STDLED623,
STULED623
N-channel 620 V, 3.0 Ω typ., 3.0 A Power MOSFET
in DPAK and IPAK packages
Datasheet - production data
Features
Order codes
TAB
TAB
STDLED623
3
3
2
1
1
STULED623
RDS(on)
max.
620 V
< 3.6 Ω
PTOT
ID
)
s
(
ct
3.0 A
45 W
u
d
o
IPAK
DPAK
VDS
• 100% avalanche tested
• Extremely high dv/dt capability
r
P
e
• Very low intrinsic capacitance
Figure 1. Internal schematic diagram
D(2,TAB)
)
(s
t
c
u
od
t
e
l
o
t
e
l
o
• Zener-protected
G(1)
r
P
e
• Improved diode reverse recovery
characteristics
• LED lighting applications
Description
These Power MOSFETs boast extremely low onresistance, superior dynamic performance and
high avalanche capability, making them suitable
for the buck-boost and flyback topology.
S(3)
s
b
O
s
b
O
Applications
AM01476v1
Table 1. Device summary
Order codes
Marking
Package
Packaging
DPAK
Tape and reel
IPAK
Tube
STDLED623
LED623
STULED623
September 2013
This is information on a product in full production.
DocID025178 Rev 1
1/18
www.st.com
18
Contents
STDLED623, STULED623
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
......................... 6
3
Test circuits
.............................................. 9
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5
Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
2/18
DocID025178 Rev 1
STDLED623, STULED623
1
Electrical ratings
Electrical ratings
Table 2. Absolute maximum ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source voltage (VGS = 0)
620
V
VGS
Gate-source voltage
± 30
V
ID
Drain current (continuous) at TC = 25 °C
3.0
A
ID
Drain current (continuous) at TC = 100 °C
3.0
A
Drain current (pulsed)
12
A
Total dissipation at TC = 25 °C
45
IDM
(1)
PTOT
IAR
Avalanche current, repetitive or not-repetitive (pulse width
limited by Tj max.)
EAS
Single pulse avalanche energy (starting Tj = 25 °C, ID =
IAR, VDD = 50 V)
dv/dt(2)
e
t
e
ol
Peak diode recovery voltage slope
VISO
Tstg
Storage temperature
)-
Tj
s
b
O
W
du
W/°C
85
kV
12
V/ns
0.36
o
r
P
Insulation withstand voltage (RMS) from all three leads to
external heat sink
(t = 1 s; TC = 25 °C)
)
s
(
ct
V
-55 to 150
°C
150
°C
Max. operating junction temperature
s
(
t
c
1. Pulse width limited by safe operating area.
2. ISD ≤ 2.2 A, di/dt ≤ 400 A/µs, VDS peak ≤ V(BR)DSS, VDD = 80% V(BR)DSS.
u
d
o
Pr
Symbol
e
t
e
ol
O
bs
Table 3. Thermal data
Value
Parameter
Unit
DPAK
IPAK
6.25
Rthj-case
Thermal resistance junction-case max.
2.78
Rthj-pcb(1)
Thermal resistance junction-pcb max.
50
Rthj-amb
Thermal resistance junction-amb max.
°C/W
°C/W
100
°C/W
1. When mounted on 1 inch² FR-4 board, 2 oz Cu.
Table 4. Avalanche characteristics
Symbol
Parameter
Max. value
Unit
IAR
Avalanche current, repetitive or not-repetitive (pulse width
limited by Tj max.)
2.7
A
EAS
Single pulse avalanche energy
(starting Tj = 25 °C, ID = IAR, VDD = 50 V)
100
mJ
DocID025178 Rev 1
3/18
Electrical characteristics
2
STDLED623, STULED623
Electrical characteristics
(TC = 25 °C unless otherwise specified)
Table 5. On/off states
Symbol
V(BR)DSS
Parameter
Drain-source
breakdown voltage
Test conditions
ID = 1 mA, VGS = 0
IDSS
Zero gate voltage
VDS = 620 V
drain current (VGS = 0) VDS = 620 V, TC = 125 °C
IGSS
Gate-body leakage
current (VDS = 0)
Min.
Typ.
Max.
620
V
1
50
µA
µA
± 10
µA
4.5
V
3
3.6
Ω
Min.
