STEC01
Datasheet
Ground path safety switch with programmable timers
Features
•
•
Input voltage range from 2.2 to 5 V
12 mΩ typ. N-channel FET RDS(on)
•
•
•
•
•
•
•
7 A continuous current capability
PWM control signal from 4 Hz to 5 kHz, with 30% to 100% duty cycle
30 µA battery supply current
2 programmable timers: T1, T3
1 fixed timer T2
Input undervoltage lockout
VFQFPN 3x3x0.9 16L, 0.5 mm pitch package
Applications
•
•
•
Electronic cigarettes
Timing/reset circuitry
Ground path protection circuitry
Description
Product status link
STEC01
Product summary
Order code
STEC01PUR
Package
VFQFPN 3x3x0.9
16L
The STEC01 is an integrated programmable 12 mΩ power switch managed by the
timer based circuitry.
The device has 3 timers designed to interrupt the ground path of a power application
after a maximum on-time and inhibits the restart of the platform during a cooling
window. The maximum on-time can be set from few seconds to hundreds of seconds,
while the cooling window can be programmed to 69, 345 and 1380 seconds.
3 multi-level input pins, combined with a programmable oscillator and a fixed
oscillator, are used to set the timing.
An input continuous or pulsed signal applied to the PWM pin starts the internal logic
and counters. In case of a normal operation, as soon as the activity on the PWM pin
stops, the device automatically enters idle mode, waiting for a new valid PWM signal
to be applied. If the device detects a fault condition, a reset pulse is generated and
the safety MOSFET is turned off and managed according to a predefined state
machine.
The STEC01 has a continuous current capability up to 7 A through the internal power
MOSFET. A higher current can be supported by using an external power transistor
driven through GDRV pin.
A rising edge on the HW_RESET input pin generates a 57 ms pulse on the
RESET_FAULT pin. This function can be used to notify the connection of an external
power source (e.g. USB).
DS13063 - Rev 2 - October 2020
For further information contact your local STMicroelectronics sales office.
www.st.com
STEC01
Block diagram
1
Block diagram
Figure 1. Block diagram
PWM
HW_RESET/
USB conn.
VBAT
Thermal
shutdown
RESET/FAULT
HW_Reset
PWR
T1
LOGIC
Safety FET
(SF)
GDRV
T2
TPF
T1P1
T1P2
T3P
PGND
T3
OSC1, OSC2,
Timers
Decoder
AGND
DS13063 - Rev 2
page 2/22
STEC01
Pin configuration
2
Pin configuration
Figure 2. Pin configuration
Table 1. Pin configuration
Symbol
Pin
RESET\FAULT
1
Open drain output, active low. It generates a 57 ms pulse if a fault condition is detected or
when HW_RESET\USB is pulled high
VBAT
2
Battery supply voltage. Bypass this pin to GND with a 1 µF ceramic capacitor
AGND
3
Analog GND. Connect it to a dedicated ground path
TPF
4
T1 oscillator programming pin. Connect a resistor to GND, to achieve a frequency ranging from
100 kHz to 400 kHz
T1P1
5
T1P2
6
T3P
7
PGND
8, 9, 10
PWR
DS13063 - Rev 2
Description
T1 timer programming pin. Connect to VBAT, GND or floating to select T1 prescaler (hard
wired). See Figure 5. Timer configuration truth table
T3 timer programming pin. Connect to VBAT, GND or floating (hard wired). See Figure 5. Timer
configuration truth table
Power ground (internal N-channel power MOS source terminal)
11, 12, 13 Input power voltage (internal N-channel power MOS drain terminal)
GDRV
14
Gate driver output. Leave floating if it is not used
HW_RESET\USB
15
Input hardware reset. Do not leave floating. If it is not used, put to GND
PWM
16
