9 2.9(1) Drain current (pulsed) 14 (1) Total dissipation at TC = 25 °C 45 IDM (2) PTOT IAR Avalanche current, repetitive or notrepetitive (pulse width limited by TJ max.) EAS Single pulse avalanche energy (starting TJ = 25 °C, ID = IAR, VDD = 50 V) dv/dt(3) o r P 20 e t e ol bs Peak diode recovery voltage slope O ) VISO Insulation withstand voltage (AC) TJ Tstg Operating junction temperature Storage temperature A ct A 45 W du 14 (s) 14 1.3 A 110 mJ 12 V/ns 2500 V - 55 to 150 s ( t c A °C 1. Limited only by maximum temperature allowed. u d o 2. Pulse width limited by safe operating area. 3. ISD ≤ 2.5 A, di/dt ≤ 400 A/µs, VDS peak ≤ V(BR)DSS, VDD = 80% V(BR)DSS. r P e let O o s b Symbol Table 3. Thermal data Value Parameter Rthj-case Thermal resistance junction-case max. Rthj-amb Thermal resistance junction-ambient max. Rthj-pcb TI (1) Thermal resistance junction-pcb max. Maximum lead temperature for soldering purpose Unit DPAK I²PAKFP 2.78 6.25 TO-220 IPAK 2.78 62.5 50 °C/W 100 °C/W °C/W 300 1. When mounted on 1inch sq FR-4 board, 2 oz Cu. DocID025164 Rev 1 3/22 Electrical characteristics 2 STDLED524,STFILED524,STPLED524,STULED524 Electrical characteristics (Tcase = 25 °C unless otherwise specified) Table 4. On/off states Symbol V(BR)DSS Parameter Test conditions Drain-source breakdown voltage ID = 1 mA, VGS = 0 IDSS Zero gate voltage VDS = 525 V drain current (VGS = 0) VDS = 525 V, TC = 125 °C IGSS Gate-body leakage current (VDS = 0) Min. Typ. Max. Unit 525 V 1 50 µA µA 10 µA 4.5 V 2.1 2.6 Ω Min. Typ. Max. Unit VDS = 100 V, f = 1 MHz, VGS = 0 - 340 30 6 - pF pF pF VDS = 0 to 420 V, VGS = 0 - 22 - pF Gate input resistance f = 1 MHz open drain - 4 - Ω Total gate charge Gate-source charge Gate-drain charge VDD = 400 V, ID = 2.5 A, VGS = 10 V (see Figure 19) - 12 2.2 7.5 - nC nC nC ) s ( ct VGS = ± 20 V; VDS = 0 VGS(th) Gate threshold voltage VDS = VGS, ID = 50 µA RDS(on) Static drain-source on-resistance VGS = 10 V, ID = 2.2 A e t e ol du 3 o r P 3.6 Table 5. Dynamic Symbol Coss eq.(1) Qg Qgs Qgd e t e ol bs O )- s ( t c u d o Equivalent output capacitance Pr s b O Test conditions Input capacitance Output capacitance Reverse transfer capacitance Ciss Coss Crss Rg Parameter 1. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDS. Table 6. Switching times Symbol td(on) tr td(off) tf 4/22 Parameter Turn-on delay time Rise time Turn-off-delay time Fall time Test conditions VDD = 260 V, ID = 1.25 A, RG = 4.7 Ω, VGS = 10 V (see Figure 18) DocID025164 Rev 1 Min. Typ. - 8 7 21 14 Max. Unit - ns ns ns ns STDLED524,STFILED524,STPLED524,STULED524 Electrical characteristics Table 7. Source-drain diode Symbol Parameter Test conditions ISD ISDM (1) Source-drain current Source-drain current (pulsed) VSD (2) Forward on voltage trr Qrr IRRM trr Qrr IRRM Min. Typ. Max. Unit - 2.5 10 A A ISD = 2.5 A, VGS = 0 - 1.6 V Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 2.5 