Typ.
Max.
Unit
-
350
-
pF
-
27
-
pF
-
4.4
-
pF
)
s
(
ct
VGS = ± 20 V
VGS(th)
Gate threshold voltage VDS = VGS, ID = 50 µA
RDS(on)
Static drain-source onVGS = 10 V, ID = 1.1 A
resistance
e
t
e
ol
Unit
du
3
o
r
P
3.6
Table 6. Dynamic
Symbol
Parameter
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer
capacitance
Co(tr)(1)
Equivalent
capacitance time
related
VGS = 0, VDS = 0 to 496 V
-
17
-
pF
RG
Intrinsic gate
resistance
f = 1 MHz open drain
-
5
-
Ω
Qg
Total gate charge
-
15.5
-
nC
Qgs
Gate-source charge
-
3.2
-
nC
Qgd
Gate-drain charge
VDD = 496 V, ID = 2.7 A,
VGS = 10 V
(see Figure 16)
-
9.8
-
nC
)
(s
ct
u
d
o
r
P
e
t
e
l
o
bs
O
4/18
s
b
O
Test conditions
VDS = 50 V, f = 1 MHz, VGS = 0
1. Time related is defined as a constant equivalent capacitance giving the same charging time as Coss when
VDS increases from 0 to 80% VDSS.
DocID025178 Rev 1
STDLED623, STULED623
Electrical characteristics
Table 7. Switching times
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
-
8
-
ns
-
4.4
-
ns
-
21
-
ns
-
22
-
ns
Turn-on delay time
td(on)
tr
VDD = 310 V, ID =1.1 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 15)
Rise time
td(off)
Turn-off-delay time
tf
Fall time
Table 8. Source-drain diode
Symbol
Test conditions
(1)
VSD(2)
trr
-
)
s
(
ct
8.8
A
-
1.6
V
Min.
Source-drain current
ISD
ISDM
Parameter
Typ.
-
u
d
o
Source-drain current (pulsed)
Forward on voltage
ISD = 2.2 A, VGS = 0
Reverse recovery time
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
trr
Reverse recovery time
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
)
s
(
ct
e
t
e
l
Pr
ISD = 2.2 A, di/dt = 100 A/µs
VDD = 60 V (see Figure 20)
o
s
b
ISD = 2.2 A, di/dt = 100 A/µs
VDD = 60 V, Tj = 150 °C
(see Figure 20)
-O
Max. Unit
2.2
A
-
200
ns
-
900
nC
-
9
A
-
240
ns
-
1150
nC
-
10
A
Min.
Typ.
30
-
1. Pulse width limited by safe operating area.
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%.
u
d
o
e
t
e
ol
Pr
Symbol
BVGSO
s
b
O
Table 9. Gate-source Zener diode
Parameter
Test conditions
Gate-source breakdown
voltage
IGS = ± 1 mA (open drain)
Max. Unit
-
V
The built-in back-to-back Zener diodes have specifically been designed to enhance not only
the device’s ESD capability, but also to make them safely absorb possible voltage transients
that may occasionally be applied from gate to source. In this respect the Zener voltage is
appropriate to achieve efficient and cost-effective intervention to protect the device’s
integrity. These integrated Zener diodes thus avoid the usage of external components.
