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STEVAL-IFD001V1

STEVAL-IFD001V1

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    -

  • 描述:

    EVAL BRD FULL USB DONGLE STR912

  • 数据手册
  • 价格&库存
STEVAL-IFD001V1 数据手册
STEVAL-IFS010V1 STR9 ZigBee® extension board for the SN260 network processor Data Brief Features ■ Digital interfaces: – 16 general purpose I/Os (GPIOs) – One I2C bus interface – Two SPI bus interfaces: one is used to interface with the STR9 dongle and the other is available to extend the board with another SPI device – 2 external interrupts ■ Digital MEMS in an LGA14 package (optional) ■ 1 debug port ■ 1 button and 2 LEDS c u d Description e t le The STR9 ZigBee extension board provides an SN260 ZigBee interface to an application using the STR9 dongle (part number STEVALIFD001V1). The STMicroelectronics SN260 integrates a 2.4 GHz, IEEE 802.15.4-compliant transceiver with a 16-bit network processor (XAP2b core) to run EmberZNet™, the ZigBee-compliant network stack. The SN260 accesses the EmberZNet API across a standard SPI module, allowing application development on a host processor. This means that the SN260 can be viewed as a ZigBee peripheral connected over an SPI. The XAP2b microprocessor is a power-optimized core integrated in the SN260. It contains integrated Flash and RAM memory along with an optimized peripheral set to enhance the operation of the network stack. For additional information regarding the SN260, please refer to the device datasheet. This document should be used in conjunction with user manual UM0282, which describes the STR9 dongle (part number STEVAL-IFD001V1). ) s ( ct o s b O - ) s t( o r P STEVAL-IFS010V1 u d o r P e t e l o s b O July 2008 Rev 1 For further information contact your local STMicroelectronics sales office. 1/4 www.st.com 4 Block diagram STEVAL-IFS010V1 1 Block diagram Figure 1. STR9 ZigBee extension board schematic ZigBee U2 RSTB 1 R21 HOST_INT 2 3.3 V 10 KΩ SPI_SEL0 3 SPI_MOSI 4 SPI_MISO 5 SPI_CLK 6 7 3.3 V 8 SN260 RSTB 17 LED_SDBG SDBG 16 LED_ACTIVE HOST_INT ACTIVITY SPI_SEL WAKE SPI_MOSI PTI_DATA SPI_MISO PTI_EN SIF_MOSI VDD SIF_MISO 15 WAKE_UP R22 14 PS_DATA 10 KΩ 3.3 V 10 9 8 7 6 5 4 3 2 1 SIF_MOSI 13 PS_FRAME SIF_MISO 12 SIF_LOADB SPI_CLK SIF_LOADB GN D CN1 PS_DATA PS_FRAME RSTB SIF_LOADB SIF_CLK 3.3 V 11 SIF_MOSI Debug I/F 10 SIF_MISO SIF_CLK 9 SIF_CLK CN3 SPI_MOSI SPI_MISO SN260 3.3 V 1 3 5 c u d Header 3x2 3.3 V LD24 2.1 V yellow R24 1 2 LED_SDBG 300 -> 4 mA Active WA KE _UP 2 LD25 2.3 V green 1 2 LED_ACTIVE e t le B22 EX T_IN T R25 250 -> 4 mA Link o s b O - C22 10 nF o r P ) s t( SPI_CLK SPI_SEL2 2 4 6 3.3 V C20 100 nF C21 10 nF HOST_INT, and WAKE_UP are active low, must be kept pulled up externally CONNECTORS to STR9_DONGLE SPI_SEL0 SPI_SEL2 SPI_CLK RSTB SPI_MISO HOST_IN T c u d (t s) CN2 DIGI TAL_CON P80P 81 SPI_SEL1 1 2 P82P 83 3 4 P22P 84 5 6 P23P 85 7 8 P24P 86 9 10 P87P 25 SPI_MOSI 11 12 P26P 27 SSP0_NSS R23 13 14 P55 WAKE_UP P54 15 16 10 kΩ 17 18 19 20 o r P e t e l o bs 3.3 V O 3.3 V + C01 2.2 µF MEMS 3.3 V 3.3 V 3.3 V 6 5 4 3 2 1 VCC GND GND GND VCC VDD_io SPI_SEL1 7 3.3 V CS SCL_SPC U1 LIS302DL 14 SPI_CLK INT_2 GND SDA/SDI INT_1 GND SDO 8 9 10 11 12 13 SPI_MOSI SPI_MISO 3.3 V C10 100 nF NSS = 1 means STR9 is master APM0025 2/4 STEVAL-IFS010V1 2 Revision history Revision history Table 1. Document revision history Date Revision 07-Jul-2008 1 Changes Initial release. c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O 3/4 STEVAL-IFS010V1 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. c u d ) s t( Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. e t le o r P UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. o s b O - UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. ) s ( ct u d o Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. r P e t e l o s b O ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 4/4
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