Input control signal, 4 Hz to 5 kHz, 30%-100% duty cycle
GND
EXP
Exposed pad, connect to thermal ground plane
page 3/22
STEC01
Typical application diagram
3
Typical application diagram
Figure 3. Typical application diagram, Iload up to 7 A
Main control board
ACTUATOR
PChannel
PWM FET
(1)
B
A
T
T
E
R
Y
DC-DC
MCU
PWM
PWR
GDRV
T1p1
T1p2
T3p
VBAT
Protection board
1uF
STEC01
Up to 30V
Reset\Fault
200kΩ
TPF
HW_reset
RTPF
100kΩ
100nF
(1) Suggested for high inductive actuator
Figure 4. Typical application diagram, Iload > 7 A, external MOSFET
ACTUATOR
Main control board
PChannel
PWM FET
(1)
B
A
T
T
E
R
Y
DC-DC
MCU
PWM
PWR
GDRV
T1p1
T1p2
T3p
VBAT
1uF
Protection board
STEC01
Up to 30V
Reset\Fault
200kΩ
TPF
RTPF
HW_reset
100kΩ
100nF
(1) Suggested for high inductive actuator
DS13063 - Rev 2
page 4/22
STEC01
Maximum ratings
4
Maximum ratings
Table 2. Absolute maximum ratings
Symbol
Parameter
Value
Unit
VBAT
Supply voltage pin to AGND
-0.3 to 6
V
PWM
PWM input signal to AGND
-0.3 to 11.5
V
T1P1,T1P2 ,T3P
Timing setting pins to AGND
-0.3 to VBAT+0.3
V
TPF
T1 oscillator programming pin to AGND
-0.3 to 1.8
V
HW_RESET
Hardware reset pin to AGND
-0.3 to 11.5
V
RESET/FAULT
Open drain pin to PGND
-0.3 to 6
V
GDRV
Gate driver pin to PGND
-0.3 to VBAT+0.3
V
PWR
Input power voltage pin to PGND
-0.3 to 11.5
V
IPWR
DC N-channel power MOSFET current
7
A
TJ-MAX
Maximum junction temperature
150
°C
TSTG
Storage temperature
-55 to 150
°C
Table 3. Thermal data
Note:
DS13063 - Rev 2
Symbol
Parameter
Value
Unit
Rthja
Thermal resistance, junction-to-ambient
42
°C/W
Rthjc
Thermal resistance, junction-to-case
5
°C/W
thermal test board JESD51-7, 4-layer PCB (2s2p)
page 5/22
STEC01
Electrical characteristics
5
Electrical characteristics
TA = 25 °C, VBAT = 3.7 V, CBAT = 1 μF, T1P1=T1P2=GND, RTPF = 100 kΩ, T3P = GND, unless otherwise
specified.
Table 4. Electrical characteristics
Symbol
Parameter
VBAT
Supply voltage range
VUVLO
Undervoltage lockout
VHyst
UVLO hysteresis
VBAT falling
0.05
tBATT_PWM
VBAT valid to PWM time
VBAT rising above UVLO then PWM rising
1
VPWM
PWM input voltage range
TA from -40 to 85 °C
PWM threshold
TA from -40 to 85 °C
VIL_MAX
VIH_MIN
PWM_HysT
PWM hysteresis
FPWM
PWM operating frequency
tPWM_HI
PWM minimum high time
RDS(on)
Internal power MOSFET onresistance
Test conditions
Min.
Typ.
2.2
Turn-on, voltage rising,
TA from -40 to 85 °C
1.7
1.9
1
4
V
V
3.5
ms
10
V
0.05
5000
40
VBAT = 2.5 V, IPWR=1 A
12
VBAT = 3 V, IPWR=1 A
11.3
mΩ
TA from -40 to 85 °C, VBAT=>2.5 V IPWR=1 A
20
1.5
PWR=10 V, fault condition
IBATT
Battery supply current
VBAT from 2.2 to 5 V, active mode
30
IC in idle-mode
2
IC in idle-mode,
Gate drive high resistance
RGDRV_L
Gate drive low resistance
VHW_RESET
Hardware reset threshold
TA from -40 to 85 °C
IHW_RESET
Hardware reset leakage
TA from -40 to 85 °C, VHW_RESET=10 V
tHW_RESET_dl
Hardware reset deglitch time
VRESET/FAULT
VOL_MAX
IRESET/FAULT
Reset leakage current
tPW_RESET
Reset pulse width
VPT
Programming threshold pins VIL,
input logic low
4
µA
30
T1 and T2 not expired
Ω
IGDRV=-5 mA,
8
IC idle or in fault mode
0.3
0.9
V
1
µA
10
IRESET=2 mA, fault condition,
TA from -40 to 85 °C
VRESET/FAULT=5 V,
TA from -40 to 85 °C
50
Applies to T1P1, T1P2, T3P
µA
µA
10
IGDRV=5 mA, PWM=high,
RGDRV_H
Hz
µs
TA from -40 to 85 °C
DS13063 - Rev 2
2.2
V
NFET leakage current
Idle battery current
V
0.9
IL_PWR
IBATT_IDLE
5
0.3
0.006
(1)
Max. Unit
57
ms
0.2
V
1
µA
66
ms
0.2
V
page 6/22
STEC01
Electrical characteristics
Symbol
Parameter
Test conditions
Min.