DocID025178 Rev 1
5/18
Electrical characteristics
2.1
STDLED623, STULED623
Electrical characteristics (curves)
Figure 2. Safe operating area for DPAK and
IPAK
Figure 3. Thermal impedance for DPAK and
IPAK
AM15326v1
ID
(A)
10
)
D
S(
1
on
O
Li per
m at
ite io
d ni
by n
m this
ax a
R rea
is
10µs
100µs
0.1
1ms
)
s
(
ct
10ms
Tj=150°C
Tc=25°C
Single pulse
0.01
0.1
10
1
u
d
o
Figure 4. Output characteristics
Figure 5. Transfer characteristics
AM09184v1
ID
(A)
ID
(A)
VGS=10V
O
)
7V
4
t(s
3
uc
od
1
0
0
ete
5
Pr
10
6V
15
O
VGS
(V)
VDD=496V
ID=2.2A
500
10
2.5
2.0
0
0
VDS(V)
AM09186v1
VDS
12
3.0
0.5
Figure 6. Gate charge vs gate-source voltage
bs
VDS=15V
1.0
25
ol
AM00889v1
1.5
5V
20
let
o
s
b
3.5
5
2
r
P
e
VDS(V)
100
400
8
1
2
3
4
5
6
7
8
9
VGS(V)
Figure 7. Static drain-source on-resistance
AM09187v1
RDS(on)
(Ω)
VGS=10V
3.3
3.2
3.1
300
6
3.0
200
4
100
2
0
0
6/18
5
10
15
0
Qg(nC)
2.9
2.8
2.7
0
DocID025178 Rev 1
0.5
1.0
1.5
2.0
ID(A)
STDLED623, STULED623
Electrical characteristics
Figure 8. Capacitance variations
Figure 9. Output capacitance stored energy
AM09188v1
C
(pF)
Ciss
AM09189v1
Eoss
(µJ)
2.5
100
2.0
1.0
10
Coss
0.5
Crss
1
0.1
1
100
10
0
0
VDS(V)
Figure 10. Normalized gate threshold voltage vs
temperature
(norm)
t
e
l
o
ID=50µA
1.10
2.5
1.00
VDS(V)
AM09191v1
ID=1.1A
VGS=10V
s
b
O
2.0
0.95
)-
0.90
s
(
t
c
0.85
0.80
0.75
0.70
-75
-25
e
t
e
l
du
o
r
P
25
75
so
VSD (V)
1.5
1.0
0.5
0
-75
TJ(°C)
125
Figure 12. Source-drain diode forward
characteristics
b
O
u
d
o
r
P
e
RDS(on)
(norm)
1.05
400 500 600
Figure 11. Normalized on-resistance vs
temperature
AM09190v1
VGS(th)
200 300
100
)
s
(
ct
AM09193v1
-25
25
75
125
TJ(°C)
Figure 13. Maximum avalanche energy vs
temperature
AM09192v1
BVDSS
(norm)
TJ=-50°C
ID=1mA
0.9
1.10
TJ=25°C
0.8
0.7
0.6
1.05
TJ=150°C
0.5
0.4
1.00
0.3
0.95
0.2
0.1
0
0
1
2
3
4
5
ISD(A)
0.90
-75
DocID025178 Rev 1
-25
25
75
125
TJ(°C)
7/18
Electrical characteristics
STDLED623, STULED623
Figure 14. Maximum avalanche energy vs
starting Tj
AM09180v1
EAS (mJ)
90
ID=2.2 A
VDD=50 V
80
70
60
50
40
30
)
s
(
ct
20
10
0
0
20
60
40
u
d
o
100 120 140 TJ(°C)
80
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
8/18
DocID025178 Rev 1
STDLED623, STULED623
3
Test circuits
Test circuits
Figure 15. Switching times test circuit for
resistive load
Figure 16. Gate charge test circuit
VDD
12V
47kΩ
1kΩ
100nF
3.3
μF
2200
RL
μF
IG=CONST
VDD
VGS
100Ω
Vi=20V=VGMAX
VD
RG
2200
μF
D.U.T.
VG
c
u
d
47kΩ
1kΩ
AM01468v1
e
t
e
ol
Figure 17. Test circuit for inductive load
switching and diode recovery times
A
A
G
D.U.T.
FAST
DIODE
B
B
S
s
(
t
c
3.3
μF
B
25 Ω
D
RG
so
1000
μF
r
P
e
S
AM01469v1
L
VD
2200
μF
3.3
μF
VDD
ID
Vi
D.U.T.
Pw
AM01470v1
Figure 19. Unclamped inductive waveform
b
O
s
b
O
VDD
u
d
o
G
let
)-
L=100μH
o
r
P
Figure 18. Unclamped Inductive load test circuit
A
D
)
s
(
t
2.7kΩ
PW
PW
D.U.T.
AM01471v1
Figure 20. Switching time waveform
DocID025178 Rev 1
9/18
Package mechanical data
4
STDLED623, STULED623
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 10. DPAK (TO-252) mechanical data
mm
Dim.
Min.
2.40
A1
0.90
1.10
A2
0.03
b
0.64
b4
5.20
c
0.45
c2
0.48
D
6.00
6.40
u
d
o
0.23
e
t
e
l
o
s
b
)
s
(
ct
E1
e
u
d
o
e1
Pr
H
b
O
10/18
)
s
(
ct
2.20
E
so
Max.
