STE26NA90
N - CHANNEL 900V - 0.25Ω - 26A - ISOTOP
FAST POWER MOSFET
TYPE
STE26NA90
■
■
■
■
■
■
V DSS
R DS(on)
ID
900 V
< 0.3 Ω
26 A
TYPICAL RDS(on) = 0.25 Ω
± 30V GATE TO SOURCE VOLTAGE RATING
100% AVALANCHE TESTED
LOW INTRINSIC CAPACITANCE
GATE CHARGE MINIMIZED
REDUCED VOLTAGE SPREAD
c
u
d
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ SWITCH MODE POWER SUPPLY (SMPS)
■ DC-AC CONVERTER FOR WELDING
EQUIPMENT AND UNINTERRUPTABLE
POWER SUPPLY AND MOTOR DRIVE
ISOTOP
e
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le
)
s
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o
r
P
INTERNAL SCHEMATIC DIAGRAM
o
s
b
O
-
)
s
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ct
u
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P
e
ABSOLUTE MAXIMUM RATINGS
t
e
l
o
Symb ol
V DS
s
b
O
V DGR
V GS
Value
Un it
Drain-source Voltage (V GS = 0)
Parameter
900
V
Drain- gate Voltage (R GS = 20 kΩ)
900
V
± 30
V
G ate-source Voltage
o
ID
Drain Current (continuous) at Tc = 25 C
26
A
ID
Drain Current (continuous) at Tc = 100 C
16.2
A
Drain Current (pulsed)
104
A
T otal Dissipation at Tc = 25 C
450
W
Derating Factor
3.6
W /o C
I DM (•)
P tot
T s tg
Tj
V ISO
o
o
-55 to 150
o
C
Max. Operating Junction Temperature
150
o
C
Insulation Withstand Voltage (AC-RMS)
2500
Storage T emperature
V
(•) Pulse width limited by safe operating area
October 1998
1/8
STE26NA90
THERMAL DATA
R thj -case
R thc-h
Thermal Resistance Junction-case
Thermal Resistance Case-heatsink With Conductive
Grease Applied
Max
0.27
o
C/W
Max
0.05
o
C/W
AVALANCHE CHARACTERISTICS
Symbo l
Parameter
IAR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max)
E AS
Single Pulse Avalanche Energy
(starting Tj = 25 o C, ID = IAR , V DD = 50 V)
Max Value
Unit
13
A
3000
mJ
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symbo l
V (BR)DSS
Parameter
Test Con ditions
Drain-source
Breakdown Voltage
I D = 500 µA
Min.
V GS = 0
I DSS
V DS = Max Rating
Zero Gate Voltage
Drain Current (V GS = 0) V DS = Max Rating
IGSS
Gate-body Leakage
Current (VDS = 0)
900
T c = 125 oC
V GS = ± 30 V
e
t
le
ON (∗)
Symbo l
Parameter
so
Test Con ditions
b
O
-
V GS(th)
Gate Threshold Voltage V DS = V GS
R DS(on)
Static Drain-source On
Resistance
V GS = 10 V
I D(o n)
On State Drain Current
V DS > ID(o n) x R DS(on )ma x
V GS = 10 V
DYNAMIC
o
r
P
e
Symbo l
g f s (∗)
Parameter
s
b
O
2/8
I D = 1 mA
V DS > ID(o n) x R DS(on )ma x
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V DS = 25 V
f = 1 MHz
)
s
t(
Max.
c
u
d
o
r
P
µA
µA
± 200
nA
Typ.
Max.
Unit
2.25
3
3.75
V
0.25
0.3
Ω
Min.
V GS = 0
V
250
1000
26
I D = 13 A
Unit
Min.
I D = 13 A
Test Con ditions
Forward
Transconductance
t
e
l
o
C iss
C os s
C rss
c
u
d
(t s)
Typ.
A
Typ.
Max.
15
Unit
S
13600
1130
270
17700
1470
350
pF
pF
pF
STE26NA90
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbo l
Typ.
Max.
Unit
t d(on)
tr
Turn-on Time
Rise Time
Parameter
V DD = 450 V
I D = 12 A
R G = 4.7 Ω
V GS = 10 V
(see test circuit, figure 3)
Test Con ditions
Min.
40
52
56
73
ns
ns
Qg
Q gs
Q gd
Total G ate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 720 V I D = 26 A V GS = 10 V
470
43
226
660
nC
nC
nC
Typ.
Max.
Unit
108
25
145
152
35
203
ns
ns
ns
SWITCHING OFF
Symbo l
tr (Voff)
tf
tc
Parameter
Off-voltage Rise T ime
Fall T ime
Cross-over Time
Test Con ditions
Min.
V DD = 720 V
I D = 26 A
V GS = 10 V
R G = 4.7 Ω
(see test circuit, figure 5)
SOURCE DRAIN DIODE
Symbo l
Parameter
Test Con ditions
Min.
ISD
I SDM (•)
Source-drain Current
Source-drain Current
(pulsed)
V SD (∗)
Forward On Voltage
I SD = 26 A
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I SD = 26 A
di/dt = 100 A/µs
o
T j = 150 C
V DD = 100 V
(see test circuit, figure 5)
t rr
Q rr
I RRM
so
)
s
(
ct
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
u
d
o
r
P
e
Safe Operating Area
e
t
le
V GS = 0
b
O
-
c
u
d
Typ.
o
r
P
)
s
t(
Max.
Unit
26
104
A
A
1.6
V
1.3
µs
38
µC
58
A
Thermal Impedance
t
e
l
o
s
b
O
3/8
STE26NA90
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
c
u
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e
t
le
)
s
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ct
u
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o
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P
e
Gate Charge vs Gate-source Voltage
t
e
l
o
s
b
O
4/8
o
r
P
o
s
b
O
-
Capacitance Variations
)
s
t(
STE26NA90
Normalized Gate Threshold Voltage vs
Temperature
Normalized On Resistance vs Temperature
Source-drain Diode Forward Characteristics
c
u
d
e
t
le
)
s
(
ct
)
s
t(
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P
o
s
b
O
-
u
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o
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P
e
t
e
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o
s
b
O
5/8
STE26NA90
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 4: Gate Charge test Circuit
c
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e
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le
)
s
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ct
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P
e
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s
b
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-
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
t
e
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o
s
b
O
6/8
o
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P
)
s
t(
STE26NA90
ISOTOP MECHANICAL DATA
mm
DIM.
MIN.
TYP.
inch
MAX.
MIN.
TYP.
MAX.
A
11.8
12.2
0.466
0.480
B
8.9
9.1
0.350
0.358
C
1.95
2.05
0.076
0.080
D
0.75
0.85
0.029
0.033
E
12.6
12.8
0.496
0.503
F
25.15
25.5
0.990
1.003
G
31.5
31.7
1.240
1.248
H
4
0.157
J
4.1
4.3
0.161
K
14.9
15.1
0.586
)
s
t(
L
30.1
30.3
1.185
M
37.8
38.2
1.488
N
4
O
7.8
0.169
0.157
e
t
le
8.2
G
)
s
(
ct
O
od
0.307
o
s
b
O
-
0.594
1.193
1.503
0.322
A
B
H
s
b
O
F
D
t
e
l
o
E
u
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P
e
N
Pr
uc
J
C
K
L
M
7/8
STE26NA90
c
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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1998 STMicroelectronics – Printed in Italy – All Rights Reserved
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8/8
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