VPT
Programming threshold pins VIH,
input logic high
Applies to T1P1, T1P2, T3P
1.9
IPT
Programming input pins leakage
current
Applies to T1P1, T1P2, T3P. VPT=5 V
T1P1,T1P2=GND, RTPF =91 kΩ
T1
T2
Timer accuracy
Typ.
Max. Unit
V
1
4
5
µA
6
0.250 0.285 0.330
T3
T3P=GND
60
69
OTP
Overtemperature protection
PWR OFF
160
OTP_HYST
OTP hysteresis
PWR ON
20
s
80
°C
1. Guaranteed by design.
Figure 5. Timer configuration truth table
T1p1
0
Floating
1
0
Floating
1
0
Floating
1
T1P2
0
0
0
1
1
1
Floating
Floating
Floating
Prescaler
x1
x4
x16
x64
x256
x1024
T1 [s]
5 - 20
20 - 80
80 - 320
320 - 1280
1280 - 5120
5120 - 20480
T2 [ms]
250
T3p
0
Floating
1
T3[s]
60
345
1380
Do not use
Connect 100 kΩ 1% tolerance between RTPF and GND to obtain minimum values
Connect 400 kΩ 1% tolerance between RTPF and GND to obtain maximum values
Note:
DS13063 - Rev 2
See Section 6.1 T1 timer settings for more details.
page 7/22
STEC01
General description
6
General description
The STEC01 is an integrated low-side 12 mΩ N-channel power MOSFET used to protect applications where a big
amount of current flows from the battery to an actuator such as the heater inside an e-cigarette. The maximum
on-time can be configured for the actuator with a range from 5 s to 20480 s. Once the set time expires, the
actuator is disconnected from the GND path.
The device monitors the PWM activity and as soon as a rising edge is detected it exits the idle mode, turns the Nchannel power MOSFET on to connect the actuator to the GND path and starts the setting on-time timer (T1). As
soon as a falling edge on PWM is detected, a 285 ms timer (T2) is started and, if within such time no further PWM
activity is recognized, the N-channel MOSFET is turned off and the device enters idle mode till a new PWM signal
is detected (Figure 6. T1 vs RTPF- prescaler x1). Depending on the user's application, the device works with a
continuous or pulsed PWM signal.
If, for any reason, the PWM duration is longer than the value set for timer T1, a fault event is detected, the Nchannel MOSFET is turned off and a fault signal is generated. In order to exit fault mode, a stable low voltage
level on the PWM pin is required. Once the PWM goes low, T2 starts counting about 250 ms to make sure the
fault has been removed and as soon as it expires, the T3 timer is started. Timer T3 sets the cooling window
during which any new activity on the PWM pin is ignored and the internal N-channel power MOSFET is kept OFF
(T3 can be programmed to 69 s, 345 s or 1380 s). Once T3 expires, a new power cycle can be started by a valid
PWM signal.
The STEC01 is able to manage a continuous current up to 7 A through the internal power MOSFET. A higher
current can be supported by using an external N-channel power MOSFET driven through GDRV pin.
A rising edge on the HW_RESET input pin generates a 57 ms pulse on the RESET_FAULT pin that can be
detected by a dedicated MCU GPIO. This function can be used to notify the connection of an external power
source (e.g. USB).
6.1
T1 timer settings
Figure 6. T1 vs RTPF- prescaler x1 reports the typical T1 curve vs setting resistor RTPF when the prescaler x1 is
selected. It allows the user to set T1 from 5 s to 20 s as reported in Figure 5. Timer configuration truth table.