A, di/dt = 100 A/µs VDD= 60 V (see Figure 20) - 173 778 9 ns µC A Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 2.5 A, di/dt = 100 A/µs VDD= 60 V TJ = 150 °C (see Figure 20) - 196 941 10 ns µC A 1. Pulse width limited by safe operating area. ) s ( ct u d o 2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%. r P e Table 8. Gate-source Zener diode Symbol BVGSO Parameter t e l o Test conditions Gate-source breakdown voltage bs IGS= ± 1 mA, ID = 0 Min. Typ. 30 - Max. Unit - V O ) The built-in back-to-back Zener diodes have been specifically designed to enhance not only the device’s ESD capability, but also to make them capable of safely absorbing any voltage transients that may occasionally be applied from gate to source. In this respect, the Zener voltage is appropriate to achieve efficient and cost-effective protection of the device’s integrity. The integrated Zener diodes thus eliminate the need for external components. s ( t c u d o r P e t e l o s b O DocID025164 Rev 1 5/22 Electrical characteristics 2.1 STDLED524,STFILED524,STPLED524,STULED524 Electrical characteristics (curves) Figure 2. Safe operating area DPAK, IPAK AM08839v1 ID (A) 10µs 10 is ea is x in n ma tio y ra d b e e p O imit L R 100µs ) ar th 1 Figure 3. Thermal impedance DPAK, IPAK on S( D 1ms 10ms ) s ( ct 0.1 Tj=150°C Tc=25°C Single pulse 0.01 0.1 10 1 100 u d o VDS(V) Figure 4. Safe operating area for I2PAKFP 10 is ea s i th x in n ma tio y ra d b e e p O imit L R ) (s 10µs ) ar on S( D s b O 100µs ct du 0.1 0.01 0.1 1ms 10ms ro P e t e l o 1 Tj=150°C Tc=25°C Single pulse 10 100 VDS(V) Figure 6. Safe operating area TO-220 bs O 10 is in e ar ax R 100µs ) on S( D 1ms n m tio by ra pe ited O im L 0.1 6/22 th 10µs is a 0.01 0.1 Figure 7. Thermal impedance TO-220 AM08837v1 ID (A) 1 t e l o AM08838v1 ID (A) 1 r P e Figure 5. Thermal impedance for I2PAKFP 10ms Tj=150°C Tc=25°C Single pulse 1 10 100 VDS(V) DocID025164 Rev 1 STDLED524,STFILED524,STPLED524,STULED524 Electrical characteristics Figure 8. Output characteristics Figure 9. Transfer characteristics AM08840v1 ID (A) AM08841v1 ID (A) 7 10 VGS=10V VDS=15V 6 7V 8 5 6 4 6V 3 4 ) s ( ct 2 2 1 5V 0 0 5 10 20 15 0 0 VDS(V) 25 Figure 10. Normalized BVDSS vs temperature RDS(on) (Ω) 1.45 BVDSS ID=1mA 1.10 1.35 O ) 1.00 s ( t c 0.95 0.90 -75 -25 e t e l du 4 5 du 6 7 8 9 o r P VGS(V) e t e l AM08843v1 VGS=10V o r P 25 75 AM08844v1 VGS (V) VDD=420V ID=4.4A 12 VDS 10 VGS 1.25 1.20 1.15 1.10 TJ(°C) 125 1.30 1.05 Figure 12. Gate charge vs gate-source voltage b O 3 o s b 1.40 1.05 so 2 Figure 11. Static drain-source on-resistance AM08842v1 (norm) 1 1.00 0 1.0 2.0 3.0 4.0 ID(A) Figure 13. Capacitance variations AM08845v1 C (pF) 400 350 1000 Ciss 300 8 250 6 200 100 150 4 100 2 Crss 50 0 0 Coss 10 5 10 15 20 0 25 Qg(nC) DocID025164 Rev 1 1 0.1 1 10 100 VDS(V) 7/22 Electrical characteristics STDLED524,STFILED524,STPLED524,STULED524 Figure 