A
D1
e
t
e
l
Typ.
L
-O
5.40
0.60
0.60
6.20
6.60
4.70
2.28
4.40
4.60
9.35
10.10
1.00
1.50
2.80
L2
0.80
0.60
1.00
R
V2
0.90
5.10
(L1)
L4
Pr
0.20
0°
8°
DocID025178 Rev 1
STDLED623, STULED623
Package mechanical data
Figure 21. DPAK (TO-252) drawings
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
0068772_K
DocID025178 Rev 1
11/18
Package mechanical data
STDLED623, STULED623
Figure 22. DPAK footprint (a)
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
a. All dimensions are in millimeters.
12/18
DocID025178 Rev 1
Footprint_REV_K
STDLED623, STULED623
Package mechanical data
Table 11. IPAK (TO-251) mechanical data
mm
Dim.
Min.
Typ.
Max.
A
2.20
2.40
A1
0.90
1.10
b
0.64
0.90
b2
0.95
b4
5.20
5.40
B5
)
s
(
ct
0.30
c
0.45
c2
0.48
D
6.00
E
6.40
0.60
du
e
t
e
ol
e
2.28
e1
4.40
H
L
9.00
L1
)0.80
L2
s
b
O
s
(
t
c
V1
o
r
P
0.60
6.20
6.60
4.60
16.10
9.40
1.20
0.80
1.00
10°
u
d
o
r
P
e
t
e
l
o
s
b
O
DocID025178 Rev 1
13/18
Package mechanical data
STDLED623, STULED623
Figure 23. IPAK (TO-251) drawings
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
14/18
0068771_K
DocID025178 Rev 1
STDLED623, STULED623
5
Packaging mechanical data
Packaging mechanical data
Table 12. DPAK (TO-252) tape and reel mechanical data
Tape
Reel
mm
mm
Dim.
Dim.
Min.
Max.
A0
6.8
7
A
B0
10.4
10.6
B
1.5
12.1
C
12.8
1.6
D
20.2
G
16.4
B1
Min.
D
1.5
D1
1.5
E
1.65
1.85
N
F
7.4
7.6
T
K0
2.55
2.75
P0
3.9
4.1
P1
7.9
8.1
P2
1.9
2.1
R
40
T
0.25
W
15.7
t
c
u
)
(s
330
)
s
(
ct
13.2
u
d
o
r
P
e
50
t
e
l
o
s
b
O
Max.
18.4
22.4
Base qty.
2500
Bulk qty.
2500
0.35
16.3
d
o
r
P
e
t
e
l
o
s
b
O
DocID025178 Rev 1
15/18
Packaging mechanical data
STDLED623, STULED623
Figure 24. Tape for DPAK (TO-252)
10 pitches cumulative
tolerance on tape +/- 0.2 mm
P0
Top cover
tape
T
P2
D
E
F
B1
W
K0
B0
For machine ref. only
including draft and
radii concentric around B0
A0
D1
P1
)
s
(
ct
User direction of feed
u
d
o
r
P
e
let
o
s
b
O
)
s
(
t
c
u
d
o
Bending radius
User direction of feed
AM08852v1
Figure 25. Reel for DPAK (TO-252)
T
r
P
e
REEL DIMENSIONS
40mm min.
t
e
l
o
s
b
O
R
Access hole
At slot location
B
D
C
N
A
Full radius
Tape slot
in core for
tape start 25 mm min.
width
G measured at hub
AM08851v2
16/18
DocID025178 Rev 1
STDLED623, STULED623
6
Revision history
Revision history
Table 13. Document revision history
Date
Revision
03-Sep-2013
1
Changes
First release.
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
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O
DocID025178 Rev 1
17/18
STDLED623, STULED623
)
s
(
ct
Please Read Carefully:
u
d
o
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
r
P
e
t
e
l
o
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
s
b
O
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
)
(s
t
c
u
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
d
o
r
ST PRODUCTS ARE NOT AUTHORIZED FOR USE IN WEAPONS. NOR ARE ST PRODUCTS DESIGNED OR AUTHORIZED FOR USE
IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH
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