Figure 6. T1 vs RTPF- prescaler x1
25
20
T1 [s]
15
10
5
0
50
100
150
200
250
300
350
400
450
RTPF [kΩ]
For a longer setting time, please refer to the example below:
DS13063 - Rev 2
page 8/22
STEC01
Timer expiration: normal mode
The typical example of RTPF calculation to obtain T1=6 minutes (3600 s): select the x256 pre-scaler (according to
the ranges reported in Figure 5. Timer configuration truth table, by keeping T1P1 floating and T1P2=1. Divide
3600 s by selected pre-scaler value (256) and obtain 14.06 s that in the graph above corresponds to RTPF = 280
kΩ.
6.2
Timer expiration: normal mode
Figure 7. Normal power cycle shows a typical power cycle not triggering a fault condition. In this example a PWM
signal with duty cycle lower than 100% is applied to also show T2 timer functionality but a 100% duty cycle can be
used as well.
When a rising edge on the PWM input pin is detected (a), T1 is started, the internal power MOSFET is turned on
and the external gate drive pin is activated. As soon as a falling edge of the PWM signal is detected, T2 is started.
The purpose of T2 is to detect the end of the power cycle. After the power cycle starts, every high level of the
PWM signal resets T2.
If the PWM signal is in line with requirements (4 Hz < fPWM 30%), its low time is always lower
than 285 ms (typ., T2 fixed value) and T2 never expires till the end of the power cycle (b). T2 is started and reset
at each PWM period.
After the power cycles ends, the voltage at PWM input remains low for more than 285 ms causing the expiration
of T2 (c). When T2 expires, the internal N-channel power MOSFET is turned off, the GDRV output is deactivated
and the device enters idle mode (low power consumption mode) during which it keeps monitoring the PWM line
waiting for a new cycle to start.
In this example the time duration of the full power cycle (a to c) is lower than the maximum on-time programmed
for T1.
Figure 7. Normal power cycle
(a)
(b)
(c)
SF ON
SF OFF
GDRV Status
T3
T2
0.285s
T1
IC
STAND BY
PWM
T1 & T2
Reset
a) Start on first PWM rising edge. Global reset
b) 8 s elapsed, PWM stops toggling
c) T2 expires, T1/T2 are reset, IC goes to idle mode, ready for next PWM cycle
DS13063 - Rev 2
page 9/22
STEC01
T1 timer expiration: fault mode
6.3
T1 timer expiration: fault mode
Figure 8. T1 expiration, fault mode shows an example of platform failure triggering the protection function of the
IC. In this case, the power control unit keeps generating the power PWM signal for a time longer than expected.
As per previous case, the device exits idle mode, starts T1, turns on the internal N-channel power MOSFET and
activates the GDRV output as soon as a rising edge on PWM is detected (a).
The PWM signal keeps commutating for more than the maximum programmed on-time causing T1 to expire and
making the device enter fault mode (b).
In fault mode, the internal power MOSFET is turned off, the GDRV output is deactivated, a reset pulse on the
RESET/FAULT pin is generated and the device starts waiting for the fault condition to be removed. The condition
to exit fault mode is a low voltage level at the PWM pin for more than T2 ((d) to (e), 285 ms typ.). When the fault
removal is detected (e), T3 timer is started. During T3 (cooling window), any activity on the PWM line is ignored
and the power MOSFETs (both internal or external if used) are kept off to let the application cool down.
After T3 expires, the device enters again idle mode and is ready for a new cycle.
Figure 8. T1 expiration, fault mode
(a)
(b)
(c) (d)
(e)
(f)
SF ON
SF
OFF
GDRV Status
IC
IDLE MODE
T3
285ms
T2
T1
Reset
57ms
PWM: 30%up to 100% duty cycle
SW FAULT
EXAMPLE
a) Global reset on first PWM rising edge, T1 starts, SF ON
b) T1 expires, SF is turned OFF and 57 ms reset pulse is generated
c) 57 ms reset pulse ends
d) PWM stops toggling (or goes stable low) and T2 starts 285 ms timer
e) T2 expires and T3 starts
f) T3 expires, the device goes to idle mode and SF can be turned ON again if needed (by PWM rising edge)
DS13063 - Rev 2
page 10/22
STEC01
HW_RESET functionality
6.4
HW_RESET functionality
The HW_RESET input can be used to monitor an input power line (e.g. USB) to notify the connection to the
platform control unit.