14. Normalized gate threshold voltage vs temperature Figure 15. Normalized on-resistance vs temperature AM08846v1 VGS(th) AM08847v1 RDS(on) (norm) (norm) 1.10 2.5 ID=50µA 2.0 1.00 1.5 0.90 1.0 ) s ( ct 0.80 0.5 0.70 -75 25 -25 75 125 0 -75 TJ(°C) Figure 16. Source-drain diode forward characteristics 0.9 100 0.7 ) (s TJ=150°C 0.5 0.3 r P e 0 0 t e l o 1 2 3 4 5 AM08849v1 ID=4.4A 90 80 70 60 50 40 20 ISD(A) s b O 8/22 TJ(°C) 30 od 0.2 0.1 b O t c u 0.4 125 o r P l o s 110 TJ=25°C 0.6 ete EAS (mJ) TJ=-50°C 0.8 du 75 Figure 17. Maximum avalanche energy vs starting Tj AM08848v1 VSD (V) 25 -25 DocID025164 Rev 1 10 0 0 20 40 60 80 100 120 140 TJ(°C) STDLED524,STFILED524,STPLED524,STULED524 3 Test circuits Test circuits Figure 18. Switching times test circuit for resistive load Figure 19. Gate charge test circuit VDD 12V 47kΩ 1kΩ 100nF 3.3 μF 2200 RL μF IG=CONST VDD VGS 100Ω Vi=20V=VGMAX VD RG 2200 μF D.U.T. VG c u d 47kΩ 1kΩ AM01468v1 e t e ol Figure 20. Test circuit for inductive load switching and diode recovery times A A G D.U.T. FAST DIODE B B S s ( t c 3.3 μF B 25 Ω D 1000 μF RG S r P e s b O 2200 μF 3.3 μF VDD ID Vi D.U.T. Pw let AM01470v1 AM01471v1 Figure 22. Unclamped inductive waveform b O AM01469v1 L VD VDD u d o G so )- L=100μH o r P Figure 21. Unclamped inductive load test circuit A D ) s ( t 2.7kΩ PW PW D.U.T. Figure 23. Switching time waveform ton V(BR)DSS tdon VD toff tr tdoff tf 90% 90% IDM 10% ID VDD 10% 0 VDD VDS 90% VGS AM01472v1 0 DocID025164 Rev 1 10% AM01473v1 9/22 Package mechanical data 4 STDLED524,STFILED524,STPLED524,STULED524 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 9. DPAK (TO-252) mechanical data mm Dim. Min. Typ. 2.20 2.40 A1 0.90 1.10 A2 0.03 b 0.64 b4 5.20 c 0.45 c2 0.48 D 6.00 E 6.40 u d o 0.23 e t e l o s b ) s ( ct E1 e u d o e1 Pr H so b O 10/22 ) s ( ct A D1 e t e l Max. L -O 5.40 0.60 0.60 6.20 6.60 4.70 2.28 4.40 4.60 9.35 10.10 1.00 1.50 2.80 L2 0.80 0.60 1.00 R V2 0.90 5.10 (L1) L4 Pr 0.20 0° 8° DocID025164 Rev 1 STDLED524,STFILED524,STPLED524,STULED524 Package mechanical data Figure 24. DPAK (TO-252) drawings ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 0068772_K DocID025164 Rev 1 11/22 Package mechanical data STDLED524,STFILED524,STPLED524,STULED524 Figure 25. DPAK footprint (a) ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O a. All dimensions are in millimeters. 12/22 DocID025164 Rev 1 Footprint_REV_K STDLED524,STFILED524,STPLED524,STULED524 Package mechanical data Table 10. I2PAKFP (TO-281) mechanical data mm Dim. Min. Typ. Max. A 4.40 4.60 B 2.50 2.70 D 2.50 2.75 D1 0.65 0.85 E 0.45 0.70 F 0.75 1.00 ) s ( ct F1 1.20 G 4.95 H 10.00 L1 21.00 L2 13.20 L3 10.55 L4 2.70 L5 0.85 L6 7.30 du 5.20 - ol ete )- s b O o r P 10.40 23.00 14.10 10.85 3.20 1.25 7.50 s ( t c u d o r P e t e l o s b O DocID025164 Rev 1 13/22 Package mechanical data STDLED524,STFILED524,STPLED524,STULED524 Figure 26. I2PAKFP (TO-281) drawings ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 14/22 DocID025164 Rev 1 UHY$ STDLED524,STFILED524,STPLED524,STULED524 Package mechanical data Table 11. TO-220 type A mechanical data mm Dim. Min. Typ. A 4.40 4.60 b 0.61 0.88 b1 1.14 1.70 c 0.48 0.70 D 15.25 15.75 D1 ) s ( ct 1.27 E 10 e 2.40 e1 4.95 F 1.23 H1 6.20 J1 2.40 L 13 L1 3.50 10.40 du 2.70 L30 )- 3.75 du Q s b O s ( t c ∅P ete ol L20 e t e ol Max. 2.65 o r P 5.15 1.32 6.60 2.72 14 3.93 16.40 28.90 3.85 2.95 o r P s b O DocID025164 Rev 1 15/22 Package mechanical data STDLED524,STFILED524,STPLED524,STULED524 Figure 27. TO-220 type A drawings ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r 0015988_typeA_Rev_S P e t e l o s b O 16/22 DocID025164 Rev 1 STDLED524,STFILED524,STPLED524,STULED524 Package mechanical data Table 12. IPAK (TO-251) mechanical data mm Dim. Min. Typ. Max. A 2.20 2.40 A1 0.90 1.10 b 0.64 0.90 b2 0.95 b4 5.20 5.40 B5 ) s ( ct 0.30 c 0.45 c2 0.48 D 6.00 E 6.40 0.60 du e t e ol e 2.28 e1 4.40 H L 9.00 L1 )0.80 L2 s b O s ( t c V1 o r P 0.60 6.20 6.60 4.60 16.10 9.40 1.20 0.80 1.00 10° u d o r P e t e l o s b O DocID025164 Rev 1 17/22 Package mechanical data STDLED524,STFILED524,STPLED524,STULED524 Figure 28. IPAK (TO-251) drawings ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 18/22 0068771_K DocID025164 Rev 1 STDLED524,STFILED524,STPLED524,STULED524 5 Packaging mechanical data Packaging mechanical data Table 13. DPAK (TO-252) tape and reel mechanical data Tape Reel mm mm Dim. Dim. Min. Max. A0 6.8 7 A B0 10.4 10.6 B 1.5 12.1 C 12.8 1.6 D 20.2 G 16.4 B1 Min. D 1.5 D1 1.5 E 1.65 1.85 N F 7.4 7.6 T K0 2.55 2.75 P0 3.9 4.1 P1 7.9 8.1 P2 1.9 2.1 R 40 T 0.25 W 15.7 t c u ) (s 330 ) s ( ct 13.2 u d o r P e 50 t e l o s b O Max. 18.4 22.4 Base qty. 2500 Bulk qty. 2500 0.35 16.3 d o r P e t e l o s b O DocID025164 Rev 1 19/22 Packaging mechanical data STDLED524,STFILED524,STPLED524,STULED524 Figure 29. Tape for DPAK (TO-252) 10 pitches cumulative tolerance on tape +/- 0.2 mm P0 Top cover tape T P2 D E F B1 W K0 B0 For machine ref. only including draft and radii concentric around B0 A0 D1 P1 ) s ( ct User direction of feed u d o r P e let o s b O ) s ( t c u d o Bending radius User direction of feed AM08852v1 Figure 30. Reel for DPAK (TO-252) T r P e REEL DIMENSIONS 40mm min. t e l o s b O R Access hole At slot location B D C N A Full radius Tape slot in core for tape start 25 mm min. width G measured at hub AM08851v2 20/22 DocID025164 Rev 1 STDLED524,STFILED524,STPLED524,STULED524 6 Revision history Revision history Table 14. Document revision history Date Revision 27-Aug-2013 1 Changes First release. ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O DocID025164 Rev 1 21/22 STDLED524,STFILED524,STPLED524,STULED524 ) s ( ct Please Read Carefully: u d o Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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