When the signal on the HW_REST pin is more than VHW_RESET threshold, after a deglitch time of the 10 ms
(typ.), a 57 ms (typ.) pulse is generated on the RESET/FAULT output pin. If several pulses longer than the
deglitch time are detected, during the RESET/FAULT low time, the pulse duration is extended (see events (a) and
(b) in the example below).
Figure 9. HW_RESET input functionality
(a)
(b)
(c)
HW_RESET
RESET/FAULT
57ms
57ms
a) HW_RESET is higher than VHW_RESET threshold for more than the deglitch time of 10 ms (typ.), a 57 ms reset
fault pulse is generated
b) HW_RESET goes down and rises again above the VHW_RESET threshold for more than the deglitch time, a new
50 ms reset fault signal is generated overlapping the previous one
c) HW_RESET is higher than VHW_RESET threshold for more than deglitch time on rising edge and remains high
Note:
DS13063 - Rev 2
A Schmitt trigger is used in the input stage of HW_RESET. If the HW_RESET is used for USB VBus line
monitoring, during USB disconnection, in case of voltage bouncing, a reset might be generated.
page 11/22
STEC01
Typical performance characteristics
7
Typical performance characteristics
Figure 11. RDS(on) vs VBAT@-40 °C
Figure 10. RDS(on) vs VBAT, room temperature
12
14.5
11.5
11
13.5
RDS ON [mΩ]
RDS ON [m Ω]
14
13
12.5
12
10.5
10
9.5
9
8.5
8
11.5
7.5
11
2
2.5
3
3.5
4
4.5
5
7
5.5
2
2.5
3
VBAT [V]
RDS ON@1A
3.5
4
4.5
5
5.5
VBAT [V]
RDS ON@2A
RDS ON@5A
RDS ON@1A
RDS ON@2A
RDS ON@5A
Figure 13. Reset pulse width: VBAT=3.7 V
T1P1=T1P2=T3P=GND, ROSC=100 kΩ
Figure 12. RDS(on) vs VBAT@-85 °C
17.5
17
RDS ON [m Ω]
16.5
16
15.5
15
14.5
14
13.5
2
2.5
3
3.5
4
4.5
5
5.5
VBAT [V]
RDS ON@1A
RDS ON@2A
RDS ON@5A
Figure 15. PWM VIL_MAX: VBAT=3.7 V
1.05
1.05
0.95
0.95
0.85
0.85
VIL_MAX [V]
VIH_MIN [V]
Figure 14. PWM VIH_MIN: VBAT=3.7 V
0.75
0.75
0.65
0.65
0.55
0.55
0.45
-45
-25
-5
15
35
Temp [°C]
DS13063 - Rev 2
55
75
95
0.45
-45
-25
-5
15
35
Temp [°C]
55
75
95
page 12/22
STEC01
Typical performance characteristics
Figure 16. HW_RESET VIH_MIN: VBAT=3.7 V
Figure 17. HW_RESET VIL_MAX: VBAT=3.7 V
1.05
0.95
0.95
0.85
0.85
VIL_MAX [V]
VIH_MIN [V]
1.05
0.75
0.75
0.65
0.65
0.55
0.55
0.45
-45
-25
-5
15
35
Temp [°C]
55
75
0.45
95
-45
-25
-5
15
35
55
75
95
Temp [°C]
Figure 18. IBATT_ACTIVE: VBAT=3.7 V
Figure 19. IBATT_IDLE: VBAT=3.7V
6.00
55.00
5.00
IBATT_IDLE [uA]
IBATT_ACTIVE [uA]
45.00
35.00
25.00
4.00
3.00
2.00
15.00
1.00
0.00
5.00
-45
-25
-5
15
35
55
75
-45
95
-25
-5
Figure 20. Leakage TxPy pin: VTxPY@5 V
35
55
75
95
Figure 21. Leakage PWR: VPWR@10 V
9
2500
8
2000
7
1500
nA
LEAKAGE TxPy pin [nA]
15
Temp [°C]
Temp [°C]
6
1000
5
500
4
0
3
-45
-25
-5
15
35
Temp [°C]
DS13063 - Rev 2
55
75
95
-45
-25
-5
15
35
Temp [°C]
55
75
95
page 13/22
STEC01
Package information
8
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
DS13063 - Rev 2
page 14/22
STEC01
VFQFPN 3x3x0.9 16L package information
8.1
VFQFPN 3x3x0.9 16L package information
Figure 22. VFQFPN 3x3x0.9 package outline
DS13063 - Rev 2
page 15/22
STEC01
VFQFPN 3x3x0.9 16L package information
Table 5. VFQFPN 3x3x0.9 mechanical data
Symbol
Milimeters
Min
Typ
Max
A
0.80
0.90
1.00
A1
0
0.02
0.05
A3
b
0.20
0.18
D
D2
1.55
DS13063 - Rev 2
1.70
1.80
3.00
1.55
e
Note:
0.30
3.00
E
E2
0.25
1.70
1.80
0.50
L
0.20
K
0.20
0.30
aaa
0.05
bbb
0.10
ccc
0.10
ddd
0.05
eee
0.08
0.40
VFQFPN - standard for thermally enhanced very thin fine pitch quad flat package no leads. The leads size is
comprehensive of the thickness of the leads finishing material. Dimensions do not include mold protrusion, not to
exceed 0,15 mm. Package outline exclusive of metal burr dimensions.
page 16/22
STEC01
VFQFPN 3x3x0.9 16L package information
Figure 23. VFQFPN 3x3x0.9 recommended footprint
DS13063 - Rev 2
page 17/22
STEC01
Revision history
Table 6. Document revision history
DS13063 - Rev 2
Date
Version
Changes
14-Jan-2020
1
Initial release.
20-Oct-2020
2
Updated Section 3 Typical application diagram and Table 2. Absolute
maximum ratings.
page 18/22
STEC01
Contents
Contents
1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2
Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
3
Typical application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
5
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
6
General description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6.1
T1 timer settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6.2
Timer expiration: normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6.3
T1 timer expiration: fault mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6.4
HW_RESET functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7
Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
8
Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
8.1
VFQFPN 3x3x0.9 16L package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
DS13063 - Rev 2
page 19/22
STEC01
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Pin configuration . . . . . . . . . . . . .
Absolute maximum ratings . . . . . .
Thermal data. . . . . . . . . . . . . . . .
Electrical characteristics . . . . . . . .
VFQFPN 3x3x0.9 mechanical data.
Document revision history . . . . . . .
DS13063 - Rev 2
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. 3
. 5
. 5
. 6
16
18
page 20/22
STEC01
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
DS13063 - Rev 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical application diagram, Iload up to 7 A . . . . . . . . . . . . . . . . . . . . . .
Typical application diagram, Iload > 7 A, external MOSFET . . . . . . . . . . .
Timer configuration truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
T1 vs RTPF- prescaler x1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Normal power cycle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
T1 expiration, fault mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HW_RESET input functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RDS(on) vs VBAT, room temperature. . . . . . . . . . . . . . . . . . . . . . . . . . .
RDS(on) vs VBAT@-40 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RDS(on) vs VBAT@-85 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reset pulse width: VBAT=3.7 V T1P1=T1P2=T3P=GND, ROSC=100 kΩ .
PWM VIH_MIN: VBAT=3.7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PWM VIL_MAX: VBAT=3.7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HW_RESET VIH_MIN: VBAT=3.7 V . . . . . . . . . . . . . . . . . . . . . . . . . . .
HW_RESET VIL_MAX: VBAT=3.7 V . . . . . . . . . . . . . . . . . . . . . . . . . . .
IBATT_ACTIVE: VBAT=3.7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IBATT_IDLE: VBAT=3.7V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Leakage TxPy pin: VTxPY@5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Leakage PWR: VPWR@10 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VFQFPN 3x3x0.9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . .
VFQFPN 3x3x0.9 recommended footprint . . . . . . . . . . . . . . . . . . . . . .
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. 2
. 3
. 4
. 4
. 7
. 8
. 9
10
11
12
12
12
12
12
12
13
13
13
13
13
13
15
17
page 21/22
STEC01
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2020 STMicroelectronics – All rights reserved
DS13063 - Rev 2
page 22/22